Patents Examined by Phuong T. Vu
  • Patent number: 6275384
    Abstract: An electrical transition device includes a cover unit, a printed circuit board received in the cover unit, an electronic component mounted on the printed circuit board. The electronic component has a body and a pair of electrode tails extending from a bottom surface of the body. A support member is positioned between the body of the electronic component and the printed circuit board. The support member forms a pair of slots extending along a longitudinal surface thereof for receiving the electrode tails of the electronic component.
    Type: Grant
    Filed: August 20, 1999
    Date of Patent: August 14, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Peter Kuo
  • Patent number: 6269005
    Abstract: A PCMCIA connector includes an insulative header retaining contact elements therein and a shielding casing having a top panel attached to the header. The shielding casing has two side panels extending from the top panel for defining a primary space adapted to receive a type I or type II PCMCIA card. A raised section is formed on the top panel and has a top wall located above the top panel. Two side walls extend from the top wall and are connected to the top panel thereby defining a secondary space in communication with and substantially continuous with the primary space whereby the primary and secondary spaces together can accommodate a type III PCMCIA card. A dummy card is selectively received in the secondary space without interfering with insertion of the type I or type II PCMCIA card into the primary space. The dummy card includes a flat body receivable in the secondary space and defines a recess in which a panel is pivotally supported for selectively shielding the primary and secondary spaces.
    Type: Grant
    Filed: July 1, 1999
    Date of Patent: July 31, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Shun-Chi Tung, Hung-Chi Yu
  • Patent number: 6229714
    Abstract: An electrical enclosure in accordance with the principles of the invention includes one or more conductive straps connecting an enclosure door to an enclosure cabinet. The conductive strap may include a detachable connection at one, or both, ends and may be employed in combination with a conventional conductive gasket to form a substantially continuous conductive enclosure for electronics equipment. The conductive strap may include a detachable connection at one or both ends. The body of the conductive strap may be composed of solid or braided conductor material, such as a solid metal wire or braided metal wire. The strap may be employed in conjunction with a conventional conductive gasket and is connected to the gasket, the cabinet door, and the cabinet body in a manner that ensures that all three components are held at substantially the same electrical potential.
    Type: Grant
    Filed: May 25, 1999
    Date of Patent: May 8, 2001
    Assignee: Lucent Technologies Inc
    Inventor: Rolando Rosales
  • Patent number: 6222741
    Abstract: A thin, compliant, electrically and thermally conductive aluminum shim for providing minimum distance circuit path from a power amplifier (or transistor) to the underside of the circuit board (ground). The aluminum shim creates an interference fit between the underside of the circuit board and chassis, which guarantees an electrical connection with the bottom of amplifier and underside of the circuit board. Additionally, with the present invention, post-machining of the chassis during assembly of components is not required since the aluminum shim is sufficiently compliant to conform to both the bottom surface of the amplifier and the existent flatness and surface finish on the chassis produced from the initial machining step. This ensures superior electrical and thermal contact to the chassis regardless of slight imperfections in chassis flatness and surface finish at the seat location, thereby improving reliability and decreasing cost of manufacture and assembly.
    Type: Grant
    Filed: September 4, 1998
    Date of Patent: April 24, 2001
    Assignee: Qualcomm Incorporated
    Inventors: William Anthony Drennen, David C. Stillinger
  • Patent number: 6195265
    Abstract: A device that prevents electromagnetic interference between a portable computer and a docking station, that are electrically connected via interface ports, while the portable computer is used with the docking station may be integrated with a computer system. The computer system may be constructed using a first conduction member that may be made of a conductive metal strip material that is mounted on the docking station while also being grounded to the docking station. A second conduction member that is made of a conductive material is inserted in the bottom side of a portable computer and is also grounded to the portable computer. The first conduction member is electrically connected to the second conduction member while the portable computer is engaged with the docking station. Together, the first and second conduction members join the grounds of the portable computer and the docking station to effectively prevent the leakage of electromagnetic waves between the devices.
