Abstract: Electrical circuit for measuring a current flowing in a conductor comprising: a first pair of Rogowski-type coils connected in series, the Rogowski-type coils of the first pair being able to operate in a first frequency band; a second pair of Rogowski-type coils connected in series, the Rogowski-type coils of the second pair being able to operate in a second frequency band, the second frequency band comprising at least partly frequencies higher than the frequencies of the first frequency band; and a means for electrically shielding the first pair of coils, and wherein a core of the Rogowski-type coils of the first and second pairs has a relative permeability of less than 10 and wherein one coil of each pair comprises at least one multi-turn winding, the other coil of the pair comprising at least one multi-turn winding.

Abstract: A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.

Abstract: A test probe assembly includes: a conductive pipe; a probe inserted in the pipe without contacts and elastically retractable along a lengthwise direction; and an insulation probe supporting member configured to support the probe between an inner wall of the pipe and an outer surface of the probe. The test probe assembly of the present disclosure is improved in noise shield performance and convenient in repairing the probe since the probe is mounted to a probe socket as supported in a metal pipe without contacts.

Abstract: A probe pin is proposed. The probe pin includes a first plunger configured to come in contact with a testing target contact point of a testing object and a second plunger configured to come in contact with a testing contact point of a testing circuit, in which the first plunge or the second plunger has a stem extending with a predetermined cross-sectional area and a contact portion extending from the stem such that a cross-sectional area decreases, and having first second tips, which are configured to come in contact with the testing target contact point or the testing contact point, at a front end; and the first and second tips are formed in symmetric shapes at positions that are symmetric with a central axis of the stem therebetween.

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT. The DUT includes an antenna and radiates a RF signal. The test kit further includes a reflector having a lower surface. The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT.

Abstract: An ODMR member is arranged in a measurement target AC magnetic field. A coil applies a magnetic field of a microwave to the ODMR member. A high frequency power supply causes the coil to conduct a current of the microwave. An irradiating device irradiates the ODMR member with light. A light receiving device detects light that the ODMR member emits. A measurement control unit performs a predetermined DC magnetic field measurement sequence at a predetermined phase of the measurement target AC magnetic field, and in the DC magnetic field measurement sequence, controls the high frequency power supply and the irradiating device and thereby determines a detection light intensity of the light detected by the light receiving device. A magnetic field calculation unit calculates an intensity of the measurement target AC magnetic field on the basis of the predetermined phase and the detection light intensity.

Abstract: A magnetic sensor includes a magnetic field converter, a magnetic field detector, and a plurality of shields aligned in a Y direction. The magnetic field converter includes a plurality of yokes. Each yoke has a shape elongated in the Y direction, and is configured to receive an input magnetic field component in a direction parallel to a Z direction and to output an output magnetic field component in a direction parallel to an X direction. The magnetic field detector includes a plurality of trains of elements. Each train of elements includes a plurality of MR elements that are aligned in the Y direction along one yoke and connected in series. Each shield has such a shape that its maximum dimension in the Y direction is smaller than its maximum dimension in the X direction.

Abstract: Provided is an inspection socket capable of elastically contacting the conductor with the electrode of the object to be tested and the electrode for inspection by pushing the object to be inspected toward the inspection substrate side, without adhering foreign matters or contact marks to the object to be inspected. The inspection socket is so configured that the object to be inspected (100) is pushed toward the inspection substrate (10) without touching the object to be inspected (100), by integrally holding the object to be inspected (100) and the positioning table (20) using air pressure (negative pressure or positive pressure) and pushing the positioning table (20) by the pushing unit (50), so that the object to be inspected comes into contact with the land (11) of the inspection substrate (10) through the contact probe (30).

Abstract: A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.

Abstract: A probe for characteristic inspection of a connector includes a plunger, a coaxial cable, a flange, and a housing having an end portion on one side including an increased diameter portion. A recessed portion which receives the increased diameter portion is in an upper surface of the flange. The increased diameter portion has side walls in contact with or facing respective inner side surfaces of the flange partly, with the inner side surfaces forming the recessed portion, and a bottom wall in contact with an upper recessed surface of the flange that forms the recessed portion. The increased diameter portion has connection surfaces connecting the bottom and side walls and inclined inward from one of the side walls toward the bottom wall. Alternatively, the inner side surfaces each have a first surface inclined downward, and a vertical surface extending downward from the first surface to the upper recessed surface.

Abstract: A test apparatus includes a first module configured to structurally support a target semiconductor device, and a second module reversibly attachable to the first module. The first module includes a first housing including one or more inner surfaces at least partially defining an inner space, a volume control unit configured to control a volume of the inner space, a mounting unit at least partially exposed to the inner space and configured to be exposed to the target semiconductor device, and a magnetic force control unit in the first housing. The second module includes a second housing, a test board in the second housing, and an attachable/detachable member in the second housing. The test board may be electrically connected to the target semiconductor device. The magnetic force control unit may control a magnetic property of the attachable/detachable member to cause the attachable/detachable member to attach/detach to/from the magnetic force control unit.

