Abstract: A capacitor element for a solid electrolytic capacitor is provided which comprises a chip which is a sintered mass of metal powder, and an anode wire projecting from the chip. The anode wire has a nail head end compressively formed for electrical attachment to a surface of the chip. The attachment of the anode wire may be formed by first forming a ball at a forward end of the anode wire and then pressing the ball end against the chip.

Abstract: A solid electrolytic capacitor having a solid electrolyte comprising manganese dioxide dispersed in an aromatic polyamide capable of further cure to form polyimide linkages, the solid electrolyte being disposed between a first electrode made of valve metal covered by an anodic oxide film and a second electrode opposite the first electrode. The electrolyte autogenously produces water, oxygen, and hydroxyl groups which act as healing substances and is not itself produced pyrolytically. Reduction of the manganese dioxide and the water molecules released by formation of imide linkages result in substantially improved self-healing of anodic dielectric layer defects.

Abstract: This invention packages option devices, such as floppy drives and hard disk drives, within an enclosure, thereby providing EMI/RFI shielding, promoting unimpeded option device electronic signaling, and reducing wasted space within an enclosure, such that small enclosures may encase the components. This invention includes a cage, for holding option devices, that is groundingly mounted in spaced relation to the major surface of a logic board, and an option device bracket that is slideably mounted within the cage. Each of the option device brackets contains one option device.

Abstract: A shield can for radio frequency (RF) shielding of electronic circuitry mounted on or embedded in the surface of an insulating substrate such as a printed circuit board (PCB). The design of the shield can allows it to conform to variations in the surface of the PCB. The shield can, which is usually formed of metal, includes a top and a plurality of side walls dimensioned to completely cover the electronic circuity when the shield can is placed over the circuitry. According to the present invention, any of the sides of the shield can may be made to conform to the surface of the PCB (and to effectively contact a ground trace on the PCB) by providing a plurality of vertical slots in the side. The slotted side would then have a series of metal teeth each of which can be displaced angularly to the extent required to conform to the PCB when a modest force is applied to the top of the shield can.

Abstract: An IC card comprises a module with an electric circuit and two panels adhered to each other to cover the module between them. The two panels are adhered with an adhesive with a sufficient adhesion strength and seals the module with no path of air to the outside of the IC card. Airtight sealing of the IC card in realized in various ways. For example, a groove having a varying width is provided in one of the panels for applying an adhesive, while a groove engaging to the groove is provided in the other of the panels. When the two panels are adhered to each other, gas channels may be formed in the groove at portions with narrower widths, while an adhesive in the groove at portions with wider widths fills the gas channels due to viscosity. In another way, a protrusion provided in one of the panels has an edge opposite to a groove provided in the other of the panels. Thus, the groove is kept air-tight. In a different way, an adhesive having a high viscosity at curing temperature is used.

Abstract: A robust optoelectronic transceiver module which is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a potting box with potting material inserted therein. In addition, a circuit board is encased by the potting material. The circuit board has an optical subassembly mounted thereon. The optical subassembly extends outside of the potting box through a recess. Correspondingly, a recess cover is provided for forming a liquid tight seal between the recess cover, the potting box, and the optical subassembly.

Abstract: The multilayer ceramic chip capacitor includes a multilayer ceramic capacitor chip having internal electrodes and an external electrode that is formed of a sintered layer of a paste containing both an electroconductive metal powder and a glass frit on both end faces of the multilayer ceramic capacitor chip and having an electric connection to the internal electrodes. A coating of plated metal is deposited on the surface of the external electrode. The multilayer ceramic capacitor chip is chamfered to a radius of curvature (R) of 0.10 mm or more on the periphery of each of the end faces at which the internal electrodes are to be connected to the external electrode and/or the external electrode has a dual structure consisting of an undercoat in contact with the internal electrodes and a topcoat in superposition on the surface of the undercoat.

Abstract: A computer includes a main enclosure for housing a plurality of computer components. A subenclosure or card cage for housing a planar circuit board, including a CPU, and at least one accessory board may be removably secured within the main enclosure, wherein the subenclosure, planar circuit board, and accessory circuit board may be selectively removed from the main enclosure as a unit. A connection device is provided to releasably electrically connect at least the planar circuit board to one of the computer components housed within the main enclosure.

Abstract: An improved electrostatic discharge protection guide rail system for a PCB which is capable of providing an electrostatic discharge protection function so that a PCB of a plug-in unit disposed in a sub-rack of an electronic instrument from a damage due to an electrostatic discharge (ESD), which includes an ESD ground surface formed on the PCB, an engaging jaw portion formed in a lower portion of the guide rail and having a groove, and an insertion groove formed in a side portion of the guide rail in order for the ESD strip to be inserted therein, wherein the bent ESD strip is inserted into the insertion groove, the ESD ground surface contact portion and the ESD PCB contact portion are inserted into a groove formed in the engaging jaw portion of the guide rail, both ends of the ESD PCB having a copper plate are protruded beyond a side surface of a sub-rack and horizontally cross with respect to the parallel guide rails, and a ground cable is connected to both ends of the ESD PCB, respectively.

Abstract: An electric double-layer capacitor including, as the positive electrode and the negative electrode, a material obtained by adhering a polarizable electrode on one or both sides of a conductive material by the use of a conductive adhesive, in which capacitor the polarizable electrodes are formed by a carbon material composed mainly of active carbon, amorphous carbon and expanded graphite, or the conductive adhesive is composed mainly of a resin and expanded graphite, or the polarizable electrodes are formed by a carbon material composed mainly of active carbon, amorphous carbon and expanded graphite and the conductive adhesive is composed mainly of a resin and expanded graphite.The electric double-layer capacitor has alleviated the drawbacks of the prior art, has a low internal resistance, gives substantially no change in internal resistance when subjected to repeated discharging, and has a long life.

