Patents Examined by Paresh Patel
  • Patent number: 12130318
    Abstract: A testing base includes a housing, a carrier, a wave absorber, and a filler. The housing has an inner surface. The carrier is disposed on the housing. The carrier includes an upper surface, a lower surface, and a groove recessed in the upper surface. The groove is adapted for accommodating a component to be tested. The lower surface and the inner surface of the housing define a cavity body together. The wave absorber is disposed on the inner surface of the housing. The filler is filled in the cavity body and contacts the wave absorber and the carrier. A relative permittivity of the filler is less than or equal to 2.
    Type: Grant
    Filed: November 14, 2022
    Date of Patent: October 29, 2024
    Assignee: TMY Technology Inc.
    Inventor: Su-Wei Chang
  • Patent number: 12130306
    Abstract: A module substrate for a semiconductor module includes: a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction; a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring, and a fastening thin film provided on the wiring substrate and covering the via holes, wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface is pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: October 29, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kwangkyu Bang, Kiljoong Yun, Yun Chang, Jaegyu Choi
  • Patent number: 12117472
    Abstract: An oscillation detector includes an amplitude variation detection circuit configured to generate a first pulse signal by comparing levels of voltages with each other, a frequency variation detection circuit configured to generate a second pulse signal by filtering the first pulse signal and allowing to pass a frequency component that is less than or equal to a certain frequency among frequency components of the first pulse signal, and a time variation detection circuit configured to output an oscillation detection signal when the second pulse signal has consecutive pulses for a period of time.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: October 15, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaeseung Lee, Sungmin Yoo, Taehwang Kong, Junhyeok Yang
  • Patent number: 12116035
    Abstract: A sensing system and method of recognizing a hand gesture established by a sequence of hand touch positionings on an object. The method includes at least steps of: providing to a signal line a time-dependent measurement signal; receiving the measurement signal after being at least partially reflected by at least one portion of the signal line; determining positions on the object of the portions of the signal line that have reflected the measurement signal; comparing an obtained plurality of stored successively determined positions on the object with at least one predefined pattern of successive positions to derive a measure of similarity; and providing an output signal that is indicative of the predefined pattern of successive positions if the derived measure of similarity is lower than a predefined threshold value.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: October 15, 2024
    Assignee: IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A.
    Inventors: Baptiste Anti, Laurent Lamesch, Thomas Faber, Thomas Stifter, Michael Puetz, Andreas Fox
  • Patent number: 12106690
    Abstract: A method includes applying first different voltages to pixels included in a reference pixel column and pixels included in a pad adjacent pixel column electrically connected to a second pad adjacent to a first pad connected to the reference pixel column, and applying second different voltages to the pixels included in the reference pixel column and to pixels included in a line adjacent pixel column electrically connected to a second data line adjacent to a first data line connected to the reference pixel column.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: October 1, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Dongsun Lee, Wonkyu Kwak, Dong Eup Lee, Dongsoo Kim, Seungwoo Sung, Mincheol Lee
  • Patent number: 12105117
    Abstract: An electrical component inspection instrument includes a substrate and a rod-shaped conductor component having one end for contact with a conductor of an electrical component which is an object to be inspected. A conductor pattern on a board surface of the substrate reaches an edge of the substrate, and the other end of the rod-shaped conductor component is electrically connected to the conductor pattern at the edge of the substrate. A direction in which the rod-shaped conductor component extends is orthogonal to the direction of the normal to the board surface of the substrate.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: October 1, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Junji Oosaka, Osamu Hashiguchi
  • Patent number: 12099078
    Abstract: A probe card and a wafer testing assembly thereof are provided. The wafer testing assembly includes a printed circuit board, a space transformer, a plurality of copper pillars and a plurality of strengthening structure units. The printed circuit board includes a bottom surface and a plurality of first contacts arranged on the bottom surface. The space transformer includes a top surface and a plurality of second contacts. The second contacts are arranged on the top surface and corresponding to the first contacts. The copper pillars are respectively arranged between the first contacts and the second contacts. Two ends of each of the copper pillars are respectively electrically connected to the first contacts and the second contacts. The strengthening structure units are arranged on the bottom surface of the printed circuit board and respectively surrounding the copper pillars.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: September 24, 2024
    Assignee: MPI CORPORATION
    Inventors: Yi-Chien Tsai, Huo-Kang Hsu, Yu-Wen Chou, Yu-Shan Hu
  • Patent number: 12100563
