Abstract: A bi-directional pig apparatus for removing wax and hydrate deposits in subsea hydrocarbon production flowlines including a pig arranged for movement inside a pipe, the pig having a tubular body and one or more magnets arranged in a circumferential wall of said body, each of the one or more magnets includes an elongated bar having a succession of teeth and slots, arranged such that the succession of teeth are facing radially outwards. The apparatus having a through-going opening between opposite ends of said tubular body to allow fluids (F) in the pipe to flow through and propulsion means arranged and configured for imparting a motive force to the pig, whereby the pig is movable inside the pipe.

Abstract: The application describes several methods and an apparatus for treatment of a substrate. In those methods, at least one liquid is applied thereto and electromagnetic radiation is generated in the liquid by means of radiation before applying the liquid to the substrate. Electromagnetic radiation is introduced into the film such that at least a portion of the radiation reaches the substrate surface. In another method for changing the surface characteristics of a substrate having an at least partially hydrophobic substrate surface such that at least a portion of said surface gets a hydrophilic surface characteristic, a liquid is applied to at least the partial area of the surface of the substrate, and UV radiation of a predetermined wavelength is guided onto at least the partial area of the surface of said substrate.

Abstract: A plasma etching apparatus includes an electrostatic chuck and an etching gas supply unit for supplying an etching gas to a processing space between a first and a second electrode to perform a dry etching process on the target object. The apparatus further includes a cleaning gas supply unit for supplying a cleaning gas to a processing space; a first high frequency power supply unit for supplying a first high frequency power to the first electrode; and a controller for controlling the first high frequency power supply unit such that a first period during which the first high frequency power has a first amplitude that generates the plasma and a second period during which the first high frequency power has a second amplitude that generates substantially no plasma are alternately repeated at a specific cycle when the plasma cleaning is performed in the processing chamber without the target object.

Abstract: Described herein is a method for removing coke deposits in radiant tubes of an olefin cracking furnace and removing accumulated spalled coke from one or more outlet elbows of the olefin cracking furnace without performing a cold shutdown of the furnace.

Abstract: A device for cleaning ionizing electrodes includes a coil spring fixedly mounted at opposite ends, and an ionizing electrode operable by an actuator plunger for reciprocating movement relative to an axis of the coil spring along a line that extends from an outer periphery of the spring toward an inner periphery thereof, whereby during each reciprocating movement a tip of the electrode penetrates a complete cross-section of the coil spring so as to intersect the adjacent coils at opposing extremities thereof each of which is thereby able to collect dust and other waste deposits from the electrode.

Abstract: A dishwasher including a washing chamber to wash dishes, a sump concavely formed at a lower portion of the washing chamber to collect water used in washing, a microfilter disposed at the sump to filter out dirt produced when the dishes are washed, and an ultrasonic generator to radiate ultrasonic waves toward the microfilter. Since the microfilter is automatically cleaned by the ultrasonic generator, a user may not need to manually clean the microfilter.

Abstract: A surgical instrument configured for insertion through a surgical access device including a seal member is disclosed. The surgical instrument includes an elongate body having a central passageway extending at least partially therethrough and a plurality of slots extending radially outward from the central passageway. The plurality of slots are configured to engage the seal member and the surgical access device when the elongate body is translated therethrough to remove debris from the seal member and the surgical access device. The plurality of slots and the central passageway are configured to retain the removed debris therein during withdrawal of the surgical instrument from the surgical access device.

Abstract: The present invention relates to a process for the removal of polymer thermosets from the substrates without damaging the substrates. The present invention relates to a process for the removal of polymer thermoset from the substrate retaining the physical and chemical properties of the substrates. The present invention more particularly relates to the use of bio molecules for cleaving polymer thermosets and the process to perform the cleaving.

Abstract: A substrate treatment method includes a substrate holding unit which horizontally holds a substrate; a rotating unit which rotates the substrate held by the substrate holding unit about a vertical axis; and a first nozzle having an opposing face to be opposed to a lower surface of the substrate inward of a peripheral portion of the substrate in spaced relation to the lower surface of the substrate during rotation of the substrate by the rotating unit and a treatment liquid spout provided in the opposing face for filling a space defined between the lower surface of the substrate and the opposing face with a treatment liquid spouted from the treatment liquid spout to keep the space in a liquid filled state; wherein the treatment liquid spreads outwardly over the lower surface of the substrate and further, flows around to a peripheral portion of an upper surface of the substrate.

Abstract: A device for removing secretions from an artificial tube is provided. The device may include a clearing catheter and a driving mechanism that may apply repetitive motion to the clearing catheter. In another version of the device, the clearing catheter may dispense irrigation fluid and aspirate the irrigation fluid. The clearing catheter may have an irrigation and an aspiration lumen that may both reciprocate with the clearing catheter. In another version a compliant member into which irrigation fluid is located may be present.

