Patents Examined by Peter DungBa Vo
  • Patent number: 11374473
    Abstract: An EC motor for an electric hand tool having a stator in which a rotor is rotatably mounted, which comprises a rotor lamination stack, which has a passage opening and is formed of individual laminations, and a rotor shaft which is cast in the passage opening of the rotor lamination stack by means of a casting compound, and having a plurality of permanent magnets, which are received in the pockets formed in the rotor lamination stack. An annular channel, which is connected to the pockets in a fluid-conducting manner via radial channels, each of which is formed of a plurality of channel sections formed in adjacent laminations of the rotor lamination stack, is formed between the rotor shaft and the wall of the passage opening for supplying the casting compound from the annular channel to the pockets. A method is also provided for producing a rotor for an EC motor.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: June 28, 2022
    Assignee: C. & E. Fein GmbH
    Inventors: Christoph Maier, Martin Adamczyk, Thomas Burkhardt
  • Patent number: 11369345
    Abstract: Substrate is produced by using a MEMS technique to form multiple diaphragms in a substrate by forming piezoelectric material layer on one surface of the substrate and thereafter by forming openings in the substrate from the other surface of the substrate; substrate and substrate on which signal detection circuit is formed are aligned to each other using at least one of multiple diaphragms as alignment diaphragm; and substrate and substrate are bonded together.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: June 28, 2022
    Assignee: KONICA MINOLTA, INC.
    Inventor: Yuta Nakayama
  • Patent number: 11370004
    Abstract: A biosensor includes an array of metal nanorods formed on a substrate. An electropolymerized conductor is formed over tops of a portion of the nanorods to form a reservoir between the electropolymerized conductor and the substrate. The electropolymerized conductor includes pores that open and close responsively to electrical signals applied to the nanorods. A dispensing material is loaded in the reservoir to be dispersed in accordance with open pores.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: June 28, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Steven J. Holmes, Emily R. Kinser, Qinghuang Lin, Nathan P. Marchack, Roy R. Yu
  • Patent number: 11363748
    Abstract: An assembly machine comprising a continuous circuitous track; a dispensing head system configured to at least partially assemble products, wherein the dispensing head system includes one or more dispensing heads movable around the continuous circuitous track; a product conveyance system extending between a first location of the continuous circuitous track and a second location of the continuous circuitous track and a placement module, the placement module including a first positioning system configured to move along a first axis that intersects with the product conveyance system, wherein the first positioning system is configured to receive a first of the products from the product conveyance system and move the first of the products from the product conveyance system to a first placement location; and a second positioning system configured to move along a second axis that intersects with the product conveyance system, wherein the second positioning system is configured to receive a second of the products from
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: June 14, 2022
    Assignee: UNIVERSAL INSTRUMENTS CORPORATION
    Inventors: Peter Joseph Dionne, John Edward Danek, Koenraad Alexander Gieskes
  • Patent number: 11358247
    Abstract: Disclosed herein is a system that includes a placement head, the placement head including a spindle assembly, the spindle assembly including a spindle capable of receiving one of a plurality of nozzles for attachment. The system includes a nozzle changer, the nozzle changer including a revolver capable of holding a plurality of nozzles. A position of the nozzle changer is changeable in response to movement of the spindle assembly. Further disclosed is a method of receiving and attaching nozzles with a nozzle changer.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: June 14, 2022
    Assignee: UNIVERSAL INSTRUMENTS CORPORATION
    Inventor: Koenraad Alexander Gieskes
  • Patent number: 11362472
    Abstract: A terminal extraction tool includes a handle and an extraction arm extending from the handle. The handle has a bottom extending between a handle front and a handle rear having a handle axis centered between the handle front and the handle rear. The extraction arm has a base at the bottom of the handle and a finger extending from the base. The finger has an elbow between an upper finger member and a lower finger member. The lower finger member is angled non-parallel to the upper finger member. The lower finger member extends from the elbow to a tip configured to engage a latching beam to release the latching beam and allow removal of the terminal from a housing. The handle and the extraction arm are rotated about the elbow to rotate the lower finger member and the tip to engage the latching beam.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: June 14, 2022
    Assignee: TE Connectivity Corporation
    Inventors: Thomas Robert DeWitte, Pushkar S. Kolhatkar
  • Patent number: 11363724
    Abstract: A fabrication method of a flexible electronic package device including the following steps is provided. A tolerable bending radius of the flexible electronic package device is obtained. A minimum surface curvature radius of a selected portion of an applied carrier is obtained. A relationship of the tolerable bending radius being smaller than the minimum surface curvature radius is ensured. The flexible electronic package device is disposed on the selected portion.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: June 14, 2022
    Assignee: Industrial Technology Research Institute
    Inventors: Chien-Min Hsu, Chih-Ming Shen, Shih-Hsien Wu
  • Patent number: 11363749
    Abstract: A machine that is used to automate the assembly of a circuit board assembly is provided. The machine includes a rotating indexer, at least one anvil holder, a punch, and an activation switch. The at least one anvil holder is carried by the rotating indexer and is configured to receive a connector pin. The anvil holder is rotatable relative to the punch, such that the at least one anvil holder may be aligned with the punch. A circuit board may be located about the connector pin, after which the activation switch may be activated to cause movement of the punch towards the anvil holder. When this occurs, the connector pin is compressed, which causes the connector pin to be secured to the circuit board. More specifically, a top section of the connector pin is compressed to form a top lip, where the circuit board is located between the top lip and a shoulder of the connector pin.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: June 14, 2022
    Assignee: Concord Electronics, Inc.
