Patents Examined by Nickolas R Harm
  • Method for reducing label waste using a cutting apparatus
    Patent number: 11148846
    Abstract: A method of reducing label waste that employs a stand-alone or printer attached apparatus for cleanly and efficiently cutting a web of media or tag stock into individual units. The apparatus used by the method may cut vinyl, plastic, or RFID stock material in both back and forth directions without sacrificing cut quality, and preferably comprises a housing, a carriage assembly and a movable cutter assembly. The cutter assembly comprises a cutting element such as a wheel blade, and a pressure adjusting element for adjusting the amount of pressure applied by the cutting element to the stock material. Alternatively, the cutter assembly may be manufactured with a predetermined pressure load, but still permit an operator to adjust the depth of cut. The method involves using the cutting apparatus to make a series of cuts as the label material is incrementally advanced through the cutting apparatus.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: October 19, 2021
    Assignee: Avery Dennison Retail Information Services, LLC
    Inventors: João Pedro Gomes da Costa, Donald J. Ward, Roberto Mauro, Jeffrey A. Raymond, Mitchell G. Stern, Jeanne F. Duckett
  • Ultrasonic bonding apparatus and ultrasonic bonding method using the same
    Patent number: 11135779
    Abstract: An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: October 5, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hyun a Lee, Chan-Jae Park, Heeju Woo, Kikyung Youk, Sangduk Lee, Daehwan Jang
  • Apparatus and method for peeling a liner away from a substrate
    Patent number: 11130329
    Abstract: An apparatus is provided for peeling a liner away from a substrate. The apparatus comprises a first member rotatable about an axis. The apparatus also comprises a second member disposed on the first member and for generating a suction force to be applied to the liner to peel a portion of the liner away from the substrate when the suction force of the second member is applied to the liner and the first member is rotating about its axis. The apparatus further comprises a third member synchronized to rotation of the first member about its axis such that the third member clamps the peeled portion of the liner against the first member while the second member is applying suction force to the liner and the first member is rotating about its axis.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: September 28, 2021
    Assignee: The Boeing Company
    Inventors: Carl R. McIver, Brice A. Johnson, Michael R. Anderson
  • Automation line for processing a molded panel
    Patent number: 11107716
    Abstract: An automation line for processing a molded panel which is attached, via thermal release adhesive, to a first carrier. The automation line including a release workstation which includes a release unit having a carrier-engagement arrangement movable to engage the first carrier. The carrier-engagement arrangement includes a heating sub-arrangement to thermally contact the first carrier and an attachment sub-arrangement to attach the first carrier to the carrier-engagement arrangement, wherein the carrier-engagement arrangement is operable to heat the intermediate panel assembly to a release temperature of the thermal release adhesive and to separate the first carrier from the molded panel.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: August 31, 2021
    Assignee: PYXIS CF PTE. LTD.
    Inventor: Amlan Sen
  • Lining material peeling method
    Patent number: 11097528
    Abstract: In a lining material peeling method of peeling a lining material, which is fixedly formed on a surface of a base material, from the base material, a liquefied fluid which evaporates after injection is injected to a boundary between the base material and the lining material.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: August 24, 2021
    Assignee: IHI CORPORATION
    Inventors: Akira Sadaki, Jun Maeno, Akito Yamasaki, Tomoko Ebata, Yuichi Takahama
  • Method of manufacturing element array and method of removing specific element
    Patent number: 11101317
    Abstract: In a method of manufacturing an element array, prepared is an adhesive sheet in which elements are arranged in a predetermined array on an adhesive layer. A specific element among the arrayed elements is removed from the adhesive sheet by radiating a laser to the specific element. The arrayed elements are directly or indirectly transferred onto a mounting substrate.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: August 24, 2021
    Assignee: TDK CORPORATION
    Inventors: Toshinobu Miyagoshi, Seijiro Sunaga, Osamu Shindo, Yasuo Kato
  • Image removing device, method for recycling recording material, and image removing method
    Patent number: 11099499
    Abstract: The present invention configures an image removing device capable of certainly and cleanly removing an image comprising an image forming substance and formed on the surface of a plastic recording material. An image removing device is provided with a means 2 for applying an ultraviolet curable resin and a means 4 for emitting ultraviolet light above a conveyance path for a recording material 1 on the surface of which an image is formed, and removes the image from the surface of the recording material 1 by transferring an image forming substance 1a to the ultraviolet curable resin and attaching the image forming substance, together with the ultraviolet curable resin, to the surface of a release body 5 by irradiating the ultraviolet light.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: August 24, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Hidetaka Kimura, Keita Kawanami
  • Support for bonding a workpiece and method thereof
    Patent number: 11097306
    Abstract: The present invention provides a support for temporary bonding a workpiece such as a thick device wafer. The support comprises a carrier having a supporting surface and an isolation film. A first side of the isolation film is bonded to the supporting surface with a peeling strength of from 0.01 to 50.0 g/cm. The invention also provides a method of using the support to e.g. grind the workpiece in making thinned products such as thin silicon wafer, optical lens, thin LCD glass, and thin rock crystal wafer, among others.