    Type: Grant
    Filed: November 30, 1998
    Date of Patent: February 27, 2001
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Phil-Kyu Choi
  • Patent number: 6181575
    Abstract: A shield adapted to protect an electronic device from electromagnetic interference includes a shielding panel having two board support arms extending from opposite sides thereof. Each board support arm defines an elongate slot therein extending in a direction substantially normal to the panel from a remote end to a proximal end. An expanded hole is defined in the board support arm at the remote end of the slot and communicates with the slot by means of a converging section whereby a mounting extension of a circuit board of the electronic device is received in the slot by being inserted in the expanded hole and guided by the converging section into the slot toward the proximal end thereof. The expanded hole facilitates the insertion of the mounting extension into the slot thus the width of the slot may be dimensioned to securely retain the circuit board without interfering with the insertion of the circuit board. The expanded hole also facilitates removal of the circuit board from the slot.
    Type: Grant
    Filed: April 14, 1999
    Date of Patent: January 30, 2001
    Assignee: Hon Hai Preicision Ind. Co., Ltd.
    Inventor: Chris Kuo-Wei Yang
  • Patent number: 6157542
    Abstract: An electric jack, which includes a housing, a circuit board mounted inside the housing, a terminal holder mounted inside the housing to hold down said circuit board, a plurality of forked terminals mounted in respectively holes at the terminal holders and welded to respective plug holes at the circuit board, a cable positioned in the terminal holder and having electric wires respectively connected to the forked terminals, and a plurality of holding down caps respectively pivoted to the terminal holders and turned between a first position where the electric wires of the cable are held down by the holding down caps to make a respective electric contact with the forked terminals, and a second position where the holding down caps are disconnected from the electric wires of the cable for enabling the cable to be disconnected from the terminal holder, the terminal holder having two stop blocks at two opposite sides, each stop block having a plurality of recessed receiving holes at inner side, which receive the end
    Type: Grant
    Filed: June 23, 1999
    Date of Patent: December 5, 2000
    Assignee: Hsing Chau Industrial Co., Ltd.
    Inventor: Peter Wu
  • Patent number: 6088216
    Abstract: A capacitor and method of making is described incorporating a semiconductor substrate, a bottom electrode formed on or in the substrate, a dielectric layer of barium or lead silicate, and a top electrode. A sandwich dielectric of a barium or lead silicate and a high dielectric constant material such as barium or lead titanate may form the dielectric. The silicate layer may be formed by evaporating and diffusing, ion implanting, or electroplating and diffusing barium or lead. The high epsilon dielectric constant material may be formed by sol gel deposition, metal organic chemical vapor deposition or sputtering. The invention overcomes the problem of a bottom electrode and dielectric layer which chemically interact to form a silicon oxide layer in series or below the desired dielectric layer.
    Type: Grant
    Filed: April 28, 1995
    Date of Patent: July 11, 2000
    Assignee: International Business Machines Corporation
    Inventors: Robert Benjamin Laibowitz, Thomas McCarroll Shaw
  • Patent number: 6002595
    Abstract: A cable-to-board assembly configured to nondetachably couple wires of a cable to surface-mounted pads on a circuit board. The cable-to-board assembly includes a first nonconductive housing and a flexible board having thereon a plurality of conductive traces. The conductive traces have first ends and second ends opposite the first ends with the first ends being electrically coupled to the wires. The first nonconductive housing encapsulates a first portion of the flexible board including the first ends. The cable-to-board assembly further includes a plurality of conductive legs configured for coupling with the surface-mounted pads on the board. The plurality of conductive legs are electrically coupled to the second ends of the conductive traces. There is also included a second nonconductive housing encapsulating a second portion of the flexible board including the second ends of the conductive traces and a portion of the conductive legs.
    Type: Grant
    Filed: September 14, 1998
    Date of Patent: December 14, 1999
    Assignees: DiCon Connectors, Inc., DiCon (S) PTE Ltd.
