Abstract: An apparatus (100) for installing at least one electrical contact (152) into a connector housing (150) comprises a base (110) configured to fixedly support the connector housing (150), an alignment guide (122), extending from the base (110) and having a central axis (164), and a carrier (124), translatably and pivotally coupled with the alignment guide (122). With the connector housing (150) fixedly supported by the base (110), the alignment guide (122) is configured to be parallel to an insertion axis (160) of a socket (154) of the connector housing (150), and the carrier (124) is movable parallel to the insertion axis (160). The apparatus (100) additionally comprises a tool holder (132), coupled to the carrier (124). The tool holder (132) has a working axis (162), only one degree of freedom relative to the carrier (124), and only three degrees of freedom relative to the base (110).

Abstract: As wire is wound around and onto the surface of a former to form a coil, perturbations such as waves are introduced into turns of the coil, each perturbation being formed in a length of the wire less than the full length of a respective turn and projecting along the former surface, the perturbation having an initial shape and size. The coil is taken from the former and fixed in form. A surrounding jacket is radially collapsed onto the wire coil to uniformly press the coil against an internal compressible body in the course of which the overall diameter of the coil is reduced. Resulting stresses in the wire generated during the collapse are relieved by alteration of the perturbations from their initial shape and size to a subsequent shape and size.

Abstract: A cup feed assembly for a can bodymaker with a vertically oriented, reciprocating, elongated ram assembly is provided. The cup feed assembly includes a chute assembly, a rotatable feeder disk assembly, and a cup locator. The chute assembly includes a transfer chute. The transfer chute includes an outer second side member, a first end and a second end. The transfer chute first end is in communication with the feeder chute outlet end. The outer second side member at the transfer chute second end includes a first biasing device. The cup locator defines a holding space, the holding space in communication with the transfer chute second end. The feeder disk assembly is structured to move a cup disposed at feeder chute outlet end through the transfer chute into the cup locator. The first biasing device is structured to maintain a cup in the holding space.

Abstract: The measurement position determination device of the present disclosure is a measurement position determination device for determining a measurement position on a board, the measurement position being for measuring height of the board on which on which a component is mounted, and includes a measurement position determination section for acquiring one or more scheduled mounting positions of the component on the board at the time of measuring the board height and determining at least one of the acquired scheduled mounting positions as the measurement position of the board height.

Abstract: Multiple designs for a multi-layer circuit may be simulated to determine impedance profiles of each design, allowing a circuit designer to select a design based on the impedance profiles. One feature that can be modified is the structure surrounding the barrels of a differential VIA on layers that are not connected to the differential VIA. Specifically, one antipad can be used that surrounds both barrels or two antipads can be used, with one antipad for each barrel. Additionally, the size of the antipad or antipads can be modified. These modifications affect the impedance of the differential VIA. Additionally, a conductive region may be placed that connects to the VIA barrel even though the circuit on the layer does not connect to the VIA. This unused pad, surrounded by a non-conductive region, also affects the impedance of the differential VIA.

Abstract: A device casing includes a wall having a metallic substrate and electrical connection of a feedthrough that includes a metal through-element made at least in a zone of isolation of the area of the feedthrough from the substrate material, in the form of an islet of closed contour, physically and electrically isolated from the substrate. An interface for coupling the through-element to the substrate provides the mechanical securing of the through-element to the substrate and the electrical isolation thereof and includes a peripheral lateral layer made of an electrically isolating material that surrounds the through-element over the whole periphery thereof and extends transversally through the thickness of the thinned area of the substrate. The substrate, the through-element and the lateral layer form a monolithically integrated unit, and the lateral layer provides essentially and directly both the mechanical securing and the electrical isolation between through-element and substrate.

Abstract: A method of manufacturing a rotor includes forming plates each including a scrap portion that has a center hole and core plate portions that are disposed continuously with the scrap portion on an inner side of the center hole and that each defines a portion of a corresponding one of the outer cores forming a multilayer body including the outer cores by stacking the plates, setting at least a portion of the multilayer body and a portion of the inner core in a mold with a gap therebetween in the radial direction, forming a molded body by pouring a molten filling material into a gap in the mold and forming the filling section, at least a portion of the filling section being positioned between the outer cores, and separating the scrap portion and the core plate portions from each other.

Abstract: A method is presented for forming a nanowire electrode. The method includes forming a plurality of nanowires over a first substrate, depositing a conducting layer over the plurality of nanowires, forming solder bumps and electrical interconnections over a second flexible substrate, and integrating nanowire electrode arrays to the second flexible substrate. The plurality of nanowires are silicon (Si) nanowires, the Si nanowires used as probes to penetrate skin of a subject to achieve electrical biopotential signals. The plurality of nanowires are formed over the first substrate by metal-assisted chemical etching.

Abstract: A multi-axis MEMS gyroscope includes a micromechanical detection structure having a substrate, a driving-mass arrangement, a driven-mass arrangement with a central window, and a sensing-mass arrangement which undergoes sensing movements in the presence of angular velocities about a first horizontal axis and a second horizontal axis. A sensing-electrode arrangement is fixed with respect to the substrate and is set underneath the sensing-mass arrangement. An anchorage assembly is set within the central window for constraining the driven-mass arrangement to the substrate at anchorage elements. The anchorage assembly includes a rigid structure suspended above the substrate that is elastically coupled to the driven mass by elastic connection elements at a central portion, and is coupled to the anchorage elements by elastic decoupling elements at end portions thereof.

