Patents Examined by Paresh Patel
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Patent number: 11774468Abstract: A vertical probe head includes upper and lower die units having upper and lower through holes, and probes each including a body portion between the die units, tail and head portion installation parts in the upper and lower through holes respectively, and a head portion contact part for electrically contacting a device under test. The probes include a pair of signal probes including at least one distinctive probe, for which, the body portion is smaller in width than the head portion installation part, and a body portion center line is deviated from a head portion installation part center line toward the probe paired thereto. For the paired probes, a head portion contact part pitch is larger than a body portion pitch for matching a large-pitch high-speed differential pair of the device under test, great impedance matching effect, and consistent contact force and stable elasticity of the probes in operation.Type: GrantFiled: July 6, 2022Date of Patent: October 3, 2023Assignee: MPI CORPORATIONInventors: Chin-Tien Yang, Yang-Hung Cheng, Yu-Hao Chen, Chin-Yi Tsai, Hui-Pin Yang, Horng-Chuan Sun
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Patent number: 11768227Abstract: Embodiments are directed to probes formed from multiple layers with at least a portion of the layers including portions that include elastic compliant regions of the probes wherein such elastic portions of different layers are formed of different materials and wherein a plane of preferred elastic deformation of the probes is parallel to a plane containing (1) a normal to the planes of the layers and (2) a longitudinal axes of the probes or a local longitudinal axes of the probes.Type: GrantFiled: April 22, 2022Date of Patent: September 26, 2023Assignee: MICROFABRICA INC.Inventor: Ming Ting Wu
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Patent number: 11762008Abstract: A connecting device for inspection includes a probe head configured to hold electric contacts and optical contacts such that tip ends of the respective contacts are exposed on a lower surface of the probe head, and a transformer including connecting wires arranged therein and optical wires penetrating therethrough. The respective proximal ends of the electric contacts and the optical contacts are exposed on an upper surface of the probe head, and tip ends on one side of the connecting wires electrically connected to the proximal ends of the electric contacts and connecting ends of the optical wires optically connected to the proximal ends of the optical contacts are arranged in a lower surface of the transformer.Type: GrantFiled: April 3, 2020Date of Patent: September 19, 2023Assignee: Kabushiki Kaisha Nihon MicronicsInventor: Minoru Sato
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Patent number: 11761982Abstract: Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Other probes are formed from single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere.Type: GrantFiled: December 31, 2020Date of Patent: September 19, 2023Assignee: Microfabrica Inc.Inventor: Arun S. Veeramani
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Patent number: 11747364Abstract: The invention relates to a high-frequency test connector device (12; 12?) having an adapter housing including a sleeve-like ground contact section (10; 10?) axially at one end, (18) at the other end, and centrally an insulated inner contact (20), wherein the ground contact section has an electrically conducting spring member (26; 26?, 28; 42, 44; 44?, 46) for ground contact, associated such that for engaging over the sleeve section (14) of the contacting partner (16), the latter with an end face (30), to form a contact and resiliently along the movement or connecting longitudinal axis, can engage on the spring member (26) formed in a sleeve base of the ground contact section (10), or wherein, for engaging in the sleeve section (14?) of the connecting partner (16?), the spring member (26?) projects from an end face end section of the ground contact section (10?), to form a contact and resiliently along the longitudinal axis, can engage on a ground-conducting inner section (40) of the connecting partner.Type: GrantFiled: October 22, 2018Date of Patent: September 5, 2023Assignee: Ingun Prüfmittelbau GmbHInventors: Thomas Schrodi, Dominik Böhler, Michael Neher, Nebiat Awano, Sergiy Royak, Pascal Neumann
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Patent number: 11742651Abstract: An arc fault detection system with a built-in-test includes an arc fault detector having a load noise voltage input, a test current input and an arc fault detector output. The system includes a processing unit having a switch in electrical communication with the test current input and an input in electrical communication with the arc fault detector output. A method for testing an arc fault detection system includes generating a new bit with a processing unit and outputting the new bit to a switch operatively connected to the processing unit to at least one of turn the switch on or turn the switch off. The method includes reading a signal at an input of the processing unit.Type: GrantFiled: May 10, 2019Date of Patent: August 29, 2023Assignee: Hamilton Sundstrand CorporationInventor: John A. Dickey
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Patent number: 11740260Abstract: A pogo pin-free testing device for IC chip test includes a load board, a ceramic interposer disposed on the load board, and copper core balls. The ceramic interposer has first and second surfaces and connecting points, and the second surface of the ceramic interposer faces the load board. Each connecting point has through holes penetrating the first and second surfaces, and an inner sidewall surface thereof has a metallization layer. The metallization layer is extended to a portion of the first surface and a portion of the second surface. In each of the connecting points, an area of an extending portion of the metallization layer extended to the second surface is less than an area of an extending portion of the metallization layer extended to the first surface. The copper core balls are disposed between the load board and the through holes of each connecting point of the ceramic interposer.Type: GrantFiled: January 10, 2022Date of Patent: August 29, 2023Assignees: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng, Pei-Shiou Huang