    Abstract: An arc detection system includes an obtainer and a determiner. The obtainer obtains a measurement result for current flowing in a power supply line to which power is supplied from a DC power source. The determiner determines, based on a component of a specific frequency band in the measurement result for the current obtained by the obtainer, whether an arc fault has occurred. The determiner determines that the arc fault has occurred when a specific time for which the component of the specific frequency band is at least a threshold is longer than an occurrence time in which an arc can occur when a device is attached to or detached from the power supply line.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: September 24, 2024
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Kazunori Kidera, Tatsuo Koga, Takahiro Ohori
  • Patent number: 12092657
    Abstract: A radio frequency (RF) test probe adapter comprises a cable adapter operable for use with a RF test probe and a housing. The cable adapter comprises a cable connector configured to physically couple to a connector of a coaxial cable, a first pin operable to electrically couple a center conductor of the coaxial cable to a first lead of the RF test probe, and a second pin operable to electrically couple an outer conductor of the coaxial cable to a second lead of the test probe. The housing is sized and shaped to secure the RF test probe and the cable adapter in a physically coupled configuration.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: September 17, 2024
    Assignee: Raytheon Company
    Inventors: Susanne L. Stuart, John C. Grise
  • Patent number: 12085628
    Abstract: A signal processing method according to the present disclosure is for use in a signal processing system including a first magnetic detection unit, a second magnetic detection unit, and a processing unit. The signal processing method includes an angle calculating step and a failure diagnosis step. The angle calculating step includes transforming, by using an inverse trigonometric function, a sine signal, a cosine signal, and a tangent signal into a first angle signal, a second angle signal, and a third angle signal, respectively. The failure diagnosis step includes making a failure diagnosis of the first magnetic detection unit and the second magnetic detection unit by comparing with each other two or more pieces of angle information selected from first angle information, second angle information, and third angle information.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: September 10, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hideaki Fujiura, Yoshiyuki Saito
  • Patent number: 12085587
    Abstract: High frequency operation of an integrated circuit test system is greatly extended by incorporation of a dedicated high frequency signal element that provides a circuit specific compensation network as part of the intermediation circuit board that enables connectivity between test equipment and the integrated circuit under test.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: September 10, 2024
    Assignee: ESSAI, INC.
    Inventors: Nasser Barabi, Chee Wah Ho, Hin Lum Lee
  • Patent number: 12086336
    Abstract: The present disclosure provides a thin film sensor and a method for preparing a thin film sensor. The thin film sensor includes: a base substrate; a first conductive mesh on the base substrate; where the first conductive mesh includes first metal wires arranged side by side along a first direction and each extending in a second direction, and second metal wires each extending in a third direction; and the first metal wires intersect with the second metal wires; and a second conductive mesh on a side of the first conductive mesh away from the base substrate; where the second conductive mesh includes first transparent conductive wires arranged side by side along the first direction and each extending in the second direction, and second transparent conductive wires each extending in the third direction; and the first transparent conductive wires intersect with the second transparent conductive wires.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: September 10, 2024
    Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Wenjie Xu, Feifei Yu, Xiaodong Xie, Jing Wang, Tengfei Zhong, Huayu Sang, Xue Zhao, Bin Pang, Xinxiu Zhang
  • Patent number: 12077111
    Abstract: An in-vehicle power supply structure, in which a vehicle is divided into a plurality of zones and a power supply hub for connecting an electronic device is provided in each of the zones, includes a break detection wire routed along a power supply wire, for detecting damage to the power supply wire caused by an external force acting on the vehicle by its own damage. Both ends of the break detection wire are connected to power supply hubs placed adjacent to each other.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: September 3, 2024
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Sadahisa Yamada, Yoshimasa Kurokawa, Tetsuhiro Yamashita, Masaaki Shimizu
  • Patent number: 12078655
    Abstract: A voltage sensor is disclosed for high and medium voltage use, wherein a voltage divider is arranged in a housing with external creepage distance enlarging ribs. To implement structures for creepage path enlargement to a sensor housing in a very effective and easy way, the voltage divider is arranged in a housing or in housing modules which is or are covered at least partly by at least one shrinking tube of insulating material such that the shrinking creepage enlarging structures are implemented at least at outer surface of the shrinking tube.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: September 3, 2024
    Assignee: ABB Schweiz AG
    Inventor: Radek Javora
  • Patent number: 12066462
    Abstract: Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Other probes are formed from single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere.
