Patents Examined by Nam X. Nguyen
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Patent number: 7569128Abstract: A sensor for detecting water vapor in a gaseous sample. The sensor comprises (a) an anode, (b) a cathode, (c) an electrolyte intermediate the anode and cathode, and (d) an inlet orifice through a central area of the anode or cathode through which the gaseous sample may be placed into contact with the electrolyte. The electrolyte can be retained on a porous electrical-insulating separator located between the interior-facing major surfaces of the anode and the cathode.Type: GrantFiled: December 14, 2004Date of Patent: August 4, 2009Assignee: Mocon, Inc.Inventors: Daniel W. Mayer, Stephen D. Tuomela
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Patent number: 7563348Abstract: An electroplating head including a chamber having a fluid entrance and a fluid exit is provided. The chamber is configured to contain a flow of electroplating solution from the fluid entrance to the fluid exit. The electroplating head also includes an anode disposed within the chamber. The anode is configured to be electrically connected to a power supply. The electroplating head further includes a porous resistive material disposed at the fluid exit such that the flow of electroplating solution is required to traverse through the porous resistive material.Type: GrantFiled: June 28, 2004Date of Patent: July 21, 2009Assignee: Lam Research CorporationInventors: Yezdi Dordi, Bob Maraschin, John Boyd, Fred C. Redeker
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Patent number: 7553400Abstract: A plating method is capable of mechanically and electrochemically preferentially depositing a plated film in fine interconnect recesses such as trenches and via holes, and depositing the plated film to a flatter surface. The plating method including: disposing a substrate having fine interconnect recesses such that a conductive layer faces an anode; disposing a porous member between the substrate and the anode; filling a plating solution between the substrate and the anode; and repeating a process of holding the conductive layer and the porous member in contact with each other and moving the conductive layer and the porous member relatively to each other, a process of passing an electric current between the conductive layer and the anode while keeping the conductive layer still with respect to the porous member, and a process of stopping the supply of the electric current between the conductive layer and the anode.Type: GrantFiled: December 21, 2004Date of Patent: June 30, 2009Assignees: Ebara Corporation, International Business Machines Corporation (IBM)Inventors: Mizuki Nagai, Hiroyuki Kanda, Keiichi Kurashina, Satoru Yamamoto, Ryoichi Kimizuka, Hariklia Deligianni, Brett Baker, Keith Kwietniak, Panayotis Andricacos, Phillipe Vereecken
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Patent number: 7544274Abstract: There is provided a plating method and device having a fixed drum (20) in which an anode (21) is exposed on the external peripheral surface; a rotating drum provided on the external periphery of the fixed drum, onto which a workpiece W transported in the longitudinal direction is wound; an annular opening (35) formed at the bottom of the rotating drum and provided so as to penetrate from the external periphery of the rotating drum to the internal periphery continuously in the peripheral direction of the rotating drum; a plating solution feeding channel (22) that leads into the fixed drum and is formed in a position on the external periphery of the fixed drum corresponding to the angle position (52a) of the prescribed arc of contact of the rotating drum onto which the workpiece is wound; a plating device for feeding the plating solution to the flow channel using the tunnel-shaped space (52) enclosed by the workpiece wound on the external periphery of the rotating drum, the peripheral wall of the annular openinType: GrantFiled: December 27, 2005Date of Patent: June 9, 2009Assignee: Dowa Metaltech Co., Ltd.Inventors: Hiroshi Miyazawa, Terumasa Inao
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Patent number: 7534337Abstract: A substrate before an insulation process, which is provided with a protection film to prevent a part of a surface area, which has electrical conductivity from being insulated, the substrate comprises: a base including the surface area, which has electrical conductivity; a protection film covering over the part of the surface area, which has electrical conductivity, and being formed on the base; the protection film including; a first protection layer having a circumferential partition wall and a second protection layer placed and embedded in an area, which is surrounded by the circumferential partition wall.Type: GrantFiled: January 26, 2006Date of Patent: May 19, 2009Assignee: Seiko Epson CorporationInventor: Hironori Hasei
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Patent number: 7531077Abstract: Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.Type: GrantFiled: January 3, 2005Date of Patent: May 12, 2009Assignee: Microfabrica Inc.Inventors: Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
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Patent number: 7531741Abstract: The present invention comprises a tracking solar power array that provides shelter to items disposed beneath the solar power array, particularly to vehicles.Type: GrantFiled: March 8, 2004Date of Patent: May 12, 2009Assignee: Sacred Power CorporationInventors: David S. Melton, Odes Armijo-Caster
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Patent number: 7527721Abstract: Multi-layer structures are electrochemically formed on porous dielectric substrates. In some embodiments, the substrates have at least one surface which is infiltrated with a sacrificial conductive material, all pores (e.g. openings in between dielectric regions of the substrate) or selected pores near the surface of the substrate are opened, and a structural material is deposited to fill at least a portion of the opened pores. If more pores are opened than have been filled or will be filled by the structural material a sacrificial material may be deposited to fill the additional pores. After completing formation of an initial patterned surface on the substrate, a plurality of layers are formed on the substrate (e.g. via electrodeposition operations) and after layer formation is complete, the conductive sacrificial material filling the pores is removed.Type: GrantFiled: May 7, 2004Date of Patent: May 5, 2009Assignee: Microfabrica Inc.Inventors: Pavel B. Lembrikov, Dennis R. Smalley, Adam L. Cohen
