Abstract: A processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as the pallet is rotating. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate back and forth across an arc over their respective targets for uniform target erosion and uniform deposition on the wafers.

Abstract: The electrode cartridge for measuring an internal stress of a film of plating includes a cathode support, an anode support, a shield plate and an anode shell. The anode support supports an anode plate so that the anode plate is opposite to the cathode plate with a predetermined spacing. The shield plate is interposed between the cathode and anode plates. A through hole is made in the shield plate in such a manner that the through hole confronts a plating section and has a geometry which is reduced by a first predetermined scale factor relative to a geometry of the plating section. An opening is made in the anode shell in such a manner that the opening confronts the plating section and has a geometry which is magnified by a second predetermined scale factor relative to the geometry of the plating section.

Abstract: Polymeric compounds and related methods and apparatus, as can be used in a wide range of RNA and DNA separations.

Abstract: Disclosed are an apparatus and a method for determining whether or not a biosensor comprising two working electrodes and one reference electrode is well manufactured, and for rapidly and accurately quantifying a specific substance contained in a biological sample. The method comprises the steps of: sequentially supplying the respective working electrodes with power supply voltage; sequentially detecting the amounts of current flowing in the respective working electrodes by virtue of the supplied power supply voltage; re-supplying the two working electrodes with power supply voltage after a predetermined time to redetect the amounts of current flowing in the respective working electrodes; reading concentrations corresponding to the amounts of current detected from a memory, and calculating an average value from the read concentrations; and checking whether or not the concentrations read from memory are within a predetermined critical range to display an error message or the calculated average value.

Abstract: Disclosed is a system and a method for manufacturing flexible copper clad laminate film capable of efficiently electroplating both surfaces of a polyimide-based film to form copper plating layers thereon while making it easy to repair and maintain the apparatus or clean its plating or cleaning bath. The system includes a pickling device adapted to spray a pickling liquid to both surfaces of a to-be-plated film to remove oxide coatings from the copper coatings; a number of water-cleaning devices for removing the pickling liquid and copper electrolyte remaining on the film; at least one plating device positioned between the water-cleaning devices to form copper plating layers on both surfaces of the film; an antirust device for preventing the copper plating layers, which have been formed by the plating device, from rusting; and a drying device for drying the antirust liquid on the film, which has been subjected to antirust treatment.

Abstract: An electrochemical sensor for corrosive gases that contains at least two electrodes is described. The presence of a target corrosive gas results in the formation of metal ions that can be reduced at an electrode producing an electrical current that depends on the instantaneous corrosive gas concentration and deposition of the metal on the electrode. Extension of this deposit to a second electrode through further deposition will result in a short circuit, the longer the time to the short circuit, the lower the cumulative corrosive gas concentration.

Abstract: An improved plating system comprises a plurality of non-electrically conductive shields forming an elongated upper channel and an elongated lower channel, the upper and lower channels each having a width less than or equal to one inch; a plurality of part holding clamps electrically coupled to a power source and positioned within the upper channel or the lower channel; a plating solution sparger comprising a series of inlets oriented to direct any plating solution flowing through the inlets into the lower channel and towards the upper channel; and a plurality of anodes positioned outside and along the length of the upper and lower channels.

Abstract: A liquid and a gas is constantly filled into a target chamber of a target. Then the liquid and the gas flow around the chamber and are flown out. By doing so, the target is effectively cooled down.

Abstract: Multi-layer fabrication methods (e.g. electrochemical fabrication methods) for forming microscale and mesoscale devices or structures (e.g. turbines) provide bushings or roller bearing that allow rotational or linear motion which is constrained by multiple structural elements spaced from one another by gaps that are effectively less than minimum features sizes associated with the individual layers used to form the structures. In some embodiments, features or protrusions formed on different layers on opposing surfaces are offset along the axis of layer stacking so as to bring the features into positions that are closer than allowed by the minimum features sizes associated with individual layers. In other embodiments, interference is used to create effective spacings that are less than the minimum features sizes.

Abstract: A method for fabricating a conductive bump structure of a circuit board is disclosed. The circuit board with a plurality of electrical connection pads is provided. An insulating protective layer and a resist layer are successively applied on the circuit board, wherein openings are formed in the layers at positions corresponding to the pads to expose the pads. Then, a conductive layer is formed on surfaces of the resist layer and openings, and a metal layer is formed on the conductive layer via electroplating and filled in the openings. Subsequently, the metal layer and conductive layer formed on the resist layer are removed via thinning, so as to form metal bumps on the pads. After the resist layer is removed, the metal bumps are covered by an adhesive layer to form a conductive bump structure for electrically connecting the circuit board to the external electronic component.

Abstract: Embodiments of the invention provide a method for plating copper into features formed on a semiconductor substrate. The method includes positioning the substrate in a plating cell, wherein the plating cell includes a catholyte volume containing a catholyte solution, an anolyte volume containing an anolyte solution, an ionic membrane positioned to separate the anolyte volume from the catholyte volume, and an anode positioned in the anolyte volume. The method further includes applying a plating bias between the anode and the substrate, plating copper ions onto the substrate from the catholyte solution, and replenishing the copper ions plated onto the substrate from the catholyte solution with copper ions transported from the anolyte solution via the ionic membrane, wherein the catholyte solution has a copper concentration of greater than about 51 g/L.