    Type: Grant
    Filed: July 11, 2015
    Date of Patent: August 24, 2021
    Assignee: Micro Materials Inc.
    Inventors: Hao Tang, Zhoujie Zhang
  • Peeling method of resin sheet
    Patent number: 11090921
    Abstract: There is provided a peeling method of a resin sheet for peeling off the resin sheet from a plate-shaped object to which the resin sheet is stuck. The peeling method includes a resin sheet heating step of heating an end part of the resin sheet of the plate-shaped object to which the resin sheet is stuck to turn up the resin sheet from the end part and form a peeling origin point and a resin sheet removal step of removing the resin sheet from the plate-shaped object through peeling off the resin sheet from the peeling origin point.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: August 17, 2021
    Assignee: DISCO CORPORATION
    Inventor: Yoshinobu Saito
  • Method for producing thin wafer
    Patent number: 11069557
    Abstract: A method for producing a thin wafer includes: separating the support body from the laminate by irradiating a wafer laminate, which includes a support body, an adhesive layer formed on the support body, and a wafer laminated with a surface thereof including a circuit plane facing the adhesive layer, with light from a side of the support body of the wafer laminate; and after separating, removing a resin layer remaining on the wafer from the wafer by peeling, wherein the adhesive layer includes only a resin layer A with a light-blocking property, and a resin layer B including a thermosetting silicone resin or a non-silicone thermoplastic resin in this order from the side of the support body.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: July 20, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki Yasuda, Michihiro Sugo
  • Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
    Patent number: 11062925
    Abstract: By using a needle having a flat part on a top surface and concave portions at four corners of the top surface, the semiconductor chip pasted on the adhesive tape is pushed up, and the adhesive tape at four corners of the semiconductor chip are uniformly peeled off. Then, the pickup is performed.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: July 13, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Masato Negishi, Kazuo Yoshida
  • Edge banding machine with detachable adhesive applying mechanism
    Patent number: 11059068
    Abstract: An edge banding machine includes a foundation, an adhesive applying mechanism, a motor, a chain guide and a chain. The adhesive applying mechanism is detachably attached to foundation and includes an adhesive tank and an adhesive shaft that extends into the adhesive tank and has a lower end provided with a first sprocket. The adhesive shaft draws adhesive from the adhesive tank. The motor is fixed to the foundation and has a power-take-off shaft that has a second sprocket. The chain engages with the first sprocket and the second sprocket. The chain guide is attached to the foundation and has a guide wheel extending into the chain for pushing against the chain, so that the chain can move between a tensioned position and a relaxed position.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: July 13, 2021
    Inventor: Yen-Tsung Chang
  • Fluid viscosity control during wafer bonding
    Patent number: 11056356
    Abstract: Techniques and mechanisms for bonding a first wafer to a second wafer in the presence of a fluid, the viscosity of which is greater than a viscosity of air at standard ambient temperature and pressure. In an embodiment, a first surface of the first wafer is brought into close proximity to a second surface of the second wafer. The fluid is provided between the first surface and the second surface when a first region of the first surface is made to contact a second region of the second surface to form a bond. The viscosity of the fluid mitigates a rate of propagation of the bond along a wafer surface, which in turn mitigates wafer deformation and/or stress between wafers. In another embodiment, the viscosity of the fluid is changed dynamically while the bond propagates between the first surface and the second surface.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: July 6, 2021
    Assignee: Intel Corporation
    Inventors: Brennen K. Mueller, Daniel Pantuso, Mauro J. Kobrinsky, Chytra Pawashe, Myra McDonnell
  • Lining material peeling method
    Patent number: 11052646
    Abstract: In a lining material peeling method of peeling a lining material, which is fixedly formed on a surface of a base material, from the base material, a liquefied fluid which evaporates after injection is injected to a boundary between the base material and the lining material.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: July 6, 2021
    Assignee: IHI CORPORATION
    Inventors: Akira Sadaki, Jun Maeno, Akito Yamasaki, Tomoko Ebata, Yuichi Takahama
  • Adhesive bonding and sealing of seams and joints
    Patent number: 11027496