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Patent number: 7521630Abstract: A solar panel has n rows of solar cells in a regular grid array. The cells constituting each row are wired in parallel, the rows are wired in series and an equalizing network of n-1 capacitors are connected in electrical series. In a first configuration, a network of switches connects a first capacitor across the first row, and a second capacitor across the second row, and so on until the n-1th capacitor is connected across the cells of the n-1th row. In a second configuration, the switch network connects the first capacitor across the second row, and the second capacitor across the third row, and so on until the n-1th capacitor is connected across the nth row. This causes the voltage across each row to be substantially equal to the voltage across every other row. Since equal voltage is a hallmark of parallel connection, this voltage equalized series connection is referred to as a virtual parallel connection.Type: GrantFiled: March 1, 2007Date of Patent: April 21, 2009Inventor: Newton E. Ball
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Patent number: 7521629Abstract: A nitrogen-containing thermoelectric material, which has an element composition represented by: AlzGayInxMuRvOsNt??(A) or AlzGayInxMuRvDwNm??(B) (wherein M represents a transition element; R represents a rare earth element; D represents at least one element selected from elements of the Group IV or II; 0?z?0.7, 0?y?0.7, 0.2?x?1.0, 0?u?0.7, 0?v?0.05, 0.9?s+t?1.7, 0.4?s?1.2, 0?w?0.2, and 0.9?m?1.1; and x+y+z=1), and has an absolute value of a Seebeck coefficient of 40 ?V/K or more at a temperature of 100° C. or more. These thermoelectric materials comprise elements having low toxicity, are excellent in a heat resistance, a chemical resistance and the like, and have a high thermoelectric transforming efficiency.Type: GrantFiled: July 25, 2003Date of Patent: April 21, 2009Assignee: National Institute of Advanced Industrial Science and TechnologyInventors: Shigeo Yamaguchi, Yasuo Iwamura, Atsushi Yamamoto
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Patent number: 7520972Abstract: A process for making a mould piece having a main curved surface bearing an utilitary microstructure which comprises transferring a utilitary microstructure from a master piece main surface to a main surface of a flat cured elastomeric film; pressing the cured elastomeric film and a master article against each other so as to conform the overall shape of said cured elastomeric film to the curved shape of the main surface of the master article and to spread over a curable coating composition between the curved main surface of the master article and the main surface bearing the replica of the said utilitary microstructure of the cured elastomeric film; curing the coating composition; removing the cured elastomeric film and depositing a layer of a metal or a metallic alloy on the exposed main surface of the hard coating of the master article; and recovering said metal or metallic alloy layer to obtain a mould piece having a curved main surface bearing a replica of said transferred utilitary microstructure.Type: GrantFiled: June 30, 2003Date of Patent: April 21, 2009Assignee: Essilor InternationalInventors: Gerhard Keller, Mary Jane New, Kerim Yasan Arda, Philip John Rawlins, Allan Carmichael
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Patent number: 7517442Abstract: An ensemble of components and methods are disclosed for utilizing two-dimensional electrophoresis in polyacrylamide or related polymer gels using common, existing and familiar electrophoresis formats and equipment. The disclosed invention makes two-dimensional electrophoresis convenient and easy to use for individuals already using vertical “mini-gel” type systems. The invention discloses the combination of pre-cast disposable gels for both first and second separation dimensions using novel support devices and cassettes that simplify the difficult multiple sample handling and processing steps inherent in ordinary two-dimensional electrophoresis methods. Devices and methods are disclosed in said invention that provide exceptional gel to gel reproducibility.Type: GrantFiled: August 4, 2000Date of Patent: April 14, 2009Assignee: Life Technologies CorporationInventor: James T. Champagne
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Patent number: 7517437Abstract: A method and apparatus for sputter depositing a film on a substrate is disclosed. By providing a superimposed RF bias over a DC bias, plasma ionization is increased. In order to increase the resistive load across the substrate, an impedance circuit is provided between the substrate and the susceptor. The impedance circuit allows an insulating substrate to effectively function as an anode and connect to ground.Type: GrantFiled: March 29, 2006Date of Patent: April 14, 2009Assignee: Applied Materials, Inc.Inventor: Bassam Shamoun
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Patent number: 7513981Abstract: A load lock chamber (12) is connected in a front stage of a film forming chamber (11) through a damper and the like. A pipe to which a N2 gas and aeriform or fog-like H2O are supplied is connected to the load lock chamber (12). The pipe is led from a vaporizer (13). Inside the load lock chamber (12), a carrying section 15 on which a wafer (20) is placed is provided, whereas outside the load lock chamber (12), a cooler (14) cooling a carrying section (15) by means of liquid nitrogen is arranged. The temperature of the carrying section 15 is held at, for example, ?4° C.Type: GrantFiled: March 25, 2005Date of Patent: April 7, 2009Assignee: Fujitsu Microelectronics LimitedInventors: Kazutaka Miura, Shozo Noda