    Inventors: Steven Paul Gasparovic, Lee Hock Eng, Ng Lea Swee
  • Patent number: 5986890
    Abstract: A semifinished product for an electronic module includes an integrated circuit and a coil electrically connected with the circuit, the coil being disposed between two carrier layers and the integrated circuit being disposed in a specially provided cavity in the two carrier layers. To achieve plane surfaces of the semifinished product, the remaining cavity between the carrier layers and the integrated circuit is filled with a filling material in such a way that plane surfaces of the semifinished product result in the area of the cavity which are flush with the surfaces of the carrier layers.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: November 16, 1999
    Assignee: Giesecke & Devrient GmbH
    Inventors: Joachim Hoppe, Arno Hohmann
  • Patent number: 5973926
    Abstract: A method and apparatus for mounting a motherboard to a chassis of a personal computer using only a single screw. A number of standoffs snap into the base of the chassis, electrically contacting the chassis. Each standoff includes a projection. The motherboard includes apertures for accepting the projections such that when an ramp and shelf of each projection is aligned with the motherboard, the motherboard is positioned a fixed distance from the chassis. A mounting bracket also includes a number of projections. Apertures provided in the motherboard correspond to the projections of the mounting bracket. The surface of each side of the motherboard surrounding each aperture is plated with an electrically conductive material to form a conductive path between the motherboard and the standoffs and the bracket. The projections of the bracket are inserted into the corresponding apertures in the motherboard. A screw is inserted through a wall of the chassis and into a threaded hole in the bracket.
    Type: Grant
    Filed: February 29, 1996
    Date of Patent: October 26, 1999
    Assignee: Palo Alto Design Group, Inc.
    Inventors: Jim Sacherman, John Toor
  • Patent number: 5973912
    Abstract: The invention provides a polarizable electrode composed of activated carbon/carbon composite having micropores among which micropores having a diameter ranging from 0.1 to 5.0 micrometers have a volume ranging from 0.1 to 1.2 cm.sup.3 /g. The composite further has a specific surface area equal to or greater than 1000 m.sup.2 /g, and a density equal to or greater than 0.5 g/cm.sup.3. The micropores having a diameter of micrometers order to be formed in the polarizable electrode in accordance with the invention, facilitate the movement of ions in the electrode. Thus, it is possible to accomplish a polarizable electrode suitable for a larger amount of current discharge.
    Type: Grant
    Filed: December 20, 1994
    Date of Patent: October 26, 1999
    Assignee: NEC Corporation
    Inventors: Yukari Kibi, Takashi Saito, Atsushi Ochi
  • Patent number: 5966295
    Abstract: A terminal board for attachment to a control device in one of a flush or exposed type configuration. The terminal board including at least one exposed fixing hole defined in an upper portion of the terminal board, and at least one attached plate fixing hole defined in a lower portion of the terminal board, wherein the terminal board may be mounted to the control device in an exposure type attachment configuration in which the exposed fixing hole is exposed relative to the case. Alternatively, the terminal board may be mounted to the control device in an flush type attachment configuration in which the exposed fixing hole is flush with the case of the control device.
    Type: Grant
    Filed: November 28, 1995
    Date of Patent: October 12, 1999
    Assignee: Autonics Corporation
    Inventor: Hwan Ki Park
  • Patent number: 5959832
    Abstract: A heat resistant derivative conductive polymer containing nitrogen atoms exclusively in units of polyaniline or a derivative thereof contains a sulfonic acid compound as a dopant, and the percentage of sulfonic acid groups per recurring unit of the polyaniline or derivative thereof is set to 28 to 40%. Also, a solid electrolytic capacitor uses a solid electrolyte of polyaniline or derivative thereof containing a sulfonic acid compound as a dopant, wherein the percentage of sulfonic acid groups per recurring unit of polyaniline or derivative thereof is set to 28 to 40%. In this selected range of the concentration of the dopant, the conductivity and the pyrolysis commencement temperature characteristics are excellent.
    Type: Grant
    Filed: February 28, 1997
    Date of Patent: September 28, 1999
    Assignee: NEC Corporation
    Inventors: Atsushi Kobayashi, Takashi Fukaumi, Kosuke Amano, Hitoshi Ishikawa, Masaharu Satoh
  • Patent number: 5959844
    Abstract: An instrument cluster having a housing, a system support (21) to receive indicating instruments, and a circuit board (6) which is connected by fastening elements (35) to the system support (21) and mounted in floating fashion.
