Abstract: Methods of establishing contact between a probe tip of a probe system and a device under test, probe systems that perform the methods, and storage media that directs probe systems to perform the methods. The methods include measuring a height differential between a DUT surface of the DUT and an auxiliary surface of an auxiliary chuck and aligning the probe tip and the auxiliary chuck for contact with one another. The methods also include physically contacting the probe tip with the auxiliary surface to determine an auxiliary contact height between the probe tip and the auxiliary surface and determining a DUT contact height between the probe tip and the DUT surface. The methods further include aligning the probe tip and the DUT for contact with one another and moving the probe tip to the DUT contact height to physically contact the probe tip with the DUT surface.

Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner planar spring elements along their length. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.

Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner spring elements along their lengths. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.

Abstract: A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.

Abstract: A magnetic sensor according to the invention has a magnetoresistive element having a multi-layer structure and a magnetically sensitive axis, and at least a soft magnetic body that is arranged near the magnetoresistive element. The soft magnetic body has a sloping line at least at a corner thereof, wherein the sloping line is tilted with respect to two sides of the soft magnetic body that extend to the corner, as viewed in a stacking direction of the magnetoresistive element.

Abstract: The present disclosure provides a probe and an elastic structure thereof. The probe includes: a first end portion, a second end portion and a plurality of elastic units. The elastic units are disposed between the first end portion and the second portion. Each elastic unit includes a first supporting element and a second supporting element, wherein the first supporting element and the second supporting element are at opposite sides of an axis, and the axis extends along a length of the probe.

Abstract: A downhole electromagnetic device includes an antenna wire placed on or at a tool body, a cavity in the tool body having a cavity pressure smaller than a downhole fluid pressure, and an electronic circuit disposed in the cavity. The antenna wire includes an electrical conductor, and an insulator configured to be exposed to a downhole fluid. The device includes an electrical connector connected to an end of the antenna wire, a sealing element configured to seal the connector from the downhole fluid, the sealing element contacting an inner surface of the connector and an outer surface of the insulator, and a first support member configured to support a load applied on the connector by the antenna wire. The connector provides electrical contact between the antenna wire and the electronic circuit, and the load is caused by a differential pressure defined by the downhole fluid pressure and the cavity pressure.

Abstract: An inspection jig includes a rod-shaped probe, a first support portion that supports one end portion side of the probe, a second support portion that supports the other end portion side of the probe, and a separation holding member that holds the first support portion and the second support portion to be separated from each other. The first support portion includes a support plate in which a through hole through which the probe is inserted is formed. A reinforcing plate having bending strength stronger than that of the support plate is disposed on a surface of the support plate facing the second support portion.

Abstract: In a pulse edge detection circuit, a measurement circuit has a comparator provided therein which compares a voltage with a reference voltage and outputs a pulse signal. An RSFF puts a signal in a high level at a timing at which detecting a rise edge due to a change of the pulse signal to the high level. In such manner, a set signal of an RSFF becomes inactive and a reset signal of the RSFF becomes active, and a fall edge of the pulse signal becomes detectable. When a fall edge is generated due to a change of the pulse signal from the high level to the low level, the set signal of the RSFF becomes active, and a signal becomes high level.

Abstract: A sensor assembly and sensing method is provided for proximity detection for assessing an attachment state of a sensing probe with respect to a subject. A probe is coupled to an electronic probe controller. The probe includes a proximity sensor having a passive energy storing circuit element, and a biological sensor receptacle configured to receive a biological sensor for sensing a biological characteristic of an object. The electronic probe controller excites a circuit network incorporating the proximity sensor with an excitation signal and determines a characteristic of the circuit network that is excited by the excitation signal. The electronic probe controller further generates a proximity indication indicating whether the probe is attached to the object based on the characteristic of the circuit network.

Abstract: A testing base includes a housing, a carrier, a wave absorber, and a filler. The housing has an inner surface. The carrier is disposed on the housing. The carrier includes an upper surface, a lower surface, and a groove recessed in the upper surface. The groove is adapted for accommodating a component to be tested. The lower surface and the inner surface of the housing define a cavity body together. The wave absorber is disposed on the inner surface of the housing. The filler is filled in the cavity body and contacts the wave absorber and the carrier. A relative permittivity of the filler is less than or equal to 2.

