Abstract: The present application discloses a chip socket, a testing fixture and a chip testing method thereof. The chip socket includes a pedestal, a plurality of conductive traces, a plurality of clamp structures, and a plurality of electrical contacts. The plurality of conductive traces are formed in the pedestal. The plurality of clamp structures are conductive and disposed on the first surface of the pedestal, and at least one of the plurality of clamp structures is coupled to a corresponding conductive trace and configured to clamp a solder ball of a chip to be tested. The plurality of electrical contacts are disposed on the second surface of the pedestal, and at least one of the plurality of electrical contacts is coupled to a corresponding clamp structure through a corresponding conductive trace.

Abstract: Using a capacitance sensor may include taking a first noise measurement by imposing a first signal on a capacitance sensor, the first signal having a first frequency; taking a second noise measurement by imposing a second signal on the capacitance sensor, the second signal having a second frequency different than the first frequency; determining the measurement with the lower amount of noise between the first noise measurement and the second noise measurement; and taking a capacitance measurement by imposing a third signal on the capacitance sensor, the third signal having either the first frequency or the second frequency based, at least in part, on the frequency of the measurement with the lower amount of noise.

Abstract: A calibration apparatus is provided with a calibration card (6) attachable in an insertion opening (E) of a wafer prober (1) to form a corresponding substantially closed space. A calibration temperature probe (60, 61) attached to the calibration card can be approached by a temperature-controlled chuck (3), for clamping the wafer (4) which can be moved by means of a position controller (350) in lateral directions and in height direction. The position controller operates in such a way that the calibration temperature probe (60, 61) can detect a respective current temperature at various positions on the surface (O) of the chuck or on the surface (O?) of a wafer (4) clamped thereon.

Abstract: A non-intrusive, in-situ power method for measuring the loss associated with magnetic components (for example, an inductor) of a power converter is provided. The method involves first capturing a first set of voltage and current waveforms from the power converter. An additional capacitor is then connected to the power converter and a second set of voltage and current waveforms are captured. Based on the first set of waveforms and the second set of waveforms, a timing skew between the current and voltage waveforms captured from the power converter may be determined. This timing skew may then be used to determine the loss of the inductor. The loss may be used to design an optimized power converter.

Abstract: A calibration circuit may include a calibration signal generator configured to receive an oscillator signal provided by an oscillator and generate a calibration signal based on the oscillator signal. The calibration signal may be generated to have a predetermined amplitude. The calibration circuit may include a calibration peak detector configured to detect a peak amplitude of the calibration signal. The calibration circuit may include a logic circuit configured to calibrate a peak detector connected to the oscillator based at least in part on the peak amplitude of the calibration signal.

Abstract: The present invention relates to an eddy current sensor for detecting a crack in a battery cell, and a system for detecting a crack of a battery cell including the eddy current sensor. According to the present invention, it is possible to easily detect a crack generated in an electrode, an electrode tab or a welded portion.

Abstract: A nuclear magnetic resonance coil array and a decoupling method thereof, and a nuclear magnetic resonance detection device. The coil array includes: a coil resonant unit and a decoupling network unit, where the coil resonant unit includes multiple coil resonant circuits; the decoupling network unit includes multiple decoupling circuits; where a coil resonant circuit includes a coil and a resonant capacitor; the resonant capacitor in each coil resonant circuit is connected in parallel with the coil; the coils in each coil resonance circuit are equally spaced on a circumference; a decoupling circuit is provided between a positive terminal and a negative terminal of adjacent coils, respectively; each coil is connected to an antenna switching circuit of a nuclear magnetic resonance detection device at the same time.

Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

Abstract: A duty cycle measurement (DCM) device includes a charge pump circuit and a clocked comparator circuit. The charge pump circuit is configured to receive a clock signal that has an unknown duty cycle and to generate a capacitor voltage based on the duty cycle of the clock signal. The clocked comparator circuit is configured to receive the capacitor voltage and a reference voltage and to generate a digital output code based on the capacitor voltage and the reference voltage. The digital output code is indicative of the duty cycle of the clock signal. The charge pump circuit is further configured to receive the digital output code. A method of determining a duty cycle of a clock signal is also disclosed.

Abstract: A corrosion sensor is an electric resistance type corrosion sensor including a sensor portion exposed to an arbitrary environment and formed of an electric conductor, and a reference portion isolated from the arbitrary environment and formed of an electric conductor, and measuring a corrosion loss of the sensor portion based on an electric resistance value of the reference portion and an electric resistance value of the sensor portion. A width of the sensor portion is set to satisfy Formula (II): w?(32×tlimit) . . . (II), tlimit: maximum corrosion loss to be measured [mm], and w: width of the sensor portion [mm].

Abstract: A tester apparatus is described. Various components contribute to the functionality of the tester apparatus to facilitate movement of a wafer pack holding a vacuum without human oversight. These functionalities include a latch system to keep the wafer pack intact and a pressure sensing system to detect and relay a pressure in the wafer pack.

