Patents Examined by Nga Leung V Law
  • Patent number: 10808312
    Abstract: An object of the present invention is to provide: a wiring method in which wiring is performed in a vacuum chamber of a charged particle device without using gas deposition or the like; and a charged particle device. In order to achieve the above-described object, the present invention proposes: a wiring method in which a wiring line composed of an ionic liquid is formed by dropping an ionic liquid on a sample or preparing an ionic liquid on a sample table, on which a sample is placed in advance, and irradiating a wiring track between a wiring start point and a wiring end point with a charged particle beam; and a charged particle device. According to this configuration, wiring can be performed in a vacuum chamber of a charged particle device without using a gas deposition method or the like.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: October 20, 2020
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Yoichiro Hashimoto, Eiko Nakazawa, Mami Konomi, Shuichi Takeuchi
  • Patent number: 10804094
    Abstract: Methods of forming SiCON films comprising sequential exposure to a silicon precursor and a mixture of alkanolamine and amine reactants and an optional plasma are described. Methods of forming a silicon-containing film comprising sequential exposure to a silicon precursor and an epoxide with an optional plasma exposure are also described.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: October 13, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Mark Saly, David Thompson, Thomas Knisley, Bhaskar Jyoti Bhuyan
  • Patent number: 10793942
    Abstract: A plasma spray system including a turntable subsystem operable to position a multiple of work pieces on a respective multiple of workpiece mounts; a plasma spray subsystem operable to plasma spray the multiple of work pieces on said turntable subsystem; and an overspray wash subsystem operable to wash the multiple of work pieces on said turntable subsystem subsequent to plasma spray of the multiple of work pieces.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: October 6, 2020
    Assignee: Raytheon Technologies Corporation
    Inventors: Brian T Hazel, Joseph A DePalma, Jessica L Serra, Henry H Thayer, Donn R Blankenship, Mario P Bochiechio, Paul H Zajchowski
  • Patent number: 10787825
    Abstract: A method for applying a layer of curable material to a surface including the steps of: applying the curable material to the surface; positioning a trowel relative to the surface so that a plurality of first radial teeth of the trowel, extending from a working edge of the trowel, is in contact with the surface; and with the plurality of first radial teeth in contact with the surface, moving the trowel across the surface to spread the curable material across the surface at a constant thickness.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: September 29, 2020
    Assignee: The Boeing Company
    Inventor: Chad D. Schmitz
  • Patent number: 10784111
    Abstract: A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is imparted selectively to the plateable material portion 32 by supplying a catalyst solution N1 onto the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by supplying a plating liquid M1 onto the substrate W. A pH of the catalyst solution N1 is previously adjusted such that the plating layer 35 is suppressed from being precipitated on the non-plateable material portion 31 while being facilitated to be precipitated on the plateable material portion 32.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: September 22, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yuichiro Inatomi, Takashi Tanaka, Kazutoshi Iwai
  • Patent number: 10775534
    Abstract: Methods of manufacturing a structure having at least one plated region and at least one unplated region. The method includes plating a metal on a polymer structure having a first region accepting the metal and a second region unreceptive to the metal plating. The first region may include fully-cured polymer optical waveguides and the second region may include partially-cured polymer optical waveguides. The first region may include a first polymer composition and the second region may include a second polymer composition different than the first polymer composition.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: September 15, 2020
    Assignee: HRL Laboratories, LLC
    Inventors: Jacob M. Hundley, Zak C. Eckel, Sophia S. Yang, Alan J. Jacobsen, William Carter
  • Patent number: 10775115
    Abstract: Thermal spray coating methods and thermal spray coated articles are disclosed. The thermal spray coating method includes positioning a covering on a cooling channel of a component, and thermal spraying a feedstock onto the covering. The covering prohibits the feedstock from entering the cooling channel in the component and is not removed from the component. In another embodiment, the thermal spray coating method includes providing a component comprising a substrate material, providing a cooling channel on a surface of the component, positioning a covering on the cooling channel, and thermal spraying a feedstock onto the component and the covering, the feedstock comprising a bond coat material. The covering prohibits the bond coat material from entering the cooling channel. The thermal spray coated article includes a component, a cooling channel, a covering on the cooling channel, and a thermally sprayed coating on the component and the covering.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: September 15, 2020
    Assignee: GENERAL ELECTRIC COMPANY
    Inventor: Jon Conrad Schaeffer
  • Patent number: 10766296
