Abstract: A thin-film probe card and a test module thereof are provided. The test module includes a carrying unit, a plurality of vertical probes fixed in position by the carrying unit, an elastic cushion disposed on the carrying unit, and a thin sheet. The thin sheet includes a carrier partially disposed on the elastic cushion, a plurality of signal circuits disposed on the carrier, and a plurality of electrically conductive protrusions that are respectively formed on the signal circuits. An end of the vertical probes is arranged at an inner side of the electrically conductive protrusions and is coplanar with free ends of the electrically conductive protrusions.

Abstract: The present invention relates to a locking mechanism for a press head, and an electronic device testing apparatus comprising the same, wherein a slider and a locking pin are disposed on the press head and a test socket substrate, respectively. When the press head is moved and engaged with the test socket substrate, an actuator drives the slider to secure the locking pin, so as to secure the press head and the test socket substrate and prevent the press head and the test socket substrate from being separated from each other. The mechanism is simple in construction, easy to install and maintain, reliable, and can be integrated into the support arms, and occupies a relatively small space. Energy is consumed only when the actuator is actuated to effect locking or unlocking. That is, only when the slider is driven and moved, energy is consumed. No extra energy is needed to persistently press down or drive the locking mechanism.

Abstract: A plate spring-type connection pin is proposed. The connection pin includes: a support pin that has a bending lip portion at an upper portion thereof and a base portion at a lower portion thereof, and is vertically elongated; a plate spring that has an upper probe portion vertically extending adjacent to the lip portion, a lower probe portion disposed at the same height as the base portion, a laterally lying V-shaped portion disposed between the upper probe portion and the lower probe portion, an upper bending portion connecting an upper end of the V-shaped portion and a lower end of the upper probe portion, and a lower bending portion connecting a lower end of the V-shaped portion and an upper end of the lower probe portion; and a bridge that is disposed between the base portion of the support pin and the lower probe portion of the plate spring.

Abstract: A probe head includes a probe seat, a first spring probe penetrating through upper, middle and lower dies of the probe seat for transmitting a first test signal, and at least two shorter second spring probes penetrating through the lower die for transmitting a second test signal with higher frequency. Two second spring probes are electrically connected in a way that top ends thereof are abutted against two electrically conductive contacts on a bottom surface of the middle die electrically connected by a connecting circuit therein. The lower die has a communicating space and at least two lower installation holes communicating therewith and each accommodating a second spring probe partially located in the communicating space. The probe head is adapted for concurrent high and medium or low frequency signal tests, meets fine pitch and high frequency testing requirements and prevents probe cards from too complicated circuit design.

Abstract: The present disclosure provides methods for testing and evaluating electrical parameters of electronic circuits. An exemplary method includes providing a device-under-test electrically coupled to a testing apparatus; and determining an optimum value of a first electrical parameter and an optimum value of a second parameter by testing the device-under-test according to a set of first electrical parameter values and a set of second electrical parameter values. The optimum value of the first electrical parameter and the optimum value of the second parameter are determined based on an electrical noise response of the device-under-test.

Abstract: An electronic sensor includes a signal generator configured to output a first excitation signal and a second excitation signal and a variable differential transformer connected to the signal generator to receive the first excitation signal and the second excitation signal. The variable differential transformer may include a primary coil, a first secondary coil connected to the signal generator, a second secondary coil connected to the signal generator, and a core disposed at least partially in a magnetic field generated via the first secondary coil and the second secondary coil and the first excitation signal and the second excitation signal. A phase of an output signal of the primary coil corresponds to a position of the core.

Abstract: A method of testing a self-contained device under test having at least a circuit under test and a power source is provided. The method may include at least temporarily enabling power from the power source to the circuit under test, determining a first voltage across the circuit under test, determining a second voltage across the circuit under test after a test duration, and calculating an average current of the circuit under test based at least partially on the first voltage, the second voltage and the test duration.

Abstract: A sensor device is provided for testing electrical connections in a DUT using contactless fault detection. The sensor device includes main traces for conducting an RF signal supplied by a signal source; at least one inductor connected to at least one of the main traces; and a slit formed between opposing conductor portions at a tip of the sensor device for sensing open circuits and/or short circuits in portions of the DUT located in a sensing region below the slit, the tip being at an end of the sensor device opposite ends of the main traces connected to the signal source. An electric field, generated by the sensor device in response to the RF signal, substantially concentrates in the slit, enhancing the sensing of the open and/or the short circuits during the contactless fault detection.

Abstract: A semiconductor device test system may include a body providing an internal space, in which a test device is loaded, and a cover coupled to the body to cover the internal space. The cover may include a first cover including first openings two-dimensionally arranged and a second cover including second openings two-dimensionally arranged. An arrangement of the first openings may be different from an arrangement of the second openings.

Abstract: The present invention relates to an active measuring probe for EMI detection comprising a first connecting member, an impedance element, an amplifier and a second connecting member. The first connecting member is coupled to one terminal of the impedance element and an input terminal of the amplifier. The other terminal of the impedance element is coupled to a ground terminal. The second connecting member is coupled to an output terminal of the amplifier.

Abstract: A probe holder holds contact probes each of which comes in contact with one electrode of a contact target on one end portion side in a longitudinal direction. The probe holder includes a plate in which holder holes configured to hold the respective contact probes are formed and penetrate the probe holder. Each of the holder holes includes a first hole portion disposed on one end of a penetrating direction and extending in the penetrating direction, a large diameter portion connected to the first hole portion and extending in the penetrating direction, the large diameter portion being larger than a diameter of the first hole portion, and a second hole portion disposed on another end of the penetrating direction, connected to the large diameter portion, and extending in the penetrating direction, the second hole portion being smaller than a diameter of the large diameter portion.