    Abstract: The adhesive bonding and sealing by application of adhesive material and sealing material at corresponding seams and joints, wherein the adhesive material is arranged to rest directly, at least in part, on the sealing material.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: June 8, 2021
    Inventors: Russos Makris, Patrick Krauss
  • Method for the bonding and debonding of substrates
    Patent number: 11024530
    Abstract: A product-substrate-to-carrier-substrate bond with a product substrate, which is bonded to a carrier substrate via a connection layer, wherein a soluble layer is arranged between the connection layer and the product substrate, and wherein a) the soluble layer is soluble due to an interaction with an electromagnetic radiation of a radiation source, and b) the connection layer and the carrier substrate are both at least predominantly transparent to the electromagnetic radiation transmitted through the connection layer, wherein a material of the soluble layer and the electromagnetic radiation are chosen such that an increase of temperature of the soluble layer caused by the interaction with the electromagnetic radiation is less than 50° C.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: June 1, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventors: Jurgen Burggraf, Harald Wiesbauer
  • Peel-off device
    Patent number: 11001044
    Abstract: A blade includes an edge to be pressed against an end portion of a carrier film to fold the end portion upwards from a sheet. A clamp mechanism peels the carrier film off from the sheet by moving while clamping the upwardly folded end portion of the carrier film.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: May 11, 2021
    Assignee: NIKKISO CO., LTD.
    Inventors: Toru Makino, Tomoyo Sawada, Takahiro Mori
  • Films and bags with visually distinct regions and methods of making the same
    Patent number: 10994509
    Abstract: One or more implementations of a multi-layer film include a first substantially un-pigmented layer non-continuously bonded to a second pigmented layer. The multi-layer film includes an unexpected appearance differing from the appearance of the pigmented layer. In one or more embodiments, the multi-layer film includes a metallic appearance despite the pigmented layer being devoid of metallic pigment. The multi-layer film also includes areas that are visually distinct from areas of the film with the unexpected appearance. The visually-distinct areas comprise areas in which the first substantially un-pigmented layer non-continuously bonded is in intimate contact with the second pigmented layer. The visually-distinct areas have the appearance of the pigmented layer. One or more implementations also include methods of making multi-layer films and bags with an unexpected appearance and visually-distinct areas.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: May 4, 2021
    Assignee: The Glad Products Company
    Inventors: Kyle R. Wilcoxen, Theodore J. Fish, Jason R. Maxwell, Kenneth E. Cisek, Michael O. Johnson
  • Device for removing portion of cover and method of removing portion of cover
    Patent number: 10993358
    Abstract: A device for removing a portion of cover is provided, which includes a lower platform and an upper platform oppositely disposed, a cover jig between the lower and upper platforms, a feed roller and a receiving roller oppositely disposed, and an adhesive film. The upper platform includes a plurality of protrusions, and each of the protrusions extends toward the lower platform. The cover jig includes a plurality of through holes, and each of the through holes is disposed opposite to each of the protrusions, so that each of the protrusions can be inserted through each of the through holes. One end of the adhesive film is connected to the feed roller, and the other end of the adhesive film is connected to the receiving roller, and a portion of the adhesive film between the two ends is located between the upper platform and the cover jig.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: April 27, 2021
    Assignee: Unimicron Technology Corp.
    Inventors: Chi-Shiang Chen, Bo-Han Li
  • Drywall banjo tools for applying joint tape
    Patent number: 10988339
    Abstract: Method and apparatus are disclosed for drywall banjo tools for applying joint tape. An example drywall banjo for applying joint tape includes a banjo body. The banjo body includes a panel and side walls protruding from outer edges of the panel to define a cavity that is configured to contain joint compound mud. The side walls include a first side wall that extends between an inlet and an outlet. The example disclosed drywall banjo also includes a sloped mound configured to couple to and project away from the first side wall within the cavity. The sloped mound is configured to guide the joint compound mud within the cavity toward the joint tape travelling between the inlet and the outlet to enable the joint compound mud to uniformly collect on a side of the joint tape.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: April 27, 2021
    Assignee: THE ADVANCE EQUIPMENT MANUFACTURING COMPANY
    Inventors: John Wedekind, Duane Huber, Richard Eisfeller, II