Abstract: A metallized film suitable for providing a self-preservative metallized film capacitor is prepared. A metallized stock film strip is provided which includes a dielectric film strip and a plurality of deposited metal segments formed thereon so that the deposited metal segments are generally separated from each other but with an electrical connection extending therebetween. The electrical connection is then removed by a short circuit energy or a subsequent slitting. As a result, a metallized film having metal segments deposited on a dielectric film strip can be produced efficiently while avoiding winding wrinkles and a lowering of the process speed.

Abstract: A laminated capacitor and a process for producing the same. The laminated capacitor includes a plurality of capacitor assemblies and external electrodes, the capacitor assemblies each including a thermoplastic resin film having consecutively thereon a metal film as a first internal electrode, an inorganic dielectric material film, and a metal film as a second internal electrode, the plurality of capacitor assemblies being laminated with each other to form a laminated body, the external electrodes each being provided on an end surface of the laminated body, on which the first or second internal electrode is exposed, and being electrically connected to the first and second internal electrodes, respectively.

Abstract: A finished capacitor product and method in which the outer dielectric, protecting or encapsulating the basic inner capacitor structure, is improved in dielectric quality, relative to prior art and relative to the inner dielectric between plates. This improved outer dielectric has been experimentally demonstrated to provide improved electrical performance, including better signal handling performance, for the capacitor. This finding is contrary to prior art, which has attached great significance to the quality of the inner dielectric between capacitor plates, but has not attached great significance to the quality of the dielectric outside the capacitor plates.

Abstract: Applicant has discovered that the dielectric constant of Ta.sub.2 O.sub.5 can be significantly enhanced by the addition of small quantities of TiO.sub.2. Specifically, if Ta.sub.2 O.sub.5 is doped with more than about 3 mole percent of TiO.sub.2 the doped material will have a dielectric constant higher than the undoped material. For example, at a ratio of 0.92 Ta.sub.2 O.sub.5 :0.08TiO.sub.2, the dielectric constant is enhanced by a factor of more than three. Because both Ta and Ti are compatible with current microelectronics processing, the new dielectric can be used to make capacitors of reduced size with but minor modifications of conventional processes.

Abstract: An electronic circuit module having a metal cover is provided for interconnecting with a host device. The module includes an interface whereby electronic signals can be exchanged between the module and the host device. A mechanism for electrically grounding the metal cover to the ground plane of a printed circuit board housed within the module is provided along with a device for connecting the ground plane of the printed circuit board to a signal reference ground potential supplied by the host device. The present invention includes a module frame for attaching the metal cover thereto. A printed circuit board, including a ground plane, is mounted within the frame. A connector having a plurality of contact elements electrically connected to various the circuits disposed on the printed circuit board, including at least one contact element electrically connected to the ground plane is also adapted to fit within the module frame. The connector includes at least one grounding member.

Abstract: A chip card includes a plastic card. A plastic body is disposed in the plastic card and a semiconductor chip is surrounded by the plastic body. Contact strips are electrically connected with the semiconductor chip and are connected to the plastic card. The contact strips have a flexible region near and outside of the plastic body and are advantageously parts of a lead frame. An adhesive which joins the contact strips to the plastic card has at least three layers including a middle layer of flexible material.

Abstract: An electromagnetic shield assembly for securing a circuit board having an electromagnetic shield; and an electrically-conductive gasket having a framework of planar limbs and opposing first and second projections upstanding laterally from at least one of the limbs to intimately contact side faces of the shield and inhibit movement of the shield in a direction between the first and second projections, wherein the first projection includes a barb engaging a side face of the shield to fasten the gasket to the shield.

Abstract: A radio frequency identification tag with printed antenna coil integrated on a flexible substrate, and an integrated circuit area of the substrate adjacent the antenna coil for carrying circuit elements. The radio frequency identification tag is designed to be sufficiently robust to withstand the rigors of mail efficiency processing measurement applications.

Abstract: An IC card (1) has a shape of a substantially flat rectangular parallelepiped. The IC card (1) has electronic devices (2) including integrated circuits, a substrate (3) and a frame (5) for supporting the electronic devices (2), a first panel (6c) covering the upper surface of the frame (5), and a second panel (6d) covering the lower surface of the frame (5). Hereupon, the first panel (6c) is directly mounted to the frame (5) in such a manner that each of the left and right end portions (15) of the first panel (6c) is bent twice in accordance with the outer surface of the frame (5) and further each of edges of the left and right end portions (15) is fastened to the lower surface of the frame (5).

Abstract: IC card of the present invention consists of a frame including a rectangular bottom plate and a U-shaped side wall along the three edges of the bottom plate; a connector fixed to the open side of the frame with the U-shaped side wall; a board module at least one including printed-circuit boards with electronic components mounted thereon, combined with the connector, and inserted in the frame; and a metal panel for sealing off the board module inside the frame with the connector fixed thereto.

Abstract: A circuit board (10) has a frangible portion (12) for carrying information relating to the circuitry carried on the circuit board. The information is carried in the form of a label (18) or barcode, and identifies the version of the circuitry so that during manufacturing, and later during repair, the circuit can be correctly identified. The frangible portion is broken from the circuit board, but kept with the circuit board. In one embodiment, an adhesive label retains the frangible portion.