    Inventors: Agustin Flores, Richard Guiterrez, Omar Gonzalez
  • Patent number: 11356071
    Abstract: A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. Patterned electrodes are deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the electrodes and a planarized support layer is deposited over the sacrificial layer. The device can include temperature compensation layers (TCL) that improve the device TCF. These layers can be thin layers of oxide type materials and can be configured between the top electrode and the piezoelectric layer, between the bottom electrode and the piezoelectric layer, between two or more piezoelectric layers, and any combination thereof. In an example, the TCLs can be configured from thick passivation layers overlying the top electrode and/or underlying the bottom electrode.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: June 7, 2022
    Assignee: Akoustis, Inc.
    Inventors: Dae Ho Kim, Frank Bi, Mary Winters, Ramakrishna Vetury, Abhay Kochhar
  • Patent number: 11355894
    Abstract: A terminal crimping machine includes a machine body and a cable diameter fitting mechanism. The machine body includes an installation portion, an adjustment member and a driven member. The driven member is driven by the adjustment member and includes a driven alignment portion. The cable diameter fitting mechanism includes an assembly portion corresponding to the driven alignment portion. The driven member is driven by the adjustment member to move with the adjustment of the adjustment member, and the driven alignment portion moves along with the driven member. The cable diameter fitting mechanism is installed on the installation portion, and the assembly portion is assembled corresponding to the driven alignment portion during the installation process. Accordingly, the terminal crimping machine can achieve the effect of simple and convenient operation.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: June 7, 2022
    Assignees: DINKLE ENTERPRISE CO., LTD., DINKLE ELECTRIC MACHINERY (CHINA) CO., LTD.
    Inventor: Shang-Tsai Wu
  • Patent number: 11355267
    Abstract: A wire harness producing device configured to produce a wire harness by displaying a wire laying-out drawing in a full size in a length direction on a plurality of display devices, and laying-out electric wires along the wire laying-out drawing. The device includes a displaying control section configured to look up operation recipe information configured as a database capable of identifying wire laying-out order numbers of the electric wires, and in turn display wire laying-out position indicators configured to indicate positions of the electric wires to be laid out, on the plurality of display devices, according to a wire laying-out order of the electric wires. The operation recipe information includes coordinate information for indicating displaying positions for the wire laying-out position indicators. The displaying control section is configured to display the wire laying-out position indicators, in the displaying positions indicated by the coordinate information on the plurality of display devices.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: June 7, 2022
    Assignee: HITACHI METALS, LTD.
    Inventor: Kenji Kawase
  • Patent number: 11350549
    Abstract: A component supply device includes a pallet configured to allow a tray to be arranged thereon, a magazine operable to hold a plurality of pallets, and a magazine holder configured to allow the magazine to be arranged therein. The magazine holder is configured to allow the pallet to be conveyed from the magazine that has been arranged to a component supply position. The component supply device further includes a magazine supply unit configured to supply the magazine to the magazine holder, a magazine ejection unit configured to receive the magazine ejected from the magazine holder, and a magazine conveyance unit configured to convey the magazine from the magazine supply unit to the magazine holder.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: May 31, 2022
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Norimitsu Suzuki, Takafumi Fukuda, Tomoyasu Arai
  • Patent number: 11349065
    Abstract: A method for manufacturing a hybrid structure comprising an effective layer of piezoelectric material having an effective thickness and disposed on a supporting substrate having a substrate thickness and a thermal expansion coefficient lower than that of the effective layer includes: a) a step of providing a bonded structure comprising a piezoelectric material donor substrate and the supporting substrate, b) a first step of thinning the donor substrate to form a thinned layer having an intermediate thickness and disposed on the supporting substrate, the assembly forming a thinned structure; c) a step of heat treating the thinned structure at an annealing temperature; and d) a second step, after step c), of thinning the thinned layer to form the effective layer. The method also comprises, prior to step b), a step a?) of determining a range of intermediate thicknesses that prevent the thinned structure from being damaged during step c).