    Type: Grant
    Filed: September 9, 1994
    Date of Patent: September 28, 1999
    Assignee: VDO Adolf Schindling AG
    Inventors: Ernst-Ulrich Simon, Stephan Zech, Norbert May
  • Patent number: 5956225
    Abstract: An activated carbon has a specific surface area of pores with a pore diameter of not less than 20 .ANG. in the pore distribution determined from the nitrogen adsorption isotherm of not less than 1,000 m.sup.2 /g, and the ratio of the specific surface area of the pores with a pore diameter of not less than 20 .ANG. to the specific surface area of the whole pores of not less than 0.45.
    Type: Grant
    Filed: November 10, 1997
    Date of Patent: September 21, 1999
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Kohei Okuyama, Kazushi Matsuura, Yoshitaka Takeda, Yoshio Yoshino
  • Patent number: 5953204
    Abstract: An electric double layer capacitor is provided that includes a positive electrode having a currect collector combined with a polarizable electrode material composed mainly of activated carbon, a negative electrode having a current collector of porous metal incapable of forming an alloy with lithium, combined with a carbonaceous material having lithium ions occluded by a chemical method or an electrochemical method to a carbon material capable of occluding and releasing a lithium ions, and a nonaqueous electrolyte containing a lithium salt. The negative electrode is supported on a current collector of porous metal having a thickness of 0.1 to 1 mm and a porosity of 5 to 80%.
    Type: Grant
    Filed: December 18, 1995
    Date of Patent: September 14, 1999
    Assignee: Asahi Glass Company Ltd.
    Inventors: Manabu Suhara, Kazuya Hiratsuka, Takeshi Morimoto, Katsuji Ikeda
  • Patent number: 5946199
    Abstract: A shielding case ensures no deterioration in shielding effect, and allows a printed circuit board (PCB) to be installed from under the frame thereof and a leader terminal to be also installed from above the opening thereof.
    Type: Grant
    Filed: December 1, 1997
    Date of Patent: August 31, 1999
    Assignee: Alps Electric Co., Ltd.
    Inventor: Satoru Matsuzaki
  • Patent number: 5940275
    Abstract: A PCMCIA card structure includes a front connector, a frame, a substrate, and a sheet metal cover having a top cover panel. A ground plate having rearwardly extending ground contacts is carried on the upper surface of the connector. The frame includes an insulative cross beam disposed adjacent to the rear of the connector, the cross beam serving to support the top cover panel of the card, to prevent the top cover panel from contacting the connector ground plate or the contacts extending from the ground plate, and, along with portions of the ground plate, to close off the space between the connector and the front edge of the top cover panel. The ground plate has a transverse length shorter than that of the connector, defining end shoulder surfaces along the upper surface of the connector. The top cover panel includes a pair of laterally spaced, forwardly extending tabs, each tab overlying an end shoulder surface on the connector.
    Type: Grant
    Filed: August 8, 1997
    Date of Patent: August 17, 1999
    Assignee: Xircom, Inc.
    Inventor: Ian A. Laity
  • Patent number: 5938797
    Abstract: A method of forming a solid electrolytic capacitor which has an anode body, with an anode body lead being set therein, formed of a valve-action metal, and sequentially provided thereon are a dielectric oxide layer, a manganese dioxide layer as a first semiconductor oxide layer, a manganese dioxide layer containing graphite particles as a second semiconductor oxide layer, a graphite layer, and a metal layer either in a silver paste layer or a nickel plated layer. The manganese dioxide layer containing graphite particles possesses characteristics as in both the semiconductor oxide layer and the graphite layer so that the interface resistance and the impedance are reduced and there is no development of cracks and separations which may otherwise develop in the interface between the semiconductor oxide layer and the graphite layer caused by high temperature, high humidity and high pressure.
    Type: Grant
    Filed: August 26, 1997
    Date of Patent: August 17, 1999
    Assignee: NEC Corporation
    Inventors: Masaki Fujiwara, Takasi Kono, Kenichi Omatsu