Abstract: Probe systems for optically probing a device under test (DUT) and methods of operating the probe systems. The probe systems include a probing assembly that includes an optical probe that defines a probe tip and a distance sensor. The probe systems also include a support surface configured to support a substrate, which defines a substrate surface and includes an optical device positioned below the substrate surface. The probe systems further include a positioning assembly configured to selectively regulate a relative orientation between the probing assembly and the DUT. The probe systems also include a controller programmed to control the operation of the probe systems. The methods include methods of operating the probe systems.

Abstract: A method and system provides an acquisition scheme for generating magnetic resonance elastography displacement data with whole-sample coverage, high spatial resolution, and adequate SNR in a short scan time. The method and system can acquire in-plane and through-plane k-space shots over a volume of a sample divided into a plurality of slabs that each include a plurality of non-adjacent slices to obtain three dimensional multiband, multishot data, can apply multiband radio frequency refocusing pulses to the sample, can acquire navigators before readout, and can correct for non-linear motion errors.

Abstract: A probe head and a conductive probe thereof are provided. The conductive probe includes a first long lateral surface and an opposite second long lateral surface. The first long lateral surface and the second long lateral surface define a central axis there-between. The conductive probe includes a middle segment, an upper connecting segment and a lower connecting segment respectively extending from the middle segment in two opposite directions, and an upper contacting segment and a lower contacting segment respectively extending from the upper and the lower connecting segments in two opposite directions. The upper connecting segment includes an extension extending from the first long lateral surface in a direction away from the central axis. The upper contacting segment includes a protrusion extending from the first long lateral surface in a direction away from the central axis, and the extension and the protrusion are spaced apart from each other.

Abstract: Provided is a probe pin alignment device that can readily correct a positional deviation between a probe pin and an electrode pad in real time and can prevent damage to the probe pin or an electronic device. The probe pin alignment device includes a mirror to reflect a mirror image of the electrode pad while the probe pin is approaching a crystal oscillator, a camera to take a picture containing an image of the probe pin and the mirror image reflected on the mirror, a deviation measurer to measure a deviation between the position of the probe pin and the position of the electrode pad in the taken picture, a displacer to relatively displace a carrier and the probe pin, and a controller to cause the displacer to relatively displace the carrier and the probe pin such that the deviation is substantially zero.

Abstract: A method may include coupling a first electrical connector of an article to a second electrical connector of a measurement device. The article may include a tested material, the first electrical connector, and a plurality of electrical contacts electrically connected to the first electrical connector. The measurement device may include a power source and a user interface. The method also may include causing, by a controller, an electrical signal to be applied to a pair of drive electrical contacts from the plurality of electrical contacts. The method further may include receiving, by the controller, from an analog-to-digital converter, a measured voltage measured using a measurement electrical contact from the plurality of electrical contacts. The method also may include determining, by the controller, whether the tested material includes a crack or other defect based on the measured voltage.

Abstract: A probe card of a testing apparatus of electronic devices comprises a testing head, which houses a plurality of contact elements extending along a longitudinal axis between a first end portion and a second end portion, a support plate, onto which the first end portion is adapted to abut, and a flexible membrane. Suitably, the testing head is arranged between the support plate and a first portion of the flexible membrane, which is connected to the support plate through a second portion thereof, the probe card further comprising a plurality of contact tips arranged on a first face of the flexible membrane at the first portion thereof, the second end portion of each contact element being apt to abut onto a second face of the flexible membrane, opposite to the first face, the number and distribution of the contact elements being different to the number and distribution of the contact tips.

Abstract: A measurement system may include a set of drive electrical contacts including a force electrical contact and a return electrical contact electrically coupled to a tested material, a measurement electrical contact electrically coupled to the tested material, a return node, a voltage source, and a control module. A circuit path between the voltage source and the return node may include a fixed resistor and the tested material. The control module may be configured to cause the voltage source to apply a voltage signal to the force electrical contact, cause a voltage drop across the fixed resistor to be measured, cause a measured voltage to be measured using the measurement electrical contact, determine a measured equivalent impedance of the tested material associated with the measurement electrical contact based on the voltage drop across the fixed resistor and the measured voltage, and determine whether the tested material includes a crack or other defect based on the measured equivalent impedance.

Abstract: A system for determining an amplitude of a sinusoidal output waveform from a sensor includes a controller configured to provide a sample signal having a sample frequency that is four times a frequency of a sinusoidal excitation waveform provided to the sensor. The sensor has inductively-coupled primary and secondary windings that produce the sinusoidal output waveform from the secondary winding when the excitation waveform is provided to the primary winding. An analog-to-digital converter measures a first and second voltage of the sensor waveform separated in time by the period of the sample frequency, and the system calculates the amplitude based on the measurements of the first and second voltages.

Abstract: An impulse tester according to the present invention includes a first terminal, a second terminal, a voltage generation circuit, and an oscillation suppression circuit. The oscillation suppression circuit includes a discharge switch and a capacitor. The discharge switch has a first electrode and a second electrode. The first electrode is connected to the first terminal. The second electrode is disposed at a spacing from the first electrode. The discharge switch becomes conductive when a voltage difference between the first electrode and the second electrode is greater than a discharge voltage corresponding to the spacing between the first electrode and the second electrode. The capacitor is connected between the second electrode and the second terminal.