Patents Examined by Paul D Kim
  • Patent number: 11678133
    Abstract: The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate. A silicon oxide layer formed on one side of the first silicon substrate. A second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates. A diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates such that the first plate and the diaphragm are configured to form a capacitive microphone.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: June 13, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jung-Huei Peng, Chia-Hua Chu, Chun-Wen Cheng, Chin-Yi Cho, Li-Min Hung, Yao-Te Huang
  • Patent number: 11678433
    Abstract: Systems, methods, and devices for electrically coupling an integrated circuit to a set of coaxial lines via a printed circuit board assembly are described. A device sample holder includes a printed circuit board that is operable to edge-couple to an integrated circuit. A surface of the printed circuit board that carries a set of coaxial connectors is orthogonal to another surface of the printed circuit board that exposes a set of conductive traces. The set of conductive traces are operable to electrically couple to a set of conductive paths of an integrated circuit to provide a communicative path between the integrated circuit and components of an input/output system in a refrigerated environment.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: June 13, 2023
    Assignee: D-WAVE SYSTEMS INC.
    Inventor: Richard D. Neufeld
  • Patent number: 11672179
    Abstract: An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: June 6, 2023
    Assignee: BFLY OPERATIONS, INC.
    Inventors: Jonathan M. Rothberg, Susan A. Alie, Jaime Scott Zahorian, Paul Francis Cristman, Keith G. Fife
  • Patent number: 11665875
    Abstract: A substrate work machine for repeatedly performing substrate work, the substrate work machine including a data storing section configured to store component data used in the substrate work, the component data including shape data related to a shape of an electronic component to be mounted on a substrate, a reference value and a tolerance; a data determining section configured to determine whether a difference between measurement data acquired by measuring the electronic component during the substrate work and the reference value of the component data is within a range of the tolerance; a quality information acquiring section configured to acquire work quality information related to a performance condition of a second substrate work machine; and a data correcting section configured to correct at least one of the reference value and the tolerance in accordance with the work quality information.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: May 30, 2023
    Assignee: FUJI CORPORATION
    Inventor: Yoshiharu Tanizawa
  • Patent number: 11657961
    Abstract: A method for manufacturing an electric winding of an electromagnetic induction apparatus includes providing a conductor structure and forming an electric winding by means of the conductor structure. The conductor structure includes a conductor element extending longitudinally along a main extension direction and one or more spacer bands arranged on corresponding lateral surfaces of the conductor element. Each spacer band includes a supporting structure made of electrically insulating material and spacer elements made of electrically insulating material arranged on the supporting structure. The spacer elements are spaced one from another along the supporting structure. The electric winding extends axially along a winding direction and has a plurality of turns arranged around the winding direction. Each turn of the electric winding is formed by a corresponding longitudinal portion of the conductor element.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: May 23, 2023
    Assignee: Hitachi Energy Switzerland AG
    Inventors: Gianluca Bustreo, Paolo Pavanello, Massimo Carmignoto, Roberto Zannol
  • Patent number: 11640862
    Abstract: A method utilizes a funnel system and robotic end effector grippers to feed an unjacketed portion of a shielded cable through a sleeve. The funnel is designed with one or more thin extensions (hereinafter “prongs”) on which a sleeve is placed prior to a cable entering the funnel. Preferably two or more prongs are employed, although a single prong may be used if properly configured to both guide a cable and fit between the sleeve and cable. The prongs close off the uneven surface internal to a sleeve and provide a smooth surface for the cable to slide along and through the sleeve, preventing any damage to the exposed shielding. The sleeve is picked up and held on the prongs using a robotic end effector. If the sleeve is a solder sleeve, the robotic end effector has grippers designed to make contact with the portions of the solder sleeve that are between the insulating rings and the central solder ring.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: May 2, 2023
    Assignee: The Boeing Company
    Inventors: Grace L. Duncan, Lars E. Blacken, Keith M. Cutler, Bradley J. Mitchell
  • Patent number: 11636975
