Abstract: The present invention relates to a method for recovering a precious metal selectively adsorbed on a porous porphyrin polymer, and to an electroless plating method capable of recovering a precious metal in a film form by desorbing and leaching the precious metal without an additional oxidizing agent and using same as a plating solution to reduce the precious metal on the surface of a substrate without an additional reducing agent.

Abstract: Method for metallising a porous structure made of carbon material, the method comprising the following steps: supplying a porous structure made of carbon material, immersing the porous structure in a solution comprising an ionic liquid, formed by a cation and an anion, and a metal precursor, placing the porous structure in a vacuum, immersed in the solution, in such a way as to cause the solution to penetrate into the porosity of the porous structure, adding a hydrogenated reducing agent, in such a way as to metallise the porous structure to within the porosity of the porous structure.

Abstract: A present invention provides a method for manufacturing a printed wiring board having excellent plating adhesion to a resin substrate having low surface roughness such as having surface roughness Ra of 0.2 ?m or less, having excellent treating solution stability, and having high penetrability into the resin substrate. The method for manufacturing a resin substrate includes a step 1A or a step 1B; and a step 2 after the step 1A or the step 1B; and the steps are conducted before conducting electroless plating.

Abstract: An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, including copper ions; a reducing agent; a complexing agent for copper ions; wherein the bath further includes at least one compound according to formula (1): in which Z1 and Z2 are independently selected from the group consisting of hydrogen; carboxylic acid; carboxylate; sulfonic acid; sulfonate; carboxamide; nitrile; nitro; trialkylammonium; 2-carboxyvinyl; 2-vinylcarboxylate; 2-(trialkylammonium)vinyl; hydroxamic acid; and oxime; provided at least one of Z1 and Z2 is not hydrogen; and in which R1, R2, R3 and R4 are: i. R1, R2, R3 and R4 are hydrogen; or ii. R1 with R2 form together an aromatic ring, R3 and R4 are hydrogen; or iii. R3 with R4 form together an aromatic ring, R1 and R2 are hydrogen; or iv. both R1 with R2 and R3 with R4 form together an aromatic ring, respectively.

Abstract: A fixture for masking a gas turbine engine blade, the blade having a root, a platform and an airfoil, the platform having inner and outer surfaces and peripheral faces extending between the surfaces, the fixture including a base with a receptacle for receiving the root of the blade; a removable sidewall mountable to the base to form a masking box with the receptacle that shields the root; a first removable Z plane detail mountable to the base, the first removable Z plane detail providing a first electrical contact point to the root; and a second removable Z plane detail mountable to the removable sidewall, the second removable Z plane detail providing a second electrical contact point to the root

Abstract: The present disclosure relates to methods of creating a biosensor. A palladium film is deposited onto a surface of a substrate. The palladium film is then treated with an air plasma to stabilize the palladium and reduce or eliminate its catalytic activity. The biosensor is created from the treated palladium film and the substrate.

Abstract: Method for gap fill includes performing in order the following: (a) performing, consecutively, a first plurality of cycles of an atomic layer deposition process on a substrate; (b) purging process gases from the atomic layer deposition process; (c) performing a first plasma treatment on the substrate by introducing a fluorine plasma in the process chamber; (d) purging process gases from the plasma treatment; (e) repeating, in order, operations (a) through (d) until a predefined plurality of cycles has been performed; (f) performing, consecutively, a second plurality of cycles of the atomic layer deposition process on the substrate; (g) purging process gases from the atomic layer deposition process; (h) performing a second plasma treatment on the substrate by introducing a fluorine plasma in the process chamber; (i) purging process gases from the plasma treatment; (j) repeating, in order, operations (f) through (i) until a predefined plurality of cycles has been performed.

Abstract: A method of marking a line includes providing a line marking apparatus including a body (21), a line marking head (29) movable relative to the body, and a positioning system (35, 37, 41, 43) for determining a geographical location of the line marking head. In addition, a mathematical model is provided for a line to be marked by the line marking head, the model being cumulatively updated in response to a position fix (61) obtained by the positioning system. The position of the line marking head is adjusted relative to the body in dependence upon the mathematical model.

Abstract: There is provided a film forming method of embedding a film in a groove formed in a front surface of a substrate, which includes: depositing an in-conformal film in the groove formed in the front surface of the substrate while forming a V-like cross-sectional shape in the groove; and embedding a conformal film in the groove by depositing the conformal film.