    Abstract: In a method for lacquering pencils by the push-through method, a respective pencil is guided through a lacquering chamber in order to apply a lacquer coat. After exiting the lacquering chamber, successive pencils butt against one another and are held against one another at their end sides such at a plurality of pencils form a stable strand which is guided, subsequent to the lacquering chamber, through a drying section, with the result that a respective pencil is held in a hovering manner on leaving the lacquering chamber. It is hereby in particular also made possible to use UV-curing lacquers, with the overall result that a very short total lacquering time for lacquering pencils, in particular cosmetic pencils, is achieved.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: September 8, 2020
    Assignee: SCHWAN-Stabilo Cosmetics GmbH & Co. KG
    Inventor: Juergen Reitenspies
  • Patent number: 10745793
    Abstract: A ceramic coating process comprises introducing a suspension including a fine ceramic particulate suspended in a liquid carrier into a plasma torch. The method includes melting the fine ceramic particulate in the plasma torch; propelling the fine ceramic particulate toward a substrate; and forming a coating on the substrate, the coating comprises splats of the fine ceramic particulate.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: August 18, 2020
    Assignee: Raytheon Technologies Corporation
    Inventors: Brian T Hazel, Mario P Bochiechio
  • Patent number: 10737358
    Abstract: The metallurgical composition of a machine surface may be determined. Based on the composition of the surface layer and its substrate materials, a mixture of pure metal nanoparticles, each coated with a monomolecular organic layer adsorbed on its surface can be mixed with catalysts, reaction initiators, and/or other necessary ingredients for the repair action of the machine surface, depending on the specific machine, operational type, and/or the nature of the damage. The nanoparticles are applied to the machine surface, the organic monolayer wears away from the nanoparticles under shear stresses and the nanoparticles adhere to the machine surface to form a repair layer on the machine surface, thereby providing a repaired surface.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: August 11, 2020
    Assignee: The George Washington University
    Inventor: Stephen Hsu
  • Patent number: 10730798
    Abstract: Disclosed herein are methods for producing an ultra-dense and ultra-smooth ceramic coating. A method includes feeding a slurry of ceramic particles into a plasma sprayer. The plasma sprayer generates a stream of particles directed toward the substrate, forming a ceramic coating on the substrate upon contact.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: August 4, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Jennifer Sun, Biraja Prasad Kanungo, Yikai Chen, Vahid Firouzdor
  • Patent number: 10727046
    Abstract: A method for performing gap fill of a feature on a substrate includes the following operations: (a) moving the substrate into a process chamber; (b) performing a plurality of cycles of an ALD process; (c) purging process gases from the ALD process from the process chamber; (d) performing a plasma treatment on the substrate by introducing a fluorine-containing gas into the process chamber and applying RF power to the fluorine-containing gas to generate a fluorine plasma in the process chamber; (e) purging process gases from the plasma treatment from the process chamber; (f) repeating operations (b) through (e) until a predefined number of cycles has been performed.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: July 28, 2020
    Assignee: Lam Research Corporation
    Inventors: Joseph Abel, Adrien Lavoie, Purushottam Kumar
  • Patent number: 10724131
    Abstract: A method of making a light weight component is provided. The method including the steps of: forming a metallic foam core into a desired configuration; and applying an external metallic shell to an exterior surface of the metallic foam core after it has been formed into the desired configuration.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: July 28, 2020
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventor: Gary D. Roberge
  • Patent number: 10689761
    Abstract: A plating method includes a first mask forming step of ejecting a UV-curable ink in the form of ink droplets from an inkjet head so as to have the ejected ink droplets land on a plating target object and to form a first plating mask on the plating target object, a catalyst applying step of applying a catalyst for deposition of plating material to the plating target object on which the first plating mask is formed, a second mask forming step of having the ink droplets land on the first plating mask so as to form a second plating mask on the first plating mask, a plating step of performing electroless plating to the plating target object subsequent to the second mask forming step, and a mask removing step of removing the first plating mask and the second plating mask from the plating target object subsequent to the plating step.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: June 23, 2020
    Assignee: MIMAKI ENGINEERING CO., LTD.
    Inventor: Masaru Ohnishi
  • Patent number: 10682664
    Abstract: In a microvolume-liquid dispenser, there is performed an application operation for dispensing a microvolume liquid present in an amount measured in nanoliters or picoliters from a nozzle tip-end opening and applying the microvolume liquid to an application surface. When the application operation has not been performed over a time interval longer than a set time interval ta, a tip-end liquid surface of an application liquid in the nozzle tip-end opening is caused to vibrate at a high amplitude that includes the position of a liquid surface height from immediately before application in the case of application at equal time intervals. The subsequently performed application operation is performed at a point in time when the liquid surface height has returned to the liquid surface height. The operation for applying the microvolume application liquid can be precisely performed in the same manner as when application is performed at equal time intervals.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: June 16, 2020
    Assignee: ENGINEERING SYSTEM CO., LTD.
