Abstract: A film formation method is provided with a catalyst film formation step for forming a catalyst film on the surface of a substrate by displacement reduction plating, an intermediate film formation step for forming a palladium plating film on the catalyst film, and a surface film formation step for forming a gold plating film on the palladium plating film.

Abstract: An arc wire spraying method includes conveying at least two wires out of respective lance nozzles of a wire conveying device by means of the wire conveying device, applying current to the two wires to form an arc for melting the ends of the two wires, and applying airflow to the arc in the direction transverse to the longitudinal direction of the wire conveying device by means of an airflow applying device so as to spray the melted wire material toward a surface to be sprayed. The airflow applying device rotationally applies the airflow around the longitudinal direction of the wire conveying device. Parameters for spraying are variably adjusted along the rotating direction of the airflow applying device. The airflow is rotationally applied at a varying rotating speed.

Abstract: The present disclosure is directed to methods for altering the surface of carbon fibers by growing carbon nanotubes thereon. Coverage of the carbon fibers by carbon nanotubes provides increased surface area and aspect ratio, as well as provides high electrical and thermal conductivity. In some embodiments, the surface of the carbon fibers are further modified via argon-ion bombardment or plasma treatment to provide controllable defects and to allow for easier growth of carbon nanotubes on the surface of the carbon fibers.

Abstract: The present invention relates to a method for directly depositing palladium onto a non-activated surface of a gallium nitride semiconductor, the use of an acidic palladium plating bath (as defined below) for directly depositing metallic palladium or a palladium alloy onto a non-activated surface of a doped or non-doped gallium nitride semiconductor, and a palladium or palladium alloy coated, doped or non-doped gallium nitride semiconductor.

Abstract: A substrate processing method is provided for performing a plating processing on a substrate having, on a surface thereof, an impurity-doped polysilicon film containing a high concentration of impurities. The substrate processing method includes forming a catalyst layer by supplying, onto the substrate, an alkaline catalyst solution containing a complex of a palladium ion and a monocyclic 5- or 6-membered heterocyclic compound having one or two nitrogen atoms as a heteroatom; and forming a plating layer through electroless plating by supplying a plating liquid onto the substrate after the forming of the catalyst layer.

Abstract: A method for producing a surface-modified component includes: a process of forming a thermal sprayed coating on a substrate; a process of irradiating a surface of the thermal sprayed coating with a high energy beam so as to cause an entirety of the thermal sprayed coating and a part of the substrate in a thickness direction to melt and then solidify, and thereby forming a densified modified layer; a process of forming a thermal sprayed coating on the modified layer which has been formed in the latest; and a process of irradiating a surface of the thermal sprayed coating with a high energy beam so as to cause an entirety of the thermal sprayed coating and a part of the modified layer which has been formed in the latest in the thickness direction to melt and then solidify, and thereby forming a densified modified layer.

Abstract: An electroless process for depositing gold (Au0) from a solution, comprising allowing gold (Au0) place from a solution of gold thiocyanate complex dissolved in a mixture of water-miscible organic solvent and water, or the deposition of gold (Au0) takes place on a deposition-directing layer comprising positively charged organic groups, said layer being provided on at least a portion of a surface of a substrate sought to be gold-coated.

Abstract: A plated plated fiber-reinforced member includes: a fiber-reinforced member formed of a composite fiber material in which multiple reinforcing fibers dispersed in a resin, some of the multiple reinforcing fibers being allowed so that portions thereof protruding from a surface of the resin; and an electroless-plated layer formed on the fiber-reinforced member to cover the surface of the resin and the portions of the reinforcing fibers protruded from the surface of the resin.

Abstract: A composite membrane for hydrogen separation and purification, including: a modified and activated support, a Palladium (Pd) layer, and an interstice layer between the second surface-modifying layer and the Pd layer. The support includes a support substrate, a first surface-modifying layer on the support substrate, and a second surface-modifying layer on the first surface-modifying layer.

Abstract: A method that includes introducing a suspension comprising a coating material and a carrier into a heated plume of a thermal spray device. The coating material may include silicon or a silicon alloy. The method further includes directing the coating material using the heated plume toward a substrate that includes a ceramic or a ceramic matrix composite and depositing the coating material to form a bond coat directly on the substrate such that the bond coat defines a porosity of less than about 3 percent by volume.