Abstract: Treating a reflective optical element (104) for the EUV wavelength range that has a reflective coating on a substrate. The reflective optical element in a holder (106) is irradiated with at least one radiation pulse of a radiation source (102) having a duration of between 1 ?s and 1 s. At least one radiation source (102) and the reflective optical element move relative to one another. Preferably, this is carried out directly after applying the reflective coating in a coating chamber (100). Reflective optical elements of this type are suitable in particular for use in EUV lithography or in EUV inspection of masks or wafers, for example.

Abstract: There is provision of a thermal spraying method of a component for a plasma processing apparatus performed by a plasma spraying apparatus including a nozzle and a plasma generating unit having a common axis with the nozzle. The method includes a step of injecting, with a plasma generating gas, feedstock powder having a particle diameter of 15 ?m or less from a tip of the nozzle to the plasma generating unit, a step of generating a plasma from the plasma generating gas in the plasma generating unit, by using electric power not more than 50 kW, and a step of thermal spraying the feedstock powder liquefied by the plasma at the component through a mask, such that a surface of a resin layer of the component is covered with the feedstock powder.

Abstract: A method for producing a plated part, includes: forming, on a surface of a base member, a catalyst activity inhibiting layer containing a polymer which has at least one of an amide group and an amino group; irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed; applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface.

Abstract: A plasma processing system includes processing modules, a transfer device connected to the processing modules, and a control unit for controlling an oxygen partial pressure and a water vapor partial pressure in the transfer device. The control unit controls the oxygen partial pressure and the water vapor partial pressure in the transfer device to 127 Pa or less and 24.1 Pa or less, respectively. The processing modules include a first processing module for performing etching on the target object, a second processing module for performing surface treatment on the target object, and a third processing module for performing a deposition process on the target object. The second processing module performs the surface treatment using hydrogen radicals generated by a high frequency antenna. The high frequency antenna resonates at one half of a wavelength of a signal supplied from a high frequency power supply used in the processing system.

Abstract: A novel method of depositing grit particles onto a fan blade tip coating is provided. The method enhances grit capture by presenting a softened coating surface for the impinging particles. The softened surface is achieved without high substrate temperatures that could degrade the base metal properties in the fan blade. An auxiliary heat source is used to establish a locally heated and softened surface where the grit deposition takes place. The softened surface greatly increases the probability of grit capture.

Abstract: A method of making a thermal control coating is provided. A primer layer can be applied to a substrate to form an exposed surface. The primer layer can include an epoxy binder and a silica filler. The exposed surface can be treated with an oxygen plasma to form a treated surface. A silicate-based thermal control coating can be applied to the treated surface, for example, by spraying, to form a thermal control coating on the substrate. Spacecraft and spacecraft hardware components coated with the thermal control coating, are also provided.

Abstract: A method that can plate a predetermined position on various plating targets without implementing a pretreatment thereon is provided. A plating method is performed on a plating target using a plating solution, and the plating method includes at least a bubble ejection step of ejecting a bubble generated by a bubble ejection member to a plating solution. The bubble ejection member includes an electrode formed of a conductive material and an insulating material covering at least a part of the electrode, at least a part of the insulating material forms a bubble ejection port, and an air gap surrounded by the insulating material is formed between at least a part of the electrode and the bubble ejection port.

Abstract: A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is selectively imparted to the plateable material portion 32 by performing a catalyst imparting processing on the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by supplying a plating liquid M1 onto the substrate W. The plating liquid M1 contains an inhibitor which suppresses the plating layer 35 from being precipitated on the non-plateable material portion 31.

Abstract: Methods of processing coated articles, such as transparencies, are provided comprising flash annealing one or more layers of the coated article. The one or more layers may be reflective metallic layers, such as silver layers, or comprise a transparent conductive oxide, such as indium tin oxide, or a semiconductor.

Abstract: Methods of processing coated articles, such as transparencies, are provided comprising flash annealing one or more layers of the coated article. The one or more layers may be reflective metallic layers, such as silver layers, or comprise a transparent conductive oxide, such as indium tin oxide, or a semiconductor.

Abstract: A method of forming a sprayed coating includes preparing a spray target member having a surface on which openings of first ends of holes are formed, preparing a plurality of masking pins each of which comprises metal, and inserting each of the masking pins into a corresponding one of the holes so that each of the masking pins partially protrudes from the surface. The method also includes applying an adhesive agent for fixing the masking pins to the respective holes, to at least one of the holes or the masking pins, forming a ceramic layer by spraying on the surface of the spraying target member, the ceramic layer comprising a ceramic material, while the masking pins are fixed to the respective holes via the adhesive agent, and removing the masking pins from the holes after the spraying step.