Abstract: A plunger of the probe has a slider portion engaged with a plunger guide hole formed in a socket body, which is prevented from rotating, and first and second positioning surfaces having different vertical positions along a central axis of the probe by cutting two places of a rounded bar member in a radial direction. The probe receptacle has a first abutting protrusion on which the first positioning surface is abuttable and a second abutting protrusion on which the second positioning surface is abuttable when the probe is inserted in a correct posture. When the plunger is inserted in an erroneous posture, the first positioning surface abuts on the second abutting protrusion to prevent the plunger from projecting from the plunger guide hole or project the plunger by an amount less than the design dimension.

Abstract: The invention is a contacting device suitable for measurements and/or other contact tests, the device comprising a head unit comprising a plunger (14) having a broadened portion (28) at its first end, and a head element (16) being on a second end of the plunger (14); a tube element (10) having a third end and a fourth end opposite the third end, receiving the broadened portion (28) of the plunger (14) at the third end, and keeping the broadened portion (28) in its inner space by means of an inward-projecting flange portion (18) arranged at the third end; and a resilient element (20) being arranged in the inner space of the tube element (10) being supported against the end portion of the broadened portion (28) and against the closed fourth end of the tube element (10). The second end of the plunger (14) projects out from the tube element (10) in case the broadened portion (28) is abutted against the flange portion (18).

Abstract: This document describes techniques and devices for a rotation input device for a capacitive sense cord. A cord may be constructed that includes a cable, a plurality of sensing wires, and a rotation input device. The sensing wires are twisted around one another within a cable jacket of the cable throughout an insensitive portion of the cord that is insensitive to touch input. The rotation input device includes the plurality of sensing wires disposed proximate to a surface of the cord and positioned lengthwise along the cord to provide a capacitively sensitive portion of the cord. The plurality of sensing wires are independently sensitive to touch input. Also, the rotation input device is configured to enable rotational input based on a pattern of change in capacitance values corresponding to at least a subset of the plurality of sensing wires in the rotation input device.

Abstract: In some implementations, an apparatus for testing an insulated glass unit is provided. The apparatus includes a housing and a port coupled to the housing, where the port is configured to couple with a pigtail of an insulated glass unit. The apparatus includes a battery housed within the housing, where the battery is configured to provide power to an insulated glass unit. The apparatus includes an input interface which is coupled to the housing, where the input interface is configured to receive. The apparatus includes a controller which is housed within the housing and is configured to receive the input from the input interface, send commands to an insulated glass unit, and receive data from the insulated glass unit. The apparatus also includes one or more indicators coupled with the housing, where the one or more indicators are configured to indicate a status of the insulated glass unit.

Abstract: An electric connection device includes a probe (10) and a probe head (20). The probe (10) includes: a tubular barrel (11), a rod-like top-side plunger (121), and a rod-like bottom-side plunger (122). The top- and bottom-side plungers are connected to the barrel (11) with tips thereof exposed from respective open ends of the barrel (11). The probe head (2) includes guide plates (211 and 212) which are spaced apart from each other in the axial direction of the probe (10) and each include a through-hole through which a body of the barrel (11) penetrates. A protrusion (13) having an outer diameter greater than the body of the barrel (11) is provided on the circumference of the probe (10). The guide plates (211 and 212) include a support guide plate in which the through-hole has a diameter smaller than the outer diameter of the protrusion (13).

Abstract: A probe card includes a circuit board and a probe set. The probe set is electrically coupled to the circuit board. Also, the probe set includes a plurality of probes. Each of the plurality of probes includes a plurality of nanotwinned copper pillars that are arranged in a predetermined crystal orientation. In addition, each of the plurality of probes further includes a tip. The tip substantially and electrically contacts a chip. Such that the circuit board can test the chip via the tip.

Abstract: A device for testing a semiconductor device includes a blade, a socket, and a test board. The blade includes one or more outer blade conductors disposed on one or more side surfaces of the blade. The socket includes one or more outer socket conductors disposed on one or more side surfaces of the socket. The one or more outer socket conductors are disposed at a location such that they are in contact with or are isolated from the one or more outer blade conductors depending on a position of the blade. The test board transfers a test signal to the one or more outer socket conductors.

Abstract: Methods, systems, and apparatus for electrical connector assemblies. The assemblies include a socket defining a signal cavity, the socket having a first socket opening and a second socket opening. The assemblies include a signal contact probe located within the signal cavity. The signal contact probe includes a first plunger received in the shell cavity and extending through a first shell opening and located in the first socket opening. The signal contact probe includes a second plunger received in the shell cavity and extending through a second shell opening and located in the second socket opening. The assemblies include an end insulation ring located in the second socket opening and around the second plunger, the end insulation ring configured to facilitate substantially constant impedance through the signal spring probe, and configured to restrict lateral movement of the second plunger within the second socket opening.

Abstract: A probe card has an edge sensor. The edge sensor has a first needle and a second needle. The first needle and the second needle are in contact with each other when the first needle and a wafer are not in contact with each other, and the first needle and the second needle are not in contact with each other when the first needle and the wafer are in contact with each other. The probe card has a resistor connected between the first needle and the second needle.

Abstract: A probe card device and a neck-like probe thereof are provided. The neck-like probe includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and each of the broad side surfaces has a long slot extending from one of the narrow side surfaces to the other one. The two long slots have a minimum distance therebetween that is 75%-95% of a maximum distance between the two broad side surfaces. The ring-shaped insulator surrounds a portion of the conductive pin having the two long slots, and a portion of the neck-like probe corresponding in position to a part of the ring-shaped insulator on the two broad side surfaces has a thickness that is 85%-115% of the maximum distance.

