Abstract: A probe card for a test equipment of electronic devices includes a flexible membrane configured to carry high frequency signals between a device under test and a support plate. The flexible membrane is connected to the support plate through a peripheral zone, and a damping structure is arranged between the support plate and the flexible membrane. A plurality of micro contact probes include a body extending between a first end and a second end, and the second end is configured to abut onto contact pads of the device under test, and the damping structure and the first ends of the micro contact probes are in contact with opposite faces of a same contact zone of the flexible membrane. The flexible membrane includes at least one weakening zone arranged between the contact zone and the peripheral zone.

Abstract: A solid-state power controller (SSPC) system with a built-in-test circuit includes a SSPC field-effect transistor (FET) switch. The system includes a current sense resistor electrically connected to the SSPC FET switch in series. A resistor is electrically connected to the current sense resistor in series. A switch is electrically connected to the resistor in series. A method for testing a current sense resistor value in a solid-state power controller (SSPC) system includes determining a cycle count, generating a new bit with a processing unit, and outputting the new bit to a switch operatively connected to the processing unit to at least one of turn the switch on or turn the switch off. The method includes reading a load current with the processing unit to determine whether a current sense resistor electrically coupled to the switch is operating within a desired resistance range.

Abstract: A testing apparatus includes a first coordinates obtaining unit, a second coordinates obtaining unit, and a controller that performs determining card gravity center coordinates of a probe card held at a pogo frame opposite to an alignment stage, determining reference coordinates in a target coordinate system of a reference target at predetermined coordinates, determining alignment coordinates when the first coordinates obtaining unit is aligned with the second coordinates obtaining unit, determining wafer gravity center coordinates of a wafer, and calculating contact coordinates by using the determined card gravity center coordinates, the determined alignment coordinates, and the determined wafer gravity center coordinates.

Abstract: An inspection system includes an inspection device that includes a stage on which a substrate is mounted and inspects the substrate on the stage, a temperature adjustment mechanism that adjusts the temperature of the stage, a substrate accommodating part, a temperature measurement substrate standby part that makes a temperature measurement substrate wait, a transfer unit that transfers the substrate and the temperature measurement substrate onto the stage, and a camera used for aligning the substrate on the stage. The temperature measurement substrate includes, on the surface thereof, a temperature measurement member whose state changes depending on the temperature. The transfer unit transfers the temperature measurement substrate onto the stage, the camera images the temperature measurement member, and the temperature of the temperature measurement substrate is measured from a change in the state of the temperature measurement member.

Abstract: The contact probe comprises a barrel 50, an inspection device side terminal 60, a test board side terminal 70, and a spring 80 disposed in a state of being in contact with the test board side terminal 70 and the inspection device side terminal 60, the test board side terminal 70 includes a stop portion 74 that can abut on the caulked portion 52 in the barrel 50 and a terminal body that projects from the other end 56 of the barrel 50, and the terminal body includes, in order from a tip end, a first shaft section 71, a second shaft section 72 having a diameter larger than a diameter of the first shaft section 71, and a third shaft section 73 having a diameter smaller than the diameter of the second shaft section 72 and having at least a part that can be housed in the barrel 50.

Abstract: A testing device with power protection includes a power interface and a testing platform. The testing platform includes a casing, a fixed frame and a sliding frame. The power interface is disposed at one surface of the casing. The fixed frame covers the power interface. One side of the fixed frame formed with an entrance that exposes the power interface outwards from the fixed frame. The sliding frame includes a rack body slidably that is located on the casing, and a shielding door that is rotatably connected to the rack body for covering the entrance of the fixed frame. When the rack body is slid towards the power interface so as to rotate the shielding door away from the entrance by the fixed frame, the power interface is exposed outwards from the fixed frame through the entrance.

Abstract: A flexible sensor configured to detect a physical amount of a measurement target in a state surrounding the measurement target includes a sensor cable configured to detect the physical amount of the measurement target and a holding portion on which a base end portion of the sensor cable is mounted, the holding portion having a groove portion in which a distal end portion of the sensor cable is fitted from a side surface.

Abstract: Probe systems and methods for testing a device under test are disclosed herein. The probe systems include an electrically conductive ground loop and a structure that is electrically connected to a ground potential via at least a region of the electrically conductive ground loop. The probe systems also include nonlinear circuitry. The nonlinear circuitry is configured to resist flow of electric current within the ground loop when a voltage differential across the nonlinear circuitry is less than a threshold voltage differential and permit flow of electric current within the ground loop when the voltage differential across the nonlinear circuitry is greater than the threshold voltage differential. The methods include positioning a device under test (DUT) within a probe system that includes an electrically conductive ground loop and nonlinear circuitry. The methods also include selectively resisting and permitting electric current flow within the ground loop and through the nonlinear circuitry.

Abstract: A probe head includes a probe seat having upper, middle and lower dies, an electrically conductive layer inside the probe seat, a first spring probe penetrating through the probe seat, and at least two shorter second spring probes penetrating through the lower die in a way that top ends of the second spring probes are located inside the probe seat and abutted against the electrically conductive layer. Another probe head includes the aforesaid probe seat, an electrically conductive layer partially inside the probe seat and partially outside the probe seat, a first spring probe penetrating through the probe seat, and a shorter second spring probe penetrating through the lower die in a way that a top end of the second spring probe is located inside the probe seat and abutted against the electrically conductive layer. As such, fine pitch requirement and different high frequency testing requirements are fulfilled.

