Abstract: Disclosed is a probe device of a floating structure including a probe unit having a groove formed at one end thereof into which a needle for transmitting an electrical signal is inserted, and a guide portion formed at the other end thereof and a plate unit having an inner space which is inserted with the guide portion and formed to support a part of the guide portion, wherein the guide portion is spaced apart from the inner space at a predetermined interval by an external force applied to the needle.

Abstract: A probe unit includes: a plurality of contact probes each of which has one end that is brought into contact with a contacting electrode, the one end being an end in a longitudinal direction; a first ground member connected to an external ground; a second ground member provided around each of the contact probes; a connecting member electrically connected to the first ground member, and electrically connected to one end of the second ground member; and a probe holder configured to hold the contact probes, the first ground member, the second ground member and the connecting member.

Abstract: A cantilever contact probe includes a shaped probe body included between a descending probe section and an ascending probe section. At least one end portion is formed in the descending probe section, and bent with respect to a longitudinal axis starting from a bending point and ending with a contact tip of the cantilever contact probe that is configured to abut onto a contact pad of a device under test of that wafer. Suitably, the shaped probe body comprises at least one base portion, an upper portion extending, starting from the base portion, along a longitudinal extension axis of the shaped probe body, orthogonally to the reference plane and a top portion, connected to the upper portion and having a greater diameter than a diameter of the upper portion to form a T, the upper portion being the stem of the T and the top portion being the crosspiece of the T.

Abstract: The described embodiments may provide a chemical detection circuit. The chemical detection circuit may comprise a column of chemically-sensitive pixels. Each chemically-sensitive pixel may comprise a chemically-sensitive transistor, and a row selection device. The chemical detection circuit may further comprise a column interface circuit coupled to the column of chemically-sensitive pixels and an analog-to-digital converter (ADC) coupled to the column interface circuit. Each column interface circuit and column-level ADC may be arrayed with other identical circuits and share critical resources such as biasing and voltage references, thereby saving area and power.

Abstract: A high-frequency measurement line structure includes a circuit board structure and a multi-conductor transmission line section, a high-frequency measurement probe pad section and a transition section which are formed by the circuit board structure, wherein the transition section is arranged between the multi-conductor transmission line section and the high-frequency measurement probe pad section to be connected to the multi-conductor transmission line section and the high-frequency measurement probe pad section. The high-frequency measurement probe pad section includes a group of high-frequency measurement probe pads arranged on a first metal layer of the circuit board structure to touch a high-frequency probe to transmit a high-frequency signal.

Abstract: Provided is a superconducting tape testing device, including lead contacts and a support plate. Each lead contact a conductive contact and a magnet; the magnet is provided with a through hole through which the conductive contact passes, the support plate comprises a plate and a magnetic conductive member; and the magnetic conductive member is fixed on the surface of the plate body.

Abstract: A split thin-film probe card and an elastic module thereof are provided. The elastic module includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions that are respectively formed on the signal circuits. The carrier has a plurality of grooves so as to divide the carrier into a plurality of action segments respectively disposed on the independent elastic segments. The signal circuits are respectively disposed on the action segments. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

Abstract: An insulation resistance measurement device includes a jig unit, a control unit and a transfer mechanism. The jig unit includes a lower jig having a reference surface, an upper jig having an abutting surface, a probe unit and a servomotor. When the upper jig is lowered toward the lower jig by the servomotor, the probe contacts a portion to be measured. When the upper jig is lowered further and the abutting surface of the upper jig abuts the reference surface, a torque of the servomotor increases. When the torque reaches a predetermined value, an insulation resistance is measured by the probe in a state where the torque is maintained.

Abstract: A diagnosing device of a three phase inverter is provided, which includes a relay connected in series with a capacitor disposed on a DC link, an initial charging resistor connected in parallel to the relay, an inverter comprising a switching device for controlling a power supply to three phase output lines, a current sensor disposed on a connection line connecting between the DC link and the inverter to sense a current, and a control unit for driving the switching device and diagnosing at least one of opening and shorting of the switching device according to whether the current is sensed or not.

Abstract: A plunger of the probe has a slider portion engaged with a plunger guide hole formed in a socket body, which is prevented from rotating, and first and second positioning surfaces having different vertical positions along a central axis of the probe by cutting two places of a rounded bar member in a radial direction. The probe receptacle has a first abutting protrusion on which the first positioning surface is abuttable and a second abutting protrusion on which the second positioning surface is abuttable when the probe is inserted in a correct posture. When the plunger is inserted in an erroneous posture, the first positioning surface abuts on the second abutting protrusion to prevent the plunger from projecting from the plunger guide hole or project the plunger by an amount less than the design dimension.

Abstract: The invention is a contacting device suitable for measurements and/or other contact tests, the device comprising a head unit comprising a plunger (14) having a broadened portion (28) at its first end, and a head element (16) being on a second end of the plunger (14); a tube element (10) having a third end and a fourth end opposite the third end, receiving the broadened portion (28) of the plunger (14) at the third end, and keeping the broadened portion (28) in its inner space by means of an inward-projecting flange portion (18) arranged at the third end; and a resilient element (20) being arranged in the inner space of the tube element (10) being supported against the end portion of the broadened portion (28) and against the closed fourth end of the tube element (10). The second end of the plunger (14) projects out from the tube element (10) in case the broadened portion (28) is abutted against the flange portion (18).