    Inventors: Kazuki Tomita, Kentaro Fukuda
  • Patent number: 10662520
    Abstract: A method for recycling a substrate process component of a processing chamber is provided. In one example, the recycling process includes retrieving a reference dimension for the substrate process component. The substrate process component includes a side wall having a bottom surface, an outer surface, a pre-defined wall thickness between the bottom surface and the outer surface, and a residue layer. The reference dimension corresponds to the pre-defined wall thickness. The recycling process includes machining the substrate process component with a mechanical cutting tool. The machining includes securing the substrate process component to a work piece holder and passing the mechanical cutting tool across the outer surface in a machining operation controlled by a controller to remove the residue layer. The controller uses the reference dimension to control the machining operation so that the substrate process component has the reference dimension after removal of the residue layer.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: May 26, 2020
    Assignee: Applied Materials, Inc.
    Inventor: Brian T. West
  • Patent number: 10655206
    Abstract: Disclosed herein is a surface treatment method of a ceramic powder using microwave plasma in order to enhance flowability. The surface treatment method can be applied to a ceramic powder having a small particle size of 45 ?m or less and can significantly enhance flowability while reducing an influence on a particle size compared to a conventional method. Consequently, the ceramic particles surface-treated by the above-described surface treatment method can be formed to have a smooth and dense coating film without pores during spray coating.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: May 19, 2020
    Assignee: SEWON HARDFACING CO., LTD.
    Inventors: Heung Soo Moon, Pyoung Woo Shin, Sae Mee Park, Yong Cheol Hong, Se Min Chun, Dong Hun Shin
  • Patent number: 10660217
    Abstract: Provided herein is a method to printed electronics, and more particularly related to printed electronics on flexible, porous substrates. The method includes applying a coating compound comprising poly (4-vinylpyridine) (P4VP) and SU-8 dissolved in an organic alcohol solution to one or more surface of a flexible, porous substrate, curing the porous substrate at a temperature of at least 130° C. such that the porous substrate is coated with a layer of said coating compound, printing a jet of a transition metal salt catalyst solution onto one or more printing sides of the flexible, porous substrate to deposit a transition metal salt catalyst onto the one or more printing sides, and submerging the substrate in an electroless metal deposition solution to deposit the metal on the flexible, porous substrate, wherein the deposited metal induces the formation of one or more three-dimensional metal-fiber conductive structures within the flexible, porous substrate.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: May 19, 2020
    Inventors: Jun Yang, Tengyuan Zhang, Qiuquan Guo
  • Patent number: 10648081
    Abstract: The invention provides a method of burying trenches of a sample comprises at least the steps of: from the sample having the trenches extending from one surface into a depth direction, cutting a sample piece of a small part including the trenches; and by irradiating an electron beam toward the inside of the trenches from a side surface extending along the depth direction of the sample piece and simultaneously injecting a compound gas into the inside of the trenches from openings on the side of the one surface of the trench, decomposing the compound gas with secondary electrons generated by irradiation of the electron beam and depositing constituents of the compound gas within the trenches. Therefore, the method can bury the trenches uniformly without generating cavities within the trenches even if the trenches of the sample piece have a high aspect ratio deep in a depth direction.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: May 12, 2020
    Assignee: Hitachi High-Tech Science Corporation
    Inventor: Shota Torikawa
  • Patent number: 10640874
    Abstract: A method of performing electroless electrochemical atomic layer deposition is provided and includes: providing a substrate including an exposed upper metal layer; exposing the substrate to a first precursor solution to create a sacrificial metal monolayer on the exposed upper metal layer via underpotential deposition, where the first precursor solution is an aqueous solution including a reducing agent; subsequent to the forming of the sacrificial metal monolayer, rinsing the substrate; subsequent to the rinsing of the substrate, exposing the substrate to a second precursor solution to replace the sacrificial metal monolayer with a first deposition layer; and subsequent to replacing the sacrificial metal monolayer with the first deposition layer, rinsing the substrate. The exposure of the substrate to the first precursor solution and the exposure of the substrate to the second precursor solution are electroless processes.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: May 5, 2020
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Aniruddha Joi, Kailash Venkatraman, Yezdi Dordi