Abstract: A measurement unit includes: a ground portion forming a part of a line configured to provide continuity for grounding electric potential, the ground portion including a surface forming a plane at one end of the ground portion; a signal portion forming a part of a line configured to provide continuity for a signal for measurement, the signal portion including an end portion configured to come out in a plane that is same as the plane of the ground portion; an insulative dielectric portion provided between the ground portion and the signal portion; an electrically conductive first contact probe configured to expand and contract along a longitudinal axis, the first contact probe coming into contact with the signal portion; and an electrically conductive second contact probe configured to expand and contract along a longitudinal axis, the second contact probe coming into contact with the ground portion.

Abstract: The present disclosure proposes a coil sensor circuit including a sensor coil configured to provide an AC sensor signal, a feedforward amplifier stage configured to amplify the AC sensor signal to obtain an amplified sensor signal, a feedback amplifier stage coupled between an output and an input of the feedforward amplifier stage and configured to provide a control signal for cancelling a DC offset of the feedforward amplifier stage, and a switching circuit The switching circuit is configured to, during a first operational mode of the coil sensor circuit, couple the sensor coil to the input of the feedforward amplifier stage, and, during a second operational mode of the coil sensor circuit, decouple the sensor coil from the feedforward amplifier stage, and increase a gain of the coil sensor circuit with respect to the first operational mode.

Abstract: The present invention relates to a moisture sensor comprising a support substrate having a first face and a second face, geometrically opposite to the first face, and wherein: the first face is provided with a plurality of pairs of electrodes configured to be in contact with a liquid, and the second face comprises a plurality of means of detection connected to each other in parallel, and each means of detection comprises a transistor associated to a pair of electrodes, and the moisture sensor is sensitive to an equivalent resistance of the plurality of means of detection.

Abstract: A compact testing system for sockets is presented having a removable and easily replaceable DUT PCB electrically connected with the electrical testing components of the system. The DUT PCB includes a socket to receive a DUT having electrical contacts. In one or more arrangements, the system includes a housing forming a hollow interior and a motherboard. The motherboard has electrical contacts connected to the test circuitry. In one or more arrangements, the system includes a receiver in a top surface of the housing to receive and hold the DUT PCB. When the DUT is held within the socket the DUT is electrically connected to the electrical contacts of the DUT PCB. When the second circuit board is held within the receiver assembly, the DUT PCB is electrically connected with the DUT, thereby electrically connecting the test circuitry with the DUT for testing.

Abstract: A method of monitoring a thermal impedance of at least a portion of a thermal path between a semiconductor device having at least two output terminals and a heat sink s provided. The method includes causing power dissipation in the semiconductor device by reloading parasitic capacitances of the semiconductor device such that the at least two output terminals are at the same voltage level, measuring a first temperature in response to the power dissipation at a first end of the portion of the thermal path, measuring a second temperature in response to the power dissipation at a second end of the portion of the thermal path, and determining a measure of the thermal impedance based on the first temperature and the second temperature.

Abstract: An optical metrology device includes a selectable pump arm that is used to produce a transient response in the target sample and a probe arm and may be configured to perform static Magneto-Optic Kerr Effect (MOKE) measurements or ellipsometry measurements when the pump arm is not selected, and time resolved (TR) MOKE measurements or ellipsometry measurements when the pump arm is selected. The optical metrology device may be further configured to perform opto-acoustic measurements when the pump arm is selected. A pulse shaper in the pump arm may be used to modify the pulse duration, phase, or both, of the incident pump beam to enable measurement of the dependence of the magnetic dynamics on the pump pulse characteristics. The optical metrology device may be configured to operate at a single selectable wavelength or multiple wavelengths in a continuous or discontinuous spectrum.

Abstract: An example system is configured to detect a fault in a bundle of wires. The bundle of wires include a first wire and a second wire. The system includes a first driver that is electrically connectable to, and electrically disconnectable from, the first wire; a second driver that is electrically connectable to, and electrically disconnectable from, the second wire; and a control system to control the first driver to electrically connect to the first wire and to output a signal to the first wire, to control the second driver to electrically connect to the second wire and to drive a static voltage to the second wire to enable the second wire to act as a signal return for the first wire, and to detect a fault in the first wire based on a reflection of the signal on the first wire.

Abstract: Improved performance for attenuated testing when probing a device under test with a probe array is provided. By moving the attenuation components from their conventional location on the printed circuit board of the probe head to the space transformer of the probe head, electrical path lengths can be decreased, thereby improving performance. This is particularly helpful in connection with loopback testing.

Abstract: A magnetic sensor includes a plurality of MR elements, a plurality of yokes each including a portion long in a first direction, and a plurality of shields each including a portion long in a second direction. The plurality of MR elements include a plurality of first specific elements. The plurality of yokes include a plurality of yoke pairs each including one of the plurality of first specific elements. The plurality of shields include a plurality of shield pairs each with one of the plurality of first specific elements therebetween. The plurality of first specific elements are arranged in a direction intersecting both the first direction and the second direction.