Abstract: To provide a cleaning method which makes it possible to reduce alkaline component mixing in an ozone cleaning solution, thereby preventing impairment of cleaning ability of ozone. In the cleaning method, before chuck members retain another workpiece having previously been dipped in an ozone cleaning solution in an ozone cleaning tank, alkaline component attached to part of transfer arms and the chuck members is removed by cleaning, thereby preventing the alkaline component from mixing into the ozone cleaning solution.

Abstract: A wire made up of a plurality of wire strands is wound around a tubular body coupled to a distal end working unit. A fixing pin has a through hole through which the wire is inserted. The fixing pin is fitted into a recess disposed in a side surface of the tubular body. The fixing pin is welded to the tubular body and the wire. The melting point of the wire is higher than the melting point of the fixing pin. In a state where material of the fixing pin flows in between the wire strands, the fixing pin and the wire are joined together.

Abstract: Embodiments of the invention include methods for in-situ chamber dry cleaning a plasma processing chamber utilized for gate structure fabrication process in semiconductor devices. In one embodiment, a method for in-situ chamber dry clean includes supplying a first cleaning gas including at least a boron containing gas into a processing chamber in absence of a substrate disposed therein, supplying a second cleaning gas including at least a halogen containing gas into the processing chamber in absence of the substrate, and supplying a third cleaning gas including at least an oxygen containing gas into the processing chamber in absence of the substrate.

Abstract: The present invention provides a cleaning brush and a cleaning apparatus that can effectively discharge dust, removed from a dresser disk of a CMP apparatus upon cleaning the dresser disk, to the outside of the cleaning system in order to prevent the dust from being again deposited on the dresser disk. A cleaning brush includes a large number of brushes formed to protrude on its top surface, vertical through-holes and into which a nozzle for ejecting a cleaning fluid is inserted, and a recessed groove formed on a lower surface that lower ends of the through-holes and face. It is configured such that dust deposited onto the brushes upon cleaning the dresser disk is discharged to outside from the recessed groove through a gap between the surrounding of the nozzle and the inner surface of the through-holes and together with the cleaning fluid.

Abstract: A coating removing device includes a coating thickness gauge configured for detecting a thickness of a coating layer formed on a surface of a article. A controller configured for determining an intensity of a laser beam needed to be emitted according to the thickness of the coating layer detected by the coating thickness gauge. In addition, a laser emitter emits the laser beam to the coating layer to remove the coating layer, the laser beam having the intensity determined according to the thickness of the coating layer. The intensity and energy of the laser beam arrived the surface of the article is changed over the coating thickness on the surface, the coated adhesive layer of the PCB is removed, and the appearance of the PCB will not be damaged.

Abstract: A pipeline cleaning system can include a pipeline cleaning apparatus with at least one fluid director that causes fluid which flows through the fluid director to repeatedly change direction. A method of cleaning a pipeline can include inserting a pipeline cleaning apparatus into the pipeline, flowing a fluid, thereby causing the fluid to be discharged from the pipeline cleaning apparatus into the pipeline, and a fluid director of the pipeline cleaning apparatus repeatedly changing a direction of discharge of the fluid from the pipeline cleaning apparatus. A pipeline cleaning apparatus can include a housing adapted for insertion into a pipeline, and at least one fluid director that repeatedly changes a direction of discharge of fluid from the pipeline cleaning apparatus, in response to flow of the fluid through the apparatus.

Abstract: The invention relates to a method for the removal of coatings from scrap materials (3), wherein the scrap (3) is brought into contact with a liquid and, while the coating removal process is performed, moves within a conveying trough (2) of a vibrating conveyor (1) in a direction (6) from the inlet end (7) towards the outlet end (8) of said conveying trough (2). The invention is of special importance for the dezincing of steel scrap. The method operates on a continuous basis with the removal of coatings being efficiently accomplished.

Abstract: A brush for dislodging impurities on steam relief screen basket within an operating vessel including at least one brush that includes an elongated support column with a brush attached to a first end of the elongated support column extends out of a seal located on a removable vessel cover of the vessel. The steps using the brush to dislodge impurities on steam relief screen basket include locating the brush comprised of a plurality of bristles adjacent to the steam relief screen basket, contacting the brush with the screen basket, extending the elongated support column through the seal, closing the removable vessel cover of the vessel to avoid pressure drop inside the vessel, and moving the brush from a first location on the screen basket to a second location on the screen basket to dislodge impurities attached to the screen basket.

Abstract: Embodiments of mechanisms for cleaning a wafer are provided. A method for cleaning a wafer includes cleaning a wafer by using a wafer scrubber and cleaning the wafer scrubber in a scrubber cleaning module. An agitated cleaning liquid is applied on the wafer scrubber to clean the wafer scrubber. The method also includes cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning liquid.

Abstract: Described embodiments include an unmanned aerial vehicle and a method. The unmanned aerial vehicle includes an airframe and a rotary wing system coupled with the airframe and configured to aerodynamically lift the vehicle in the air. The unmanned aerial vehicle includes a flight controller configured to control a movement of the vehicle while airborne. The unmanned aerial vehicle includes a cleansing controller configured to manage a removal of a surface contaminant from a selected portion of a surface of an external object using an airflow generated by the rotary wing system.