Patents Examined by Paul D Kim
  • Patent number: 11903130
    Abstract: An inductor includes a planar laminated magnetic core and a conductive winding. The planar magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The non-magnetic layer includes an insulating layer that is disposed between first and second interface layers. The conductive winding turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The inductor can be integrated into a multilevel wiring network in a semiconductor integrated circuit to form a microelectronic device, such as a transformer, a power converter, or a microprocessor.
    Type: Grant
    Filed: June 8, 2021
    Date of Patent: February 13, 2024
    Assignee: Ferric Inc.
    Inventors: Noah Sturcken, Ryan Davies, Michael Lekas
  • Patent number: 11890082
    Abstract: A system and method are provided for determining a pressure associated with a lumen of a body. A wireless sensor is positioned in the lumen of the body. The sensor comprises an LC resonant circuit having a resonant frequency configured to vary in response to changes in pressure in the lumen. One or more sensor calibration parameters are stored at an external base unit. The external based unit generates and transmits an energizing signal. A ring down response is received from the wireless sensor. The system and method determine the resonant frequency of the LC resonant circuit from the ring down response and calculate the pressure in the lumen from the resonant frequency of the LC resonant circuit utilizing the one or more sensor calibration parameters associated with the LC resonant circuit.
    Type: Grant
    Filed: October 21, 2021
    Date of Patent: February 6, 2024
    Assignee: TC1 LLC
    Inventors: Florent Cros, David O'Brien, Michael Fonseca, Matthew Abercrombie, Jin Woo Park, Angad Singh
  • Patent number: 11881350
    Abstract: A laminated core comprising a plurality of lamination sheets made of a soft magnetic alloy is provided. The lamination sheets have a main surface and a thickness d. The main surfaces of the lamination sheets are stacked one on top of another in a direction of stacking. Adjacent lamination sheets are joined to one another by a plurality of substance-to-substance joints, the joints being filler-free and entirely surrounded by the main surfaces of the adjacent lamination sheets.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: January 23, 2024
    Assignee: VACUUMSCHMELZE GMBH & CO. KG
    Inventors: Frederic Bäcker, Jens Diehl, Dominik Fackelmann
  • Patent number: 11881343
    Abstract: A method for constructing a solenoid inductor includes positioning an inner winding substantially around a magnetic core, positioning an outer winding substantially around the inner winding, and using a layered process to perform said positioning the inner and outer windings. The layered process includes processing a first conducting layer as a bottom layer of the outer winding, above processing a first dielectric layer, above processing a second conducting layer as a bottom layer of the inner winding, above processing a second dielectric layer, above processing a magnetic core layer, above processing a third dielectric layer, above processing a third conducting layer as a top layer of the inner winding, above processing a fourth dielectric layer, above processing a fourth conducting layer as a top layer of the outer winding, above processing a fifth dielectric layer, and the inner and outer windings are electrically connected.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: January 23, 2024
    Assignee: Cirrus Logic, Inc.
    Inventors: Aleksey S. Khenkin, David Patten, Jun Yan
  • Patent number: 11882661
    Abstract: A method of fabricating an electromagnet includes obtaining a first flexible PCB that includes one or more first conductive coiled traces and obtaining a second flexible PCB that includes one or more second conductive coiled traces. The first flexible PCB is bent into a shape having at least one curve or corner. With the first flexible PCB having been bent into the shape, the second flexible PCB is then bent into the shape: the second flexible PCB is positioned adjacent to the first flexible PCB to conform with the first flexible PCB. The second flexible PCB may substantially surround the first flexible PCB. An electrostatic deflector may be disposed concentrically with the first and second flexible PCBs.
