Patents Examined by Peter DungBa Vo
  • Patent number: 11462874
    Abstract: A pair of crimping pliers for crimping, in particular for crimp joining, workpieces, has two oppositely arranged pressing jaws and two pliers jaws, wherein one pliers jaw is stationary and the associated pressing jaw is fastened to this stationary pliers jaw by means of a spring-loadable holder part. The holder part is fixedly connected at its end farthest from the pressing jaw to the pliers jaw. Between the stationary connection and the end of the holder part closest to the first pressing jaw, a stop connection is formed between the stationary pliers jaw and the holder part and comes into effect when a predetermined pressing force is exceeded.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: October 4, 2022
    Assignee: Rennsteig Werkzeuge GmbH
    Inventors: Benjamin Weisheit, Georg Holland-Moritz, Gerhard Koenig, Marko Endter, Ralf Legler
  • Patent number: 11462977
    Abstract: A method includes: forming a sand core including a main portion and core-head members connecting the main portion; applying a casting process to produce a frame casting having a first end, a first-end inner wall, a second end, a second-end inner wall, a closed water channel between the first-end inner wall and the second-end inner wall, a water inlet, a water outlet and sand-expelling holes at the first end; shaking the frame casting to have part of the sand core to leave the closed water channel via the water inlet, the water outlet and the sand-expelling holes; pressurizing a fluid into the closed water channel via the water inlet to carry the rest of the sand core to leave the closed water channel via the sand-expelling holes and the water outlet; and applying screw bolts to lock the sand-expelling holes to manufacture a closed-type liquid-cooling motor frame.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: October 4, 2022
    Assignee: TECO ELECTRIC & MACHINERY CO., LTD.
    Inventors: Lian-Shin Hung, Yu-De Li, Ching-Chih Huang
  • Patent number: 11456093
    Abstract: A wire harness-producing device configured to produce a wire harness by displaying a wire laying-out image in a full size in a length direction on a plurality of display devices, and laying out electric wires along the wire laying-out image. The wire harness-producing device includes an electric wire-feeding device to allow the electric wires to be manually pulled out, a storage section to store operation recipe information therein, and a displaying control section to perform a displaying control on the display devices. The operation recipe information includes lengths of the electric wires. When each of the electric wires to be laid out is pulled out, the displaying control section displays, on the display devices, a starting end location indicator indicating a location for a front end portion of each of the electric wires having been pulled out, based on the lengths of the electric wires in the operation recipe information.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: September 27, 2022
    Assignee: HITACHI METALS, LTD.
    Inventor: Kenji Kawase
  • Patent number: 11457549
    Abstract: A pick-and-place spindle module comprises: a modular body structure including a first receiving location configured to receive a spindle; a first z-axis motor configured to move a spindle received in the first receiving location in a z-axis; a first theta motor configured to rotate a spindle received in the receiving location; a first motion control chip each attached to the body structure, the first motion control chip configured to control the first z-axis motor and the first theta motor; and a mechanical attachment mechanism, the mechanical attachment mechanism configured to facilitate attachment of the modular body structure to a spindle bank.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: September 27, 2022
    Assignee: UNIVERSAL INSTRUMENTS CORPORATION
    Inventors: John Danek, Peter Joseph Dionne
  • Patent number: 11451206
    Abstract: A method of fabricating a bonded wafer with low carrier lifetime in silicon comprises providing a silicon substrate having opposing top and bottom surfaces, modifying a top portion of the silicon substrate to reduce carrier lifetime in the top portion relative to the carrier lifetime in portions of the silicon substrate other than the top portion, bonding a piezoelectric layer having opposing top and bottom surfaces separated by a distance T over the top surface of the silicon substrate, and providing a pair of electrodes having fingers that are inter-digitally dispersed on a top surface of the piezoelectric layer, the electrodes comprising a portion of a Surface Acoustic Wave (SAW) device. The modifying and bonding steps may be performed in any order. The modified top portion of the silicon substrate prevents the creation of a parasitic conductance within that portion during operation of the SAW device.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: September 20, 2022
    Assignee: Qorvo US, Inc.
