Abstract: An electrical connecting device includes an insulating probe including a bottom-side plunger, a top-side plunger, and a barrel, and a probe head including a combined guide plate having a conductive region made of a conductive material and an insulating region made of an insulating material arranged adjacent to each other in a planar view. The bottom-side plunger and the top-side plunger are electrically connected to each other inside the barrel, and the bottom-side plunger and the top-side plunger are electrically insulated from the barrel. The probe head holds the insulating probe in a state in which the barrel penetrates through the conductive region. The barrel of the insulating probe is connected to a ground potential via the conductive region when an inspection object is measured.

Abstract: Probe arrays include spacers attached to the probes that were formed along with the probes. Methods of making probe arrays by (1) forming probes on their sides and possibly as linear arrays or combination subarrays (e.g. as a number of side-to-side joined linear arrays) having probes fixed in array positions by a sacrificial material that is temporarily retained after formation of the probes; (2) assembling the probe units into full array configurations using the spacers attached to the probes or using alternative alignment structures to set the spacing and/or alignment of the probe(s) of one unit with another unit; and (3) fixing the probes in their configurations (e.g. bonding to a substrate and/or engaging the probes with one or more guide plates) wherein the spacers are retained or are removed, in whole or in part, prior to putting the array to use.

Abstract: A contact pin includes: a first plunger including a first contact portion provided at an upper end, and a hollow body portion provided below the first contact portion; a second plunger including: a second contact portion provided at a lower end; a first taper portion that is provided above the second contact portion and enlarges in diameter toward the second contact portion; a small diameter portion provided above the first taper portion; and a large diameter portion that is provided above the small diameter portion and is inserted into the body portion to abut on an inner wall surface of the body portion; and a spring for energizing the first and second contact portions to be separated from each other. The first taper portion is capable of abutting on a lower end of the body portion in a case where the first and second contact portions approach each other.

Abstract: Disclosed is a device for testing components under elevated pressure in which a pressure chamber is provided. The lateral boundary of the pressure chamber included a ring and an annular part, which may move perpendicularly to the plane of the component to be tested. A velvet-like lining is provided on the end face of the annular part or of the ring that faces the component to be tested. The fibers of the lining protrude from the annular part or from the ring toward the component to be tested and bridge the gap between the device and the component.

Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two flat spring segments with at least one of those segments being used in a compressive manner wherein the probe additionally includes guide elements, framing structures or other structural configurations that limit or inhibit one or more compressive spring segments from bowing or deflecting out of a desired position when subjected to loading.

Abstract: A busbar for current transport comprises conductive material, which extends along a current direction. A recess for a magnetic field sensor extends into the conductive material, a middle of the recess being shifted by a predetermined distance from a middle of the conductive material in the direction of an edge of the conductive material, so that, within a frequency range, a frequency dependency of a magnetic field, which is induced by an alternating current flowing along the current direction, is reduced in comparison with a busbar having a central recess.

Abstract: A probe card for a testing apparatus of electronic devices comprises a probe head housing a plurality of contact probes, each contact probe having at least one contact tip adapted to abut onto contact pads of a device under test, as well as a main support and an intermediate support connected to the main support and adapted to realize a spatial transformation of distances between contact pads on its opposite faces as a space transformer, the probe card suitably also comprising at least one connecting element adapted to link the space transformer and the main support, this connecting element having a substantially rod-like body and being equipped with a first end portion comprising at least one terminal section adapted to be engaged in a corresponding housing realized in the space transformer and with a second terminal portion adapted to abut onto an abutment element linked to the main support.

Abstract: A probe unit includes: first contact probes each coming into contact with a target electrode on one end side in a longitudinal direction; a second contact probe connected to an external ground; a signal pipe disposed around each first contact probes; a ground member provided around each signal pipe and configured to form an air layer with the signal pipe; a probe holder including a plate-shaped first and second members; a first wiring part provided at least on a front surface of the first member and electrically connected to the second contact probe; a second wiring part provided at least on a front surface of the second member and electrically connected to the second contact probe; a first conductive unit configured to electrically connect the first wiring part and the ground member; and a second conductive unit configured to electrically connect the second wiring part and the ground member.

Abstract: A magnetic field detection device includes a base, a first yoke, and a magneto-resistive effect element. The first yoke is provided on the base, and includes first and second principal surfaces each extending along a first plane, and a first end surface coupling the first and second principal surfaces. The magneto-resistive effect element is provided on the base, and includes a magnetization free layer disposed at a position overlapped with the first yoke in a first direction along the first plane. The first end surface includes an inverted tapered surface inclined relative to the first plane and extending closer to a center point of the magnetization free layer as being away from the base in a second direction orthogonal to the first plane. A distance from the center point to a first edge is shorter than a distance from the center point to a second edge.