Abstract: A module substrate for a semiconductor module includes: a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction; a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring, and a fastening thin film provided on the wiring substrate and covering the via holes, wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface is pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.

Abstract: An oscillation detector includes an amplitude variation detection circuit configured to generate a first pulse signal by comparing levels of voltages with each other, a frequency variation detection circuit configured to generate a second pulse signal by filtering the first pulse signal and allowing to pass a frequency component that is less than or equal to a certain frequency among frequency components of the first pulse signal, and a time variation detection circuit configured to output an oscillation detection signal when the second pulse signal has consecutive pulses for a period of time.

Abstract: A sensing system and method of recognizing a hand gesture established by a sequence of hand touch positionings on an object. The method includes at least steps of: providing to a signal line a time-dependent measurement signal; receiving the measurement signal after being at least partially reflected by at least one portion of the signal line; determining positions on the object of the portions of the signal line that have reflected the measurement signal; comparing an obtained plurality of stored successively determined positions on the object with at least one predefined pattern of successive positions to derive a measure of similarity; and providing an output signal that is indicative of the predefined pattern of successive positions if the derived measure of similarity is lower than a predefined threshold value.

Abstract: A method includes applying first different voltages to pixels included in a reference pixel column and pixels included in a pad adjacent pixel column electrically connected to a second pad adjacent to a first pad connected to the reference pixel column, and applying second different voltages to the pixels included in the reference pixel column and to pixels included in a line adjacent pixel column electrically connected to a second data line adjacent to a first data line connected to the reference pixel column.

Abstract: An electrical component inspection instrument includes a substrate and a rod-shaped conductor component having one end for contact with a conductor of an electrical component which is an object to be inspected. A conductor pattern on a board surface of the substrate reaches an edge of the substrate, and the other end of the rod-shaped conductor component is electrically connected to the conductor pattern at the edge of the substrate. A direction in which the rod-shaped conductor component extends is orthogonal to the direction of the normal to the board surface of the substrate.

Abstract: A probe card and a wafer testing assembly thereof are provided. The wafer testing assembly includes a printed circuit board, a space transformer, a plurality of copper pillars and a plurality of strengthening structure units. The printed circuit board includes a bottom surface and a plurality of first contacts arranged on the bottom surface. The space transformer includes a top surface and a plurality of second contacts. The second contacts are arranged on the top surface and corresponding to the first contacts. The copper pillars are respectively arranged between the first contacts and the second contacts. Two ends of each of the copper pillars are respectively electrically connected to the first contacts and the second contacts. The strengthening structure units are arranged on the bottom surface of the printed circuit board and respectively surrounding the copper pillars.

Abstract: An arc detection system includes an obtainer and a determiner. The obtainer obtains a measurement result for current flowing in a power supply line to which power is supplied from a DC power source. The determiner determines, based on a component of a specific frequency band in the measurement result for the current obtained by the obtainer, whether an arc fault has occurred. The determiner determines that the arc fault has occurred when a specific time for which the component of the specific frequency band is at least a threshold is longer than an occurrence time in which an arc can occur when a device is attached to or detached from the power supply line.

Abstract: A radio frequency (RF) test probe adapter comprises a cable adapter operable for use with a RF test probe and a housing. The cable adapter comprises a cable connector configured to physically couple to a connector of a coaxial cable, a first pin operable to electrically couple a center conductor of the coaxial cable to a first lead of the RF test probe, and a second pin operable to electrically couple an outer conductor of the coaxial cable to a second lead of the test probe. The housing is sized and shaped to secure the RF test probe and the cable adapter in a physically coupled configuration.

Abstract: The present disclosure provides a thin film sensor and a method for preparing a thin film sensor. The thin film sensor includes: a base substrate; a first conductive mesh on the base substrate; where the first conductive mesh includes first metal wires arranged side by side along a first direction and each extending in a second direction, and second metal wires each extending in a third direction; and the first metal wires intersect with the second metal wires; and a second conductive mesh on a side of the first conductive mesh away from the base substrate; where the second conductive mesh includes first transparent conductive wires arranged side by side along the first direction and each extending in the second direction, and second transparent conductive wires each extending in the third direction; and the first transparent conductive wires intersect with the second transparent conductive wires.