Patents Examined by Nickolas Harm
  • Patent number: 10137640
    Abstract: A method is provided of bonding together at least two parts. The method includes assembling together at least two parts and at least one adhesive layer, the adhesive being configured so that its adhesive power increases on heating as a result of it polymerizing, at least one of the parts being made of composite material or of metal, the adhesive layer being present, after assembly, between the parts, the assembled together parts and the adhesive being present in a chamber defined by a wall, the wall having an inside face situated facing a first part present between the adhesive layer and the wall, the first part being intended to be bonded to a second part and only a fraction of the second part being present inside the chamber; and applying a liquid against the wall on its side opposite from the chamber.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: November 27, 2018
    Assignee: SAFRAN AIRCRAFT ENGINES
    Inventors: Thierry Godon, Julien Schneider, Franck Bernard Leon Varin
  • Patent number: 10112377
    Abstract: A supporting member separation method of separating a laminate formed by laminating a substrate, an adhesive layer, a release layer which is changed in quality by absorbing light, and a support plate in this order, the method including an irradiation step in which irradiation of laser light which is pulse-oscillated with a pulse having a pulse width of 20 ns or greater is performed to the release layer.
    Type: Grant
    Filed: January 17, 2013
    Date of Patent: October 30, 2018
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yasushi Fujii, Shinji Takase
  • Patent number: 10106932
    Abstract: A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lbf/inch width as measured by TAPPI method 494; and a CD tensile of 10-300 lbf/inch width as measured by TAPPI method 494. Methods of making and using the paper substrate, products made therefrom, and uses of the paper substrate are also provided.
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: October 23, 2018
    Assignee: INTERNATIONAL PAPER COMPANY
    Inventors: Dennis W. Anderson, James E. Sealey
  • Patent number: 10093784
    Abstract: A method is provided for decomposition of a polymeric article, wherein the polymeric article contains a polymer and one or more energy modulation agents, by applying an applied energy to the polymeric article, wherein the one or more energy modulation agents convert the applied energy into an emitted energy sufficient to cause bond destruction within the polymer.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: October 9, 2018
    Assignee: IMMUNOLIGHT, LLC.
    Inventors: Zakaryae Fathi, John Pacanovsky, Frederic A. Bourke, Jr.
  • Patent number: 10096508
    Abstract: In various embodiments, an assembly for handling a semiconductor die is provided. The assembly may include a carrier with a surface. The assembly may also include an adhesive tape fixed to the surface of the carrier. The adhesive tape may be configured to adhere to the semiconductor die. The adhesive tape may include adhesive, the adhesion of which can be reduced by means of electromagnetic waves. The assembly may further include an electromagnetic source configured to apply electromagnetic waves to the adhesive tape to reduce adhesion of the adhesive tape to the semiconductor die. The assembly may additionally include a die pick-up component configured to pick up the semiconductor die from the adhesive tape.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: October 9, 2018
    Assignee: Infineon Technologies AG
    Inventors: Ronald Paramio Joves, Thanabal Ganesh Kunamani, Kuang Ming Lee, Avelino Oliveros Sumagpoa, Kian Heong Tan, Nestor Vergara Bicomong, Jagen Krishnan, Soon Hock Tong
  • Patent number: 10086631
    Abstract: A label winding device is for receiving a medium including a label liner and a label member that is removably attached to the label liner and has at least one label portion and a waste portion, separating the waste portion from the label liner at a waste separation portion, and winding the at least one label portion with the label liner. The label winding device includes: a waste winder for winding the separated waste portion; a label winder for winding the at least one label portion with the label liner without the separated waste portion; a waste guide for guiding the separated waste portion to the waste winder; a support for rotatably supporting the waste guide; a sensor for detecting a rotational speed of the waste guide; and a waste break detector for detecting break of the waste portion on a basis of the detection by the sensor.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: October 2, 2018
    Assignee: Oki Data Corporation
    Inventors: Hiromi Takahashi, Mihoko Odate, Syuji Sato
  • Patent number: 10086598
    Abstract: A holding unit holds label paper conveyed from a label printer that ejects ink onto the label paper. A peeling unit is disposed to the label paper conveyance path downstream from the holding unit, and peels labels from the liner of the label paper. The peeling unit can move bidirectionally between a start peeling position and an end peeling position. A peeling member folds back only the liner portion of the label paper. A peeling conveyance roller disposed downstream from the peeling member on the label paper conveyance path conveys the label paper. The peeling member moves from the start peeling position to the end peeling position by being pushed by the label paper conveyed by the peeling conveyance roller while the label paper is still held by the holding unit.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: October 2, 2018
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Takeshi Tokuda
  • Patent number: 10077128
    Abstract: One embodiment is a shrink labeler for use to shrink a shrink label onto a bottle including: a containment wall having a gas/steam inlet; and a showerhead container capable of holding the bottle in close proximity to orifices disposed therein and having an aperture through which the bottle may be introduced thereinto; wherein the gas/steam inlet is coupled to a plenum disposed between the containment wall and the showerhead container.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: September 18, 2018
    Assignee: NuBiome, Inc.
