Abstract: A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate such as a silicon wafer commonly used in LIGA or microsystem fabrication. The fixture described allows the workpiece to be submerged deep within an electrolytic cell, facing upwards, and allows easy transfer from one cell to another. The edges, backside, and electrical connections are sealed and protected from the electrolyte.

Abstract: A dynamically configurable electrode includes a first planar electrode and a planar array of pixels in a different plane, wherein a polarizable liquid medium (including electrolyte solutions) is to reside in the gap between electrodes. The pixels are individually addressable by a time-varying voltage, and adjacent pixels receive, at any instant in time, either the same voltage waveform or a different voltage waveform. Adjacent pixels receiving different voltage waveforms generate corresponding movement of dipolar entities, including dipolar particles, ions, or dipolar molecules in the polarizable liquid medium between the electrodes, which can in turn generate fluid flow and movement of particles suspended in the fluid along the planar array surface.

Abstract: The invention relates to a measuring device having a penetrating electrode. Said elongated electrode of the measuring device is movably mounted in axial direction thereof. In case of a load or a shock, it can absorb said load to a given degree in the housing of said measuring device. Said shock-absorbing characteristic makes it possible to largely prevent breaking of the first electrode that is preferably configured in the form of a glass electrode. The invention also relates to a measuring device, to a method for the production and the application of said measuring device.

Abstract: Methods of depositing a protective coating of a silicon-containing or metallic material onto a semiconductor substrate include sputtering such material from an electrode onto a semiconductor substrate in a plasma processing chamber. The protective material can be deposited onto a multi-layer mask overlying a low-k material and/or onto the low-k material. The methods can be used in dual damascene processes to protect the mask and enhance etch selectivity, to protect the low-k material from carbon depletion during resist strip processes, and/or protect the low-k material from absorption of moisture.

Abstract: A method for monitoring a select analyte in a sample in an electrochemical system. The method includes applying to the electrochemical system a time-varying potential superimposed on a DC potential to generate a signal; and discerning from the signal a contribution from the select analyte by resolving an estimation equation based on a Faradaic signal component and a nonfaradaic signal component.

Abstract: Methods and apparatuses for electrochemically depositing a metal layer onto a substrate. An electrochemical deposition apparatus comprises a substrate holder assembly including a substrate chuck and a relatively soft cathode contact ring. The cathode contact ring comprises an inner portion and an outer portion, wherein the inner portion directly contacts the substrate. An anode is disposed in an electrolyte container. A power supply connects the substrate holder assembly and the anode.

Abstract: An oxidation-reduction potentiometer immerses a working electrode and a reference electrode in a reference liquid, measures an interelectrode voltage between the above electrodes when an impedance reducing circuit is unconnected and an interelectrode voltage between the above electrodes when the impedance reducing circuit is connected by interelectrode voltage measuring means, computes a comparison coefficient based on the measured voltages by a comparison coefficient computing section, stores the coefficient in a comparison coefficient storing section, immerses the working electrode and the reference electrode in a test liquid, measures an interelectrode voltage between the working electrode and the reference electrode when the impedance reducing circuit is connected by the measuring means, and computes an oxidation-reduction potential by an oxidation-reduction potential computing section based on the measured voltage when the impedance reducing circuit is connected and the coefficient stored in the storing

Abstract: A polymer electrolyte composition for a dye-sensitized solar cell, a polymer electrolyte, a dye-sensitized solar cell employing the polymer electrolyte, and a method for preparing the same. The polymer electrolyte composition for a dye-sensitized solar cell includes: a mono-functional or multi-functional monomer having at least one ethylene glycol in a side chain; a photoinitiator; a lithium salt; and an organic solvent. The polymer electrolyte suppresses the volatilization of a redox electrolyte and provides stable photoelectrochemical properties against environmental changes, such as a rise in the external temperature of a solar cell. The dye-sensitized solar cell includes: first and second electrodes facing each other; a dye-adsorbed porous film interposed between the first and second electrodes; and the polymer electrolyte interposed between the first and second electrodes. The dye-sensitized solar cell has a high voltage and high photoelectric conversion efficiency.

Abstract: A solar cell structure has a solar cell unit structure including a heat sink, and a solar cell having a front side, a back side, and a solar-cell projected area coverage on the heat sink. The solar cell has an active semiconductor structure that produces a voltage between the front side and the back side when the front side is illuminated. An intermediate structure is disposed between and joined to the back side of the solar cell and to the heat sink. The intermediate structure has an intermediate-structure projected area coverage on the heat sink and includes a by-pass diode having a diode projected area coverage on the heat sink. The diode projected area coverage on the heat sink may be substantially the same as the intermediate-structure projected coverage on the heat sink. Alternatively, the diode projected area coverage on the heat sink maybe less than the solar-cell projected area coverage on the heat sink, and the intermediate structure further includes a substrate coplanar with the by-pass diode.

