Abstract: Exfoliation of graphene from graphite using multilayer coextrusion is generally disclosed. In some example embodiments, graphite may be dispersed within a first processing material, and the first processing material and a second processing material may be co-extruded through a plurality of series coupled layer multiplication dies to exfoliate graphene from the graphite. The graphene may be separated from the resulting multi-layered material. In some example embodiments, graphite flake and/or expanded graphite may be dispersed within the first processing material.

Abstract: An automatic film peeling machine for peeling a film adhered on a board, includes a workbench, a frame mounted on the workbench including a movable pushing block, a supporting plate mounted on the frame, a suction plate for locating the board on the supporting plate, and a peeling module. The peeling module includes a sliding member, a resisting member and a movable clamping member mounted on the sliding member. The clamping member includes a clamping portion with a plurality of vents. Air is blown out from the vents for rotating a movable un-adhered portion of the film into a space between the clamping portion and the resisting member. The clamping member is moved toward the resisting member for clamping the movable un-adhered portion. The pushing block is moved to push the sliding member away from the frame, for peeling the first film from the board.

Abstract: A medium transporting apparatus is used for transporting a label web including a carrier web and labels adhered thereto. A platen roller transports the label web in a transport path. A pressure roller is disposed downstream of the separating member with respect to the transport path, and causes the carrier web to be kinked. The pressure roller urges the carrier web against the platen roller. A support member is mounted on a cover and rotatably supports the pressure roller. The cover is pivoted between an open position and a closed. Immediately after the cover has moved to the closed position, the pressure roller contacts the platen roller and then slides by a predetermined amount on the circumferential surface of the platen roller in a direction away from the separating member. Thus, the carrier web sandwiched between the pressure and platen rollers becomes taut.

Abstract: A device is provided for producing a bonded joint between fiber-reinforced thermoplastic parts to be joined, in which fiber-containing plastic material is mixed into the joining zone while friction stir welding the parts to be joined in the form of a butt joint.

Abstract: A device for transferring electronic components from a first carrier to a second carrier. A first receiving portion positions the first carrier on a support, wherein the electronic components are provided on a side of the first carrier, which faces away from the support. A second receiving portion positions the second carrier. The first receiving portion and the second receiving portion are arranged with respect to each other in such a manner that a gap separates the first carrier from the second carrier. A cap and/or the second receiving portion move from a first position into a second position to make the gap smaller. At least one slide lifts the first carrier, which is applied against the support, away from the support, and to move an electronic component provided on the first carrier, in the direction of the second carrier.

Abstract: This invention discloses a corner peeling device, a film peeling apparatus, and a film peeling method, and relates to the technical field of liquid crystal panel manufacture, for the purpose of solving the problem concerning low efficiency in film peeling. The corner peeling device comprises: a movable rack; a roller pivoted on the upper part of the rack; an evacuating device in communication with the air channel; and an automatic revolving device, which is connected to the roller so that at the beginning of corner peeling and after corner peeling, the opening of the same sucking hole at one end of the plurality of the sucking holes arranged at intervals is upward. The corner peeling device is used for peeling a corner of a release film adhered to a plate-like substrate. The film peeling apparatus comprises the corner peeling device mentioned in the technical solution described above.

Abstract: Described herein is an apparatus and a method for removing an epoxy resin from a backing sheet at a temperature at or below the glass transition temperature of the epoxy resin. The apparatus (200) comprises a housing (210) in which is mounted a dispensing roll (220) comprising epoxy resin (230) on a backing sheet (240), a wind-up roll (250) comprising the backing sheet (240), a release element (260) over which the backing sheet (240) is directed, and a collection tray (270) for collecting pieces of resin (230a) removed from the backing sheet (240). The dispensing and wind-up rolls (220, 250) are mounted on respective drive shafts (225, 255) which are driven by a drive mechanism (285) controlled by a controller (280). A temperature controller (290) is also provided for controlling the temperature within the housing (210) so that it remains below or at the glass transition temperature of the epoxy resin.

Abstract: A device (1) for feeding self-adhesive or “pressure sensitive” labels to a labelling machine comprises a frame (2) and supporting means (3) comprising a supporting plate (17) for supporting a reel (4) of web (5) with labels applied to it, and also comprises at least one guide element (28, 29) designed to be at least partly inserted in a central hole (7) of the reel (4) which can rotate about it. The device (1) also comprises a detaching station (8) for detaching the labels from the web (5), feeding means (9) for feeding the web (5) to the detaching station (8) and recovery means (10) for recovering the web (5) without labels.

Abstract: In an optical device wafer, an optical device layer is formed over a front surface of an epitaxy substrate with the intermediary of a buffer layer composed of a Ga compound containing Ga. After a transfer substrate is joined to the optical device layer of the optical device wafer, a separation layer is formed at a boundary surface between the epitaxy substrate and the buffer layer by performing irradiation with a pulsed laser beam having such a wavelength as to be transmitted through the epitaxy substrate and be absorbed by the buffer layer from a back surface side of the epitaxy substrate. Thereafter, an ultrasonic horn that oscillates ultrasonic vibration is brought into contact with an outer circumferential part of the epitaxy substrate to vibrate the epitaxy substrate, and the epitaxy substrate is separated from the transfer substrate to transfer the optical device layer to the transfer substrate.

