Patents Examined by Paresh Patel
  • Probe assembly
    Patent number: 11543430
    Abstract: A probe assembly, adapted to test high-speed signal transmission lines of printed circuit boards, includes two pogo pins for providing high-frequency differential test signals, and both sides of the pogo pin include no metal layer (grounding layer). Experiments have found that when the two pogo pins test a to-be-tested object, the test signal will be coupled to the metal layers on both sides of the pogo pins to generate a radiation resonance, resulting in a loss of the test signal on a specific frequency band, and further reducing the effective bandwidth of the probe assembly. The metal layers on both sides of the pogo pins of the probe assembly are reduced, so that the foregoing radiation resonance phenomenon can be avoided.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: January 3, 2023
    Assignee: MPI CORPORATION
    Inventors: Ming-Hsiang Hsieh, Chia-Nan Chou, Hao Wei, Chia-Jung Liu, Chia-An Yu
  • Cantilever-type probe with multiple metallic coatings
    Patent number: 11543431
    Abstract: A cantilever-type probe with multiple metallic coatings is disclosed. The cantilever-type probe includes at least one probe pin. A first metallic coating is disposed upon a tip of the probe pin, and a second metallic coating is disposed upon a root of the probe pin. The second metallic coating is in contact with the first metallic coating and comprises a softer (more flexible) metal than the first metallic coating.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: January 3, 2023
    Assignee: KLA Corporation
    Inventors: Hongshuo Zou, Nanchang Zhu, Hai-Yang You
  • Probe card device and dual-arm probe
    Patent number: 11536744
    Abstract: A probe card device and a dual-arm probe are provided. The dual-arm probe has a probe length, and includes a bifurcation end portion and a testing end portion. The dual-arm probe has two broad side surfaces respectively arranged on two opposite sides thereof. The dual-arm probe has a separation slot that is recessed from a bifurcation opening of the bifurcation end portion toward the testing end portion and that penetrates from one of the two broad side surfaces to the other one, so that two branch arms of the dual-arm probe are defined by the separation slot and are spaced apart from each other. The separation slot has a slot length being 50% to 90% of the probe length. In a cross section of the two branch arms, an area of any one of the two branch arms is 90% to 110% of that of the other one.
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: December 27, 2022
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Kai-Chieh Hsieh, Wei-Jhih Su, Hong-Ming Chen, Vel Sankar Ramachandran
  • Probe head
    Patent number: 11519938
    Abstract: Provided is a probe head capable of reducing an inductance value of a ground probe. In a probe head 1, a pin plate 40, a pin block 50, and a solder resist film 60 are stacked in this order from a measuring instrument side to be integrally formed, and constitute a support body that supports a signal probe 10 and a first ground probe 20. The pin plate 40 is an insulator. The pin block 50 is a conductor, and is electrically connected to the first ground probe 20 and a measuring instrument-side ground, and is not electrically connected to the signal probe 10. The solder resist film 60 is provided on the surface of the pin block 50 on a side of a device to be inspected, and is interposed between the pin block 50 and the device to be inspected.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: December 6, 2022
    Assignee: YOKOWO CO., LTD.
    Inventors: Yoshihiko Sakurai, Hiroshi Ishigure, Daisuke Hosokawa
  • Probe card device and disposable adjustment film thereof
    Patent number: 11506685
    Abstract: A probe card device and a disposable adjustment film thereof are provided. The disposable adjustment film is integrally formed as a single one-piece structure, and includes a probe hole and a plurality of first slots that are parallel to each other. The disposable adjustment film defines two predetermined lines respectively extending from two opposite lateral edges thereof to the probe hole. The two predetermined lines respectively extend across the first slots. In a plane that the disposable adjustment film is located thereon, when the disposable adjustment film is applied with forces that act in opposite directions and that are parallel to any one of the first slots, the disposable adjustment film is broken into two abandoned films along the two predetermined lines.
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: November 22, 2022
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Kai-Chieh Hsieh, Wei-Jhih Su, Chao-Hui Tseng, Hsien-Yu Wang, Vel Sankar Ramachandran
  • Test socket and test apparatus having the same
    Patent number: 11506705
    Abstract: The present disclosure discloses a test socket according to the present disclosure including an inelastic electro-conductive housing formed of an inelastic electro-conductive material and provided with a plurality of housing holes passing therethrough in the thickness direction, each housing hole being formed at a position corresponding to each terminal of a device under test; and an electro-conductive part formed to have a configuration in which a plurality of electro-conductive particles are oriented in the thickness direction in an elastic insulating material, and comprising an electro-conductive part for grounding, an electro-conductive part for signal, and an electro-conductive part for power disposed in the housing holes, respectively, the electro-conductive part for signal and the electro-conductive part for power being insulated by an insulating layer.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: November 22, 2022
    Assignee: TSE CO., LTD.