Abstract: An edge of a long PCI card plugs into a connector at one end of a computer enclosure. The opposite end extends into the enclosure and may be superimposed over a component such as a disk drive. The support of the present invention is rigidly mounted on the enclosure to fit under the inner end of the card. A slide on the support grips the inner end of the card. The slide is adjustably positioned on the support to accommodate cards of different lengths.

Abstract: The solid electrolytic capacitor disclosed has a conducting polymer as a solid electrolyte and an antioxidant contained substantially only in a layer disposed in the neighborhood of a surface of the conducting polymer. The antioxidant serves to block the progress of oxidation of organic materials. A capacitor element with conducting polymer not containing the antioxidant is first prepared and this capacitor element is then dipped in a solution containing the antioxidant. Thus, the antioxidant at high concentration is caused to be introduced into the conducting polymer so as to be contained substantially only in a layer disposed in the neighborhood of the surface of the conducting polymer. Since the antioxidant can be introduced by merely dipping the capacitor element in the antioxidant solution, the method can be applied widely to capacitors irrespective of the process of conducting polymer formation.

Abstract: A method for forming a double layer planar polysilicon capacitor for use within integrated circuits is presented. Formed within a semiconductor substrate is a deep trench which is filled with a dielectric material. Formed within the dielectric material within the deep trench is a shallow trench which has a first polysilicon capacitor plate formed therein. The upper surface of the first polysilicon capacitor plate is substantially planar with the semiconductor substrate. Formed upon the first polysilicon capacitor plate is a polysilicon capacitor dielectric layer. Formed upon the polysilicon capacitor dielectric layer is a second polysilicon capacitor plate.

Abstract: A docking adapter includes a male HDI 30 type connector (for connecting to a "POWERBOOK" portable computer) and a female DB 25 type connector (for connecting via a SCSI bus cable to either a "MACINTOSH" personal computer or a SCSI external hard drive). The pins of the HDI type connector are electrically connected to the corresponding pins of the DB type connector. The adapter includes a switch having an actuated position for grounding pin 1 of the HDI type connector to "dock" the portable computer in a disk operating mode facilitating data transfer with the "MACINTOSH" over the SCSI bus. When not in the actuated position, the portable computer may be connected to and access the external hard drive over the SCSI bus. The adapter also includes a light emitting diode (LED) connected between the termination power pins of the DB and HDI connectors and ground to monitor for the presence of termination power on the SCSI bus.

Abstract: A integrated circuit card having a rigidized frame to surround the electronic devices on a printed circuit (PC) board. The card includes a frame and integral cover for the top and bottom. The top and bottom are constructed out of a material that does not interfere with the use of an antenna coupled to the board assembly within the card. The bottom and top are coupled together using pins. When the two are coupled together the frame is better supported.

Abstract: A case for microcircuit card reader, including a case body (1), an electronic circuit incorporated into the case body, a device for guiding the card and holding it in place, and a connector provided with elastic contact segments ensuring an electrical connection between the conductor elements of the card and the electronic circuit. It includes at least one elastic element (13, 55) for supporting the card by means of an elastic force.

Abstract: A first printed circuit board (principal printed circuit board) is placed onto a housing frame having a stepped contour in a front edge region of the housing. The first printed circuit board is introduced into a receptacle of the frame provided with an entry bevel and, when put in place, is automatically interlocked by interlocked elements preferably arranged at an opposite side. Additional printed circuit boards can be inserted into guide elements present at the backplane, being inserted under this first printed circuit board. Their ultimate position is compelled by corresponding holder elements. In this ultimate position, each printed circuit board that is introduced and lies parallel to the backplane is interlocked by an interlock element that takes effect in this position. The additional, second printed circuit boards can be inserted independently of the first printed circuit board and are preferably provided for optional add-ons.

Abstract: A rack for a communication system as, including a backboard having a first side, a second side, a connector capable of being connected to an electrical communication cable, and a plurality of through apertures. A first side panel has an open slot and a closed slot. The first side panel is connected to the first side of the backboard while a second side panel having a grooved slot is connected to the second side of the backboard. A rear panel has a first flange for detaining the first side panel, a second flange for detaining the second side panel, and first and second longitudinal detaining units for positioning strips perforated by columns of holes aligned with through apertures. The first and second longitudinal detaining units are located at sides of the rear panel. The strips are insertable into one of said strip detaining units. A plurality of guide plates have guide pins and a rear side.

Abstract: A package for electronic circuits can be made using a bottom plate, a top plate, and side walls which are stick capacitors. The top and bottom plates can be used as two of the terminations for the electronic circuit to provide a low impedance connection for heavy currents. The contact areas of the stick capacitor are bonded to the top and bottom plates, such as by reflow soldering. The top and bottom plates and the stick capacitor side walls provide a completely enclosed equivalent of a Faraday shield for superior EMI enclosure. Although the top and bottom are isolated electrically at DC by the dielectric layers of the capacitor, they are effectively short circuited at higher AC frequency. The stick capacitors can be drilled through to provide for additional conductors to the electronic circuit. In another embodiment of the invention, a stiffener for a printed circuit board comprises a stick capacitor as a filler for a laminated beam in which the top and bottom stress members are conductors.

Abstract: A method of forming a capacitor apparatus includes providing a substrate having a node, providing an electrically conductive reaction barrier layer with opposed recessed lateral edges over the substrate node, forming an inner capacitor plate, providing oxidation barrier blocks over the opposed recessed lateral edges, forming a dielectric layer and providing an outer capacitor plate.