    Inventor: Brian C. Lue
  • Patent number: 10071544
    Abstract: A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate, includes: a first holding unit which holds the processing target substrate; a second holding unit which holds the supporting substrate; a moving mechanism which relatively moves the first holding unit or the second holding unit in a horizontal direction; a load measurement unit which measures a load acting on the processing target substrate and the supporting substrate when the processing target substrate and the supporting substrate are separated; and a control unit which controls the moving mechanism based on the load measured by the load measurement unit.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: September 11, 2018
    Assignees: Tokyo Electron Limited, INTEL CORPORATION
    Inventors: Osamu Hirakawa, Masaru Honda, Akira Fukutomi, Takeshi Tamura, Jiro Harada, Kazutaka Noda, Xavier Francois Brun
  • Patent number: 10065407
    Abstract: In accordance with these and embodiments of the present disclosure, an information handling system may include a circuit board, an information handling resource electrically coupled to the circuit board, and a mechanical mechanism configured to receive a user interaction at a mechanical mechanism, and, in response to the user interaction, separate a mechanical bond between the information handling resource and a component by applying a controlled force of the mechanical mechanism to the information handling resource at a controlled location of the information handling resource.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: September 4, 2018
    Assignee: Dell Products L.P.
    Inventors: Lawrence A. Kyle, Corey Dean Hartman, Hsu-Chu Wang
  • Patent number: 10070537
    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface, curing the second surface while the laminate remains applied, and removing the laminate. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: September 4, 2018
    Assignee: INTEL CORPORATION
    Inventors: Deepak Arora, Daniel N. Sobieski, Dilan Seneviratne, Ebrahim Andideh, James C. Meyer
  • Patent number: 10065808
    Abstract: An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: September 4, 2018
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Masakatsu Ohno, Kohei Yokoyama, Satoru Idojiri, Hisao Ikeda, Yasuhiro Jinbo, Hiroki Adachi, Yoshiharu Hirakata, Shingo Eguchi
  • Patent number: 10052777
    Abstract: The present disclosure provides a method and a system for separating a touch panel from a display module of a touch display device. The system includes a carrying unit configured to secure a to-be-processed touch display device, and a disassembling unit configured to soften an adhesive between the touch panel and the display module so as to separate the touch panel from the display module, thereby to disassemble the touch display device secured on the carrying unit.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: August 21, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Yifei Zhan
  • Patent number: 10052859
    Abstract: An apparatus for disassembling a display screen device. The apparatus comprises: 1) a container configured to receive liquid nitrogen into a liquid nitrogen chamber within the container, wherein at least one portion of the container has at least one vent hole that enables cold nitrogen gas to escape from the container; and 2) a cover configured to be brought into contact with the container to thereby form a nitrogen gas chamber that receives the nitrogen gas escaping from the container. The display screen device is disposed within the nitrogen gas chamber. The nitrogen gas freezes exposed surfaces of the display screen device. An adhesive layer disposed in a cooling area of the display screen device proximate an exposed surface loses it adhesiveness as the cooling area becomes colder. The apparatus further comprises an insulation pad disposed within the nitrogen gas chamber and configured to be brought into contact with a protected surface of the display screen device.
