Abstract: A food dispensing module for a delaminating food dispensing system includes an outer housing; and a delaminating housing. The delaminating housing has a first portion being located within said outer housing and a second portion located outside said outer housing. The delaminating housing includes delaminating nips, a first film take-up roller, a second film take-up roller, an output opening, and a trap void. The output opening is located in the second portion of the delaminating housing.

Abstract: An aspect of the present invention provides a raw fabric cutting device. The device comprises: a support portion for supporting a raw fabric; a compressing portion for evacuating the space between a cover arranged on the raw fabric and the support portion such that the raw fabric is compressed; a cutting portion transferred above the support portion so as to cut the raw fabric; and a sealing portion transferred together with the cutting portion and configured to supply a sealing member to an open area of the cover, which is exposed as the raw fabric is cut, thereby covering the open area, wherein the sealing portion comprises a sealing member cutting portion for forming a notch on at least one side of the sealing member in the transverse direction with regard to the direction of transfer of the sealing member.

Abstract: A vapor barrier and method for applying same around an insulated pipe structure is disclosed. The vapor barrier a vapor retarder layer, an adhesive layer disposed on one side of the vapor retarder layer, and a release layer covering the adhesive layer. The vapor barrier has a two-dimensional geometric profile which corresponds to a three-dimensional structure of a specific pipe joint. Applying the vapor barrier comprises removing first and second portions of the release layer to expose respective portions of the adhesive layer, adhering the respective portions of release layer to corresponding areas of the pipe joint, forming an overlap seal in which a portion of the vapor barrier is adhered to itself via a portion of the adhesive layer, and forming an edge seal in which a portion of the prefabricated vapor barrier is adhered to a portion of adjacent insulation structure via a portion of the adhesive layer.

Abstract: Apparatuses and methods adapted for removing a layer of paint, sealant, or adhesive from a surface of an article, including wooden, metal, plaster, stone, and brick articles. The apparatuses are provided with a module comprising at least one carbon infrared emitter bulb that generates short-wavelength infrared radiation. The module has an opening through which the infrared radiation is emitted from the module, and the intensity and wavelengths of the infrared radiation are controlled to selectively attain temperatures in a range of about 90 to 375° C. at the surface of the article when located a distance of about 5 to 15 centimeters from the opening of the module.

Abstract: A method of manufacturing an electronic device is provided. The method includes forming a stack structure by placing a to-be-peeled layer on a substrate, applying thermal shock to the stack structure, detaching the to-be-peeled layer from the substrate, and transferring the detached to-be-peeled layer to a target substrate.

Abstract: A method for attaching and detaching a substrate from a bonded stack is disclosed. A broadband light-absorbing material is combined with an adhesive material to form a broadband light-absorbing adhesive. A layer of the broadband light-absorbing adhesive is then applied on one side of a transparent carrier. A substrate is placed on the broadband light-absorbing adhesive and the transparent carrier to form a bonded stack. The substrate can be a wafer or a polymeric film. At this point, processing steps can be performed on the substrate. After the processing steps have been completed, a light pulse from a flashlamp is utilized to heat up the broadband light-absorbing adhesive in order to loosen the substrate from the bonded stack such that the substrate can be easily detached from the bonded stack.

Abstract: A method for manufacturing a battery module is disclosed herein. In some embodiments, a method for manufacturing a battery module which comprises a module case, in which an internal space is formed by a bottom plate and sidewalls, and an injection port is formed in the bottom plate or the sidewalls; a plurality of battery cells existing in the internal space; and a resin layer in contact with the bottom plate or the sidewalls while being in contact with the battery cells, the method including attaching a tape to cover the injection port of the bottom plate or the sidewalls; mounting an injection device of a resin composition such that the injection device is mounted on the injection port while penetrating the tape, and injecting the resin composition into the mounted injection device. The method provides a simple process and at low cost without occurrence of a reverse discharge phenomenon.

Abstract: A transfer device is disposed in a vacuum transfer chamber. The transfer device includes a structure body having an inner space isolated from the vacuum transfer chamber, an arm that rotates with respect to the structure body, and a vacuum seal structure configured to airtightly seal a sliding portion between the structure body and the arm. Further, the vacuum seal structure includes one or more seal members disposed at the sliding portion; a sealing portion formed by the structure body, the arm, and the seal members, lubricant being sealed in the sealing portion; and a pressure adjusting unit configured to adjust a pressure in the sealing portion.

Abstract: The present invention relates to a peeling device of sheet material for peeling off graphite, and the peeling device of sheet material according to the present invention is characterized in that a specific microchannel is used to apply a shear force required to peel off graphite, and simultaneously, graphene itself is not ground and the discharge flow rate of the graphene dispersion increases to increase graphene preparation efficiency.

Abstract: A prepreg sheet attached with a protective sheet is placed on a mounting table to partially overhang. An angle between an edge side direction of an edge section of the mounting table on which overhanging is performed, and a fiber direction of the prepreg sheet, is then set large enough. Overhanging part is physically impacted in a direction to bend fibers of the prepreg sheet to partially peel the protective sheet from the prepreg sheet. A part of the protective sheet peeled from the prepreg sheet is hold and the protective sheet is peeled from an entire surface of the prepreg sheet. A method of peeling a protective sheet from a prepreg sheet more efficiently without damaging the prepreg sheet and an apparatus for peeling to be used therein are provided.

Abstract: A manufacturing method and a manufacturing device of a flexible panel are provided. the flexible panel includes a bending area, and the manufacturing method includes: providing a panel unit including a flexible substrate and a back film which are laminated, the panel unit including a panel area corresponding to the flexible panel and a non-panel area outside the panel area; and removing the non-panel area of the panel unit while peeling off a peelable portion of the back film in the bending area of the flexible panel.

