Abstract: An inspection jig includes a rod-shaped probe, a first support portion that supports one end portion side of the probe, a second support portion that supports the other end portion side of the probe, and a separation holding member that holds the first support portion and the second support portion to be separated from each other. The first support portion includes a support plate in which a through hole through which the probe is inserted is formed. A reinforcing plate having bending strength stronger than that of the support plate is disposed on a surface of the support plate facing the second support portion.

Abstract: In a pulse edge detection circuit, a measurement circuit has a comparator provided therein which compares a voltage with a reference voltage and outputs a pulse signal. An RSFF puts a signal in a high level at a timing at which detecting a rise edge due to a change of the pulse signal to the high level. In such manner, a set signal of an RSFF becomes inactive and a reset signal of the RSFF becomes active, and a fall edge of the pulse signal becomes detectable. When a fall edge is generated due to a change of the pulse signal from the high level to the low level, the set signal of the RSFF becomes active, and a signal becomes high level.

Abstract: A sensor assembly and sensing method is provided for proximity detection for assessing an attachment state of a sensing probe with respect to a subject. A probe is coupled to an electronic probe controller. The probe includes a proximity sensor having a passive energy storing circuit element, and a biological sensor receptacle configured to receive a biological sensor for sensing a biological characteristic of an object. The electronic probe controller excites a circuit network incorporating the proximity sensor with an excitation signal and determines a characteristic of the circuit network that is excited by the excitation signal. The electronic probe controller further generates a proximity indication indicating whether the probe is attached to the object based on the characteristic of the circuit network.

Abstract: A testing base includes a housing, a carrier, a wave absorber, and a filler. The housing has an inner surface. The carrier is disposed on the housing. The carrier includes an upper surface, a lower surface, and a groove recessed in the upper surface. The groove is adapted for accommodating a component to be tested. The lower surface and the inner surface of the housing define a cavity body together. The wave absorber is disposed on the inner surface of the housing. The filler is filled in the cavity body and contacts the wave absorber and the carrier. A relative permittivity of the filler is less than or equal to 2.

Abstract: A module substrate for a semiconductor module includes: a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction; a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring, and a fastening thin film provided on the wiring substrate and covering the via holes, wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface is pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.

Abstract: An oscillation detector includes an amplitude variation detection circuit configured to generate a first pulse signal by comparing levels of voltages with each other, a frequency variation detection circuit configured to generate a second pulse signal by filtering the first pulse signal and allowing to pass a frequency component that is less than or equal to a certain frequency among frequency components of the first pulse signal, and a time variation detection circuit configured to output an oscillation detection signal when the second pulse signal has consecutive pulses for a period of time.

Abstract: A sensing system and method of recognizing a hand gesture established by a sequence of hand touch positionings on an object. The method includes at least steps of: providing to a signal line a time-dependent measurement signal; receiving the measurement signal after being at least partially reflected by at least one portion of the signal line; determining positions on the object of the portions of the signal line that have reflected the measurement signal; comparing an obtained plurality of stored successively determined positions on the object with at least one predefined pattern of successive positions to derive a measure of similarity; and providing an output signal that is indicative of the predefined pattern of successive positions if the derived measure of similarity is lower than a predefined threshold value.

Abstract: An electrical component inspection instrument includes a substrate and a rod-shaped conductor component having one end for contact with a conductor of an electrical component which is an object to be inspected. A conductor pattern on a board surface of the substrate reaches an edge of the substrate, and the other end of the rod-shaped conductor component is electrically connected to the conductor pattern at the edge of the substrate. A direction in which the rod-shaped conductor component extends is orthogonal to the direction of the normal to the board surface of the substrate.

Abstract: A method includes applying first different voltages to pixels included in a reference pixel column and pixels included in a pad adjacent pixel column electrically connected to a second pad adjacent to a first pad connected to the reference pixel column, and applying second different voltages to the pixels included in the reference pixel column and to pixels included in a line adjacent pixel column electrically connected to a second data line adjacent to a first data line connected to the reference pixel column.

Abstract: A probe card and a wafer testing assembly thereof are provided. The wafer testing assembly includes a printed circuit board, a space transformer, a plurality of copper pillars and a plurality of strengthening structure units. The printed circuit board includes a bottom surface and a plurality of first contacts arranged on the bottom surface. The space transformer includes a top surface and a plurality of second contacts. The second contacts are arranged on the top surface and corresponding to the first contacts. The copper pillars are respectively arranged between the first contacts and the second contacts. Two ends of each of the copper pillars are respectively electrically connected to the first contacts and the second contacts. The strengthening structure units are arranged on the bottom surface of the printed circuit board and respectively surrounding the copper pillars.