Abstract: A vertical probe head includes upper and lower die units having upper and lower through holes, and probes each including a body portion between the die units, tail and head portion installation parts in the upper and lower through holes respectively, and a head portion contact part for electrically contacting a device under test. The probes include a pair of signal probes including at least one distinctive probe, for which, the body portion is smaller in width than the head portion installation part, and a body portion center line is deviated from a head portion installation part center line toward the probe paired thereto. For the paired probes, a head portion contact part pitch is larger than a body portion pitch for matching a large-pitch high-speed differential pair of the device under test, great impedance matching effect, and consistent contact force and stable elasticity of the probes in operation.

Abstract: Embodiments are directed to probes formed from multiple layers with at least a portion of the layers including portions that include elastic compliant regions of the probes wherein such elastic portions of different layers are formed of different materials and wherein a plane of preferred elastic deformation of the probes is parallel to a plane containing (1) a normal to the planes of the layers and (2) a longitudinal axes of the probes or a local longitudinal axes of the probes.

Abstract: A connecting device for inspection includes a probe head configured to hold electric contacts and optical contacts such that tip ends of the respective contacts are exposed on a lower surface of the probe head, and a transformer including connecting wires arranged therein and optical wires penetrating therethrough. The respective proximal ends of the electric contacts and the optical contacts are exposed on an upper surface of the probe head, and tip ends on one side of the connecting wires electrically connected to the proximal ends of the electric contacts and connecting ends of the optical wires optically connected to the proximal ends of the optical contacts are arranged in a lower surface of the transformer.

Abstract: Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Other probes are formed from single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere.

Abstract: The invention relates to a high-frequency test connector device (12; 12?) having an adapter housing including a sleeve-like ground contact section (10; 10?) axially at one end, (18) at the other end, and centrally an insulated inner contact (20), wherein the ground contact section has an electrically conducting spring member (26; 26?, 28; 42, 44; 44?, 46) for ground contact, associated such that for engaging over the sleeve section (14) of the contacting partner (16), the latter with an end face (30), to form a contact and resiliently along the movement or connecting longitudinal axis, can engage on the spring member (26) formed in a sleeve base of the ground contact section (10), or wherein, for engaging in the sleeve section (14?) of the connecting partner (16?), the spring member (26?) projects from an end face end section of the ground contact section (10?), to form a contact and resiliently along the longitudinal axis, can engage on a ground-conducting inner section (40) of the connecting partner.

Abstract: An arc fault detection system with a built-in-test includes an arc fault detector having a load noise voltage input, a test current input and an arc fault detector output. The system includes a processing unit having a switch in electrical communication with the test current input and an input in electrical communication with the arc fault detector output. A method for testing an arc fault detection system includes generating a new bit with a processing unit and outputting the new bit to a switch operatively connected to the processing unit to at least one of turn the switch on or turn the switch off. The method includes reading a signal at an input of the processing unit.

Abstract: A pogo pin-free testing device for IC chip test includes a load board, a ceramic interposer disposed on the load board, and copper core balls. The ceramic interposer has first and second surfaces and connecting points, and the second surface of the ceramic interposer faces the load board. Each connecting point has through holes penetrating the first and second surfaces, and an inner sidewall surface thereof has a metallization layer. The metallization layer is extended to a portion of the first surface and a portion of the second surface. In each of the connecting points, an area of an extending portion of the metallization layer extended to the second surface is less than an area of an extending portion of the metallization layer extended to the first surface. The copper core balls are disposed between the load board and the through holes of each connecting point of the ceramic interposer.

Abstract: A probe pin inspection mechanism a includes a base, a pair of movable bodies, a pair of movable-body elastic bodies, and a conductor. The movable bodies are supported by the base to be movable in a first direction from a first position with respect to the base, and respectively include ends and terminals electrically connected to the respective ends. The movable-body elastic bodies elastically press the movable bodies in a second direction. The conductor is supported by the base and electrically connects the terminals of the movable bodies by making contact with the terminals. The state between the terminals and the conductor is switched, according to the position of the movable bodies, between a conductive state in which the terminals and the conductor are in contact with each other and a non-conductive state in which the terminals and the conductor are separated from each other.

Abstract: An electronic sensor includes a signal generator configured to output excitation signals and a variable differential transformer connected to the signal generator to receive excitation signals. Embodiments of the variable differential transformer may include a primary coil, a first secondary coil connected to the signal generator, a second secondary coil connected to the signal generator, and a core disposed at least partially in a magnetic field generated via the first secondary coil and the second secondary coil and the first excitation signal and the second excitation signal. A phase of an output signal of the primary coil may correspond to a position of the core.

Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.

Abstract: A probe fitting structure includes a connector to be inspected and a probe capable of being fitted to the connector. The connector includes a plurality of connection electrodes. The probe includes a flange having a through hole and used for attaching the probe to a device, a coaxial cable extending through the through hole and including a leading end portion to which a probe pin is attached, a plunger including a leading end through which the probe pin is exposed, and a spring housing the coaxial cable between the flange and the plunger and including a first end portion fixed to the flange and a second end portion fixed to the plunger. The plunger includes a plunger-side fitting portion in a leading end portion of the plunger. The connector includes a connector-side fitting portion (opening portion) capable of being fitted to the plunger-side fitting portion.