Abstract: A probe card for a testing apparatus of electronic devices comprises a probe head housing a plurality of contact probes, each contact probe having at least one contact tip adapted to abut onto contact pads of a device under test, as well as a main support and an intermediate support connected to the main support and adapted to realize a spatial transformation of distances between contact pads on its opposite faces as a space transformer, the probe card suitably also comprising at least one connecting element adapted to link the space transformer and the main support, this connecting element having a substantially rod-like body and being equipped with a first end portion comprising at least one terminal section adapted to be engaged in a corresponding housing realized in the space transformer and with a second terminal portion adapted to abut onto an abutment element linked to the main support.

Abstract: A first signal line pattern has one end electrically connected to a first connector. A second signal line pattern has one end electrically connected to a second connector. The second signal line pattern has the other end facing the other end of the first signal line pattern. A conductive block has a convex portion. The convex portion of the conductive block is electrically connected to a third portion of the conductive pattern positioned between the other end of the first signal line pattern and the other end of the second signal line pattern of the wiring board.

Abstract: A probe includes: a rod-shaped plunger (11) including a tip section (111) and an insertion section (112) connected to the tip section (111); a tube-shaped barrel (12) in which the insertion section (112) of the plunger (11) is located inside; and a conductive first fixing member (131) which is located in an area where the plunger (11) and the barrel (12) face each other and is configured to fix the plunger (11) to the barrel (12), the first fixing member (131) having a lower melting point than that of the material of both of the plunger (11) and the barrel (12). The gap between the plunger (11) and the barrel (12) is filled with the first fixing member (131) without any voids in a cross section of the probe in an area where the plunger (11) and the barrel (12) overlap each other, including the area where the first fixing member (131) is located.

Abstract: A semiconductor device test socket has a shielding structure formed around each contactor so as to prevent signal delay or distortion during a test process and thereby enhance the test reliability. The socket includes a vertical probe comprising a contactor which has a contact terminal to be electrically connected to an external connection terminal of a semiconductor device. The shielding structure which is formed by laminating a conductive material on the outer edge of the contactor and is electrically connected to a ground. The socket further includes an elastic layer which is filled in the space between the contactor and the shielding structure, and surrounds the contactor such that the contact terminal of the contactor is exposed; and a connection film which is formed by laminating a conductive material so as to electrically connect shielding structures of multiple vertical probes.

Abstract: A Magnetic Particle Imaging (MPI) system with a magnet configured to generate a magnetic field with a field free line, the magnet integrated with a flux return designed so that a flux path at approximately the center of the field-free line has a first reluctance and a second flux path distal from the center of the field-free line has a second reluctance, and the second reluctance is lower than the first reluctance to facilitate a high fidelity magnetic field and high fidelity field free line.

Abstract: The present invention provides a guide plate for a probe card. The guide plate for the probe card according to the present invention includes: a first guide plate including a plurality of first pin insertion holes formed therein, and made of an anodic oxide film; and a second guide plate disposed to be spaced apart from the first guide plate by a predetermined distance, and including a plurality of second pin insertion holes through which probe pins passing through the first pin insertion holes pass, wherein a buffer part is provided at least partially on each of an upper portion and a lower portion of the first guide plate.

Abstract: Disclosed are a test chamber and a test apparatus having the same. The test chamber includes a test compartment configured to support a plurality of test boards, each being configured to secure a test object. The test chamber applies a test signal to the test object. The test chamber includes an inlet side and a discharge side, and a supply duct vertically extending along a height of the test compartment. The supply duct supplies the inlet side of the test compartment with the test fluid. The test chamber includes a fluid controller to uniformly control a distribution of a test fluid in the supply duct and uniformly supply the test compartment with the test fluid. The disclosed test chamber and test apparatus provide a uniform test temperature and thereby improve a test reliability of a test object such as a semiconductor or semiconductor package.

Abstract: A test device for testing a solar generator of a satellite or solar drone, the solar generator includes an array of solar cells, each junction being capable of converting photons of a respective wavelength band into electric current, the test device includes: an array of light sources including at least one row of light sources, wherein each light source emits light in each of the electrical conversion wavelength bands of the junction(s) of the solar cells, and a control unit for the array of light sources, and capable of controlling the turning on and off of each of the light sources of the array individually, wherein the array of light sources selectively illuminates each solar cell of the solar generator by turning on one or more light sources of the array, with the solar cell receiving an irradiance that is greater than at least 130W/m2.

Abstract: A high-frequency testing probe is disclosed. The probe includes a layered probe substrate having a first and second PCB, as well as first and second conducting traces disposed on opposite sides of the substrate. The probe substrate has an ungrounded differential region including two probe tips coupled to the traces, a grounded differential region, and a decoupled differential region including two probe connectors coupled to the traces. The probe also includes a ground plane between the two PCBs and between the two traces in the decoupled and grounded differential regions. In the ungrounded differential region, the first and second traces form a first differential transmission pair having a differential impedance. In the grounded differential region, the first and second traces form a second differential transmission pair having the differential impedance. The probe connectors are configured to couple to one of a vector network analyzer and a time domain reflectometer.

Abstract: A method for upgrading an automatic testing system includes electrically connecting at least one pogo pin attaching device to an expansion instrument and a pogo pin of a pogo pin interface of the automatic testing system wherein the pogo pin attaching device comprises at least one metal attaching member and at least one cable, each of said at least one cable having two opposite ends, a first end electrically connected to the metal attaching member and a second end electrically connected to the expansion instrument, and the metal attaching member attaches to the pogo pin. In response to operating the automatic testing system, electrically connecting the pogo pin to a subject so that a measurement path is established between the subject and the expansion instrument through the pogo pin attaching device, wherein the measurement path is configured to connect signals for upgrading the automatic testing system.