Abstract: An apparatus for processing an elongated structure includes a mold within which an uncross-linked rubber material is placed, at least one heating unit configured to heat the mold, and a pressure device configured to press the rubber material using the mold heated by the heating unit to promote shaping the rubber material by the mold while proceeding the cross-linking of the rubber material. The heating unit includes a central heating device configured to heat a longitudinal central portion of the mold, multiple cooling devices configured to cool two longitudinal end portions of the mold, multiple intermediate heating devices configured to heat two intermediate portions between the longitudinal central portion and the longitudinal end portions of the mold, heat shield plates disposed between the central heating device and the intermediate heating devices, and heat shield plates disposed between the cooling devices and the intermediate heating devices.

Abstract: Disclosed herein is an apparatus for removing material from a surface of a carrier. The apparatus comprises a buckling mechanism that comprises a gripper configured to engage the material. When engaged with the material, the gripper is movable relative to the surface of the carrier to move the material relative to the surface of the carrier and to form a buckle in the material. The apparatus also comprises a separation mechanism that is coupled to the buckling mechanism and comprises a wedge that is movable relative to the surface of the carrier to be insertable into the buckle formed in the material.

Abstract: The present invention relates to a band-like joint tape for covering a butting portion formed by butting an end portion of a one packing film to an end portion of another packing film and connecting the respective end portions of these packing films to each other. The joint tape is comprised of a laminate film formed by adhering a joint layer to a support layer at a peelable state, and covered so as to face the joint portion to the butting portion and heat-sealed so that the joint layer is fused to the butting portion and the fused portion of the joint layer is peeled off from the support layer.

Abstract: Apparatuses and methods for decoupling an element that is bonded to a surface by an adhesive are provided. In one example, the apparatus includes a body, a first spool that is rotationally coupled to the body, and a cable having a first cable end portion that is coupled to the first spool, a second cable end portion that is coupled to the body, and a cable intermediate portion that is disposed between the first cable end portion and the second cable end portion. The apparatus is configured to be positioned adjacent to at least one of the element and the surface with the cable intermediate portion disposed adjacent to the adhesive such that when the first spool is rotated, the cable wraps about the first spool, thereby pulling the cable intermediate portion through the adhesive.

Abstract: Provided is an automatable peeling apparatus for peeling a protective sheet from a prepreg sheet. This peeling apparatus 2 is equipped with a loading unit 11, a prepreg sheet conveying unit 12, a leading end position detection unit 13, air spraying units 14, 15, a peeling state detection unit 16, protective sheet gripping/conveying units 17, 18, an extraction unit 19, and a control unit 20. The control apparatus 20 controls the loading unit 11, the prepreg sheet conveying unit 12, the leading end position detection unit 13, the air spraying units 14, 15, the peeling state detection unit 16, the protective sheet gripping/conveying units 17, 18, and the extraction unit 19. The first spraying mechanism 14 sprays first air onto the front of the end face of the prepreg sheet. The second spraying mechanism 15 sprays second air and fourth air onto the peeling boundary of the protective sheet.

Abstract: Electrochromic device laminates and their method of manufacture are disclosed.

Abstract: A protective film peeling apparatus includes a peeling tape, a tape support portion disposed under one side of the peeling tape, a first pressing portion which is disposed on the one side of the peeling and fixes the one side of the peeling tape to the tape support portion, a second pressing portion which is disposed on another side of the peeling tape and presses and attaches the another side of the peeling tape to one side of a dummy portion of a protective film on a panel, and a grip portion disposed on the dummy portion. The tape support portion and the first pressing portion peel the one side of the dummy portion and a predetermined portion of the dummy portion, and the grip portion peel a remaining portion of the dummy portion.

Abstract: A method of removing a carrier plate is used to peel off and remove the carrier plate from a workpiece of a disk-shaped composite substrate in which the workpiece is disposed on a face side of the carrier plate with a temporary adhesive layer interposed therebetween. The method includes a step forming step of forming a step protruding laterally from the carrier plate more on a reverse side of the carrier plate than on the face side of the carrier plate, by removing an outer circumferential portion of the workpiece, an outer circumferential portion of the temporary adhesive layer, and a face-side side of an outer circumferential edge of the carrier plate, a starting point region forming step of forming a starting point region that acts as a starting point in peeling off the carrier plate from the workpiece.

Abstract: An apparatus for applying the film to the substrate includes a bed having a substrate placement surface and a selectively positionable tack bar, a roller support moveable over the span of the bed, and including the location of the positioning bar, and a roller rotatably supported to the positioning bar and moveable over the bed in response to movement of the roller support with respect to the bed. In another aspect, the tack bar is of the same thickness, or slightly less thick, as the substrate onto which the film is to be applied, such that a portion of the film to be applied can be secured thereto and not on the substrate before the backing is removed from additional portions of the film, such that the tack bar supports an end of the film in substantially the plane of, or slightly below the plane of, the substrate.

