Abstract: A method and an apparatus for testing a semiconductor device are provided. The apparatus includes: one or more ground contacts configured for coupling to one or more ground terminals of the semiconductor device respectively; and a detection module having one or more inputs coupled to the one or more ground contacts respectively, and configured to detect electrical conditions at the one or more ground contacts; wherein, when the semiconductor device is mounted on the test apparatus, a first signal is generated at an output of the detection module if all of the one or more ground contacts are coupled to the one or more ground terminals of the semiconductor device, and a second signal different from the first signal is generated at the output of the detection module if at least one of the one or more ground contacts is not coupled to the one or more ground terminals.

Abstract: A contact sensor for detecting and notifying a separation of a first component of a machine from a second component of the machine is provided. The contact sensor includes a probe for detecting the separation where the first component and the second component are configured to rotate about a common axis of rotation and the probe is configured to be electrically disconnected at a location of the separation. The contact sensor additionally includes a transmitter that is coupled to the probe and is configured to transmit an alert in response to the probe being electrically disconnected.

Abstract: A plurality of conductive parts are aligned along a rotational direction of a rotor. A different-thickness part relatively differs in thickness in one direction. In the rotor, a plurality of gaps are provided to separate the plurality of conductive parts from each other. An excitation coil is annularly arranged on a counter surface of a substrate. A detection coil is disposed inside the excitation coil on the counter surface of the substrate. A detection electrode part is disposed on the counter surface of the substrate such that the detection electrode part overlaps part of a rotation trajectory of the different-thickness part at a time of rotation of the rotor in plan view in the one direction, and the detection electrode part is configured to detect capacitance generated between the detection electrode part and the rotor.

Abstract: A testing device includes a contactless measurement unit configured to measure a thickness of a test object and a probe needle configured to move by a distance in accordance with the thickness measured by the measurement unit to come into contact with an electrode of the test object.

Abstract: A current sensor includes: a first and a second input terminal configured to be capable of having a sense resistor connected therebetween; a square wave generation circuit connected to the first and second input terminals and configured to be capable of generating a square-wave signal with an amplitude proportional to the voltage across the sense resistor; and a current sense signal output circuit configured to be capable of outputting based on the square-wave signal a current sense signal corresponding to the current passing through the sense resistor.

Abstract: A vertical spring contact that is constructed of a single piece of electrical conductor, having a central compressible spine that acts as a spring. This contact is also provided with a pair of arms extending downwards from a top member, flanking both sides of the central spine without being in contact with the central spine. The central spine structurally connects the top member to a bottom member. The bottom member is provided with recesses that are adapted to loosely receive the lower tips of the arms. In this way, when the contact is compressed, the lower tips of the arms are pressed into the recesses, thus establishing more contact points for a current to pass through.

Abstract: According to one embodiment, a cassette housing includes a storage unit, a probe card, and a container. The storage unit stores a semiconductor wafer including a plurality of nonvolatile memory chips. The probe card includes a probe. The probe is configured to be brought into contact with a pad electrode provided on the semiconductor wafer. The container contains heat transfer fluid for lowering or raising temperature of one or both of the probe card and the semiconductor wafer stored in the storage unit.

Abstract: Planarity adjustment of RF microprobes in a load pull setup on wafer, using a low-profile impedance tuner that is mounted on a 3-axis tuner positioner under an angle matching the angle of the wafer probe. is performed using a swivel or a gimbal connecting the vertical axis of the 3-axis tuner positioner with the tuner body. A swivel is used when there is a single geometrical axis between the RF microprobe tips and the tuner slabline. If the axis of the slabline is not aligned with the tips of the RF microprobes, then a gimbal is used to connect the tuner body with the vertical axis of the 3-axis tuner positioner. In all cases the assembly rotates around the axis of the probe tips and allows fine adjustment of the planarity.

Abstract: A phase angle is measured accurately when a resistance component leakage current is measured. A measurement apparatus 10 according to the present disclosure includes a magnetic core 11, first and second coils L1 and L2 wound around the magnetic core 11, a current measurement circuit 12, a voltage measurement circuit 13, a phase angle detection circuit 15, a signal generator 14 that can output sinusoidal waves to the second coil 12 and the phase angle detection circuit 15, and a controller 16. The phase angle detection circuit 15 can detect a calibration phase angle between a current measured by the current measurement circuit 12 when the signal generator 14 is outputting the sinusoidal waves, and one of the sinusoidal waves input from the signal generator 14. The controller 16 calculates a corrected phase angle based on a phase angle and the calibration phase angle, and calculates a resistance component leakage current based on a leakage current and the corrected phase angle.

Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.

Abstract: A test fixture includes a fixed base for placing a module and probes. The fixed base defines threading needle holes, and the threading needle holes communicate with a surface of the fixed base adjacent to the module. The probes are connected with a tester and extend through the threading needle holes to contact with the module placed on the fixed base. The tester is capable of testing the module. When the module is disposed on the fixed base, the probes are directly connected with the module for testing, a gilded block between the module and the probes is omitted for improving a stability and an accuracy of test results. An early warning system is also disclosed.

