Abstract: A probe card device is provided, including a thin film substrate, a first circuit board, and a plurality of probes. The thin film substrate has opposite first and second surface. The first circuit board is disposed over the second surface of the thin film substrate to electrically connect the thin film substrate. The probes are disposed over the first surface of the thin film substrate and are not deformable.

Abstract: A semiconductor test system has a test fixture with a plurality of test sites. Each test site has a DUT placement area and an electrical test circuit dedicated for a DUT to perform voltage and current testing. The electrical test circuit has a voltage measuring block and a current measuring block. The voltage measuring block has an analog-to-digital converter for converting an analog voltage measurement to a digital voltage measurement. The current measuring block has a resistor conducting a current to be measured, an amplifier with a first input and a second input coupled across the resistor, and an analog-to-digital converter with an input coupled to an output of the amplifier and an output for providing a digital current measurement. A test control system controls the test fixture. The electrical test circuit can be an integrated circuit or a discrete circuit.

Abstract: Provided is a printed circuit board for degradation detection, the printed circuit board having an insulator substrate and a wiring pattern for degradation detection, the wiring pattern being formed on an outer surface of the insulator substrate, and the printed circuit board for degradation detection being attached to a main printed circuit board for which degradation is to be detected. The wiring pattern is formed on, of the outer surfaces of the insulator substrate, a back surface positioned on the main printed circuit board side. The insulator substrate has a penetrating part (through hole, notch part) penetrating from the back surface to a front surface positioned on the side opposite from the back surface.

Abstract: Various embodiments are described that relate to failure determination for an integrated circuit. An integrated circuit can be tested to determine if the integrated circuit is functioning properly. The integrated circuit can be subjected to a specific radiation such that the integrated circuit produces a response. This response can be compared against an expected response to determine if the response matches the expected response. If the response does not match the expected response, then the integrated circuit fails the test. If the response matches the expected response, then the integrated circuit passes the test.

Abstract: An optical probe includes a core part and a clad part arranged along an outer circumference of the core part, and has an incident surface having a radius of curvature R through which an optical signal enters. The radius of curvature R and a central half angle ? at an incident point of the optical signal on the incident surface fulfil the following formulae using a radiation angle ? of the optical signal, an effective incident radius Se of the optical signal transmitted in the core part without penetrating into the clad part on the incident surface, a refractive index n(r) of the core part at the incident point, and a refracting angle ? at the incident point: R=Se/sin(?) ?=±sin?1{[K22/(K12+K22)]1/2} where K1=n(r)×cos(?)?cos(?/2) and K2=n(r)×sin(?)?sin(?/2).

Abstract: A device includes a first electronic component and a case, wherein the case includes a first charging compartment configured to accommodate and charge the first electronic component. The device further includes a first magnet included in the first electronic component and a 3D magnetic field sensor included in the case. The device further includes a detection unit configured to detect a position of the first electronic component relative to the first charging compartment based on a magnetic field sensed by the 3D magnetic field sensor.

Abstract: An integrated circuit (IC) device test socket has an integrally formed IC picking mechanism for removing an IC device from the test socket after testing. The test socket has a base member and a cover member. The base member includes a recess that is configured to receive an IC device for testing. The cover member is configured to removably engage the base member to secure the IC device between the cover member and the base member. The cover member includes an IC picking mechanism configured to use suction to retain the IC device to the cover member.

Abstract: A method for automatically detecting a sensor coupled to an electronic computer, including a second step, consisting of passing to a third step when the electronic computer is activated, the third step, consisting of comparing a voltage generated by the sensor coupled to the terminals of the electronic computer with a reference voltage, in the event that the result of the comparison is positive, then passing to a fourth step, and in the event that the result of the comparison is negative, passing to a fifth step, the fourth step, consisting of selecting an impedance matched to the coupling of the voltage-source sensor to the terminals of the electronic computer.

Abstract: A method is provided for determining source match of a test system including an RF source, a vector network analyzer (VNA) and a test port. The method includes connecting a first calibration standard to the test port; generating an RF signal using the RF source, and applying the RF signal to the first calibration standard; measuring a first incident signal of the RF signal at a first receiver of the test system, and measuring a first reflected signal at a second receiver of the test system; connecting a second calibration standard to the test port; measuring a second incident signal of the RF signal at the first receiver of the test system, and measuring a second reflected signal at the second receiver of the test system; and determining the source match of the test system using the first incident and reflected signals and the second incident and reflected signals.

Abstract: A system for detecting forbidden objects worn or carried by individuals includes a metal detector having at least three transducers arranged on either side of a passage, two of these transducers being positioned on the one same side of the passage and spaced apart longitudinally in the direction of travel through the passage, while the third transducer is positioned on the opposite side of the passage so that the three transducers are available in combination to perform spatial discrimination of the location of the metallic objects detected.