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Patent number: 11733067Abstract: An electronic sensor includes a signal generator configured to output excitation signals and a variable differential transformer connected to the signal generator to receive excitation signals. Embodiments of the variable differential transformer may include a primary coil, a first secondary coil connected to the signal generator, a second secondary coil connected to the signal generator, and a core disposed at least partially in a magnetic field generated via the first secondary coil and the second secondary coil and the first excitation signal and the second excitation signal. A phase of an output signal of the primary coil may correspond to a position of the core.Type: GrantFiled: October 8, 2021Date of Patent: August 22, 2023Assignee: Eaton Intelligent Power LimitedInventors: Yuriy O. Khayznikov, Galen Chui, Hai Nguyen, Bhuvan Govindasamy
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Patent number: 11733268Abstract: A probe pin inspection mechanism a includes a base, a pair of movable bodies, a pair of movable-body elastic bodies, and a conductor. The movable bodies are supported by the base to be movable in a first direction from a first position with respect to the base, and respectively include ends and terminals electrically connected to the respective ends. The movable-body elastic bodies elastically press the movable bodies in a second direction. The conductor is supported by the base and electrically connects the terminals of the movable bodies by making contact with the terminals. The state between the terminals and the conductor is switched, according to the position of the movable bodies, between a conductive state in which the terminals and the conductor are in contact with each other and a non-conductive state in which the terminals and the conductor are separated from each other.Type: GrantFiled: December 17, 2018Date of Patent: August 22, 2023Assignee: KABUSHIKI KAISHA TOSHIBAInventors: Shingo Sato, Akihiro Takahashi
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Patent number: 11733267Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.Type: GrantFiled: March 18, 2020Date of Patent: August 22, 2023Assignee: MPI CORPORATIONInventors: Che-Wei Lin, Ting-Ju Wu, Keng-Min Su, Chin-Yi Lin
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Patent number: 11719762Abstract: A probe fitting structure includes a connector to be inspected and a probe capable of being fitted to the connector. The connector includes a plurality of connection electrodes. The probe includes a flange having a through hole and used for attaching the probe to a device, a coaxial cable extending through the through hole and including a leading end portion to which a probe pin is attached, a plunger including a leading end through which the probe pin is exposed, and a spring housing the coaxial cable between the flange and the plunger and including a first end portion fixed to the flange and a second end portion fixed to the plunger. The plunger includes a plunger-side fitting portion in a leading end portion of the plunger. The connector includes a connector-side fitting portion (opening portion) capable of being fitted to the plunger-side fitting portion.Type: GrantFiled: May 26, 2021Date of Patent: August 8, 2023Assignee: Murata Manufacturing Co., Ltd.Inventor: Shinichi Kenzaki
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Patent number: 11719764Abstract: A magnetic field monitor includes a magnetic field sensor that generates an electronic signal at a time period representing a magnetic field of the environment and includes a sensor transducer having a sensor bobbin, a primary coil, a secondary, over-winding coil, a sensor circuit, a controller connected to the primary coil, and a digitally controlled potentiometer connected to the secondary coil and controller. A non-linear output is converted to a quantitative linear output.Type: GrantFiled: March 16, 2021Date of Patent: August 8, 2023Assignee: MIS SECURITY, LLCInventors: Cory J. Stephanson, Scott A. Sterling
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Patent number: 11714105Abstract: A socket electrically connects a first electric component and a second electric component, including: a base part in which a through hole extending through the base part from a top surface to a bottom surface in a vertical direction is formed; a contact pin inserted to the through hole such that a pin lower end is exposed from the bottom surface, and configured such that, when in use, a pin upper end makes contact with the first electric component; and a sheet member including a through electrode extending therethrough in the vertical direction, disposed at the base part in a state where the sheet member faces the bottom surface, and configured such that, when in use, an upper end of the through electrode makes contact with the pin lower end and a lower end of the through electrode makes contact with the second electric component.Type: GrantFiled: March 30, 2021Date of Patent: August 1, 2023Assignee: Enplas CorporationInventor: Leo Azumi