Abstract: A current sensor includes units each of which has a bus bar through which current flows, a magnetic sensor facing one of plate surfaces of the bus bar, a shield facing the other plate surface. The units have a large-current unit and a small-current unit. A first distance between the bus bar and the magnetic sensor in a normal direction of the plate surfaces of the bus bar is the same as a distance L1A of the large-current unit and a distance L1B of the small-current unit. Since, as for a second distance between the bus bar and a base of the shield, a distance L2A of the large-current unit is larger than a distance L2B of the small-current unit, a measurement range of the large-current unit is widened and a measurement error due to magnetic saturation of the shield is suppressed.

Abstract: A device for measuring a property of a substrate comprises an enclosure, two resonators, and two probes. The substrate has a top surface, and the enclosure defines a cavity for placing the substrate. The resonators extend into the cavity of the enclosure. The probes extend into the cavity, and each of the probes comprises a loop that extends about an axis that is substantially parallel to the top surface of the substrate so that the probes are operable to excite a transverse magnetic mode signal in the cavity.

Abstract: Provided is a probe card test system and method, the probe card test system including a loader for loading and placing a probe card for testing electrical properties of a substrate, on a holder, an inverter for transferring the probe card placed on the holder, to a preliminary position by inverting the probe card, a transferer for transferring the probe card transferred to the preliminary position, to a test table, a test table mover for precisely moving the test table in a first direction to test probe pins of the probe card, an optical system for optically testing the probe pins of the probe card, and an optical system mover for precisely moving the optical system or the test table in a second direction perpendicular to the first direction, to test all the probe pins of the probe card.

Abstract: Disclosed is a sensing block inspection device thermally fused and laser-welded to be mounted on a battery module to dispose a sensing block including a front and a near so that various inspections are performed through rotation, the sensing block inspection device including: a turntable for rotating a jig member mounted with a sensing block; an insulation resistance inspection unit for performing an insulation resistance inspection on the sensing block; a heat-fusion unit for heat-fusing the sensing block; a laser-welding unit for laser-welding the sensing block; an energization inspection unit for performing an energization inspection on the sensing block; a vision inspection unit for transmitting image information to a control unit; and a barcode adhesive unit for adhering a barcode printing paper to the sensing block, wherein the control unit controls the turntable to allow the jig member to sequentially move to the above components.

Abstract: A probe card for use in circuit probe testing and methods of fabrication thereof. The probe card includes a circuit board, an interposer structure that is mounted to the circuit board, and a probe structure mounted to the interposer structure and including a probe substrate, a redistribution layer over the probe substrate, and a plurality of probe pins over the redistribution layer. The interposer structure may include a plurality of elastically-deformable interposer pins electrically connecting the circuit board to the probe substrate. The center-to-center spacing (i.e., pin pitch) between the interposer pins may be greater than the center-to-center spacing (i.e., a second pin pitch) between the probe pins. A probe card in accordance with various embodiments may enable circuit probe testing of a device-under-test with a pitch between adjacent probe pins that is less than 50 ?m.

Abstract: Provided is an apparatus for connecting a wire for circuit board testing to a circuit board and a circuit board verification apparatus, the apparatus including a probe configured to electrically connect a test point included in the circuit board to a wire for circuit board testing by soldering the wire to the test point, and a robot arm configured to place the probe at a preset position on the circuit board.

Abstract: A test socket including: a testing probe including a lower plunger in contact with a pad; an upper plunger coupled to the lower plunger; a spring probe made of a cylindrical spring for applying elasticity to the lower plunger and the upper plunger; and a contact probe with an upper side contacting a terminal of a test device and a lower side contacting the upper plunger; a socket housing that provides housing holes and accommodates the contact probe and the spring probe so that an upper side of the contact probe protrudes at each housing hole; and a cover that provides cover holes and is fastened to the socket housing so that a lower side of the lower plunger protrudes at each cover hole, wherein the upper plunger provides a sliding groove, the lower plunger provides a pair of sliding protrusions inserted into the sliding groove.

Abstract: An apparatus for testing an image sensor includes a load resistor, a first switch configured to be electrically connected to a first signal line of a device under test and a first end of the load resistor, a second switch configured to be electrically connected to a second signal line of the device under test and a second end of the load resistor, a first parametric measuring unit electrically connected to the first switch, and a second parametric measuring unit electrically connected to the second switch. At least one of the first parametric measuring unit and the second parametric unit is configured to correct an error of the load resistor during a testing operation of an output voltage of the device under test.

Abstract: A device with battery model optimization includes: a processor configured to perform optimization on a battery model for determining optimized parameter values of parameters of the battery model, wherein, to perform the optimization, the processor is configured to: select target parameters from among parameters of a battery model; set a current boundary condition for each of the target parameters; determine an optimized parameter value of each of the target parameters based on the set current boundary condition; set a subsequent boundary condition reduced from the current boundary condition based on the determined optimized parameter value; and determine a subsequent optimized parameter value of each of the target parameters based on the subsequent boundary condition.