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: May 31, 2022
    Assignee: Soitec
    Inventor: Didier Landru
  • Patent number: 11349378
    Abstract: A cutting unit has a support member having insertion holes, and a movable member having through holes connected thereto. The respective left sides of upper surfaces of the square through holes are first movable blades, and the respective right sides thereof are second movable blades. Firstly, the movable member 14 is moved to the right by a predetermined amount to cut peeled-off portions of segment end portions only, and then the movable member is moved to the left by a predetermined amount to cut peeled-off portions of the segment end portions only. Distal ends of the coil segments can be cut into a uniform length to enable high quality welding, through this process.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: May 31, 2022
    Assignee: ODAWARA ENGINEERING CO., LTD.
    Inventors: Yuji Miyazaki, Noburo Miyawaki
  • Patent number: 11343920
    Abstract: A method for producing an electronic sensor module includes applying first soldering material onto electrical soldering pads of a printed circuit board element and/or electrical soldering pads of a printed circuit board element contact side of a sensor carrier, arranging the sensor carrier with the electrical soldering pads of the printed circuit board element contact side on the electrical soldering pads of the printed circuit board element to produce electrical connections between connecting lines and the printed circuit board element, applying second soldering material onto electrical connecting elements of a sensor element and/or soldering pads of the sensor receptacle, arranging the sensor element in the sensor receptacle such that the second soldering material produces electrical connections between the electrical connecting elements of the sensor element and the soldering pads of the sensor receptacle, and reflow-soldering the first soldering material and the second soldering material in a joint reflow
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: May 24, 2022
    Assignee: Robert Bosch GmbH
    Inventors: Udo Kaess, Uwe Katzenwadel, Peter Weiberle
  • Patent number: 11342822
    Abstract: A bending apparatus (10) includes an upper first die (11), an upper second die (12), a lower die (13), a control unit (20), an upper first moving mechanism (21), an upper second moving mechanism (22), a lower moving mechanism (23), a holding die (31), and a moving and rotating mechanism (32). The lower die (13) is moved in an upper direction after the upper first die (11) and the upper second die (12) are moved to the front, whereby four coil segments (4) are bent. When the upper second die (12) is moved to a first withdrawal position in the rear direction after the four coil segments (4) are bent, a working space for the holding die (31) is ensured.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: May 24, 2022
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Keita Miyashita, Kazuaki Ushiku, Shinsuke Onishi, Hideki Shigematsu, Takumi Fukaura
  • Patent number: 11333389
    Abstract: A duct making apparatus includes a first station configured to accept a formable sheet material and a second station configured to receive the formable sheet material from the first station. The first station includes a mechanism for forming one of a male lock bend and a female lock seam in a leading edge of the formable sheet material. The second station includes a retractable conveyor. Movement of the sheet material from the first station to the second station defines an axis of travel of the sheet material. The retractable conveyor is selectively movable from a first position in which the retractable conveyor is in close association with the first station, and a second position in which the retractable conveyor is spaced from the first station.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: May 17, 2022
    Assignee: MESTEK MACHINERY, INC.
    Inventor: Randy Runyan
  • Patent number: 11336158
    Abstract: A manufacturing method of a core of a rotating electrical machine includes: a preparation step of preparing a press device; a fixing step of fixing a steel sheet to a shaft member held by the press device by passing the shaft member through a hole provided in the steel sheet and extending in a stacking direction; and a processing step of performing press-working on the steel sheet by the press device in a state where the steel sheet is fixed to the shaft member.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: May 17, 2022
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroshi Kinpara, Takashi Takahashi, Tomohiro Segawa
  • Patent number: 11337347
    Abstract: A system for transferring a micro LED includes a micro LED dropped into a solution. The system further includes a micro LED grip body immersed in the solution, the micro LED grip body including a porous member having pores, and gripping the micro LED with a grip surface where the pores are provided. An upper surface of the porous member is configured with a seating recess having a guide inclined portion on which the micro LED is mounted and a shielding portion provided around the seating recess.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: May 17, 2022
    Assignee: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo Ahn, Seung Ho Park, Sung Hyun Byun
  • Patent number: 11328842
    Abstract: Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: May 10, 2022
    Assignee: The Boeing Company
    Inventors: Lars E. Blacken, Damien O. Martin, Eerik J. Helmick, Keith M. Cutler, John R. Porter