Abstract: The present application discloses a chip socket, a testing fixture and a chip testing method thereof. The chip socket includes a pedestal, a plurality of conductive traces, a plurality of clamp structures, and a plurality of electrical contacts. The plurality of conductive traces are formed in the pedestal. The plurality of clamp structures are conductive and disposed on the first surface of the pedestal, and at least one of the plurality of clamp structures is coupled to a corresponding conductive trace and configured to clamp a solder ball of a chip to be tested. The plurality of electrical contacts are disposed on the second surface of the pedestal, and at least one of the plurality of electrical contacts is coupled to a corresponding clamp structure through a corresponding conductive trace.

Abstract: Using a capacitance sensor may include taking a first noise measurement by imposing a first signal on a capacitance sensor, the first signal having a first frequency; taking a second noise measurement by imposing a second signal on the capacitance sensor, the second signal having a second frequency different than the first frequency; determining the measurement with the lower amount of noise between the first noise measurement and the second noise measurement; and taking a capacitance measurement by imposing a third signal on the capacitance sensor, the third signal having either the first frequency or the second frequency based, at least in part, on the frequency of the measurement with the lower amount of noise.

Abstract: A calibration apparatus is provided with a calibration card (6) attachable in an insertion opening (E) of a wafer prober (1) to form a corresponding substantially closed space. A calibration temperature probe (60, 61) attached to the calibration card can be approached by a temperature-controlled chuck (3), for clamping the wafer (4) which can be moved by means of a position controller (350) in lateral directions and in height direction. The position controller operates in such a way that the calibration temperature probe (60, 61) can detect a respective current temperature at various positions on the surface (O) of the chuck or on the surface (O?) of a wafer (4) clamped thereon.

Abstract: A non-intrusive, in-situ power method for measuring the loss associated with magnetic components (for example, an inductor) of a power converter is provided. The method involves first capturing a first set of voltage and current waveforms from the power converter. An additional capacitor is then connected to the power converter and a second set of voltage and current waveforms are captured. Based on the first set of waveforms and the second set of waveforms, a timing skew between the current and voltage waveforms captured from the power converter may be determined. This timing skew may then be used to determine the loss of the inductor. The loss may be used to design an optimized power converter.

Abstract: A calibration circuit may include a calibration signal generator configured to receive an oscillator signal provided by an oscillator and generate a calibration signal based on the oscillator signal. The calibration signal may be generated to have a predetermined amplitude. The calibration circuit may include a calibration peak detector configured to detect a peak amplitude of the calibration signal. The calibration circuit may include a logic circuit configured to calibrate a peak detector connected to the oscillator based at least in part on the peak amplitude of the calibration signal.

Abstract: The present invention relates to an eddy current sensor for detecting a crack in a battery cell, and a system for detecting a crack of a battery cell including the eddy current sensor. According to the present invention, it is possible to easily detect a crack generated in an electrode, an electrode tab or a welded portion.

Abstract: A nuclear magnetic resonance coil array and a decoupling method thereof, and a nuclear magnetic resonance detection device. The coil array includes: a coil resonant unit and a decoupling network unit, where the coil resonant unit includes multiple coil resonant circuits; the decoupling network unit includes multiple decoupling circuits; where a coil resonant circuit includes a coil and a resonant capacitor; the resonant capacitor in each coil resonant circuit is connected in parallel with the coil; the coils in each coil resonance circuit are equally spaced on a circumference; a decoupling circuit is provided between a positive terminal and a negative terminal of adjacent coils, respectively; each coil is connected to an antenna switching circuit of a nuclear magnetic resonance detection device at the same time.

Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

Abstract: A magnetic sensor includes a magnetic field converter, a magnetic field detector, and a plurality of shields aligned in a Y direction. The magnetic field converter includes a plurality of yokes. Each yoke has a shape elongated in the Y direction, and is configured to receive an input magnetic field component in a direction parallel to a Z direction and to output an output magnetic field component in a direction parallel to an X direction. The magnetic field detector includes a plurality of trains of elements. Each train of elements includes a plurality of MR elements that are aligned in the Y direction along one yoke and connected in series. Each shield has such a shape that its maximum dimension in the Y direction is smaller than its maximum dimension in the X direction.

Abstract: A tester apparatus is described. Various components contribute to the functionality of the tester apparatus to facilitate movement of a wafer pack holding a vacuum without human oversight. These functionalities include a latch system to keep the wafer pack intact and a pressure sensing system to detect and relay a pressure in the wafer pack.