Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.

Abstract: A probe fitting structure includes a connector to be inspected and a probe capable of being fitted to the connector. The connector includes a plurality of connection electrodes. The probe includes a flange having a through hole and used for attaching the probe to a device, a coaxial cable extending through the through hole and including a leading end portion to which a probe pin is attached, a plunger including a leading end through which the probe pin is exposed, and a spring housing the coaxial cable between the flange and the plunger and including a first end portion fixed to the flange and a second end portion fixed to the plunger. The plunger includes a plunger-side fitting portion in a leading end portion of the plunger. The connector includes a connector-side fitting portion (opening portion) capable of being fitted to the plunger-side fitting portion.

Abstract: A magnetic field monitor includes a magnetic field sensor that generates an electronic signal at a time period representing a magnetic field of the environment and includes a sensor transducer having a sensor bobbin, a primary coil, a secondary, over-winding coil, a sensor circuit, a controller connected to the primary coil, and a digitally controlled potentiometer connected to the secondary coil and controller. A non-linear output is converted to a quantitative linear output.

Abstract: A socket electrically connects a first electric component and a second electric component, including: a base part in which a through hole extending through the base part from a top surface to a bottom surface in a vertical direction is formed; a contact pin inserted to the through hole such that a pin lower end is exposed from the bottom surface, and configured such that, when in use, a pin upper end makes contact with the first electric component; and a sheet member including a through electrode extending therethrough in the vertical direction, disposed at the base part in a state where the sheet member faces the bottom surface, and configured such that, when in use, an upper end of the through electrode makes contact with the pin lower end and a lower end of the through electrode makes contact with the second electric component.

Abstract: Various embodiments are described that relate to failure determination for an integrated circuit. An integrated circuit can be tested to determine if the integrated circuit is functioning properly. The integrated circuit can be subjected to a specific radiation such that the integrated circuit produces a response. This response can be compared against an expected response to determine if the response matches the expected response. If the response does not match the expected response, then the integrated circuit fails the test. If the response matches the expected response, then the integrated circuit passes the test.

Abstract: A test socket assembly includes a contactor body having one or more compliant interconnects, and a socket opening sized and configured to receive a device under test therein. The test socket assembly further includes a lead frame assembly disposed within the contactor body and electrically coupled with the one or more compliant interconnects, and one or more antennas at least partially disposed within the contactor body, the one or more antennas configured to directly and wirelessly communicate to the device under test when the device is disposed within the socket opening.

Abstract: A wafer test device includes a test interconnect to interface with a microcircuit of the wafer at a first side and an interposer to interface with the test interconnect at a second side of the test interconnect, opposite the first side. The interposer connects the test interconnect, via a printed circuit board (PCB), to a test apparatus that determines and controls test patterns that are applied to the microcircuit via the test interconnect. A support structure supports the test interconnect and the interposer. The support structure includes an inner bearing to tilt the test interconnect to match a tilt of a surface of the microcircuit. An elastomer between the test interconnect and the interposer reduces deflection of the test interconnect during a process of connecting the test interconnect to the microcircuit.

Abstract: A wafer probe-to-waveguide adapter is transformed to a load pull device by integrating in the straight section of the waveguide a two-slug tuner with fixed penetration into diametral slots in the waveguide controlled by linear stepper actuators crossing over and sharing the same section of the waveguide.

Abstract: A method for providing battery diagnostics includes: measuring a first voltage across a first battery cell of a rechargeable battery via a first measurement path of a network using a first measurement circuit, measuring the first voltage including taking at least one first voltage sample during a first time period using the first measurement circuit; measuring a second voltage across the first battery cell via a second measurement path of the network using a second measurement circuit, measuring the second voltage including taking at least one second voltage sample during the first time period using the second measurement circuit, where the second measurement path of the network is different from the first measurement path of the network; comparing the measured first voltage with the measured second voltage; and generating a diagnostic output signal based on the comparison.

Abstract: The present disclosure relates to a battery probe set configured to plug into a battery tester and impinge upon one or more terminals of a battery. The battery probe set includes first and second probe assemblies, each including a housing with gripping portions and conductive ports, probe stems of varying lengths that attach to the housing, and probe tips that couple to the probe stems. The housing, probe stem, and probe tips are electrically coupled via conductive paths. The first and second probe assemblies are electrically coupled via a transverse connector, permitting the location of probe plugs onto one of the probe assemblies that is configured to be pluggable into the battery tester. The probe tips are interchangeable and include a light source.