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Patent number: 11675002Abstract: Various embodiments are described that relate to failure determination for an integrated circuit. An integrated circuit can be tested to determine if the integrated circuit is functioning properly. The integrated circuit can be subjected to a specific radiation such that the integrated circuit produces a response. This response can be compared against an expected response to determine if the response matches the expected response. If the response does not match the expected response, then the integrated circuit fails the test. If the response matches the expected response, then the integrated circuit passes the test.Type: GrantFiled: December 15, 2020Date of Patent: June 13, 2023Assignee: The Government of the United States, as represented by the Secretary of the ArmyInventors: Greg Rupper, John Suarez, Sergey Rudin, Meredith Reed, Michael Shur
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Patent number: 11662363Abstract: A test socket assembly includes a contactor body having one or more compliant interconnects, and a socket opening sized and configured to receive a device under test therein. The test socket assembly further includes a lead frame assembly disposed within the contactor body and electrically coupled with the one or more compliant interconnects, and one or more antennas at least partially disposed within the contactor body, the one or more antennas configured to directly and wirelessly communicate to the device under test when the device is disposed within the socket opening.Type: GrantFiled: October 19, 2018Date of Patent: May 30, 2023Assignee: XCERRA CORPORATIONInventors: Jason Mroczkowski, Dongmei Han, Victor Landa
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Patent number: 11662366Abstract: A wafer test device includes a test interconnect to interface with a microcircuit of the wafer at a first side and an interposer to interface with the test interconnect at a second side of the test interconnect, opposite the first side. The interposer connects the test interconnect, via a printed circuit board (PCB), to a test apparatus that determines and controls test patterns that are applied to the microcircuit via the test interconnect. A support structure supports the test interconnect and the interposer. The support structure includes an inner bearing to tilt the test interconnect to match a tilt of a surface of the microcircuit. An elastomer between the test interconnect and the interposer reduces deflection of the test interconnect during a process of connecting the test interconnect to the microcircuit.Type: GrantFiled: September 21, 2021Date of Patent: May 30, 2023Assignee: International Business Machines CorporationInventors: David Michael Audette, Grant Wagner, Jacob Louis Moore, Peter William Neff
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Patent number: 11662364Abstract: A wafer probe-to-waveguide adapter is transformed to a load pull device by integrating in the straight section of the waveguide a two-slug tuner with fixed penetration into diametral slots in the waveguide controlled by linear stepper actuators crossing over and sharing the same section of the waveguide.Type: GrantFiled: December 7, 2021Date of Patent: May 30, 2023Inventor: Christos Tsironis
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Patent number: 11656294Abstract: A method for providing battery diagnostics includes: measuring a first voltage across a first battery cell of a rechargeable battery via a first measurement path of a network using a first measurement circuit, measuring the first voltage including taking at least one first voltage sample during a first time period using the first measurement circuit; measuring a second voltage across the first battery cell via a second measurement path of the network using a second measurement circuit, measuring the second voltage including taking at least one second voltage sample during the first time period using the second measurement circuit, where the second measurement path of the network is different from the first measurement path of the network; comparing the measured first voltage with the measured second voltage; and generating a diagnostic output signal based on the comparison.Type: GrantFiled: January 8, 2021Date of Patent: May 23, 2023Assignee: Infineon Technologies AGInventors: Felix Weidner, Jesus Ruiz Sevillano, Maximilian Hofer
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Patent number: 11656246Abstract: A probe unit includes: a signal probe configured to receive and output a signal from and to a predetermined circuit structure; a power supply probe configured to supply power to the predetermined circuit structure; a grounding probe configured to supply a ground potential to the predetermined circuit structure; and a conductive probe holder including a plurality of hole portions in which the signal probe, the power supply probe, and the grounding probe are insertable, the plurality of hole portions having a same hole shape as one another, wherein the signal probe, the power supply probe, and the grounding probe inserted into the plurality of hole portions are interchangeable with one another to change an arrangement of the signal probe, the power supply probe, and the grounding probe.Type: GrantFiled: June 24, 2022Date of Patent: May 23, 2023Assignee: NHK Spring Co., LTD.Inventors: Kohei Hironaka, Kazuya Soma
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Patent number: 11656281Abstract: The present disclosure relates to a battery probe set configured to plug into a battery tester and impinge upon one or more terminals of a battery. The battery probe set includes first and second probe assemblies, each including a housing with gripping portions and conductive ports, probe stems of varying lengths that attach to the housing, and probe tips that couple to the probe stems. The housing, probe stem, and probe tips are electrically coupled via conductive paths. The first and second probe assemblies are electrically coupled via a transverse connector, permitting the location of probe plugs onto one of the probe assemblies that is configured to be pluggable into the battery tester. The probe tips are interchangeable and include a light source.Type: GrantFiled: December 17, 2021Date of Patent: May 23, 2023Assignee: Vertiv CorporationInventors: Thomas W. Frymyer, Jr., Ryan J. Riker, Mark Carrillo, James A. Laurie