Abstract: A composite structure comprises stacked sets of laminated fiber reinforced resin plies and metal sheets. Edges of the resin plies and metal sheets are interleaved to form a composite-to-metal joint connecting the resin plies with the metal sheets.

Abstract: Method and apparatus for forming free-standing, substantially monocrystalline semiconductor substrates is described. A template substrate is subjected to a process of forming a porous layer on each major surface of the template substrate. The porous layer is smoothed, and then an epitaxial layer is formed on each porous layer. Mechanical energy is used to separate the epitaxial layers from the template substrate, which is recycled by removing any remaining porous and epitaxial material.

Abstract: A backing film removal system including a substrate support member configured to support a substrate, where a backing film is attached to the substrate, a backing film separating member arranged operatively with respect to the substrate support member such that at least a portion of the backing film separating member is positionable between at least one portion of the substrate and backing film when the substrate is disposed on the substrate support member, a backing film holding member configured to maintain a separation between the substrate and backing film at the at least one portion of the substrate and backing film, and at least one drive unit connected to one or more of the substrate support member and the backing film separating member and operable to cause relative movement between the substrate support member and the backing film separating member.

Abstract: An apparatus for removing carpet including: a base; a hoist engaged with the base; a resilient line with first and second ends, wherein the first end is engaged with the hoist; a carpet gripping means removably engaged with the second end of the resilient line; and at least one friction surface engaged with a bottom of the base for holding the base in position. Further, a method for removing carpet comprising: the apparatus for removing carpet; moving the apparatus into position; engaging carpet to be removed with the carpet gripping means; and utilizing the hoist and resilient line to pull the carpet gripping means in order to remove the carpet.

Abstract: A separation apparatus for separating a composite substrate formed from a first substrate and a second substrate joined together includes an exfoliation unit for advancing into a boundary region between the first substrate and the second substrate of the composite substrate supported by a supporting face of a supporting base and a side face supporting unit to exfoliate the composite substrate into the first substrate and the second substrate. The exfoliation unit includes a wedge portion for advancing into the boundary region between the first substrate and the second substrate, an exfoliation member having a gas outlet open at a tip end of the wedge portion, and an exfoliation member advancing and retracting unit for advancing and retracting the wedge portion of the exfoliation member to and from the boundary region between the first substrate and the second substrate which configure the composite substrate.

Abstract: A film-removing mechanism configured to cooperate with a mechanical arm to remove a protecting film from a workpiece can include a base, a blowing member coupled to the base, and a holding assembly positioned adjacent to the blowing member. The base can be configured to support the workpiece. The blowing member defining an air outlet can be configured to communicate with an external air resource. The holding assembly can include a supporting member positioned adjacent to the base and a driving member coupled to the supporting member. The supporting member can correspond to the air outlet and the driving member can be configured to connect to the external mechanical arm.

Abstract: The present invention aims at reducing a breaking phenomenon of an adsorbed substrate while the substrate is detached from a lower plate at a high speed. An embodiment is a substrate detaching apparatus including an adsorption main body disposed on one side of the adsorbed substrate to generate an adsorption force; and a plurality of adsorption parts provided in a predetermined adsorption region of the substrate under the adsorption main body, being spaced apart from each other and applied with an adsorption force from the adsorption main body to adsorb the substrate, wherein the adsorption region includes an outer region of a first cycloid curved line protruding in a third corner direction based on a diagonal connecting between a first corner and a second corner of the adsorbed substrate and an outer region of a second cycloid curved line protruding in a fourth corner direction.

Abstract: The present disclosure generally describes techniques suitable for use in the construction or recycling of composite materials. An article may comprise a thermoplastic coupled to a bonding interface layer, with a coating layer applied to the surface of the bonding interface layer. A bonding interface layer may comprise catalytic nanoparticles embedded within and/or encapsulated by one or more radiatively unstable polymers. Application of ionizing radiation to the article may release a catalyst at the bonding interface. Application of heat and/or stress to the article may enhance catalytic degradation of the remaining bonding interface and uncoupling of the thermoplastic from the coating layer. Embodiments of methods, compositions, articles and/or systems may be disclosed and claimed.

Abstract: Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.

Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

Abstract: An apparatus and method for removing matrix material from a web of cut adhesive backed labels. A matrix stripping apparatus comprises a rotating cylinder for receiving a web of cut adhesive labels, a source for applying an electrostatic charge to the web of cut adhesive labels, and a separation member to facilitate separation of the matrix from a web comprising cut labels and a release liner. Applying an electrostatic charge to the web assists in holding the web against the rotating cylinder and relieves tension in the separation and removal of the matrix material.