Abstract: A testing device for testing an integrated circuit package is provided, including a printed circuit board having a first surface, a second surface, and multiple conductive layers between the first and second surfaces. A metal layer is formed on the second surface and is electrically connected to one of the conductive layers that is grounded. A testing socket is disposed over the first surface. A conductive fastener secures the testing socket to the printed circuit board and is electrically connected to the metal layer. A cover is disposed over the testing socket to form a space for accommodating the integrated circuit package between the cover and the testing socket. The cover has a conductive surface in contact with the integrated circuit package. A conductive element assembly is disposed between the cover and the testing socket and is electrically connected to the conductive surface and the conductive fastener.

Abstract: A probe card device and a self-aligned probe are provided. The self-aligned probe includes a fixing end portion configured to be abutted against a space transformer, a testing end portion configured to detachably abut against a device under test (DUT), a first connection portion connected to the fixing end portion, a second connection portion connected to the testing end portion, and an arced portion that connects the first connection portion and the second connection portion. The fixing end portion and the testing end portion jointly define a reference line passing there-through. The first connection portion has an aligned protrusion, and a maximum distance between the arced portion and the reference line is greater than 75 ?m and is less than 150 ?m.

Abstract: An integrated sensor includes a sensor cell, a signal source, an input optical rotator, and a signal detector. The integrated sensor includes a positioner for a signal-processing component. The positioner may be a linear positioner for the signal-processing component, such as a signal source or a signal detector, or may be a rotational positioner for the signal-processing component, such as a polarizer or a polarized signal source. The signal-processing component is located on a signal path of the integrated sensor. A method of adjusting a linear position or rotational position of a signal-processing component is also disclosed. A linear position or a rotational position of the signal-processing component may be adjusted to improve performance of the integrated sensor.

Abstract: The present invention provides a probe apparatus, which comprises a signal transmission device, a probe, and a bottom fixing device. The signal transmission device includes a first transmission part and a second transmission part. An end of the probe is connected electrically below the second transmission part. The bottom fixing device is disposed below the signal transmission device. An end of the bottom fixing device includes a first penetrating hole and a first recess is disposed below the end. The probe passes through the first penetrating hole of the bottom fixing device. The probe is located in the first recess. The bottom fixing device reinforces the mechanical strength of the signal transmission device so that the width of the signal transmission device can be reduced. Thereby, the benefit of high-density arrangement of the probe apparatus can be achieved.

Abstract: A testing device is disclosed including a plurality of elastic members, a plurality of elastic terminals, and a plurality of terminal boards. Each elastic member is provided with an arc-shaped elastic deformation portion, at least one elastic terminal is arranged as one set and is clamped on one elastic member with an inner arc of the elastic deformation portion. Each terminal board is provided with a recess for accommodating one of the elastic members, the recess is provided with at least one arc-shaped groove each matched with a respective elastic terminal, an outer arc of the elastic deformation portion is embedded in a respective arc-shaped groove, each arc-shaped groove has an upper end extending to an upper surface of the terminal board, and a lower end extending to a lower surface of the terminal board.

Abstract: A high speed signal transmitting and receiving detection device is provided. The high speed signal transmitting and receiving detection device includes a substrate unit and a plurality of probe units. The plurality of probe units pass through the substrate unit. The substrate unit includes a conducting space, a plurality of fillers and a plurality of barriers. Each of the fillers is arranged in the conducting space and between two of the probe units that are adjacent to each other. Each of the barriers is arranged in the conducting space and between the two of the probe units that are adjacent to each other. A capacitance effect between the two of the probe units that are adjacent to each other is formed through the filler and the barrier that correspond to the two of the probe units that are adjacent to each other.

Abstract: The present disclosure relates to a coaxial lead structure and method for radiating a GIS partial discharge UHF signal outward. The structure includes a GIS cavity, a circular hole provided on the GIS cavity, a medium cylinder provided at the circular hole and sealing the circular hole, a thin cylindrical metal lead that extends into and is fixed to the medium cylinder, and a ground lead connected to the thin cylindrical metal lead. According to the present disclosure, a relatively strong signal may be obtained outside a coaxial lead structure, and detection of a partial discharge UHF signal at this position may increase the detection sensitivity by one time compared with the detection methods of built-in and external disc insulators.

Abstract: An intermediate connecting member according to one aspect of the present disclosure is provided between a first member including multiple first terminals and a second member including multiple second terminals. The intermediate connecting member includes multiple connection parts configured to electrically connect the first terminals to the second terminals, and a retainer holding the multiple connection parts. Each of the multiple connection parts is formed of an elastic member to which an electrically conductive property is given at least on a surface of the elastic member.

Abstract: A probe assembly, adapted to test high-speed signal transmission lines of printed circuit boards, includes two pogo pins for providing high-frequency differential test signals, and both sides of the pogo pin include no metal layer (grounding layer). Experiments have found that when the two pogo pins test a to-be-tested object, the test signal will be coupled to the metal layers on both sides of the pogo pins to generate a radiation resonance, resulting in a loss of the test signal on a specific frequency band, and further reducing the effective bandwidth of the probe assembly. The metal layers on both sides of the pogo pins of the probe assembly are reduced, so that the foregoing radiation resonance phenomenon can be avoided.