Abstract: An arc detection system includes an obtainer and a determiner. The obtainer obtains a measurement result for current flowing in a power supply line to which power is supplied from a DC power source. The determiner determines, based on a component of a specific frequency band in the measurement result for the current obtained by the obtainer, whether an arc fault has occurred. The determiner determines that the arc fault has occurred when a specific time for which the component of the specific frequency band is at least a threshold is longer than an occurrence time in which an arc can occur when a device is attached to or detached from the power supply line.

Abstract: A radio frequency (RF) test probe adapter comprises a cable adapter operable for use with a RF test probe and a housing. The cable adapter comprises a cable connector configured to physically couple to a connector of a coaxial cable, a first pin operable to electrically couple a center conductor of the coaxial cable to a first lead of the RF test probe, and a second pin operable to electrically couple an outer conductor of the coaxial cable to a second lead of the test probe. The housing is sized and shaped to secure the RF test probe and the cable adapter in a physically coupled configuration.

Abstract: The present disclosure provides a thin film sensor and a method for preparing a thin film sensor. The thin film sensor includes: a base substrate; a first conductive mesh on the base substrate; where the first conductive mesh includes first metal wires arranged side by side along a first direction and each extending in a second direction, and second metal wires each extending in a third direction; and the first metal wires intersect with the second metal wires; and a second conductive mesh on a side of the first conductive mesh away from the base substrate; where the second conductive mesh includes first transparent conductive wires arranged side by side along the first direction and each extending in the second direction, and second transparent conductive wires each extending in the third direction; and the first transparent conductive wires intersect with the second transparent conductive wires.

Abstract: A signal processing method according to the present disclosure is for use in a signal processing system including a first magnetic detection unit, a second magnetic detection unit, and a processing unit. The signal processing method includes an angle calculating step and a failure diagnosis step. The angle calculating step includes transforming, by using an inverse trigonometric function, a sine signal, a cosine signal, and a tangent signal into a first angle signal, a second angle signal, and a third angle signal, respectively. The failure diagnosis step includes making a failure diagnosis of the first magnetic detection unit and the second magnetic detection unit by comparing with each other two or more pieces of angle information selected from first angle information, second angle information, and third angle information.

Abstract: High frequency operation of an integrated circuit test system is greatly extended by incorporation of a dedicated high frequency signal element that provides a circuit specific compensation network as part of the intermediation circuit board that enables connectivity between test equipment and the integrated circuit under test.

Abstract: An in-vehicle power supply structure, in which a vehicle is divided into a plurality of zones and a power supply hub for connecting an electronic device is provided in each of the zones, includes a break detection wire routed along a power supply wire, for detecting damage to the power supply wire caused by an external force acting on the vehicle by its own damage. Both ends of the break detection wire are connected to power supply hubs placed adjacent to each other.

Abstract: A voltage sensor is disclosed for high and medium voltage use, wherein a voltage divider is arranged in a housing with external creepage distance enlarging ribs. To implement structures for creepage path enlargement to a sensor housing in a very effective and easy way, the voltage divider is arranged in a housing or in housing modules which is or are covered at least partly by at least one shrinking tube of insulating material such that the shrinking creepage enlarging structures are implemented at least at outer surface of the shrinking tube.

Abstract: Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Other probes are formed from single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere.

Abstract: Systems and methods for weapon and destructive device detection based on electromagnetic field profile are disclosed herein. According to an aspect, a system includes one or more sensors configured to detect an electromagnetic field of one or more objects and to output an electrical signal representative of the electromagnetic field. The system also includes a computing device operably connected to the one or more sensors. Further, the computing device is configured to receive the electrical signal. The computing device is also configured to determine whether each of the one or more objects meets a predetermined electromagnetic field profile based on the electrical signal. Further, the computing device is configured to present a notification to a user in response to determining that one of the objects meet the predetermined electromagnetic field profile.

Abstract: A contact terminal includes a tubular body extending in an axial direction parallel to a central axis of the contact terminal and a bar-shaped conductor having conductivity. The conductor includes a protrusion protruding toward one side in the axial direction from the tubular body, and an insertion portion disposed inside from an outer periphery of the tubular body. The tubular body includes an end side notch provided along the axial direction on a peripheral surface of the one end portion in the axial direction of the tubular body, and a first circumferential notch connected to another side in the axial direction of the end side notch and provided along a circumferential direction away from the end side notch with respect to a first end portion in a circumferential direction of the end side notch.