Abstract: A substrate working device includes a working unit that performs work on a substrate on which a component is mounted, an imager capable of imaging a correction mark for position correction, and a mark projector that projects the correction mark. The correction mark includes a first correction mark and a second correction mark. The mark projector projects the first correction mark to a first height and projects the second correction mark to a second height.

Abstract: A method is provided that integrates a unique set of structural features for concealing self-powered sensor and communication devices in aesthetically neutral, or camouflaged, packages that include energy harvesting systems that provide autonomous electrical power to sensors, data processing and wireless communication components in the portable, self-contained packages. Color-matched, image-matched and/or texture-matched optical layers are formed over energy harvesting components, including photovoltaic energy collecting components. Optical layers are tuned to scatter selectable wavelengths of electromagnetic energy back in an incident direction while allowing remaining wavelengths of electromagnetic energy to pass through the layers to the energy collecting components below.

Abstract: A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.

Abstract: A wire harness producing method configured to produce a wire harness by arranging a plurality of display devices end to end, each including a display portion and a bezel arranged around a periphery of the display portion, displaying a wire laying-out drawing on the display devices, and laying out an electric wire along the wire laying-out drawing. The method includes compartmentalizing a two-dimensional image of the wire harness into display regions to be displayed on the display portions of the display devices respectively and non-display regions corresponding to the bezels of the display devices respectively, with the display regions and the non-display regions conforming to sizes of the display portions and the bezels respectively, trimming the two-dimensional image to create wire laying-out image data composed of only the display regions, and displaying the wire laying-out drawing on the display devices, based on the wire laying-out image data.

Abstract: A method for transporting and installing an electronic device having at least one first electrical contact element includes fixing the electronic device in a recess or interior of a reusable transport and assembly module such that access to the at least one first contact element is blocked by a protective element, transporting the transport and assembly module and the electronic device into a connection region of an electrical apparatus, removing the protective element so that the at least one first contact element is accessible, actuating an actuation apparatus provided on the transport and assembly module to move the electronic device in a direction out of the recess or interior into a contact position in which the at least one first contact element is brought into electrical contact with at least one second contact element provided on the electrical apparatus, and removing the transport and assembly module.

Abstract: An electronic component is disclosed. In an embodiment, an electronic component includes at least one NTC element and at least two electrically conductive contact elements, wherein the NTC element is electrically conductively connected to a respective contact element via a connection material, and wherein a coefficient of thermal expansion of the contact elements is adapted to a coefficient thermal expansion of the NTC element.

Abstract: An apparatus and method for determining whether a conductive ring is attached to an electrically conductive shaft. The body of the apparatus includes an electrical contact and at least one magnet in a magnet recess. The at least one magnet may include a first and second conductive region, where the first conductive region is a fixed, first radial distance from a center point of the inner cavity and the second conductive region is a second radial distance from the center point of the inner cavity. A shaft recess of the conductive shaft aligns with the magnet recess when the conductive shaft is inserted into the inner cavity and an electric circuit detects whether a metal ring is secured around the conductive shaft in response to simultaneous contact between: the metal ring and the at least one magnet and the conductive shaft and the electrical contact.

Abstract: A toolpack for a can bodymaker with a vertically oriented, reciprocating, elongated ram assembly is provided. The toolpack includes a tool pack housing assembly, a number of die spacers, a number of dies, and a compression device. The tool pack housing assembly defines a passage and includes an inner surface, an upper sidewall, a lower sidewall, a first lateral sidewall, a second lateral sidewall, a rear sidewall, and a door. The tool pack housing assembly passage extends generally vertically. Each die spacer structured to support a die and defining a central passage. Each die including a body defining a central passage. The die spacers and dies are disposed in said tool pack housing assembly. The compression device is disposed at said tool pack housing assembly lower sidewall and is structured to axially bias said number of die spacers.

Abstract: An example method for connectorizing a superconducting cable is described herein. The method can include depositing an oxide layer on a surface of a superconducting cable, electroplating a metal layer on the surface of the superconducting cable, and soldering a connector to the metal layer coated on the surface of the superconducting cable. The oxide layer allows the metal layer to adhere to the surface of the superconducting cable.

Abstract: The technology disclosed relates to accommodating embedded substrates during direct writing onto a printed circuit board and to other patterning problems that benefit from an extended depth of focus. In particular, it relates to multi-focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes. In one implementation, a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes.

Abstract: A component mounting machine used for effectively avoiding interference between a head main body and a station during exchange of a component holding tool attached to the head main body, the component mounting machine including a head main body to detachably hold a component holding member to hold a component; a head moving mechanism to move the head main body; a station attached to the component mounting machine main body, and to hold an exchange-use component holding member; a station moving mechanism to move the station; and a control device configured to use the station moving mechanism to change a height position in the raising and lowering direction of the station during exchange of the component holding member to be attached to the head main body in accordance with a height position in the raising and lowering direction of the head main body.