Abstract: Component mounting machine includes head, a device for moving head, transfer unit, and a mounting controller. Circular plate is an example of a container in which paste is placed. The bottom face of circular plate and the upper surface of the side wall have a predetermined height relationship. Height sensor is disposed on the lower face of head. Height sensor measures the height of the upper surface of the side wall of circular plate, which is a measurement point. The mounting controller recognizes the height of the bottom face of circular plate or the height of the surface of coating film disposed on circular plate from the height of the top surface of the side wall of circular plate measured by height sensor.

Abstract: A grain-oriented electrical steel sheet for a stacked transformer core. The steel sheet having a sheet thickness t, where t and an iron loss deterioration ratio obtained by subjecting the steel sheet under elliptic magnetization satisfy the following relations: (i) when t?0.20 mm, the iron loss deterioration ratio is 85% or less; (ii) when 0.20 mm<t<0.27 mm, the iron loss deterioration ratio is 80% or less; and (iii) when 0.27 mm?t, the iron loss deterioration ratio is 75% or less. The iron loss deterioration ratio is calculated from ((WA?WB)/WB)×100, where WA is iron loss under 50 Hz elliptic magnetization of 1.7 T in a rolling direction and 1.0 T in a direction orthogonal to the rolling direction, and WB is iron loss under 50 Hz alternating magnetization of 1.7 T in the rolling direction.

Abstract: A non-magnetic member, a first magnetic member and a second magnetic member are prepared. The first magnetic member and the second magnetic member are connected to the non-magnetic member. Then, a first bonding portion which bonds the non-magnetic member and the first magnetic member to each other, and a second bonding portion which bonds the non-magnetic member and the second magnetic member to each other are formed. A hot isostatic pressing process is performed to the non-magnetic member, the first magnetic member and the second magnetic member to establish diffusion-bond. Thereafter, the non-magnetic member, the first magnetic member and the second magnetic member are hollowed, and the first bonding portion and the second bonding portion are removed. Thereafter, the non-magnetic member becomes a non-magnetic body, the first magnetic member becomes a first magnetic body, the second magnetic member becomes a second magnetic body and a sleeve is obtained.

Abstract: An assembler system for manufacturing vapor-generating articles may include a rotatable assembly drum including an outer face and a flute in the outer face. The flute is structured and arranged to hold a first section and a second section of the vapor-generating article. The system also includes a first mechanism that translates the first section relative to the second section while the first section and the second section are in the flute. The system additionally includes a second mechanism that rotates the first section relative to the second section while the first section and the second section are in the flute. The translating and the rotating connect the first section to the second section to form the vapor-generating article.

Abstract: A workstation and method for the installation of a pulling head assembly onto one or more conductors of a cabling system are provided. The workstation incorporates one or more of: a conductor clamp that holds the conductors of the cabling system in place during the installation of the pulling head assembly; a cutting guide having indicia marks that indicate the lengths to which to cut the conductors in order to achieve a staggered pattern of pulling eyes attached to the conductors in the pulling head assembly; a stripping tool that is used to remove a portion of the insulation from the terminal end of each conductor so that the end of the conductor may be inserted into the pulling eye; and a crimping tool that is used to crimp the pulling eyes onto the terminal ends of each of the conductors.

Abstract: A component mounting system comprising: a stage configured to scatter components; a holding tool configured to move over the stage and hold components from the stage; a storage device configured to store positional information of components on the stage that the holding tool failed to hold; and a control device configured to control the operation of the holding tool so that components are held while excluding components in the positional information stored in the storage device from becoming holding targets.

Abstract: Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.

Abstract: A portable computing device is disclosed. The portable computing device can take many forms such as a laptop computer, a tablet computer, and so on. The portable computing device can include at least a single piece housing. The single piece housing can be machined from a single billet of material, such as a billet of aluminum. The single piece housing can include ledges with a surface receiving a trim bead and a cover. Corner brackets can be attached to the single piece housing to improve the damage resistance of the housing.

Abstract: Enhancements to existing gaming controllers facilitating expedient response time and fine-tuned accuracy are described. The enhancements comprise the internal modification of the stock resistance force supplied by the analog stick centering spring mechanism. Through modification, the force of resistance supplied may be increased to over 200 grams of force, or down to 40 grams of force, while maintaining full function of the analog stick mechanism. A second primary enhancement replaces the stock triggers, conventionally equipped with progressive resistance sensors, to a momentary ‘snap-action’ two-way switch, minimizing trigger pull distance, and removing the analog nature of the trigger to achieve optimal performance.

Abstract: In the component mounting system, when an electronic component having a positioning target is held and mounted onto the upper face of a board, the positioning target is aligned to a predetermined position of the board. The component mounting system detects a positional deviation of the positioning target on the upper face of the electronic component and performs an arrangement operation of arranging a positioning material on the board by correcting the arrangement position in accordance with the detected positional deviation. The component mounting system then performs a mounting operation for mounting the electronic component on the board by aligning the positioning target to the predetermined position of the board on which the positioning material has been arranged.