Abstract: A conductive first enclosure section 11 is molded through a primary molding process. At this time, a primary mold is provided so as to form openings 13 and 14 in the first enclosure section 11 for portions that needs insulation (non-conductivity). At a secondary molding process to make a non-conductive second enclosure section 12, a secondary mold is provided so as to cover the first enclosure section 11 and then non-conductive resin is filled thereinto. The openings 13 and 14 in the first enclosure section 11 are filled with the non-conductive resin, thus the rear cover 1 is formed.

Abstract: A robust optoelectronic transceiver module which provides for static discharge and is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a potting box with potting material inserted therein. In addition, a circuit board is encased by the potting material. The circuit board has an optical subassembly mounted thereon. The optical subassembly extends outside of the potting box through a recess. Correspondingly, a recess cover is provided for forming a liquid tight seal between the recess cover, the potting box, and the optical subassembly. Furthermore, the module provides electrically conductive latches which are conductively connected, via tabs for forming an electrical connection, to a grounded structure, such as a computer chassis.

Abstract: The capacitance type gaseous sensing device (10) includes a first electrode layer (12) formed on a semiconductor substrate layer (14). A seed layer (16) is formed on the first electrode layer (12). A reorganized layer (18) is formed on the first electrode layer (12) through interaction with the seed layer (16) to form a porous sensing layer. A second electrode layer (20) is formed on the reorganized layer (18). The reorganized layer (18) absorbs gaseous elements that change the dielectric constant of the capacitance type sensor device (10). A change in the dielectric constant causes a change in the capacitance of the reorganized layer (18) as measured across the first electrode layer (12) and the second electrode layer (20).

Abstract: A shield including a cover and pins is inserted in a solder-free connection into an electronic substrate for shielding electronic components on the substrate in an electronic device. The shield has a conductive cover, preferably with an integrally formed roof and wall, which defines a cavity. The cavity is configured to receive an electronic component or components positioned therein. The shield also has a conductive mounting pins which extend from the cover. The cover and the pins are preferably formed as a single piece. The shield also preferably includes a conductive gasket connected in a groove in the cover between the cover and the electronic substrate. Methods of assembling the shield on an electronic substrate in forming an electronic package for an electronic device are also provided.

Abstract: An electrolytic capacitor of the present invention is so constituted that a capacitor element steeped with an electrolytic solution containing quaternary ammonia salts is accommodated in an armor case of which aperture is sealed with a sealing body. To achieve the above object, an external terminal of the electrolytic capacitor has a contact surface contacting with the sealing body and being coated by a ceramic coating layer.

Abstract: In a PC card, a casing and a card are rotatably and bendably connected to each other by a hollow connecting member. A flexible wiring member is disposed in the connecting member and electrically connects the casing and card. The connecting member has a rotatable piece received in a first receiving portion formed on one end of the casing, a first cap rotatably supporting the first receiving portion and rotatable piece, an arm inserted at one end thereof in a second receiving portion formed on one end of the card, and a second cap rotatably supporting the second receiving portion and arm. The other end of the arm is bendably connected to the rotatable piece. The casing is freely moved about the arm in the up-and-down and right-and-left directions, as desired. Hence, the casino does not obstruct the operator's access to various switches and so forth arranged on a data terminal while the card is free from loads and damage.

Abstract: An electrical device such as a network protector relay is protected from ambient conditions by a housing having a printed circuit board (PCB) providing a seal for the housing and air and water tight connections between relay leads and external leads. The relay leads are soldered in first plated through apertures in the PCB substrate while the external leads are soldered in second plated through apertures connected to corresponding first apertures by conductive traces on the substrate. Potting material confined by a potting dam electrically insulates the solder connections on the external side of the PCB. Components can be mounted on either side of the substrate by soldering the component pins or leads in additinal plated through apertures electrically connected to relay and/or external leads by the conductive traces.

Abstract: The capacitance type gaseous sensing device (10) includes a first electrode layer (12) formed on a semiconductor substrate layer (14). A seed layer (16) is formed on the first electrode layer (12). A reorganized layer (18) is formed on the first electrode layer (12) through interaction with the seed layer (16) to form a porous sensing layer. A second electrode layer (20) is formed on the reorganized layer (18). The reorganized layer (18) absorbs gaseous elements that change the dielectric constant of the capacitance type sensor device (10). A change in the dielectric constant causes a change in the capacitance of the reorganized layer (18) as measured across the first electrode layer (12) and the second electrode layer (20).

Abstract: A hub for a communications network, a base hub (10), multiple communications ports (64) on the base hub (10), a motherboard (13) on which is mounted circuitry (62) for operation in a communications network, an expansion port opening (101) in the base hub (10), an interconnection board (42) in the base hub (10) carrying circuitry for operation in a communications network, the interconnection board (42) pointing toward the expansion port opening (101) for electrical connection to an expansion module (20) containing additional communication ports (64), and containing a mating interconnection board (121) for connection to the interconnection board (42) in the base hub (10).