Abstract: A deposition system includes a process chamber, a workpiece holder for holding the workpiece within the process chamber, a first target comprising a first material, a second target comprising a second material, a single magnet assembly disposed that can scan across the first target and the second target to deposit the first material and the second material on the workpiece, and a transport mechanism that can cause relative movement between the magnet assembly and the first target or the second target.

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

Abstract: In one embodiment, a magnetron sputtering apparatus includes one or more magnet arrays for moving ions or charged particles on at least two plasma discharge paths on a target. Charged particles on one of the plasma discharge paths are moved in one direction, while charged particles on the other plasma discharge path are moved in the opposite direction to reduce rotational shifting of deposition flux on the patterned substrates. The plasma discharge paths may be formed by two symmetric magnet arrays or a single asymmetric magnet array rotated from behind the target.

Abstract: Photovoltaic cells with spacers, as well as related compositions, systems, and methods, are disclosed.

Abstract: A method for producing a magnetic recording medium in which the noise of the magnetic recording medium is reduced and the thermal stability of the recorded magnetization is improved, while enabling easy writing to be carried out by a recording head, is disclosed. The magnetic recording medium of the present invention includes an underlayer having an hcp crystal structure and a magnetic layer produced by a multilayer lamination of Co/Pt or the like. The deposition rate of the underlayer is equal to or lower than 0.7 nm/second. The magnetic layer contains added silicon oxide at 1 to 10 mol %. The present method includes a step for subjecting the surface of the underlayer to Ar gas mixed with oxygen of a mass/flow rate ratio of 1% to 10% under a gas pressure of 0.1 to 10 Pa for 1 to 10 second(s). The magnetic recording medium may include an orientation control layer and a soft magnetic backing layer. Ku, Ku1, and Ku2 are controlled to provide both of thermal stability and easy writing.

Abstract: A method of forming a CNT containing wiring material is conducted by sputtering simultaneously CNT and a metal material on a surface of a substrate to form a CNT containing metal layer, then pattern-etching the CNT containing metal layer to form a wiring pattern. A sputtering target material having a metal material and CNT is used in the method.

Abstract: A cathode potential is applied to a conductive layer formed on a substrate having a depression pattern. A plating solution in electrical contact with an anode is supplied to the conductive layer to form a plating film on the conductive layer. At this time, the plating solution is supplied by causing an impregnated member containing the plating solution to face the conductive layer. Since the plating solution stays in the depression, a larger amount of plating solution is supplied than on the upper surface of the substrate, and the plating rate of the plating film in the depression increases. Consequently, the plating film can be preferentially formed in the depression such as a groove or hole.

Abstract: The invention relates to a method for operating a magnetron sputter cathode, in particular a tube cathode or several tube cathodes forming an array. In such cathodes a target passes through a magnetic field, whereby induction currents flow in the target which distort the magnetic field. This results in the nonuniform coating of a substrate. By having the relative movement between magnetic field and target alternately reverse its direction, the effect of the magnetic field distortion can be compensated. This yields greater uniformity of the coating on a substrate to be coated.

Abstract: An electrolytic copper plating process comprising two steps is proposed. The process is particularly suited to plating in very confined spaces. The first step comprises a pre-treatment solution comprising an anti-suppressor that comprises a sulfur containing organic compound, preferably incorporating an alkane sulfonate group or groups and/or an alkane sulfonic acid. The second step comprises an electrolytic copper plating solution based on an alkane sulfonic acid.

Abstract: A substrate processing system has a housing that defines a process chamber. A substrate holder disposed within the process chamber supports a substrate during substrate processing. A gas-delivery system introduces a gas into the process chamber. A pressure-control system maintains a selected pressure within the process chamber. A high-density plasma generating system forms a plasma having a density greater than 1011 ions/cm3 within the process chamber. A radio-frequency bias system generates an electrical bias on the substrate at a frequency less than 5 MHz. A controller controls the gas-delivery system, the pressure-control system, the high-density plasma generating system, and the radio-frequency bias system.

Abstract: Replacing liquid electrolytes with solid or quasi-solid electrolytes facilitates the production of photovoltaic cells using continuous manufacturing processes, such as roll-to-roll or web processes, thus creating inexpensive, lightweight photovoltaic cells using flexible plastic substrates.