Abstract: A peeling device includes a rolling mechanism, a peeling mechanism, and a suction mechanism. The rolling mechanism includes a feeding wheel and a receiving wheel. At least one of the feeding wheel and the receiving wheel is configured to rotate. The peeling mechanism includes a peeling plate including a first surface and a side surface. The suction mechanism includes a support table and a rotary suction cup. A carrier tape is transmitted in sequence around the feeding wheel, the first surface, the side surface, and the receiving wheel. The peeling plate peels the material from the carrier tape at a junction of the first surface and the side surface. The support table holds the material peeled from the carrier tape. The rotary suction cup is used to suck the material from the support table and move the material to a next processing area.

Abstract: The present disclosure discloses a display panel and a manufacturing method thereof, and a display device, and belongs to the field of display technology. The method includes: fixing a base substrate on a supporting plate; disposing the supporting plate on which the base substrate is fixed at a specified position in a process apparatus; and performing a process corresponding to the process apparatus on the base substrate which is fixed on the supporting plate by means of the process apparatus.

Abstract: Systems and methods are provided for designing composite parts. One embodiment is a method for fabricating a composite part. The method includes receiving a design that defines a stacking sequence for a composite charge comprising plies that have different fiber orientations, defining a splice zone within the design, modifying the design by splicing plies in a manner that accommodates ply slippage when the composite charge is formed to a contour, and fabricating a composite part based on the design that was modified.

Abstract: A label assembly including a face sheet, a back sheet, and a layer of an adhesive positioned between the face sheet and the back sheet. A separation line divides the label assembly into at least two portions. The separation line is formed by a first tearable line of separation extending across the back sheet and a second tearable line of separation extending across the face sheet. The first tearable line of separation is offset with respect to the second tearable line of separation, and at least one of the first and second tearable lines of separation includes a non-linear portion directed toward and/or an angled portion extending at an angle to an other of the at least one of the first and second tearable lines of separation.

Abstract: Disclosed is a thin subject assisted debonding method for separating temporarily bonded workpiece-carrier pair. The thin subject can be a thin wire, or thin filament, or thin blade. The thin subject can be applied between the workpiece and carrier pair in association with laser debonding or mechanical debonding to provide well controlled and targeted wedging function to the delaminating temporary adhesive and its adjacent substrate to which it is separating from. The workpiece can be a semiconductor wafer that has been thinned and processed, and the carrier can be a semiconductor non-device wafer or any other rigid substrate such as a glass wafer or panel. The application of a thin subject between the workpiece and carrier during debonding provides the advantage of high throughput and low defect rate.

Abstract: An apparatus for manufacturing an element array includes a substrate hold means, a laser radiation device, and a collection mechanism. The substrate hold means holds a substrate including an adhesive layer on which elements are attached in a predetermined array while a surface of the adhesive layer is inclined relative to a horizontal surface at a predetermined angle. The laser radiation device radiates a laser to a specific element among the elements attached on the adhesive layer. The collection mechanism is disposed below the substrate and configured to receive the specific element falling by the laser radiation.

Abstract: A processing method for a workpiece includes a cutting step of cutting the workpiece along streets by a cutting blade having a V-shaped tip end, to form V grooves of which shallower parts are wider than deeper parts, and a cleaning step of cleaning a back surface of the workpiece with cleaning water, after the cutting step is carried out.

Abstract: A manufacturing apparatus of a display device includes: a stage to support a work substrate covered by a work protective film; a separation module including a separation structure, and a pressure sensor to measure an intensity of a pressure applied to the separation structure; a driver to control a position of the separation module; and a controller to control the separation module and the driver.

Abstract: A method for manufacturing a substrate having a resin layer, including, in this order: (1) providing the resin layer formed on a support, the support being larger than the outer size of the substrate; (2) bonding the resin layer supported on the support to the substrate; (3) removing an end portion of the resin layer disposed on the end portion of the support and in no contact with the substrate, by a solvent capable of dissolving the resin layer; and (4) peeling off the support from the resin layer.

Abstract: A film pasting tool is used to paste one surface of a film on a member-to-be-pasted at a predetermined position. The tool comprises a flexible tabular body, a first adhesive part, a front surface thereof being adhesive, provided on one surface of the body, and a second adhesive part, a front surface thereof being adhesive, provided on a part of a region other than a region where the first adhesive part is provided out of one surface of the body. An other surface of the film is pastable on the front surface of the second adhesive part, and when the other surface of the film is pasted on the front surface of the second adhesive part, the front surface of the first adhesive part is exposed in such a manner that the front surface of the first adhesive part is pastable on the member-to-be-pasted.

Abstract: A method of removing backing film from a sheet element is provided. The sheet element has a preimpregnated layer, and sheets of backing film are adhered to the top and bottom of the preimpregnated layer. The backing film has a different coefficient of thermal expansion than the preimpregnated layer, and a plane of the sheet element is defined by the peripheral edge. A shear strain is created between the backing films and the preimpregnated layer by cooling the sheet element. A fluid stream is directed at a portion of the peripheral edge, the fluid stream being directed in the plane of the sheet element. The fluid stream causes the backing films to separate from the top and bottom of the preimpregnated layer. A differential pressure is simultaneously applied to the backing films relative to the fluid stream to cause the backing films to be removed from the preimpregnated layer.