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: January 23, 2024
    Assignee: KLA Corporation
    Inventor: Oscar G. Florendo
  • Patent number: 11877400
    Abstract: A panel alignment device for a display device includes a stage supporting a panel and including a transmitting portion that includes a first region having a first thickness and a second region having a second thickness greater than the first thickness, a head disposed over the stage and supporting a driving chip, a vision camera which is disposed under the stage, captures a first alignment mark of the panel through the first region, and captures a second alignment mark of the driving chip through the second region, and a controller which controls at least one of a movement and a rotation of each of the stage and the head based on first image information related to a position of the first alignment mark and second image information related to a position of the second alignment mark.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: January 16, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jungseon Park, Wunbong Tak, Jaeseong Lee
  • Patent number: 11869708
    Abstract: A method of manufacturing an inductor component includes preparing an insulating paste that is photosensitive and that includes a filler material composed of quartz, a glass material and a resin material, and a conductive paste, forming a first insulating layer by applying the insulating paste, and exposing the first insulating layer in a state where a first portion of the first insulating layer is shielded by a mask. The method further includes removing the first portion of the first insulating layer to form a groove at a position corresponding to the first portion, applying the conductive paste in the groove to form a coil conductor layer in the groove, and applying the insulating paste on the first insulating layer and the coil conductor layer to form a second insulating layer.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: January 9, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshiyuki Oota, Tomohiro Kido, Tomonori Sakata, Masahiro Kubota, Kenta Kondo
  • Patent number: 11871520
    Abstract: A method for producing a printed circuit board on a substrate uses control data derived from a circuit schematic, CAD file, Gerber file or files or equivalents, to operates a function head configured to effect printing conductive and non-conductive materials on the substrate and produces control data to effect the circuit printing. The method optionally uses a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: January 9, 2024
    Assignee: BOTFACTORY INC.
    Inventors: Michael Knox, Andrew Ippoliti, Georgios Kyriakou, Carlos Ospina, Nicolas Vansnick
  • Patent number: 11871521
    Abstract: A component mounting machine includes a mark imaging camera that images a board mark of a circuit board and has a function of identifying an identification target, such as a character attached to an upper surface of a component supplied by a component supply device. An illumination light source illuminates the identification target on the upper surface of the component imaged by the mark imaging camera and is attached to a lower portion of an electric component holding frame provided to protrude to the side of the mounting head. As the identification target on the upper surface of the component, which is illuminated by the illumination light source from obliquely above, is imaged by the mark imaging camera from above and the image is processed, the identification target on the upper surface of the component is identified.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: January 9, 2024
    Assignee: FUJI CORPORATION
    Inventors: Yusuke Yamakage, Hidetoshi Kawai
  • Patent number: 11870038
    Abstract: A method of manufacturing a lithium-ion secondary battery of the present invention includes at least four steps as follows: an initial charging step of charging the lithium-ion secondary battery, which has not been subjected to initial charging, under a temperature environment ranging of equal to or higher than ?20° C. and equal to or lower than 15° C.; an aging step of leaving the lithium-ion secondary battery under a temperature environment ranging of equal to or higher than 30° C. and equal to or lower than 80° C. after the initial charging step; a short circuit detecting step of detecting the presence or absence of a short circuit of the lithium-ion secondary battery by measuring a voltage drop quantity of the lithium-ion secondary battery and comparing the voltage drop quantity with a reference value; and a sorting step of sorting out a lithium-ion secondary battery in which no short circuit is detected.
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: January 9, 2024
    Assignee: AESC Japan Ltd.
    Inventors: Tomoyuki Ichikawa, Shinsuke Enomoto, Naoyuki Iwata
  • Patent number: 11869696
    Abstract: An electronic component includes a wire winding wound around a central axis. The wire winding having first and second ends, and first and second terminals are connected to or formed by the first and second ends. The terminals provide electrical contacts for connecting the component into a circuit. The component has a wet press molded body made of a mixture of magnetic and non-magnetic material that is heated and pressed about the wire winding. The wet press molded body leaves at least a portion of the terminals exposed for mounting the component to the circuit.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: January 9, 2024
    Assignee: Coilcraft, Incorporated
    Inventors: Andrzej Klesyk, Scott D. Hess, Lawrence B. Lestarge
  • Patent number: 11864324
    Abstract: The mounting system includes a mounting device, having a mounting loading section from which components can be picked up and a buffer loading section from which components cannot be picked up, and a moving work device for collecting or loading feeders. Further, this mounting system includes a moving work management device configured to create, in the production of a mounting target, pre-arrangement information, based on a production plan including multiple pieces of mounting condition information, which causes the moving work device to load the standby feeder to be used from the next time onward to the buffer loading section in an order corresponding to the arrangement positions of the feeders from the next time onward.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: January 2, 2024