    Type: Grant
    Filed: October 21, 2021
    Date of Patent: August 20, 2024
    Assignee: Microfabrica Inc.
    Inventors: Arun S. Veeramani, Dennis R. Smalley
  • Patent number: 12061307
    Abstract: Systems and methods for weapon and destructive device detection based on electromagnetic field profile are disclosed herein. According to an aspect, a system includes one or more sensors configured to detect an electromagnetic field of one or more objects and to output an electrical signal representative of the electromagnetic field. The system also includes a computing device operably connected to the one or more sensors. Further, the computing device is configured to receive the electrical signal. The computing device is also configured to determine whether each of the one or more objects meets a predetermined electromagnetic field profile based on the electrical signal. Further, the computing device is configured to present a notification to a user in response to determining that one of the objects meet the predetermined electromagnetic field profile.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: August 13, 2024
    Assignee: SoundThinking, Inc.
    Inventors: Gregory Alton Holifield, Timothy Alton Holifield, Lawrence Edward Stallman
  • Patent number: 12055561
    Abstract: A contact terminal includes a tubular body extending in an axial direction parallel to a central axis of the contact terminal and a bar-shaped conductor having conductivity. The conductor includes a protrusion protruding toward one side in the axial direction from the tubular body, and an insertion portion disposed inside from an outer periphery of the tubular body. The tubular body includes an end side notch provided along the axial direction on a peripheral surface of the one end portion in the axial direction of the tubular body, and a first circumferential notch connected to another side in the axial direction of the end side notch and provided along a circumferential direction away from the end side notch with respect to a first end portion in a circumferential direction of the end side notch.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: August 6, 2024
    Assignee: NIDEC READ CORPORATION
    Inventor: Norihiro Ota
  • Patent number: 12050234
    Abstract: A socket is configured to electrically connect a first electric component including a first terminal and a second electric component including a second terminal that is different from the first terminal in arrangement, the socket including: a contact pin configured to electrically connect the first terminal and the second terminal; a base part where the contact pin is disposed; and a sheet member disposed to face a surface of the base part on a second electric component side, the sheet member including an upper electrode configured to make contact with the contact pin when in use, a lower electrode configured to make contact with the second terminal when in use, and a wiring configured to connect the upper electrode and the lower electrode disposed at different positions in plan view.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: July 30, 2024
    Assignee: Enplas Corporation
    Inventor: Kazutaka Koshiishi
  • Patent number: 12044726
    Abstract: A verification probe system is configured to verify an automated test platform and includes: an integrated circuit test probe assembly; and a moveable platform configured to position the integrated circuit test probe assembly proximate one of more conductive pins included within a test socket assembly of the automated test platform.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: July 23, 2024
    Assignee: XCERRA CORPORATION
    Inventors: William Reid, Aaren Lonks
  • Patent number: 12031934
    Abstract: An apparatus senses the proportion of FOG flowing with effluent from a sink to a p-trap. A pipe portion is connectable for use as a tailpipe for a sink with a first electrode within the pipe portion and a second electrode outside the pipe portion. Conductors connect the first and second electrodes to a capacitance sensor, so changes in capacitance between the electrodes caused by changes in proportions of FOG content in effluent from the sink can be detected and/or monitored. The monitoring can be remote and can cause an action when an excess FOG content is detected.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: July 9, 2024
    Assignee: Thermaco Incorporated
    Inventors: William C. Batten, Sianna Haws, Fred Lehman, Lee Atkinson, Patrick Sturm