    Abstract: The invention discloses a method and its device for preparing a magnetic core with amorphous ribbon. The magnetic core is prepared with amorphous ribbon, the size of the amorphous ribbon is controlled according to the target requirements, and the magnetic core with required size and shape is prepared according to the target requirements; the single-roller rapid quenching technology with online automatic segmentation and automatic storage capability is used for preparation, which can control the length, width and thickness of the amorphous ribbon according to the target requirements; the amorphous ribbon segmented by single-roller rapid quenching technology is used to spray and cool down one by one, and then air-dry, transfer, spray adhesive and online store it one by one; the stored amorphous ribbon is reshaped, compressed and heat-treated successively, and then demoulded to prepare a magnetic core.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: April 25, 2023
    Assignee: ZHEJIANG NORMAL UNIVERSITY
    Inventors: Yunzhang Fang, Wenzhong Li, Zheng Fang, Yun Ma, Rimin Pan, Huiqun Ye, Jinju Zheng, Linfeng Jin, Xiaozhen Fan
  • Patent number: 11631534
    Abstract: A superconducting device includes a first superconducting wire configured to carry a first current in a superconducting state, and to generate thermal energy upon occurrence of a hot spot during conduction. The device includes a second superconducting wire, thermally coupled to and electrically isolated from the first superconducting wire. The second superconducting wire is configured to conduct a second current in a superconducting state below, but sufficiently near its critical surface to be quenched to a non-superconducting state upon conduction of the thermal energy from the first superconducting wire.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: April 18, 2023
    Assignee: Advanced Conductor Technologies LLC
    Inventors: Daniël Cornelis Van Der Laan, Jeremy David Weiss
  • Patent number: 11626245
    Abstract: The invention discloses a manufacturing method of magnet unit for wireless charging, including the steps: installing multiple magnetic elements onto a first carrier made of non-magnetic material; moving the first carrier into a magnetizing machine to magnetize all the magnetic elements so that each magnetic element becomes a magnet piece, an N-pole and an S-pole are formed on different portions of the same surface of the magnet piece; installing the magnet pieces onto a second carrier made of magnetically permeable material to form a magnet unit, the magnet pieces are defined in an annular array around the central axis of the second carrier installed on a wireless charging base, the magnet unit cooperates with a charging coil of the wireless charging base to charge a wireless headset. The invention simplifies the manufacturing process and ensures the consistency of magnet pieces in the same magnet unit, also improves the manufacturing efficiency.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: April 11, 2023
    Assignee: DONGGUAN JINCONN NEW MATERIAL CO., LTD.
    Inventors: Liang Chen, Xiangyang Liu, Song Chen, Qianghua Lai
  • Patent number: 11623276
    Abstract: A method for manufacturing a magnet includes (1) a step of preparing three or more unmagnetized magnet materials of which magnetization easy axes are oriented in predetermined directions, and adhering the unmagnetized magnet materials with each other to make an assembly, and (2) a step of applying a curved pulse magnetic field to the assembly to magnetize the assembly, wherein in the step (2), the unmagnetized magnet materials are magnetized into magnet blocks, and an angle ? (where 0???180 degrees holds) formed by magnetization directions of at least a pair of magnet blocks adjacent to each other is in a range of 30 degrees to 120 degrees.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: April 11, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kenichi Fujikawa, Shoichiro Saito, Katsuya Kume, Takashi Yamamoto
  • Patent number: 11621115
    Abstract: A method is described for the assembly of a magnetic core for a transformer, with the following steps: Cutting sheet metal blanks from transformer sheet, stacking the sheet metal blanks to form magnetic core segments, placing a permanent magnet at one of the magnetic core segments so that the latter is magnetized by the permanent magnet, formation of the magnetic core by placing the remaining magnetic core segments against the permanent magnet, or against a magnetic core segment already magnetized by the permanent magnet. A magnetic core is also disclosed.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: April 4, 2023
    Assignee: BorgWarner Ludwigsburg GmbH
    Inventors: Sven Schumm, Manfred Adolf, Manuel Bauer, Alexander Stark, Timo Stifel, Dirk Wüstenhagen
  • Patent number: 11621533
    Abstract: A torque transmitter includes a filter header configured to support a filter component. The torque transmitter also includes a torque-transmitting housing configured to at least partially enclose the filter header. The torque-transmitting housing is configured to receive a torque force from an installation tool, and to transmit the torque force to the filter header.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: April 4, 2023
    Assignee: PPC BROADBAND, INC.
    Inventor: Noah Montena
  • Patent number: 11615917
    Abstract: A method for manufacturing a ferrite sheet is provided. A method for manufacturing a ferrite sheet comprises the steps of: preparing a ferrite block body having a shape of a cylindrical or polygonal column; and cutting the ferrite block body to be separated into plate-shaped sheets having a predetermined thickness.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: March 28, 2023
    Assignee: AMOTECH CO., LTD.