Abstract: A magnetic sensor includes a magnetic field converter, a magnetic field detector, and a plurality of shields aligned in a Y direction. The magnetic field converter includes a plurality of yokes. Each yoke has a shape elongated in the Y direction, and is configured to receive an input magnetic field component in a direction parallel to a Z direction and to output an output magnetic field component in a direction parallel to an X direction. The magnetic field detector includes a plurality of trains of elements. Each train of elements includes a plurality of MR elements that are aligned in the Y direction along one yoke and connected in series. Each shield has such a shape that its maximum dimension in the Y direction is smaller than its maximum dimension in the X direction.

Abstract: A Hall sensor is disclosed. The Hall sensor comprises a first Hall element, configured to detect a component of a magnetic field in a first direction a using a sensitive area of the first Hall element. The Hall sensor further comprises a second Hall element, configured to detect a component of the magnetic field in a second direction b using a sensitive area of the second Hall element. The Hall sensor further comprises a conductor track, configured to generate a calibration magnetic field. The calibration magnetic field has a significant component on the sensitive area of the first Hall element in the second direction b. The calibration magnetic field further has a significant component on the sensitive area of the second Hall element in the first direction a.

Abstract: The present invention relates to a BGA socket apparatus which is a lidless-type from which a cover, generally provided on the top part of a socket body in order for the loading/unloading operation of an IC, is removed, the BGA socket apparatus enabling the elimination of elements which may obstruct air flow during testing.

Abstract: A non-destructive inspection method of detecting defects in a pouch-type secondary battery is disclosed. The defects are due to a crack or weld condition of an electrode sealed with a pouch. The method is used in a manufacturing process of the pouch-type secondary battery, where the manufacturing process includes an electrode tab pre-welding process; an electrode tab main-welding process; and a packing process. The method can include a first crack condition inspecting operation; a second crack condition inspecting operation; and a weld condition inspecting operation. The first crack condition inspecting operation inspects a first crack condition of the electrode tabs which occurs in the electrode tab pre-welding process. The second crack condition inspecting operation inspects a second crack condition of the electrode tabs, which occurs in the electrode tab main-welding process. The weld condition inspecting operation inspects a weld condition of the electrode tabs.

Abstract: An apparatus comprises a toggle member, a plurality of pogo pins, and a test board in operable communication with the toggle member. The pogo pins are coupled to the toggle member to move along a first axis when the toggle member moves along the first axis. Each pogo pin includes a plunger that moves within the pogo pin along the first axis. The pogo pins and respective plungers contact a top surface of the DUT when the DUT is coupled to the test board and positioned so that a conductor on its outer surface is aligns to and contacts a conductive region of the test board. Movement of the toggle member along the first axis translates to the plungers, applying a pressure sufficient to the top surface of the DUT to ensure flushmount electrical contact between the conductor of the DUT and the conductive region.

Abstract: A magnetic sensor includes at least one sensor main body; a detection circuit provided on the at least one sensor main body, the detection circuit including a magnetic detection element; and a plurality of sensor terminals provided on the at least one sensor main body. The plurality of sensor terminals include a plurality of signal terminals and a plurality of power supply terminals. The plurality of signal terminals are all disposed on a side of one end of the at least one sensor main body. The plurality of power supply terminals include at least one first terminal disposed on the side of the one end of the at least one sensor main body, and a plurality of second terminals disposed on a side of another end of the at least one sensor main body.

Abstract: A probe head and a probe card having the same are provided. The probe head includes a plurality of guide plates each having a guide hole, wherein each of the guide plates has a shape in which a plurality of layers are stacked, and each of the guide plates includes: a first guide layer provided at a lowermost side thereof, and having a first guide hole; and a second guide layer provided at an uppermost side thereof, and having a second guide hole, wherein a side wall of the first guide hole and a side wall of the second guide hole are not provided on the same vertical line.

Abstract: A safety circuit, in the form of a switch box, for coupling with a catheter, detects DC leakage or emission from an amplifier circuit of the catheter, and switches a switch to immediately terminates (cuts-off) power to the amplifier circuit. This immediate power termination instantaneously stops DC leakage, which if left unchecked or otherwise undetected, may reach the heart, and disrupt its electrical activity and cause other damage.

Abstract: A magnetic field detection device includes a base, a first yoke, and a magneto-resistive effect element. The first yoke is provided on the base, and includes first and second principal surfaces each extending along a first plane, and a first end surface coupling the first and second principal surfaces. The magneto-resistive effect element is provided on the base, and includes a magnetization free layer disposed at a position overlapped with the first yoke in a first direction along the first plane. The first end surface includes an inverted tapered surface inclined relative to the first plane and extending closer to a center point of the magnetization free layer as being away from the base in a second direction orthogonal to the first plane. A distance from the center point to a first edge is shorter than a distance from the center point to a second edge.