Abstract: A probe socket for inspecting electric characteristics of an object to be tested. The probe socket includes a plurality of power pins for applying power to the object to be tested, a plurality of ground pins arranged in parallel with the power pins, a support block for accommodating and supporting the plurality of power pins or ground pins in parallel, and a conductive plate arranged inside the support block in a direction transverse to lengthwise directions of the power pin and the ground pin and having at least one of a power connection pattern for electrically connecting the plurality of power pins in common and a ground connection pattern for electrically connecting the plurality of ground pins in common.

Abstract: An inspection jig includes a support member that supports a probe. The support member includes an inspection side plate-shaped body arranged on one end portion side, and an electrode side plate-shaped body arranged on the other end portion side of the support member. A probe support hole into which one end portion of the probe is inserted and supported is formed in the inspection side plate-shaped body. A probe insertion hole into which the other end portion of the probe is inserted is formed in the electrode side plate-shaped body. The probe is supported while the one end portion of the probe abuts on an inner wall of the probe support hole in a state in which a contact portion provided at the one end portion of the probe is not in contact with an inspected portion to be inspected.

Abstract: Disclosed is a probe device of a floating structure including a probe unit having a groove formed at one end thereof into which a needle for transmitting an electrical signal is inserted, and a guide portion formed at the other end thereof and a plate unit having an inner space which is inserted with the guide portion and formed to support a part of the guide portion, wherein the guide portion is spaced apart from the inner space at a predetermined interval by an external force applied to the needle.

Abstract: A probe unit includes: a plurality of contact probes each of which has one end that is brought into contact with a contacting electrode, the one end being an end in a longitudinal direction; a first ground member connected to an external ground; a second ground member provided around each of the contact probes; a connecting member electrically connected to the first ground member, and electrically connected to one end of the second ground member; and a probe holder configured to hold the contact probes, the first ground member, the second ground member and the connecting member.

Abstract: A cantilever contact probe includes a shaped probe body included between a descending probe section and an ascending probe section. At least one end portion is formed in the descending probe section, and bent with respect to a longitudinal axis starting from a bending point and ending with a contact tip of the cantilever contact probe that is configured to abut onto a contact pad of a device under test of that wafer. Suitably, the shaped probe body comprises at least one base portion, an upper portion extending, starting from the base portion, along a longitudinal extension axis of the shaped probe body, orthogonally to the reference plane and a top portion, connected to the upper portion and having a greater diameter than a diameter of the upper portion to form a T, the upper portion being the stem of the T and the top portion being the crosspiece of the T.

Abstract: The described embodiments may provide a chemical detection circuit. The chemical detection circuit may comprise a column of chemically-sensitive pixels. Each chemically-sensitive pixel may comprise a chemically-sensitive transistor, and a row selection device. The chemical detection circuit may further comprise a column interface circuit coupled to the column of chemically-sensitive pixels and an analog-to-digital converter (ADC) coupled to the column interface circuit. Each column interface circuit and column-level ADC may be arrayed with other identical circuits and share critical resources such as biasing and voltage references, thereby saving area and power.

Abstract: A high-frequency measurement line structure includes a circuit board structure and a multi-conductor transmission line section, a high-frequency measurement probe pad section and a transition section which are formed by the circuit board structure, wherein the transition section is arranged between the multi-conductor transmission line section and the high-frequency measurement probe pad section to be connected to the multi-conductor transmission line section and the high-frequency measurement probe pad section. The high-frequency measurement probe pad section includes a group of high-frequency measurement probe pads arranged on a first metal layer of the circuit board structure to touch a high-frequency probe to transmit a high-frequency signal.

Abstract: Provided is a superconducting tape testing device, including lead contacts and a support plate. Each lead contact a conductive contact and a magnet; the magnet is provided with a through hole through which the conductive contact passes, the support plate comprises a plate and a magnetic conductive member; and the magnetic conductive member is fixed on the surface of the plate body.

Abstract: A split thin-film probe card and an elastic module thereof are provided. The elastic module includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions that are respectively formed on the signal circuits. The carrier has a plurality of grooves so as to divide the carrier into a plurality of action segments respectively disposed on the independent elastic segments. The signal circuits are respectively disposed on the action segments. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

Abstract: An insulation resistance measurement device includes a jig unit, a control unit and a transfer mechanism. The jig unit includes a lower jig having a reference surface, an upper jig having an abutting surface, a probe unit and a servomotor. When the upper jig is lowered toward the lower jig by the servomotor, the probe contacts a portion to be measured. When the upper jig is lowered further and the abutting surface of the upper jig abuts the reference surface, a torque of the servomotor increases. When the torque reaches a predetermined value, an insulation resistance is measured by the probe in a state where the torque is maintained.

Abstract: A diagnosing device of a three phase inverter is provided, which includes a relay connected in series with a capacitor disposed on a DC link, an initial charging resistor connected in parallel to the relay, an inverter comprising a switching device for controlling a power supply to three phase output lines, a current sensor disposed on a connection line connecting between the DC link and the inverter to sense a current, and a control unit for driving the switching device and diagnosing at least one of opening and shorting of the switching device according to whether the current is sensed or not.