    Inventor: Chang Su Oh
  • Contact pin and socket
    Patent number: 11506684
    Abstract: Provided is a contact pin comprising: a hollow first plunger that includes a first contact portion provided on one end side in a first direction and a first enlarged portion which is enlarged in a second direction intersecting the first direction; a second plunger, the one end of which is inserted into the first plunger and that includes a second contact portion provided on the other end side in the first direction and a second enlarged portion provided in a protruding portion protruding from the first plunger so as to be enlarged in the second direction; and a spring provided between the first and second plungers so as to surround the first and second plungers, wherein the first enlarged portion forms a curve shape to bulge outward.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: November 22, 2022
    Assignee: Enplas Corporation
    Inventor: Yuki Ueyama
  • Test apparatus which tests semiconductor chips
    Patent number: 11506740
    Abstract: A test apparatus includes a motherboard including a first surface. The test apparatus further includes a handler including a second surface facing the first surface of the motherboard. The test apparatus additionally includes an adapter board disposed between the first surface of the motherboard and the second surface of the handler. The test apparatus further includes a first sensor mounted on the adapter board and senses data about temperature of the adapter board. The test apparatus additionally includes a wireless transceiver mounted on the adapter board and transmits, in real time, the sensed data.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: November 22, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Ung Jin Jang
  • Roll detection and six degrees of freedom sensor assembly
    Patent number: 11497413
    Abstract: A roll-detecting sensor assembly includes a coil extending along and disposed about an axis. The coil comprises one or more portions, with each portion defining a winding angle. At least one of the portions defines a winding angle that is substantially nonzero relative to a line perpendicular to the axis, whereby the projected area of the coil in an applied magnetic field changes as the coil rotates about the axis. As a result, the coil is configured to produce a signal responsive to the magnetic field indicative of the roll of the sensor about the axis. In an embodiment, at least one of the portions defines a winding angle that is at least 2 degrees. In an embodiment, at least one of the portions defines a winding angle that is about 45 degrees.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: November 15, 2022
    Assignee: St. Jude Medical International Holding S.à r.l.
    Inventors: Uzi Eichler, Alon Izmirli, Dan Seter
  • IC chip holder
    Patent number: 11499991
    Abstract: The present disclosure relates to an IC chip holder capable of alleviating an impact if the IC chip holder is dropped or collides with another object. In the IC chip holder, an upper housing body is provided, on a side of electric contacts of an IC chip, with an elastic deformation portion capable of elastically deforming toward the inside of the upper housing body. Thus, since the elastic deformation portion elastically deforms toward the inside of the upper housing body, if the IC chip holder is dropped or collides with another object, the elastic deformation portion bends and the impact is alleviated. Thus, a possibility of the IC chip being damaged is reduced.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: November 15, 2022
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Hidekazu Komiya, Koji Hayashi
  • Multi-conductor transmission line probe
    Patent number: 11486898
    Abstract: Vertical transmission line probes having alternating capacitive and inductive sections are provided. These alternating sections can be designed to provide a desired transmission line impedance (e.g., between 10 and 100 Ohms, preferably 50 Ohms). Probe flexure in operation is mainly in the inductive sections, advantageously reducing flexure stresses on the dielectrics in the capacitive sections.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: November 1, 2022
    Assignee: FormFactor, Inc.