Abstract: A method and an apparatus for testing a semiconductor device are provided. The apparatus includes: one or more ground contacts configured for coupling to one or more ground terminals of the semiconductor device respectively; and a detection module having one or more inputs coupled to the one or more ground contacts respectively, and configured to detect electrical conditions at the one or more ground contacts; wherein, when the semiconductor device is mounted on the test apparatus, a first signal is generated at an output of the detection module if all of the one or more ground contacts are coupled to the one or more ground terminals of the semiconductor device, and a second signal different from the first signal is generated at the output of the detection module if at least one of the one or more ground contacts is not coupled to the one or more ground terminals.

Abstract: A contact sensor for detecting and notifying a separation of a first component of a machine from a second component of the machine is provided. The contact sensor includes a probe for detecting the separation where the first component and the second component are configured to rotate about a common axis of rotation and the probe is configured to be electrically disconnected at a location of the separation. The contact sensor additionally includes a transmitter that is coupled to the probe and is configured to transmit an alert in response to the probe being electrically disconnected.

Abstract: A plurality of conductive parts are aligned along a rotational direction of a rotor. A different-thickness part relatively differs in thickness in one direction. In the rotor, a plurality of gaps are provided to separate the plurality of conductive parts from each other. An excitation coil is annularly arranged on a counter surface of a substrate. A detection coil is disposed inside the excitation coil on the counter surface of the substrate. A detection electrode part is disposed on the counter surface of the substrate such that the detection electrode part overlaps part of a rotation trajectory of the different-thickness part at a time of rotation of the rotor in plan view in the one direction, and the detection electrode part is configured to detect capacitance generated between the detection electrode part and the rotor.

Abstract: A testing device includes a contactless measurement unit configured to measure a thickness of a test object and a probe needle configured to move by a distance in accordance with the thickness measured by the measurement unit to come into contact with an electrode of the test object.

Abstract: A current sensor includes: a first and a second input terminal configured to be capable of having a sense resistor connected therebetween; a square wave generation circuit connected to the first and second input terminals and configured to be capable of generating a square-wave signal with an amplitude proportional to the voltage across the sense resistor; and a current sense signal output circuit configured to be capable of outputting based on the square-wave signal a current sense signal corresponding to the current passing through the sense resistor.

Abstract: A vertical spring contact that is constructed of a single piece of electrical conductor, having a central compressible spine that acts as a spring. This contact is also provided with a pair of arms extending downwards from a top member, flanking both sides of the central spine without being in contact with the central spine. The central spine structurally connects the top member to a bottom member. The bottom member is provided with recesses that are adapted to loosely receive the lower tips of the arms. In this way, when the contact is compressed, the lower tips of the arms are pressed into the recesses, thus establishing more contact points for a current to pass through.

Abstract: According to one embodiment, a cassette housing includes a storage unit, a probe card, and a container. The storage unit stores a semiconductor wafer including a plurality of nonvolatile memory chips. The probe card includes a probe. The probe is configured to be brought into contact with a pad electrode provided on the semiconductor wafer. The container contains heat transfer fluid for lowering or raising temperature of one or both of the probe card and the semiconductor wafer stored in the storage unit.

Abstract: Planarity adjustment of RF microprobes in a load pull setup on wafer, using a low-profile impedance tuner that is mounted on a 3-axis tuner positioner under an angle matching the angle of the wafer probe. is performed using a swivel or a gimbal connecting the vertical axis of the 3-axis tuner positioner with the tuner body. A swivel is used when there is a single geometrical axis between the RF microprobe tips and the tuner slabline. If the axis of the slabline is not aligned with the tips of the RF microprobes, then a gimbal is used to connect the tuner body with the vertical axis of the 3-axis tuner positioner. In all cases the assembly rotates around the axis of the probe tips and allows fine adjustment of the planarity.

Abstract: A phase angle is measured accurately when a resistance component leakage current is measured. A measurement apparatus 10 according to the present disclosure includes a magnetic core 11, first and second coils L1 and L2 wound around the magnetic core 11, a current measurement circuit 12, a voltage measurement circuit 13, a phase angle detection circuit 15, a signal generator 14 that can output sinusoidal waves to the second coil 12 and the phase angle detection circuit 15, and a controller 16. The phase angle detection circuit 15 can detect a calibration phase angle between a current measured by the current measurement circuit 12 when the signal generator 14 is outputting the sinusoidal waves, and one of the sinusoidal waves input from the signal generator 14. The controller 16 calculates a corrected phase angle based on a phase angle and the calibration phase angle, and calculates a resistance component leakage current based on a leakage current and the corrected phase angle.

Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.

Abstract: A test fixture includes a fixed base for placing a module and probes. The fixed base defines threading needle holes, and the threading needle holes communicate with a surface of the fixed base adjacent to the module. The probes are connected with a tester and extend through the threading needle holes to contact with the module placed on the fixed base. The tester is capable of testing the module. When the module is disposed on the fixed base, the probes are directly connected with the module for testing, a gilded block between the module and the probes is omitted for improving a stability and an accuracy of test results. An early warning system is also disclosed.