    Inventors: Shogo Inoue, Marc Solal, Robert Aigner
  • Patent number: 11445648
    Abstract: A feeder including: a feeder main body with a supply position, the feeder being configured to supply an electronic component from an electronic component housing section that houses many of the electronic components one by one to the supply position; and a handle attached to an upper surface of the feeder main body, the handle being made from a flexible strip member so as to be able to change shape.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: September 13, 2022
    Assignee: FUJI CORPORATION
    Inventor: Yukinori Takada
  • Patent number: 11444518
    Abstract: A manufacturing method for a rotary electric machine core includes a lamination step in which a plurality of steel plates is laminated so that a laminated body is configured, a heating step in which the laminated body is heated to a specified target temperature, a pressurization step in which the laminated body is pressed by a pressurization member until a pressure load reaches a target load larger than a specified fastening load in a state where the laminated body is heated to the target temperature, the pressurization member is then made to stand still until the pressure load is constant, and, once the pressure load is constant, the pressurization member is moved away, and a fastening step in which, after the heating and the pressurization are stopped, the steel plates that configure the laminated body are fastened by a fastening part until the fastening load is generated.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: September 13, 2022
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kento Furuta, Yukinori Murakami, Yoshitada Yamagishi
  • Patent number: 11444517
    Abstract: The invention relates to a method for producing stranded wires, including the steps of applying an insulation layer to lines, separating the insulated lines, individually removing the insulation layer from the separated lines along a partial length of the lines, and bringing the lines together to form a stranded wire, wherein the partial lengths are arranged at the same level at least in sections for the purpose of forming a non-insulated contact region.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: September 13, 2022
    Assignee: JHEECO E-DRIVE AG
    Inventors: Martin Stöck, Joel Bauer
  • Patent number: 11437188
    Abstract: Methods for fabricating wires insulated by low porosity glass coatings are provided, as are high temperature electromagnetic (EM) devices containing such wires. In embodiments, a method for fabricating a high temperature EM device includes applying a glass coating precursor material onto a wire. The glass coating precursor material contains a first plurality of glass particles having an initial softening point. After application onto the wire, the glass coating precursor material is heat treated under process conditions producing a crystallized intermediary glass coating having a modified softening point exceeding the initial softening point. The crystallized intermediary glass coating is then infiltrated with a filler glass precursor material containing a second plurality of glass particles.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: September 6, 2022
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Jimmy Wiggins, Harry Lester Kington, Martin Carlin Baker
  • Patent number: 11432451
    Abstract: A work machine including: a tape feeder with taped lead components having multiple leads to supply the lead components in a state of being detached from the taped components extended to a supply position; a mounting head to mount the lead components supplied by the tape feeder onto a board; an imaging device; and a control device having an imaging section to image an identification object, the identification object being on the taped components and capable of identifying the polarity of each of the multiple leads, and a determination section to determine whether an actual polarity disposition, which is the polarity disposition of each of the multiple leads, and a set polarity disposition, which is the polarity disposition of each of the multiple leads set in advance, match each other based on image data obtained by imaging with the imaging section.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: August 30, 2022
    Assignee: FUJI CORPORATION
    Inventor: Noriaki Iwaki
  • Patent number: 11430351
    Abstract: A flexible substrate, a method of processing a flexible substrate and a system of processing a flexible substrate. The method of processing the flexible substrate includes: measuring a first expansion volume of the flexible substrate; and applying a first application pressure to the flexible substrate to laminate the flexible substrate on a base substrate; according to a first corresponding relationship between a first pressure applied to the flexible substrate and a compressive expansion volume generated by the flexible substrate in compression and according to the first expansion volume, the first application pressure is selected to allow a second expansion volume of the flexible substrate to at least partially compensate for the first expansion volume.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: August 30, 2022
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Weiyun Huang, Tianyi Cheng
  • Patent number: 11431143
    Abstract: A method for manufacturing a power interface is provided. The method may includes: providing a pin workblank and disposing the pin workblank on a first mold; and performing a punching shear process on the pin workblank by a second mold, thereby forming a power pin of the power interface without a process of removing burrs. A power interface is also provided.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: August 30, 2022
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Feifei Li, Guodong Gu
  • Patent number: 11424667
    Abstract: A method for inserting electrical conductors in slots of a component, wherein, in sections, an insulating film has two legs which are connected by a V-shaped or folded tip region. The legs lie against the slot edges such that damage to the electrical conductors by edges of the slot during the insertion thereof into the slots is avoided. The invention further relates to an associated device, to an associated cutting tool, and to an associated use.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: August 23, 2022
    Assignee: GROB-WERKE GMBH & CO. KG
    Inventors: Günter Dreier, Ralf Rauscher, Korbinian Seidel, Veronika Schaller, Martin Otter
  • Patent number: 11424728
    Abstract: A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. One or more patterned electrodes are deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the one or more electrodes and a planarized support layer is deposited over the sacrificial layer. The support layer is etched to form one or more cavities overlying the electrodes to expose the sacrificial layer. The sacrificial layer is etched to release the cavities around the electrodes. Then, a cap layer is fusion bonded to the support layer to enclose the electrodes in the support layer cavities.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: August 23, 2022
    Assignee: AKOUSTIS, INC.