Abstract: The present invention relates to a method of manufacturing a printed circuit board using an imprinting process, in which a pattern having a large area can be uniformly formed using a plurality of molds, and the plurality of molds is sequentially removed, thereby solving problems occurring in release of the molds from an insulating layer.

Abstract: A method for fabricating metal wires is disclosed. A substrate is first provided, and a first metal layer is formed over the surface of the substrate. Next, a mask with patterns is formed on the surface of the substrate, in which the first metal layer is partially exposed. Next, an electroplating process is performed to form a second metal layer on top of the partially exposed first metal layer. Next, the mask with patterns is removed and an etching process is performed to remove part of the first metal layer by utilizing the second metal layer as a mask for forming a metal wire.

Abstract: A disposable microsensor is designed, fabricated and tested for standard BOD (Biochemical Oxygen Demand) measurements. A transparent Cyclic Olefin Copolymer (COC) substrate is used for sensor fabrication. Standard lithographic procedures in addition to techniques like screen printing and electroplating are used to fabricate the sensor. A microbial strain of Trichosporon Cutaneum is immobilized over one pair of sensor electrodes while the other is used as a reference. Depending on the respiratory activities of the microbial strain in different samples, the BOD values of the samples can be measured in terms of difference between the output signals. The sensor layer is attached to an injection-molded passive microfluidic channel on the top. Advantages of the BOD microsensor include, but are not limited to, fast BOD measurement, disposability because of its low cost, chemically inert polymer substrate, flow-through sample injection scheme and integration of on-chip optics.

Abstract: Disclosed is a thermoelectric material comprising a main phase which is represented by the following composition formula and having an MgAgAs-type crystalline structure: (Ta1Zrb1Hfc1)xCoySb100-x-y wherein 0<a1<1, 0<b1<1, 0<c1<1, a1+b1+c1=1, 30?x ?35, and 30?y?35.

Abstract: An ink for forming CIGS photovoltaic cell active layers is disclosed along with methods for making the ink, methods for making the active layers and a solar cell made with the active layer. The ink contains a mixture of nanoparticles of elements of groups IB, IIIA and (optionally) VIA. The particles are in a desired particle size range of between about 1 nm and about 500 nm in diameter, where a majority of the mass of the particles comprises particles ranging in size from no more than about 40% above or below an average particle size or, if the average particle size is less than about 5 nanometers, from no more than about 2 nanometers above or below the average particle size. The use of such ink avoids the need to expose the material to an H2Se gas during the construction of a photovoltaic cell and allows more uniform melting during film annealing, more uniform intermixing of nanoparticles, and allows higher quality absorber films to be formed.

Abstract: A reference electrode including a water-impermeable, non-conductive substrate having a surface; an electrically conductive metal/metal salt mixture layer in contact with the surface; a water-soluble alkali metal salt layer; and a water-impermeable barrier layer overlaying a portion of the alkali metal salt layer and a portion of the metal/metal salt layer, and a method for preparing same are described. When the reference electrode is placed in a water sample to be tested, water enters the exposed portion of the alkali metal salt layer where it dissolves the salt forming a saturated solution in the region of contact between the alkali metal salt layer and the metal/metal salt layer.

Abstract: A measuring device for the detection and determination of the concentration of at least one analyte in a liquid medium consists of a polymeric carrier having biologically active specific binding molecules dried on its upstream portion. A multiple electrode set consisting of at least one reference electrode and at least one working electrode is located thereon in a downstream region. The working electrode is provided with biologically active specific binding molecules. The carrier has a sample application zone, which is adjoined, in the downstream direction, by a non-deformable, through-flow reaction and detection chamber, a variably dimensioned interstice, and a liquid absorption element. For a qualitative and quantitative analyte determination, two liquid media are applied in succession to the sample application zone. While the first can contain the wanted analyte, the second provides for the formation of an electrical signal.

Abstract: Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.

Abstract: A method for making a gasket (32) for an internal combustion engine (20) includes forming a generally annual stopper (38) on a metallic gasket body (40) through the process of electrochemical deposition. An electrolytic cell is completed with the gasket body (40) forming a cathode. The stopper (38) is formed with a contoured compression surface (42) by selectively varying the electrical energy delivered to selected electrodes (70) over time. Electrolyte (48) rich with metallic ions is pumped at high speed through the inter-electrode gap. A PC controller (82) switches selected electrodes (70) ON at certain times, for certain durations, which cause metallic ions in the electrolyte (48) to reduce or deposit onto the gasket body (40), which are built in columns or layers into a three-dimensional formation approximating the target surface profile (106) for the compression surface (42). The subject method for building a three-dimensional formation can be applied to work parts other than cylinder head gaskets (32).