Abstract: A probe unit includes: a signal probe configured to receive and output a signal from and to a predetermined circuit structure; a power supply probe configured to supply power to the predetermined circuit structure; a grounding probe configured to supply a ground potential to the predetermined circuit structure; and a conductive probe holder including a plurality of hole portions in which the signal probe, the power supply probe, and the grounding probe are insertable, the plurality of hole portions having a same hole shape as one another, wherein the signal probe, the power supply probe, and the grounding probe inserted into the plurality of hole portions are interchangeable with one another to change an arrangement of the signal probe, the power supply probe, and the grounding probe.

Abstract: A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.

Abstract: Electrical circuit for measuring a current flowing in a conductor comprising: a first pair of Rogowski-type coils connected in series, the Rogowski-type coils of the first pair being able to operate in a first frequency band; a second pair of Rogowski-type coils connected in series, the Rogowski-type coils of the second pair being able to operate in a second frequency band, the second frequency band comprising at least partly frequencies higher than the frequencies of the first frequency band; and a means for electrically shielding the first pair of coils, and wherein a core of the Rogowski-type coils of the first and second pairs has a relative permeability of less than 10 and wherein one coil of each pair comprises at least one multi-turn winding, the other coil of the pair comprising at least one multi-turn winding.

Abstract: A test probe assembly includes: a conductive pipe; a probe inserted in the pipe without contacts and elastically retractable along a lengthwise direction; and an insulation probe supporting member configured to support the probe between an inner wall of the pipe and an outer surface of the probe. The test probe assembly of the present disclosure is improved in noise shield performance and convenient in repairing the probe since the probe is mounted to a probe socket as supported in a metal pipe without contacts.

Abstract: A probe pin is proposed. The probe pin includes a first plunger configured to come in contact with a testing target contact point of a testing object and a second plunger configured to come in contact with a testing contact point of a testing circuit, in which the first plunge or the second plunger has a stem extending with a predetermined cross-sectional area and a contact portion extending from the stem such that a cross-sectional area decreases, and having first second tips, which are configured to come in contact with the testing target contact point or the testing contact point, at a front end; and the first and second tips are formed in symmetric shapes at positions that are symmetric with a central axis of the stem therebetween.

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.

Abstract: A magnetic sensor includes a magnetic field converter, a magnetic field detector, and a plurality of shields aligned in a Y direction. The magnetic field converter includes a plurality of yokes. Each yoke has a shape elongated in the Y direction, and is configured to receive an input magnetic field component in a direction parallel to a Z direction and to output an output magnetic field component in a direction parallel to an X direction. The magnetic field detector includes a plurality of trains of elements. Each train of elements includes a plurality of MR elements that are aligned in the Y direction along one yoke and connected in series. Each shield has such a shape that its maximum dimension in the Y direction is smaller than its maximum dimension in the X direction.

Abstract: A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.

Abstract: An ODMR member is arranged in a measurement target AC magnetic field. A coil applies a magnetic field of a microwave to the ODMR member. A high frequency power supply causes the coil to conduct a current of the microwave. An irradiating device irradiates the ODMR member with light. A light receiving device detects light that the ODMR member emits. A measurement control unit performs a predetermined DC magnetic field measurement sequence at a predetermined phase of the measurement target AC magnetic field, and in the DC magnetic field measurement sequence, controls the high frequency power supply and the irradiating device and thereby determines a detection light intensity of the light detected by the light receiving device. A magnetic field calculation unit calculates an intensity of the measurement target AC magnetic field on the basis of the predetermined phase and the detection light intensity.

Abstract: A probe for characteristic inspection of a connector includes a plunger, a coaxial cable, a flange, and a housing having an end portion on one side including an increased diameter portion. A recessed portion which receives the increased diameter portion is in an upper surface of the flange. The increased diameter portion has side walls in contact with or facing respective inner side surfaces of the flange partly, with the inner side surfaces forming the recessed portion, and a bottom wall in contact with an upper recessed surface of the flange that forms the recessed portion. The increased diameter portion has connection surfaces connecting the bottom and side walls and inclined inward from one of the side walls toward the bottom wall. Alternatively, the inner side surfaces each have a first surface inclined downward, and a vertical surface extending downward from the first surface to the upper recessed surface.