    Type: Grant
    Filed: May 1, 2015
    Date of Patent: August 21, 2018
    Inventor: Euna Park
  • Patent number: 10046551
    Abstract: A recycling method includes providing an EVA insole residual product including an EVA foam material, a film, and a cloth material, placing the EVA insole residual product into an oven, heating the EVA insole residual product to a temperature of 130±25° C., and detaching the cloth material from the EVA foam material. The film includes an EVA, and a tackifier. The EVA of the film has a mass proportion of 85-95%. The tackifier has a mass proportion of 5-15%. An antioxidant is appended into the film and has a mass proportion of 0.1% of the total mass of the EVA and the tackifier. After the cloth material is detached from the EVA foam material, the EVA foam material and the film are crushed and kneaded and are recycled.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: August 14, 2018
    Inventor: Sian-De Wei
  • Patent number: 10040248
    Abstract: An automatic welding machine for lap welding the edges of plastic webs, comprising a movable supporting frame, a heating device for partially melting the plastic webs, at least two opposing, counter-rotating pressing rollers and/or advancing rollers, at least one of which being driven, and at least one driving device comprising a drive motor and at least one gearbox for driving the pressing and/or advancing rollers, wherein the pressing rollers and/or advancing rollers are driven by the driving device by way of at least one flexible shaft. Furthermore, the gearbox can be implemented as a worm gear mechanism comprising a worm that is seated directly on a motor shaft of the drive motor and two counter-rotating worm gears driven by the worm.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: August 7, 2018
    Assignee: Leister Technologies AG
    Inventors: Adolf Niederberger, Bruno von Wyl, Mathias Frei
  • Patent number: 10040246
    Abstract: A sheet bonding device includes a pressurization mold which is constituted of an upper mold and a lower mold and performs sealing through heating by sandwiching a sealing target portion of a bag main body and a sealing target portion of a gas barrier function sheet with pressurization surfaces; a plurality of support pins which are provided in the lower mold so as to be retractable and position the gas barrier function sheet with respect to one surface of the bag main body by penetrating the sealing target portions of the bag main body and the gas barrier function sheet; and gas spray means for making the gas barrier function sheet float by spraying inert gas to an area-enlarged portion, which does not overlap the bag main body, of the gas barrier function sheet supported by the support pins.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: August 7, 2018
    Assignee: FUJIFILM Corporation
    Inventor: Yoshiki Sakazaki
  • Patent number: 10035105
    Abstract: A process for preparing a membrane stack comprising the steps of (i) interposing a curable adhesive between alternate anion exchange membranes and cation exchange; and (ii) curing the adhesive; CHARACTERIZED IN THAT said membranes are in a swollen state when step (ii) is performed.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: July 31, 2018
    Assignee: Fujifilm Manufacturing Europe B.V.
    Inventors: Vinodnarain Bhikhi, Peter Jessen, Willem Van Baak, Johannes Van Engelen, Bastiaan Van Berchum
  • Patent number: 10018782
    Abstract: An apparatus for removing at least one coating from a lengthwise section of an optical fiber includes a heater extending at least partially around and at least partially defining an elongate heating region configured for receiving the lengthwise section of the optical fiber. The heater can heat the heating region to a temperature above the thermal decomposition temperature of the at least one coating. A controller automatically deactivates the heater after removal of the at least one coating from the lengthwise section of the optical fiber in the heating region. Thereafter, an air mover can cause ambient air to cool the heater.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: July 10, 2018
    Assignee: CORNING OPTICAL COMMUNICATIONS LLC
    Inventor: Qi Wu
  • Patent number: 9987838
    Abstract: A separation method allows a carrier substrate and a resin layer to be separated without, for example, breaking the resin layer for use in a final product, such that the resin layer can be rendered easy to handle thereafter. A protection step coats the surface of a resin layer with a protective film. A holding-by-suction step retains by suction the coated resin layer on a suction stage with a flat suction surface. After the back surface of the carrier substrate is supported at or near a first end by a support roller capable of moving from the first end to a second end of the carrier substrate, a peeling step lowers the first end of the carrier substrate while moving the support roller toward the second end, thereby peeling the carrier substrate from the resin layer while bending the carrier substrate at a portion supported by the support roller.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: June 5, 2018
    Assignee: Screen Laminatech Co., Ltd.
    Inventor: Mitsuo Uemura