Abstract: This document describes techniques and devices for a rotation input device for a capacitive sense cord. A cord may be constructed that includes a cable, a plurality of sensing wires, and a rotation input device. The sensing wires are twisted around one another within a cable jacket of the cable throughout an insensitive portion of the cord that is insensitive to touch input. The rotation input device includes the plurality of sensing wires disposed proximate to a surface of the cord and positioned lengthwise along the cord to provide a capacitively sensitive portion of the cord. The plurality of sensing wires are independently sensitive to touch input. Also, the rotation input device is configured to enable rotational input based on a pattern of change in capacitance values corresponding to at least a subset of the plurality of sensing wires in the rotation input device.

Abstract: In some implementations, an apparatus for testing an insulated glass unit is provided. The apparatus includes a housing and a port coupled to the housing, where the port is configured to couple with a pigtail of an insulated glass unit. The apparatus includes a battery housed within the housing, where the battery is configured to provide power to an insulated glass unit. The apparatus includes an input interface which is coupled to the housing, where the input interface is configured to receive. The apparatus includes a controller which is housed within the housing and is configured to receive the input from the input interface, send commands to an insulated glass unit, and receive data from the insulated glass unit. The apparatus also includes one or more indicators coupled with the housing, where the one or more indicators are configured to indicate a status of the insulated glass unit.

Abstract: An electric connection device includes a probe (10) and a probe head (20). The probe (10) includes: a tubular barrel (11), a rod-like top-side plunger (121), and a rod-like bottom-side plunger (122). The top- and bottom-side plungers are connected to the barrel (11) with tips thereof exposed from respective open ends of the barrel (11). The probe head (2) includes guide plates (211 and 212) which are spaced apart from each other in the axial direction of the probe (10) and each include a through-hole through which a body of the barrel (11) penetrates. A protrusion (13) having an outer diameter greater than the body of the barrel (11) is provided on the circumference of the probe (10). The guide plates (211 and 212) include a support guide plate in which the through-hole has a diameter smaller than the outer diameter of the protrusion (13).

Abstract: A device for testing a semiconductor device includes a blade, a socket, and a test board. The blade includes one or more outer blade conductors disposed on one or more side surfaces of the blade. The socket includes one or more outer socket conductors disposed on one or more side surfaces of the socket. The one or more outer socket conductors are disposed at a location such that they are in contact with or are isolated from the one or more outer blade conductors depending on a position of the blade. The test board transfers a test signal to the one or more outer socket conductors.

Abstract: A probe card includes a circuit board and a probe set. The probe set is electrically coupled to the circuit board. Also, the probe set includes a plurality of probes. Each of the plurality of probes includes a plurality of nanotwinned copper pillars that are arranged in a predetermined crystal orientation. In addition, each of the plurality of probes further includes a tip. The tip substantially and electrically contacts a chip. Such that the circuit board can test the chip via the tip.

Abstract: Methods, systems, and apparatus for electrical connector assemblies. The assemblies include a socket defining a signal cavity, the socket having a first socket opening and a second socket opening. The assemblies include a signal contact probe located within the signal cavity. The signal contact probe includes a first plunger received in the shell cavity and extending through a first shell opening and located in the first socket opening. The signal contact probe includes a second plunger received in the shell cavity and extending through a second shell opening and located in the second socket opening. The assemblies include an end insulation ring located in the second socket opening and around the second plunger, the end insulation ring configured to facilitate substantially constant impedance through the signal spring probe, and configured to restrict lateral movement of the second plunger within the second socket opening.

Abstract: A probe card has an edge sensor. The edge sensor has a first needle and a second needle. The first needle and the second needle are in contact with each other when the first needle and a wafer are not in contact with each other, and the first needle and the second needle are not in contact with each other when the first needle and the wafer are in contact with each other. The probe card has a resistor connected between the first needle and the second needle.

Abstract: A probe card for a testing apparatus of electronic devices comprises a probe head housing a plurality of contact probes, each contact probe having at least one contact tip adapted to abut onto contact pads of a device under test, as well as a main support and an intermediate support connected to the main support and adapted to realize a spatial transformation of distances between contact pads on its opposite faces as a space transformer, the probe card suitably also comprising at least one connecting element adapted to link the space transformer and the main support, this connecting element having a substantially rod-like body and being equipped with a first end portion comprising at least one terminal section adapted to be engaged in a corresponding housing realized in the space transformer and with a second terminal portion adapted to abut onto an abutment element linked to the main support.

Abstract: A probe card device and a neck-like probe thereof are provided. The neck-like probe includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and each of the broad side surfaces has a long slot extending from one of the narrow side surfaces to the other one. The two long slots have a minimum distance therebetween that is 75%-95% of a maximum distance between the two broad side surfaces. The ring-shaped insulator surrounds a portion of the conductive pin having the two long slots, and a portion of the neck-like probe corresponding in position to a part of the ring-shaped insulator on the two broad side surfaces has a thickness that is 85%-115% of the maximum distance.