    Assignee: FUJI CORPORATION
    Inventors: Yoshihiro Yasui, Yukihiro Yamashita
  • Patent number: 11850504
    Abstract: Enhancements to existing gaming controllers facilitating expedient response time and fine-tuned accuracy are described. The enhancements comprise the internal modification of the stock resistance force supplied by the analog stick centering spring mechanism. Through modification, the force of resistance supplied may be increased to over 200 grams of force, or down to 40 grams of force, while maintaining full function of the analog stick mechanism. A second primary enhancement replaces the stock triggers, conventionally equipped with progressive resistance sensors, to a momentary ‘snap-action’ two-way switch, minimizing trigger pull distance, and removing the analog nature of the trigger to achieve optimal performance.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: December 26, 2023
    Inventor: David Christopher Bailey
  • Patent number: 11856705
    Abstract: A device for handling components that is designed and equipped to handle components with multiple lateral surfaces and/or edges of the lateral surfaces. The device has at least one receiving tool, which is arranged on a turning device, for a respective component of the components, where the receiving tool is designed and equipped to receive the respective component on one of the component cover surfaces. The turning device is designed and equipped to rotate the receiving tool on a turning plane about a turning axis, and in the process optionally convey a component located on the receiving tool from a receiving position to one or more orientation positions, optionally one or more inspecting positions, a setting-down position, and optionally an ejecting position. The device also has a holding and supplying device, which faces the receiving position, for a component supply, and a discharge device.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: December 26, 2023
    Assignee: MUEHLBAUER GMBH & CO. KG
    Inventors: Stefan Feigl, Siarhei Lakhadanau
  • Patent number: 11846806
    Abstract: A stress compensating pick-up tool for aligning a companion chip with a host chip includes a tool tip and an actuator. The tool tip holds the companion chip, and includes a first tip portion and a second tip portion. The actuator applies a force to the tool tip, wherein the force causes the first tip portion and the second tip portion to rotate in opposite directions with respect to one another to optically align a portion of the companion chip with a corresponding portion of the host chip.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: December 19, 2023
    Assignee: Ciena Corporation
    Inventors: Raphael Beaupré-Laflamme, Simon Savard
  • Patent number: 11841542
    Abstract: The present invention relates to a pre-terminated (pre-terminated) optical fibre cable assembly (10,90), which is configured to be installed through a duct (20). The pre-terminated optical fibre construction (10,90) includes at least one optical fibre (46). A protective sleeve (26) is added to the optical fibre (46) before adding a terminal connector (24) to the leading end of at least one optical fibre (46). The protective sleeve (26) extends from behind the terminal connector (24) along part of the length of the optical fibre (46). When the cable is installed through a duct, the protective sleeve protects the portion of the fibre that protrudes from the end of the duct, for example in a communications cabinet (16). A residual length (28) of the protective sleeve remains within the duct. Terminal connectors and protective sleeves can be applied at both ends of the cable assembly, or only one end.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: December 12, 2023
    Assignee: EMTELLE UK LIMITED
    Inventor: Eben Colin Kirkpatrick
  • Patent number: 11837400
    Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: December 5, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takayuki Sekiguchi, Tsuyoshi Ogino, Takao Shibuya
  • Patent number: 11835940
    Abstract: An apparatus for separating components of a hard disk drive includes a pair of opposing drive rollers and a separating blade mounted on a blade mount. The opposing drive rollers are configured to contact a hard disk drive housing and move the hard disk drive through a separating station. The separating station defines a base and includes the separating blade mounted on a blade mount. The separating blade and the blade mount are resiliently suspended relative to the base. The separating blade is configured to deflect to a separation point to remove a first hard drive component from a second hard drive component.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: December 5, 2023
    Inventor: Jack Harper
  • Patent number: 11819127
    Abstract: A panel television support and mounting kit allows the consumer to employ any of the three modes of support, namely stand mount, elevated console mount and wall mount. The elevated console mount incorporates a vertical spine to elevate the panel television above the console and an offset arm to support the television over an upper shelf of the console. A mounting structure is provided that can be attached to the spine or to a wall. Pivoting and tilting is accommodated by the mounting structure.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: November 21, 2023
    Assignee: Whalen LLC
    Inventors: Kenneth Whalen, Paul Jones
  • Patent number: 11817244
    Abstract: An electronic component includes a body made of an insulator, a coating film covering the body, a conductor located in the body, and outer electrodes each of which is connected to the conductor. The insulator contains a magnetic metal powder. The coating film is composed of resin and cations of a metal which is a cationic element contained in the insulator and which has a standard electrode potential E0 of less than about 0 V.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: November 14, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Mitsunori Inoue, Hironobu Kubota