    Inventors: Dae Ho Kim, Mary Winters, Kenneth Fallon, Jeffrey B. Shealy
  • Patent number: 11424587
    Abstract: The invention relates to pressing or crimping pliers (1). According to the invention a spring device (35) (which is e.g. embodied as U-shaped leaf spring (36)) is used in the crimping pliers. In an equilibrium position (48) the leaf spring (36) is trapped between stops (49, 50). If the pressing or crimping pliers (1) are moved from the equilibrium position (48) in closing direction the leaf spring (36) is biased by a follower (54) such that the leaf spring (36) generates an opening force. In reversed direction the opening movement of the pressing or crimping pliers (1) from the equilibrium position (48) leads to a bias of the leaf spring (36) by a follower (55) such that the leaf spring is able to generate a closing force. According to the invention it is possible to provide that the pressing or crimping pliers (1) automatically and elastically open when reaching the closed position.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: August 23, 2022
    Assignee: WEZAG GMBH & CO. KG
    Inventors: Thomas Glockseisen, Roman Zinser
  • Patent number: 11413765
    Abstract: A robotic device includes a first robotic device including a first articulated arm, a first clamping mechanism, and a blow-out portion. The first clamping mechanism includes a first clamping claw and a second clamping claw. The first clamping claw is attached to the first articulated arm, and has a first support surface. The second clamping claw has a second support surface to face the first support surface in a first axial direction orthogonal to the first support surface. The second clamping claw is movable in the first axial direction relative to the first clamping claw. The blow-out portion is provided to any one of the first clamping claw or the second clamping claw. The blow-out portion is capable of blowing out fluid in a second axial direction orthogonal to the first axial direction.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: August 16, 2022
    Assignee: SONY CORPORATION
    Inventors: Shinichi Takeyama, Hirokuni Beppu, Hideaki Masamura
  • Patent number: 11412646
    Abstract: A method of assembly comprising a spindle bank for a pick-and-pace machine, a base including a plurality of mount locations, each of the plurality of mount locations configured to receive a mountable spindle module including at least one pick-and-place spindle and nozzle, a bearing system attachable to a movement axis of a pick-and-place machine such that the spindle bank is movable along the movement axis, and a power delivery system configured to deliver electrical power to each of the plurality of mount locations, wherein each of the plurality of mount locations is configured to deliver the electrical power to each of the mountable spindle modules when mounted.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: August 9, 2022
    Assignee: UNIVERSAL INSTRUMENTS CORPORATION
    Inventors: John Danek, Peter Joseph Dionne
  • Patent number: 11412651
    Abstract: A control device is used for a mounting device with a mounting head including at least a first holder on which a first pickup member is installed, and a second holder on which a second pickup member is installed, and configured to pick up components supplied from a component supply section and mount the components. The control device includes a control section configured to acquire a first deviation amount of a tip of the first pickup member and a second deviation amount of a tip of the second pickup member and select a combination of the pickup members in which an interval between the tips of the pickup members that is obtained based on the first deviation amount and the second deviation amount falls within a predetermined range.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: August 9, 2022
    Assignee: FUJI CORPORATION
    Inventor: Hideya Kuroda
  • Patent number: 11410812
    Abstract: In a method of manufacturing an embedded magnetic component, a cavity is formed in an insulating substrate. One or more drops of adhesive are applied to the cavity and a magnetic core is inserted in the cavity. The cavity and the magnetic core are then covered with a first insulating layer. Through holes are formed through the first insulating layer and the insulating substrate, and plated up to form conductive vias. Metallic traces are added to exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and the conductive vias form the windings for an embedded magnetic component, such as a transformer or an inductor.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: August 9, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Jamie Harber
  • Patent number: 11411169
    Abstract: A method of forming a piezoelectric thin film includes sputtering a first surface of a substrate to provide a piezoelectric thin film comprising AlN, AlScN, AlCrN, HfMgAlN, or ZrMgAlN thereon, processing a second surface of the substrate that is opposite the first surface of the substrate to provide an exposed surface of the piezoelectric thin film from beneath the second surface of the substrate, wherein the exposed surface of the piezoelectric thin film includes a first crystalline quality portion, removing a portion of the exposed surface of the piezoelectric thin film to access a second crystalline quality portion that is covered by the first crystalline quality portion, wherein the second crystalline quality portion has a higher quality than the first crystalline quality portion and processing the second crystalline quality portion to provide an acoustic resonator device on the second crystalline quality portion.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: August 9, 2022
    Assignee: Akoustis, Inc.
    Inventors: Craig Moe, Jeffrey B. Shealy, Mary Winters, Dae Ho Kim, Abhay Saranswarup Kochhar