Abstract: The present invention discloses a grain boundary diffusion method of an R—Fe—B series rare earth sintered magnet, an HRE diffusion source, and a preparation method thereof, comprising the following steps: engineering A of forming a dry layer on a high-temperature-resistant carrier, the dry layer being adhered with HRE compound powder, the HRE being at least one of Dy, Tb, Gd, or Ho; and engineering B of performing heat treatment on the R—Fe—B series rare earth sintered magnet and the high-temperature-resistant carrier treated with the engineering A in a vacuum or inert atmosphere and supplying HRE to a surface of the R—Fe—B series rare earth sintered magnet. The method can reduce the consumption of heavy rare earth element and control the loss of residual magnetism Br while increasing the coercivity.

Abstract: A method of transferring a micro device using a micro device transfer head is provided. The micro device transfer head includes a base arm, a first side arm and a second side arm, and the micro device is fabricated on a substrate. The method includes moving the first side arm within a sensing range of the micro device, charging the first side arm for drawing the micro device away from the substrate to move towards a space between the first side arm and the second side arm, and shortening a distance between the first side arm and the second side arm for clamping the micro device.

Abstract: A component supply device includes a plurality of kinds of tape feeders capable of mounting a first component storing tape by which supplying of components is performed precedingly, and a second component storing tape by which supplying of components is performed succeedingly; a component sensor configured to detect runout of the components in the first component storing tape; and a control unit configured to control a tape feeding operation. A specified discharge length by which the first component storing tape is discharged at the time of occurrence of the runout of the components is preliminarily set for each kind of the tape feeder. The control unit is configured to make the tape feeder perform a tape feeding operation for feeding the first component storing tape by the specified discharge length when the component sensor detects the runout of the components in the first component storing tape.

Abstract: A hairpin type of stator coil forming apparatus includes a first forming machine configured to form a vertex in a material coil so that a central portion of the material coil protrudes upward, and to form inclined portions inclined to both sides of the vertex, a second forming machine configured to receive the material coil bent-formed by the first forming machine and to form a front/rear bent portion in the material coil by bending one inclined portion and a portion of the other inclined portion based on the vertex, and a third forming machine configured to receive the material coil bent-formed by the second forming machine and to roundly form the inclined portions in front and rear directions.

Abstract: A laminated core manufacturing method according to the present invention is a manufacturing method for a laminated core including: a laminated body that is configured by laminating core strips that are made of a magnetic material, the laminated body including: a core back portion; and a tooth portion; and electrically insulating members that are disposed on two side portions of the tooth portion, wherein the laminated core manufacturing method includes a bonding step in which the insulating members are pressed onto each of the side surfaces of the tooth portion of the laminated body so as to integrate the laminated body and also so as to fix the insulating members to the laminated body, by means of at least one of an adhesive and a pressure-sensitive adhesive that is disposed between each of the side surfaces of the tooth portion and the insulating members.

Abstract: A method of making a data centre is disclosed, comprising making a data centre in an existing building (3010) having a floor, walls and a roof, an air inlet and an air outlet. The method includes: installing prefabricated data centre elements by (a) connecting to the inlet an air handling module (3001, 3002); and (b) installing cold aisle services modules (3011) each having one or more integrated blanking portions and one or more data centre services extending along its length terminating with a connection to an adjacent module (3011); and installing racks of IT equipment arranged in parallel rows; the method being so performed that the floor, racks, and cold aisle services modules (3011) together define parallel cold aisles for entraining cooling air flows to the IT equipment. Also disclosed are a data centre, a service carrying frame and a cold aisle services module for a data centre and a supporting frame for supporting prefabricated data centre elements.

Abstract: A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.

Abstract: A part verification system includes sensors for detecting tapes, a reader which reads identification information from a recording part provided to a reel, and a memory part which stores part verification information. The system further includes a part verification part which performs verification updating processing for determining whether or not the tape is mounted on the tape feeder at the set position corresponding to the identification information, and updating tape presence or absence information at the set position when the tape is mounted, a tape monitoring part for determining whether or not the tape is mounted with respect to each tape feeder during a period which differs from a period where the verification updating processing is performed, and a notification part which performs notification to request reading of the identification information relating to the tape from the recording part when the tape is mounted on the tape feeder.

Abstract: A motor housing removal assembly comprises an extension defining a plurality of surface features on at least one side, an adjustment member comprising, a support member configured to couple to and move relative to the extension, an engagement element moveably coupled to the support member and configured to engage the extension to define a locked position preventing the support member from moving relative to the extension, a base portion coupled to the support member, and a plurality of pry members each comprising a first end coupled to the base and comprising a first thickness, and a second end opposing the first end and comprising a second thickness. A holder is fixedly coupled to an end of the extension and configured to hold at least a portion of a motor housing.

Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. The ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.

Abstract: An apparatus (102) for holding at least one elongated workpiece (106) to be crimped, wherein the apparatus comprises a holder frame (122), a guide member (124) and a locator element (114) having at least one holder surface (116) defining an elongated cavity (118) for receiving and holding the workpiece. The holder frame is arranged to hold the guide member and the locator element, the at least one elongated cavity having a longitudinal main extension (120). The locator element is movable in a first guide (126) in the direction (127) of the longitudinal main extension. The guide member is movable in a second guide (128) in relation to the locator element in a direction (129) perpendicular to the direction (127) of the longitudinal main extension. The guide member and the locator element are slidably engaged with one another.