Abstract: A method for disassembling a stack of at least three substrates. The invention relates to the techniques for transferring thin films in the microelectronics field. It proposes a method for disassembling a stack of at least three substrates having between them two interfaces, one interface of which has an adhesion energy and an interface of which has an adhesion energy, with less than, the method comprising: 1) implementing a removal of material on the first substrate, in order to expose a surface of the second substrate, 2) transferring the stack onto a flexible adhesive film so that the surface has, with an adhesive layer of the film, an adhesion energy greater than, and 3) disassembling the third substrate at the interface between the second substrate and the third substrate. The method makes it possible to open the stack via the interface thereof with the highest adhesion energy.

Abstract: According to various embodiments of the present invention, an electronic device comprises: a heating unit, which includes a lower heating unit and an upper heating unit rotatably coupled to the lower heating unit, and heats an external electronic device mounted on at least one surface of the lower heating unit; a fixing unit, which is disposed to be adjacent to the lower heating unit, and has at least one part formed to be movable in the longitudinal direction of the lower heating unit, thereby fixing the external electronic device; a adsorption unit having one part, which is inserted into at least one recess formed on the upper heating unit, and adsorbing at least a region of the external electronic device; and a driving unit, which is disposed at one side or a surrounding part of the heating unit, can move in the direction perpendicular to the moving direction of the fixing unit, and rotates the upper heating unit by pressurizing the same.

Abstract: A transfer apparatus holdes a plate-shaped workpiece under suction in a noncontact condition and transfers the workpiece. The transfer apparatus includes a base, a Bernoulli transfer pad fixed to the base for spraying air toward the workpiece to produce a vacuum, and a moving unit for moving the base. The Bernoulli transfer pad includes a cylindrical pad body. The pad body has a lower surface as a holding surface to which a fluid spraying portion opens and an annular pad mounting portion for mounting an annular pad. When the annular pad is mounted on the annular pad mounting portion, the holding surface is increased in a radial direction of the pad body to thereby increase a suction force for sucking the workpiece.

Abstract: A simplified method for removing foreign matters formed on a substrate in a semiconductor device manufacturing process; and a composition for forming a coating film for foreign matter removal use, which can be used in the method. A coating film is formed on a semiconductor substrate using a composition preferably containing a polyamic acid produced from (a) a tetracarboxylic dianhydride compound and (b) a diamine compound having at least one carboxyl group or a polyamic acid produced from (a) a tetracarboxylic dianhydride compound, (b) a diamine compound having at least one carboxyl group and (c) a diamine compound, and then foreign matters occurring on the coating film are removed together with the coating film by the treatment with a developing solution.

Abstract: The present disclosure provides a peeling device and method for film material. The film material includes a first film layer, a second film layer, and a third film layer stacked in sequence, and the first film layer and the second film layer have bodies corresponding to the third film layer and protrusions. The peeling device is configured to peel off the first film layer and includes: an abutment divided into a first area configured to place the bodies of the first film layer and the second film layer and the third film layer, and a second area configured to place the protrusions of the first film layer and the second film layer; and a peeling mechanism configured to be coupled to the protrusion of the first film layer to separate the first film layer from the second film layer.

Abstract: A peeling apparatus includes a holding table for holding a plate-shaped workpiece having an upper surface and a lower surface, the upper surface being covered with a protective member. The lower surface of the workpiece is held on the holding table. A peeling mechanism peels off the protective member from the workpiece, and a recovery box is set in the peeling apparatus for recovering the protective member. The recovery box has an upper opening from which the protective member is put into the recovery box. The peeling apparatus further includes a removing mechanism for allowing the protective member to be put into the recovery box from the upper opening, and also allowing the protective member recovered into the recovery box to be removed from the recovery box, while operating the peeling mechanism to peel off the protective member.

Abstract: A frangible laminate includes first, second and third webs, and the second web is positioned between the first and third webs. The forming of the frangible laminate includes adhesively bonding a first plurality of sections of the second web to the first web, applying release material in order to inhibit at least some of any bonding between the first plurality of sections of the second web and the third web, and adhesively bonding a second plurality of sections of the second web to the third web. The frangible laminate is separated into a first laminate and a second laminate, so that the first laminate includes the first web and the first plurality of sections of the second web, and the second laminate includes the third web and the second plurality of sections of the second web.

Abstract: The method of manufacturing a light control element of the present invention includes: removing, in a predetermined portion of a light control film including a first base material with a transparent electrode layer and a second base material with a transparent electrode layer arranged so that transparent electrode layers are opposed to each other, and a liquid crystal light control layer sandwiched between the base materials with transparent electrode layers, one of the base materials with transparent electrode layers; swelling the liquid crystal light control layer remaining in the predetermined portion after the removal of the one of the base materials with transparent electrode layers with an organic solvent; bonding a pressure-sensitive adhesive tape to a surface of the swollen liquid crystal light control layer; and peeling off the pressure-sensitive adhesive tape from the light control film together with the swollen liquid crystal light control layer.

Abstract: A disassembling method of a display module includes attaching an auxiliary sheet to a display module by using an adhesive tape, the display module including a display panel attached to a window by an adhesive layer, and the auxiliary sheet attached to the display module including an external force applying portion exposed outside an outer edge of the display module; cooling the display module and the auxiliary sheet attached thereto by the adhesive tape; and after the cooling of the display module and the auxiliary sheet attached thereto, separating the display panel and the window from each other by applying force to the external force applying portion of the auxiliary sheet attached to the display module.