Abstract: An apparatus for removing a ring-shaped reinforcement, edge from a ground semiconductor wafer, which is cohesively connected to an elastic carrier film and is fixed to a circumferential wafer frame via the carrier film, includes a holding device, which has a support having suction openings for holding the semiconductor wafer on the support surface of the support, and a separating device, which includes a device for integrally detaching the reinforcement edge from the carrier film.

Abstract: A container or array of containers that is are sealed with a peelable seal is transported via a conveyor along a processing path toward a desealing station at which an adhesive surface having a width substantially the same as or greater than the width of the seal is pressed against the upper surface of the peelable seal. A collection rod applies a downward pressure on the adhesive surface, pressing it against the seal and keeping the container or container array in position on the conveyor as the plate moves with the conveyor. As the leading edge of the seal passes the collection rod, the adhesive surface is rolled upward, away from the plane of the seal, pulling up on the leading edge of the seal to separate it from the container or container array while the container or container array is held down by the roller. The removed seal is then discarded.

Abstract: A method of transferring functionalized graphene comprising the steps of providing graphene on a first substrate, functionalizing the graphene and forming functionalized graphene on the first substrate, delaminating the functionalized graphene from the first substrate, and applying the functionalized graphene to a second substrate.

Abstract: Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.

Abstract: The invention relates to a method for providing a tire with an informative label. The method comprises supporting a tire, supplying a banding material to the tire and wrapping it in a loop around a part of the tire, holding the banding material at the neck of said loop, and connecting opposed areas of the banding material at said neck to form a label wrap. The invention further relates to an apparatus for carrying out the method and to a tire provided with the label. The informative label is easily removed by a mechanic and shows an improved processability and printability. The informative label further does not leave any adhesive or other residuals on a tire.

Abstract: A dual roll fabric welding or seaming machine is configured to seam pieces of sheet material to one another as the pieces move downstream. The machine includes modular gantries and various actor devices which may be readily mounted on any of the gantries to interact with the moving sheet material to achieve various functions, such as seaming pieces of sheet material together, forming hems, applying grommets to the sheet material, printing on the sheet material, connecting reinforcement strips or ropes to the sheet material and cutting the sheet material.

Abstract: The present disclosure provides an apparatus for removing a chip, including: a loading station; a heating head arranged to soften an anisotropic conductive film on a substrate of a display panel for fixing the chip; a base table arranged on the loading station and arranged to support the display panel; and a base seat arranged on the loading station and arranged to support the heating head, wherein the heating head is rotatably mounted onto the base seat and the heating head has a rotation axis perpendicular to a surface of the loading station facing towards the base table. With the above apparatus, the face of the heating head facing towards the chip contacts with the face of the chip facing towards the heating head more sufficiently. The force to which the portion of the chip is subject is reduced and the force applied to the chip becomes more uniform.

Abstract: A semiconductor structure bonding apparatus is disclosed. The apparatus may include a leveling adjustment system configured to provide leveling adjustment of upper and lower block assemblies of the apparatus. In some cases, the leveling adjustment system may include a plurality of threaded posts, differentially threaded adjustment collars, and leveling sleeves. In some instances, the leveling adjustment system further may include a plurality of preload springs configured to provide a given preload capacity and range of adjustment. In some instances, the leveling adjustment system further may include a load cell through which one of the threaded posts may be inserted. In some embodiments, the upper block assembly further may include a reaction plate configured to reduce deformation of the upper block assembly. In some embodiments, the upper block assembly further may include a thermal isolation plate configured to provide compliance deflection and being of monolithic or polylithic construction, as desired.

Abstract: A device for translaminating tension-sensitive films from a first liner to a second liner, wherein the device has a first transport device, a second transport device, and a laminating device. The first transport device is configured to transport a first laminated strip to a film delaminating station. The second transport device is configured to transport a second strip-shaped liner to the laminating device, which is designed to laminate the tension-sensitive film onto the second liner in order to form a second laminated strip. The first transport device and the laminating device are arranged relative to each other such that the tension-sensitive film is pulled off at the film delaminating station in the direction opposite the running direction of the first laminated strip at said station.

Abstract: A system according to the principles of the present disclosure includes at least one bracket and at least one vibrator. The at least one bracket is configured to be mounted to a pallet adjacent to a stack of panels disposed on the pallet. The at least one vibrator is attached to the at least one bracket and configured to induce vibration on the stack of panels to disrupt an adhesive bond between adjacent panels in the stack of panels.

Abstract: A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate includes: a first holding unit that includes a heating mechanism heating the processing target substrate and holds the processing target substrate; a second holding unit that includes a heating mechanism heating the supporting substrate and holds the supporting substrate; a moving mechanism that relatively moves at least the first holding unit or the second holding unit in a horizontal direction; and a porous part that is annularly provided along an outer peripheral portion of the first holding unit and formed with a plurality of pores, and supplies an inert gas to the outer peripheral portion of the first holding unit holding the processing target substrate.