    Inventors: Tim Lesher, Jason William Cosman
  • Contact and test socket device for testing semiconductor device
    Patent number: 11486897
    Abstract: The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: November 1, 2022
    Inventors: Dong Weon Hwang, Jae Suk Hwang, Jae Baek Hwang
  • Contact and test socket device for testing semiconductor device
    Patent number: 11486896
    Abstract: The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: November 1, 2022
    Inventors: Dong Weon Hwang, Jae Suk Hwang, Jae Baek Hwang
  • Wafer probe integration with load pull tuner
    Patent number: 11480589
    Abstract: Integrating a bracket with planarity adjustment holding a wafer probe securely, with a low-profile impedance tuner that is mounted on a 3-axis tuner positioner under an angle matching the angle of the wafer probe. The low-profile tuner has its tuning probe operating as close as physically possible within the distance of an RF adapter from the wafer-probe and is connected directly with the wafer-probe. This integration offers the maximum possible tuning range, while simultaneously offering planarity (THETA) control. It also eliminates the need for an extension RF cable between the instrument (tuner) and the wafer-probe, including a set of two coaxial adapters.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: October 25, 2022
    Inventor: Christos Tsironis
  • Inspection jig, inspection device, and contact terminal
    Patent number: 11467186
    Abstract: When a load necessary for inspection is applied to a cylindrical body in the axial direction thereof, an end of the first bar-like main body is located closer to the other end side of the cylindrical body than one end of a support portion in a support member that supports the body portion, an end of the second bar-like main body is located closer to one end side of the cylindrical body than the other end of the support portion, the body portion is located in the entire portion where the support portion is located, and a radial distance between the outer peripheral surface of the axial central portion of at least one of the first spring portion and the second spring portion and the support member is larger than the distance between the body portion and the support portion.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: October 11, 2022
    Assignee: NIDEC-READ CORPORATION
    Inventors: Norihiro Ota, Sukkwi Kim
  • Integrated circuit contact test apparatus with and method of construction
    Patent number: 11467183
    Abstract: A test socket for a device under test (DUT) is disclosed in several embodiments. One embodiment shows a test socket base (16) with apertures (30) for insertion of test pin insert blocks (28). The blocks are inserted top—in or bottom—in and are provided with registration bosses 80 and teeth 92 or other means for maintaining registration. Blocks are provided with dielectric constants to achieve different frequency response relative to other pins. To achieve great EMI and cross talk isolation, the socket may be made of aluminum with hard anodize coating to insulate test pins (32) from the housing.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: October 11, 2022
    Assignee: Johnstech International Corporation
    Inventors: Jeffrey Sherry, Joël Erdman
  • Test socket and method of manufacturing the same
    Patent number: 11467185
    Abstract: A first base plate includes a plurality of first positioning hole portions, an accommodation portion that accommodates an optical module, a first opening portion, a first pressing portion, and a first engagement portion. A second base plate has a second positioning hole portion that is disposed at a position corresponding to the first positioning hole portion, a second opening portion that is disposed at a predetermined positional relationship with respect to the second positioning hole portion, a second holding portion, a conduction portion, a second pressing portion, a substrate portion, a cover portion, a second hinge portion, and a second engagement portion.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: October 11, 2022
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Kazuo Tamaki, Yasuki Fukui, Naruki Hara, Masataka Yamashita
  • Adjustable probe device for impedance testing for circuit board
    Patent number: 11460498
    Abstract: An adjustable probe device includes fixed and movable probes, at least one of which is a signal probe having a coaxial structure. The movable probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. Another adjustable probe device includes a first movable probe for being grounded, and fixed and second movable probes both having a coaxial structure. Any of the two movable probes is selectable to be a functioning probe in a way that the contact ends of the functioning and fixed probes are located on a same plane for contacting two pads of a DUT at the same time, and the functioning probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. As a result, the probe interval is adjustable, lowering the cost of the impedance testing apparatus for circuit boards.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: October 4, 2022
    Assignee: MPI CORPORATION
    Inventors: Yang-Hung Cheng, Ya-Hung Lo, Chien-Hsun Chen, Chia-Nan Chou, Chung-Yen Huang, Shou-Jen Tsai, Fuh-Chyun Tang
  • Integrated pogo pin enabling integrated housing
    Patent number: 11454649
    Abstract: Proposed is an integrated pogo pin including: a casing portion rolled up to have a C-shaped cross section; an upper elastic portion extending from a first side surface of the casing portion in a first spiral direction toward an upper-end opening along an inner circumferential surface thereof; an upper probe portion arranged on a non-stationary end of the upper elastic portion and rolled up to a shape of a cylinder in such a manner as to reciprocate upward and downward within the upper-end opening; a lower elastic portion extending from the first side surface of the casing portion in a second spiral direction toward a lower-end opening along the inner circumferential surface; and a lower probe portion arranged on a non-stationary end of the lower elastic portion and rolled up to the shape of the cylinder in such a manner as to reciprocate upward and downward within the lower-end opening.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: September 27, 2022
    Inventor: Sangyang Pak
  • Thermal test head for an integrated circuit device
    Patent number: 11454666
    Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: September 27, 2022
    Assignee: AEM SINGAPORE PTE LTD
    Inventors: See Jean Chan, Zhaomeng Wang, Yao Kun Leonard Mak, MuralliKrishna Govindandhanasekaran