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

Abstract: A punching process for wireless charging coils comprises: punching a metal piece for forming a coil structure and a fixing element, the coiling structure having a plurality of coil segments, a gap being between two of the plurality of coil segments, and the fixing element connecting the coil segments for keeping the width of the gap.

Abstract: A method of manufacturing an electrical connection forming tool, the method including selecting, a wire forming die module, the wire forming die module including a module housing, wherein the module housing includes a front side, the front side including a chamber configured to align with an electrical plug; a back side; and an inner compartment, the inner compartment including a coil sliding body feature, the coil sliding body feature configured to interface with the electrical plug; a die, and the die is configured to accept a wire and imprint the wire on the electrical plug; a locking feature; and a cover for the locking feature; and connecting an actuator and an actuator housing to the selected wire forming die module.

Abstract: A method used in forming an electronic device comprising conductive material and ferroelectric material comprises forming a composite stack comprising multiple metal oxide-comprising insulator materials. At least one of the metal oxide-comprising insulator materials is between and directly against non-ferroelectric insulating materials. The multiple metal oxide-comprising insulator materials are of different composition from that of immediately-adjacent of the non-ferroelectric insulating materials. The composite stack is subjected to a temperature of at least 200° C. After the subjecting, the composite stack comprises multiple ferroelectric metal oxide-comprising insulator materials at least one of which is between and directly against non-ferroelectric insulating materials. After the subjecting, the composite stack is ferroelectric. Conductive material is formed and that is adjacent the composite stack. Devices are also disclosed.

Abstract: A mounting control section of a mounting device causes a mounting section to pick up a component from a feeder at a position designated in mounting condition information. When component depletion of the feeder for which component depletion is predicted occurs, the mounting control section executes a spare component pickup process in which the mounting section is caused to pick up the component from the exchange feeder loaded to the spare loading section at a position not designated in the mounting condition information. Then, when component depletion of the feeder for which component depletion is predicted occurs, the moving control section collects the component depleted feeder in the accommodation section while moving and loading the exchange feeder, on which the spare component pickup process corresponding to the collected component depleted feeder is being performed, to the loading section from which the component depleted feeder was collected.

Abstract: A mounting system includes multiple mounting-related devices to execute a mounting-related process for mounting a component on a mounting target that are arranged side by side along the conveyance direction of the mounting target. The mounting-related device used in the mounting system includes an execution unit configured to execute the mounting-related process; a first interface configured to enable a mobile work device to access the execution unit, the mobile work device moving a member related to the mounting-related process; and an operation panel disposed in a second interface, being located on an opposite side of the first interface, to which an operator is allowed to access without access of the mobile work device.

Abstract: In many cases after degaussing the field distribution in a magnetic material there may be regions within the magnetic material that have ordered domains that contribute a remnant field. There is the need to reduce or eliminate non-uniform fields within a volume of interest left after degaussing a magnetic shield. Degaussing coils surrounding a metal shield can be used to favorably order magnetic domains within the material to counteract the remnant fields left behind following imperfect degaussing. The remnant field value can be measured and a small current may be applied through the degaussing coils. After removing the current, the field can be measured again and a higher current may be applied again through the coils. Repeated applications of currents and field measurement will progressively order domains in the direction of the applied field, resulting in a reduction of the net field and lower field gradient across the volume of interest.

Abstract: An assembly device for a three-dimensional triangular iron core is provided according to the present application, including iron core driving devices each for driving an iron core to be assembled with adjacent iron cores. There are three iron core driving devices, and each of the iron core driving devices includes an iron core fixing device and a driving assembly for driving the iron core fixing device to move. When the three-dimensional triangular iron core is required to be assembled, firstly, the three iron cores are mounted on the corresponding iron core fixing devices respectively, then the iron core fixing devices are driven by driving assemblies to move toward one another, thereby driving adjacent iron cores to move toward each other until the adjacent iron cores are assembled, and then each two adjacent iron cores are wound and assembled.

Abstract: A wiring assembly board for assembling a wire harness. The wire harness comprises a plurality of wires connected between a plurality of wiring connectors, each connector comprising an array of wire terminals. The wiring assembly board comprises an assembly surface and a plurality of test connectors provided on the assembly surface. Each test connector is for connection to a respective wiring connector and comprises an array of test terminals for establishing an electrical connection with the respective array of wire terminals once the wiring and test connectors have been connected. A microcomputer is associated with each test connector and comprises an interface for individually transmitting or receiving test signals though each test terminal of the respective test connector.

Abstract: A component mounting system that includes a unit exchange device configured to automatically exchange the component supply unit and a processing section configured to determine whether the attachment and detachment of the component supply unit is performed according to the attachment and detachment instruction based on the attachment and detachment record acquired by an acquisition section and the instruction list, and when it is determined that the attachment and detachment is performed according to the attachment and detachment instruction, to perform an update process to update the instruction list by deleting the corresponding attachment and detachment instruction.