Abstract: The present disclosure discloses a film stripping device including: a fixing mechanism for fixing a substrate on which a film to be stripped is disposed; and a stripping mechanism comprising a striping member for stripping at least a part of an edge of the film and a gripping member for gripping the stripped part of the film and movable in a direction towards the film to be stripped relative to the fixing mechanism. Correspondingly, a film stripping method using the film stripping device is also disclosed. The present disclosure increases the efficiency of film stripping and reduces an amount of used adhesive tapes.

Abstract: A flexible substrate mount for holding a first substrate when the first substrate is being detached from a second substrate, and detachment means for debonding of the second substrate by bending the first substrate. Furthermore, this invention relates to a device for detaching a first substrate from a second substrate in one detachment direction (L) with the following features: a substrate mount for holding the first substrate, said first substrate mount being flexible in the detachment direction (L), a substrate mount for holding the second substrate and detachment means for the debonding of the first substrate from the second substrate as the first substrate bends, and a method of using the same.

Abstract: A wedge-shaped jig (6) is inserted into a gap between a first substrate (21) and a second substrate (22) at a corner (221) of the second substrate (22) and separation of the attached first substrate (21) and second substrate (22) starts to proceed; then, a second suction pad (53) of a second suction portion (51), which is the closest to the corner (221), moves upward. Then, first suction pads (43) of first suction portions (41a), (41b), and (41c) sequentially move upward such that one side of the second substrate (22) separates from the stacked body. Although the second substrate (22) warps as the separation of the second substrate (22) proceeds, each of the plurality of first suction pads (43) elastically deforms. Therefore, the first suction pads (43) can be prevented from being detached from the second substrate (22), and the substrate (22) can be securely separated from the stacked body.

Abstract: An embodiment of the invention may include a cleaving apparatus. The cleaving apparatus may include a first arm having a first cleaving wedge and a second arm having a second cleaving wedge. The first cleaving wedge may include a first front surface and a first bottom surface, where the first front surface is oriented away from the first bottom surface. The second cleaving wedge may include a second front surface and a second bottom surface, where the second front surface is oriented away from the second bottom surface. The first arm and the second arm may be arranged to move with respect to each other. Further, the cleaving apparatus may include a heating apparatus located in the first cleaving wedge.

Abstract: An apparatus for separating a substrate and a method of separating a substrate by using the same are disclosed. In one aspect, the apparatus includes a stage and an adsorber facing the stage and comprising a plurality of vacuum pad portions. An upper surface of the stage includes a first region and a pair of second regions located on opposing sides of the first region, wherein the first region and the second regions are disposed on different planes, and wherein each of the second regions is inclined with respect to the first region.

Abstract: A film peeling apparatus that peels off a film from a peeling object having the film and a substrate, the film peeling apparatus including a base; a conveying unit to hold a first side of the peeling object and to turn the peeling object from a parallel orientation with respect to the base to a perpendicular orientation with respect to the base; a first peeling unit to receive the peeling object from the conveying unit and to hold a second side of the peeling object in the perpendicular orientation; a second peeling unit to hold the first side of the peeling object, the second peeling unit facing the first peeling unit; and a knife unit that is reciprocably movable toward and away from an edge of the peeling object and movable along an edge of the peeling object.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a polymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract: A label affixing machine includes a holder, a storing device, a storing device, a peeling device and a conveyer. The storing device, the peeling device and the conveyer are fixed in position on the holder. The picking device is coupled to the conveyer. The label includes a bottom board affixed under the label, the label affixing machine configured to affix the label on an object. The picking device is configured for picking the label. The peeling device includes a second fixing module fixed in position on the holder, a second moving module coupled to the second fixing module and a robotic arm fixed in position on the second moving module. The robotic arm is configured for clamping the bottom board and peeling the bottom board from the label. The conveyer moves the picking device and affixes the label on the object.

Abstract: An evaporation device includes a carrier stage, a base and a light source. The carrier stage is placed on the base; the base provides with a vacuum pin; the vacuum pin can move with respect to the base; the carrier stage provides with a pin hole; the vacuum pin can pass through the pin hole to absorb a substrate. A side of the carrier stage away from the base is coated with a photosensitive adhesive, the light source is used to irradiate the photosensitive adhesive between carrier stage and the substrate in order to decrease the adhesiveness of the photosensitive adhesive so that the substrate and the carrier stage can be separated smoothly in order to achieve a small deformation and improve the product yield rate. The evaporation method can achieve a small deformation and improve the product yield rate when separating the substrate and the spacing pad.