Abstract: A method of forming an impurity barrier layer on a CMC substrate may include introducing, to a heated plume of a thermal spray gun, a composite feedstock that includes a first coating material including a plurality of first particles; and a second coating material that may be different from the first coating material, where the second coating material at least partially encapsulates at least a portion of respective surfaces of the plurality of first particles; and directing, using the heated plume, at least the first coating material to a surface of a CMC substrate to deposit an impurity barrier layer including at least the first coating material.

Abstract: A method for producing metal structures includes an initiator composition comprising a photocatalytic substance being applied to a substrate. A precursor composition that can be reduced to a metal by the photocatalytic activity of the nanodusts is applied to the layer. A structure template is then applied, partially displacing the precursor composition, and then the substrate is illuminated. Structured metal structures are thus generated.

Abstract: An object of the present invention is to provide: a wiring method in which wiring is performed in a vacuum chamber of a charged particle device without using gas deposition or the like; and a charged particle device. In order to achieve the above-described object, the present invention proposes: a wiring method in which a wiring line composed of an ionic liquid is formed by dropping an ionic liquid on a sample or preparing an ionic liquid on a sample table, on which a sample is placed in advance, and irradiating a wiring track between a wiring start point and a wiring end point with a charged particle beam; and a charged particle device. According to this configuration, wiring can be performed in a vacuum chamber of a charged particle device without using a gas deposition method or the like.

Abstract: Methods of forming SiCON films comprising sequential exposure to a silicon precursor and a mixture of alkanolamine and amine reactants and an optional plasma are described. Methods of forming a silicon-containing film comprising sequential exposure to a silicon precursor and an epoxide with an optional plasma exposure are also described.

Abstract: A plasma spray system including a turntable subsystem operable to position a multiple of work pieces on a respective multiple of workpiece mounts; a plasma spray subsystem operable to plasma spray the multiple of work pieces on said turntable subsystem; and an overspray wash subsystem operable to wash the multiple of work pieces on said turntable subsystem subsequent to plasma spray of the multiple of work pieces.

Abstract: A method for applying a layer of curable material to a surface including the steps of: applying the curable material to the surface; positioning a trowel relative to the surface so that a plurality of first radial teeth of the trowel, extending from a working edge of the trowel, is in contact with the surface; and with the plurality of first radial teeth in contact with the surface, moving the trowel across the surface to spread the curable material across the surface at a constant thickness.

Abstract: A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is imparted selectively to the plateable material portion 32 by supplying a catalyst solution N1 onto the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by supplying a plating liquid M1 onto the substrate W. A pH of the catalyst solution N1 is previously adjusted such that the plating layer 35 is suppressed from being precipitated on the non-plateable material portion 31 while being facilitated to be precipitated on the plateable material portion 32.

Abstract: Methods of manufacturing a structure having at least one plated region and at least one unplated region. The method includes plating a metal on a polymer structure having a first region accepting the metal and a second region unreceptive to the metal plating. The first region may include fully-cured polymer optical waveguides and the second region may include partially-cured polymer optical waveguides. The first region may include a first polymer composition and the second region may include a second polymer composition different than the first polymer composition.

Abstract: Thermal spray coating methods and thermal spray coated articles are disclosed. The thermal spray coating method includes positioning a covering on a cooling channel of a component, and thermal spraying a feedstock onto the covering. The covering prohibits the feedstock from entering the cooling channel in the component and is not removed from the component. In another embodiment, the thermal spray coating method includes providing a component comprising a substrate material, providing a cooling channel on a surface of the component, positioning a covering on the cooling channel, and thermal spraying a feedstock onto the component and the covering, the feedstock comprising a bond coat material. The covering prohibits the bond coat material from entering the cooling channel. The thermal spray coated article includes a component, a cooling channel, a covering on the cooling channel, and a thermally sprayed coating on the component and the covering.

Abstract: In a method for lacquering pencils by the push-through method, a respective pencil is guided through a lacquering chamber in order to apply a lacquer coat. After exiting the lacquering chamber, successive pencils butt against one another and are held against one another at their end sides such at a plurality of pencils form a stable strand which is guided, subsequent to the lacquering chamber, through a drying section, with the result that a respective pencil is held in a hovering manner on leaving the lacquering chamber. It is hereby in particular also made possible to use UV-curing lacquers, with the overall result that a very short total lacquering time for lacquering pencils, in particular cosmetic pencils, is achieved.