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Patent number: 7511217Abstract: An optoelectronic apparatus, a method for making the apparatus, and the use of the apparatus in an optoelectronic device are disclosed. The apparatus may include an active layer having a nanostructured network layer with a network of regularly spaced structures with spaces between neighboring structures. One or more network-filling materials are disposed in the spaces. At least one of the network-filling materials has complementary charge transfer properties with respect to the nanostructured network layer. An interfacial layer, configured to enhance an efficiency of the active layer, is disposed between the nanostructured network layer and the network-filling materials. The interfacial layer may be configured to provide (a) charge transfer between the two materials that exhibits different rates for forward versus backward transport; (b) differential light absorption to extend a range of wavelengths that the active layer can absorb; or (c) enhanced light absorption, which may be coupled with charge injection.Type: GrantFiled: April 19, 2003Date of Patent: March 31, 2009Assignee: Nanosolar, Inc.Inventors: Martin R. Roscheisen, Brian M. Sager, Klaus Petritsch, Jacqueline Fidanza
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Patent number: 7507320Abstract: This invention discloses an electrochemical method for the preparation of single atom tips to replace the traditional vacuum evaporation method. The invented method for preparation of single atom tips includes the following steps: A substrate single crystal metal wire etched electrochemically to form a tip. The surface of the metal tip is cleaned. A small quantity of noble metal is plated on the apex of the tip in low concentration noble metal electrolyte. Annealing in vacuum or in inert gas ambient to diffuse the additional electroplated noble metal atoms and thus a single atom tip is formed on the surface of the substrate. The present invention also discloses the single atom tip so prepared. The single atom tip of this invention has only a very small number of atoms, usually only one atom, at its apex.Type: GrantFiled: October 9, 2004Date of Patent: March 24, 2009Assignee: Academia SinicaInventors: Ing-Shouh Hwang, Hong-Shi Kuo, Tien T. Tsong, Tsu-Yi Fu
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Patent number: 7507903Abstract: This invention comprises deposition of thin film photovoltaic junctions on metal substrates which can be heat treated following deposition in a continuous fashion without deterioration of the metal support structure. In a separate operation an interconnection substrate structure is produced in a continuous roll-to-roll fashion. In this way the interconnection substrate structure can be uniquely formulated from polymer-based materials since it does not have to endure high temperature exposure. Cells comprising the metal foil supported photovoltaic junctions are then laminated to the interconnection substrate structure. Conductive interconnections are deposited to complete the array. The conductive interconnections can be accomplished with a separately prepared interconnection component.Type: GrantFiled: October 8, 2003Date of Patent: March 24, 2009Inventor: Daniel Luch
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Patent number: 7504014Abstract: The present invention generally relates to circuits on the nanotechnology scale. Specifically, it is directed to methods of fabricating carbon nanotube-based (i.e., CNT-based) circuits. The method involves providing a mixture of carbon nanotubes that is substantially disaggregated and patterning carbon nanotubes through the use of electrostatic forces. Carbon nanotubes in the mixture are typically disaggregated through the introduction of positive charge on the individual nanotubes. The patterning of the carbon nanotubes is typically accomplished using electrostatic attraction between pre-formed metal lines and the charged carbon nanotubes.Type: GrantFiled: March 15, 2005Date of Patent: March 17, 2009Assignee: Fujitsu LimitedInventors: Michael G. Lee, Kishio Yokouchi
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Patent number: 7501049Abstract: ECM machine for electrochemically machining metallic workpieces by anodic dissolution of the workpiece by means of an electrolyte and an applied dc voltage, comprising at least one revolving table for mounting the workpiece or a workpiece carrier, as well as a portal with a transverse girder, at which one or two cathodes are provided, the at least one revolving table being rotatable about a vertical axis and being movable along horizontal guides linearly with respect to the revolving table. The transverse girder is movable vertically at vertical guides of the portal, transverse girder being rotatable about a horizontal axis of rotation. The cathode or cathodes are clampable each at one or at a common clamping device at the transverse girder and/or movable linearly along the transverse girder at least at one horizontal guide.Type: GrantFiled: August 17, 2005Date of Patent: March 10, 2009Assignee: Leistritz AktiengesellschaftInventor: Georg Schmidt
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Patent number: 7501572Abstract: This invention deals with novel method and apparatus for positioning and motion control of a solar cell system that tracks the sun or other light source. This achieves an advantageous increase in output power. The torque to produce angular deflection, and rotational motion is provided separately by an induced and/or permanent dipole coupling to an electronic grid. Thus forces and torques are produced without the use of internal moving parts such as in motors. The instant invention exceeds the capability of conventional systems. It is suited for maximization of solar energy with an ideally low-profile tracking solar cell array. Since there are no motors or other heavy and expensive equipment, the instant invention provides less costly and greater ease of manufacture, transportation, and installation. Dynamic motion can be controlled over a wide range of dimensions from micrometers to decimeters.Type: GrantFiled: December 31, 2007Date of Patent: March 10, 2009Inventor: Mario Rabinowitz