Abstract: A component mounting device includes a component supply device that supplies a component to a component supply position by using a component housing tape, a head unit provided with a suction nozzle that can be moved up and down, a first image capturing unit that captures the component supplied to the component supply position, and a component posture determination unit that determines the posture of the component supplied to the component supply position. Based on a captured image captured by the first image capturing unit, the component posture determination unit determines whether the component takes an abnormal posture protruding from a component housing part in a direction intersecting the vertical direction on a horizontal plane in the component housing tape.

Abstract: Disclosed is a manufacturing method of a gas sensor. The gas sensor has a plate-shaped sensor element with at least one pair of electrode pads, a separator disposed around the sensor element, and at least one pair of opposed metal terminals held in an insertion hole of the separator and electrically connected at contact regions thereof to the respective electrode pads. The manufacturing method includes mounting the metal terminals in the insertion hole of the separator with use of a mounting jig. The mounting jig has a flat portion interposed between the contact regions of the metal terminals during the mounting of the metal terminals in the separator so as to prevent contact and entanglement of the opposed metal terminals.

Abstract: A method of manufacturing a stacked core includes forming a first pilot hole in a metal plate, forming a worked portion of the metal plate in a state in which a first pilot pin is inserted into the first pilot hole, the worked portion being displaced relative to a plane of the metal plate, press-fitting the worked portion of the metal plate to reposition the worked portion to extend along the plane of the metal plate, forming a second pilot hole in the metal plate after press-fitting the worked portion of the metal plate, and forming a blanked member by blanking the metal plate in a state in which a second pilot pin is inserted into the second pilot hole, the blanked member including the worked portion.

Abstract: A method of making a SiC resonator includes forming a layer of an oxide material on a relatively thick wafer of SiC; bonding the layer of oxide material on the relatively thick wafer of SiC to a handle wafer having at least an oxide exterior surface, the resulting bond being substantially free of voids; planarizing the relatively thick wafer of SiC to a desired thickness; forming top and bottom electrodes on the wafer of SiC wafer to define a SiC wafer resonator portion; and forming a trench around the top and bottom electrodes, the tench completely penetrating the planarized wafer of SiC around a majority of a distance surrounding said top and bottom electrodes, except for one or more tether regions of the planarized wafer of SiC which remain physically coupled a remaining portion the SiC wafer resonator portion which defines a frame formed of the planarized wafer of SiC surrounding the SiC wafer resonator portion.

Abstract: A die clearance monitoring system includes a light source, a light detector, and a controller. The light source is disposed along a front side of a die set of a crimping device and emits light towards the die set. The die set includes a first crimp die and a second crimp die that engage and crimp an object along a crimp stroke. The light detector is disposed along a rear side of the die set. The light detector receives the emitted light from the light source that traverses across the die set through a gap defined between the first and second crimp dies and generates light absorption data based on the emitted light that is received. The controller is communicatively connected to the light detector. The controller processes the light absorption data to determine a relative spacing between the first crimp die and the second crimp die.

Abstract: The information processing device is a device used in a mounting system configured as a production line including a mounting device configured to mount components on a board. The information processing device comprises: a control section configured to obtain the operator workload to be performed within a time block between a first point-in-time and a second point-in-time based on correspondence information linking work content and operator working time required for the work content, and the production job of the production line; create a workload table linking the time block and the workload; and output the created workload table.

Abstract: A spindle for a pick-and-place machine includes a shaft including a length extending between a first end and a second end, the shaft including an outer body and a hollow interior, a nozzle tip disposed at the first end of the shaft, the nozzle tip configured to contact an electronic component for manipulation of the electronic component, and a theta gear disposed on the shaft, the theta gear configured to engage with a motor of a pick-and-place head. The spindle is configured to be removably attachable from the pick-and-place head. A dispensing head spindle module, spindle bank and assembly machine incorporating the spindle are disclosed.

Abstract: A method of assembly comprising a pick-and-place spindle module having a modular body structure including a first receiving location configured to receive a spindle, a first z-axis motor configured to move a spindle received in the first receiving location in a z-axis, a first theta motor configured to rotate a spindle received in the receiving location, an air distribution system including an air distribution port, the air distribution system configured to deliver received air from the air distribution port to a spindle received in the first receiving location, an electrical distribution system including an electrical distribution port, and a mechanical attachment mechanism, the mechanical attachment mechanism configured to facilitate attachment of the modular body structure to a spindle bank such that the air distribution port is connected to receive air from the spindle bank and the electrical distribution port is configured to receive electricity from the spindle bank.

Abstract: A pair of crimping pliers for crimping, in particular for crimp joining, workpieces, has two oppositely arranged pressing jaws and two pliers jaws, wherein one pliers jaw is stationary and the associated pressing jaw is fastened to this stationary pliers jaw by means of a spring-loadable holder part. The holder part is fixedly connected at its end farthest from the pressing jaw to the pliers jaw. Between the stationary connection and the end of the holder part closest to the first pressing jaw, a stop connection is formed between the stationary pliers jaw and the holder part and comes into effect when a predetermined pressing force is exceeded.