    Inventor: Woong Yong Lee
  • Patent number: 11615918
    Abstract: A coil module includes a coil conductor including a plurality of coil elements and a plurality of wire electrodes disposed on a circuit board, each of the plurality of coil elements including a pair of leg portions and a bridge portion connecting one end portions of the pair of leg portions together, the plurality of coil elements being disposed to cross a winding axis. A method for manufacturing the coil module includes an assembly forming step of integrating the plurality of coil elements with resin to form a coil element assembly, and a conductor forming step of mounting the coil element assembly on the circuit board to complete the coil conductor wound about the winding axis. In the conductor forming step, the resin is introduced into a die set in which the plurality of coil elements are arranged to form a block, to thus form the coil element assembly.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: March 28, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shinichiro Banba, Akihiro Muranaka
  • Patent number: 11615905
    Abstract: A shielded inductor and a method of making a shielded inductor are provided. The shielded inductor includes a core body surrounding a conductive coil, leads in electrical communication with the coil, and a shield covering at least parts of the outer surface of the core body. An insulating material may be provided between parts of the core body and parts of the shield. A method of making a shielded inductor is also provided.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: March 28, 2023
    Assignee: Vishay Dale Electronics, LLC
    Inventors: Darek Blow, Timothy M. Shafer, Chris Gubbels, Benjamin M. Hanson
  • Patent number: 11608564
    Abstract: Devices and methods including a though-hole inductor for an electronic package are shown herein. Examples of the through-hole inductor include a substrate including at least one substrate layer. Each substrate layer including a dielectric layer having a first surface and a second surface. An aperture included in the dielectric layer is located from the first surface to the second surface. The aperture includes an aperture wall from the first surface to the second surface. A conductive layer is deposited on the first surface, second surface, and the aperture wall. At least one coil is cut from the conductive layer and located on the aperture wall.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: March 21, 2023
    Assignee: Intel Corporation
    Inventors: William J. Lambert, Mihir K Roy, Mathew J Manusharow, Yikang Deng
  • Patent number: 11606890
    Abstract: A method and a system for providing operator information in an Surface Mount Technology (SMT) system comprising an SMT information database, a SMT pick and place machine and an identity tag scanner, the method comprising: receiving a bin in said SMT pick and place machine, wherein said bin is adapted to comprise vertically oriented bin load units, wherein said bin load unit has an pallet identity tag attached to the bin load units upwards facing surface; starting SMT production on said SMT pick and place machine; scanning individual identity tags attached to bin load units comprising component tape reels to obtain bin load units IDs.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: March 14, 2023
    Assignee: Mycronic AB
    Inventors: Nils Jacobsson, Roger Jonasson
  • Patent number: 11605927
    Abstract: A crimping hand tool configured to crimp a cable and a connector together is provided. The crimping hand tool includes a first body, a second body, a limiting member, a crimping member, and an adjustment member. The second body is pivoted to the first body. The limiting member is disposed in the second body. The crimping member is movably disposed in the second body and linked with the first body, the crimping member being partially interfered with the limiting member and having only one degree of freedom of movement along an axis. The adjustment member is disposed in the second body, rotating about the axis, and screwed with the crimping member. The adjustment member being forced by an user to adjust a position of the crimping member in the second body along the axis.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: March 14, 2023
    Assignee: JETOOL CORP.
    Inventor: Kai-Yen Lin
  • Patent number: 11600430
    Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: March 7, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Yoon Jang, Seok Hwan Ahn, Jeong Min Cho, Tae Hoon Kim, Jin Gul Hyun, Se Woong Paeng
  • Patent number: 11594249
    Abstract: A system and methods for manufacturing devices such as flexures using process coupons are described are described. The method including performing a test on at least one feature of a coupon, the coupon is included on an assembly sheet used in manufacturing flexures. The at least one feature is produced by a manufacturing processing step that is used to produce a portion of a flexure. And, the physical characteristics of the feature include at least one physical characteristic that is different than physical characteristics of the portion. The method also including determining the manufacturing processing step will produce an abnormal portion of a flexure based on the performed test. Further, the method includes adjusting the manufacturing processing step and manufacturing a portion of a flexure using the adjusted manufacturing processing step.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: February 28, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Kurt C. Swanson, Brian D. Boudreau