Abstract: A Wilkinson power combiner (202) is described that includes: at least one input port (210) coupled to at least one output port (212, 214, 216, 218) by at least two power combining stages. A first power combining stage (204) of the at least two power combining stages is configured as a single-stage first frequency pass circuit and a second power combining stage (206) of the at least two stages is configured as a single-stage second frequency pass circuit, and wherein the first frequency is different to the second frequency.

Abstract: A microelectromechanical resonator device is provided having two-dimensional resonant rods. The resonator device has a piezoelectric layer formed with a plurality of alternating rods and trenches. A bottom electrode is in contact with a bottom surface of the piezoelectric layer. A top electrode metal grating of conductive strips is aligned in contact with corresponding rods of the piezoelectric layer.

Abstract: Acoustic wave devices and interdigital transducer (IDT) arrangements for surface acoustic wave (SAW) devices are disclosed. Representative SAW devices are described herein that provide sharp transitions between passband frequencies and frequencies that are outside of desired passbands. A SAW device may include several IDTs arranged between reflective structures on a piezoelectric material and one or more additional IDTs or electrode pairs that are configured to modify the influence of parasitic capacitance, or other internal device capacitance, thereby improving steepness on the upper side of a passband as well as improving rejection for frequencies outside of the passband. The one or more additional IDTs or electrode pairs may be configured as at least one of a capacitor, an IDT capacitor, an IDT with a floating electrode, or combinations thereof.

Abstract: A stacked composite filter device includes a stacked body having a first region and a second region that are different from each other. A first filter includes a first inductor and has a first pass band is arranged in the first region. A second filter includes a second inductor and has a second pass band on a lower frequency side than the first pass band is arranged in the second region. A first conductive structure extends in a stacking direction of the stacked body and includes one end grounded that is arranged in an area that is in the first region and adjacent to the second region. The other end of the first conductive structure is connected to the first inductor.

Abstract: Disclosed are designs for inductor cores for electromagnetic interference (EMI) filters. In some embodiments, an inductor core comprises a plurality of enclosed structures, where each enclosed structure of the plurality of enclosed structures includes a plurality of elongated bars and at least one connection device. In some embodiments, an enclosed structure is configured to encompass a signal bus. In some embodiments, an enclosed structure has a longitudinal axis and a triangular cross-sectional shape taken perpendicular to the longitudinal axis.

Abstract: A transformer balun for high rejection unbalanced lattice filters includes two symmetrical coils separated by a shielding element. In a further exemplary aspect, the transformer may include a conductor, which may be a third coil that operates with a capacitor to form a resonant circuit that enhances mutual coupling. Using either of the exemplary transformers provides improved performance in the passband while concurrently providing out-of-band rejection at levels exceeding seventy decibels (70 dB).

Abstract: An implantable pulse generator including a header, a can, and a filtered feedthrough assembly. The header including lead connector blocks. The can coupled to the header and including a wall and an electronic substrate housed within the wall. The filtered feedthrough assembly including a flange mounted to the can and having a feedthrough port, a plurality of feedthrough wires extending through the feedthrough port, and an insulator brazed to the feedthrough port of the flange. The filtered feedthrough assembly further including a capacitor having the plurality of feedthrough wires extending there through, an insulating washer positioned between and abutting the insulator and the capacitor at least in the area of the braze joint such that the capacitor and the braze joint are non-conductive, and an electrically conductive material adhered to the capacitor and the flange for grounding of the capacitor.

Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

Abstract: A band-pass filter includes a first input/output port, a second input/output port, a first high-pass filter, a first low-pass filter, and a first stub resonator. The first stub resonator includes a first distributed constant line. The first low-pass filter is provided between the first input/output port and the first high-pass filter in the circuit configuration. The first distributed constant line has a first end connected to a first path connecting the first input/output port and the first low-pass filter, and a second end closest to a ground in the circuit configuration.

Abstract: Embodiments of a method and an apparatus for a quadrature hybrid are disclosed. In an embodiment, a quadrature hybrid includes a first port, a second port, a third port, a fourth port, first, second, and third inductors, first, second, third, and fourth capacitors, and a first variable capacitor tuning network connected between the first port and the fourth port, and a second variable capacitor tuning network connected between the second port and the third port.

Abstract: An acoustic filter circuit for noise suppression outside resonance frequency is provided. The acoustic filter circuit includes a first filter branch and a second filter branch. The first filter branch and the second filter branch are both configured to resonate at a resonance frequency to pass a radio frequency (RF) signal, but in opposite phases. The acoustic filter circuit also includes a shunt circuit coupled between the first filter branch and the second filter branch. As discussed in various embodiments in the detailed description, the shunt circuit can be configured to protect the RF signal located inside the resonance frequency and suppress noises located outside the resonance frequency. As such, the acoustic filter circuit can provide improved noise rejection and reduce insertion loss.

Abstract: Disclosed is a radio frequency (RF) filter that vertically integrates an acoustic wave filter with an integrated passive device (IPD) filter. The acoustic wave filter provides selectivity at fundamental frequency band while the IPD filter provides rejection at harmonic frequency bands.

Abstract: A surface acoustic wave (SAW) filter package structure includes a dielectric substrate having a dielectric layer, a first patterned conductive layer, a second patterned conductive layer, and a conductive connection layer. The conductive connection layer is electrically connected between the first patterned conductive layer and the second patterned conductive layer, which are disposed at opposite sides of the dielectric layer. The second patterned conductive layer has a finger electrode portion. An active surface of a chip is faced toward the finger electrode portion. A polymer sealing frame is disposed between the chip and the dielectric substrate and surrounds the periphery of the chip to form a chamber together with the chip and the dielectric substrate. The mold sealing layer is disposed on the dielectric substrate and covers the chip and the polymer sealing frame. A manufacturing method of the SAW filter package structure is also disclosed.

Abstract: An electrical filter circuit is disclosed. The circuit includes a first input line and a second input line. A first transmission line is coupled electrically in series at a first node with a first output line, and an inductor is coupled electrically in series between the first input line and the first transmission line. The filter also includes a second transmission line having a first impedance coupled to the first node. The second input line is coupled electrically in series at a second node with a second output line. A third transmission line is coupled to the second node, and a capacitor is coupled electrically in series between the second transmission line and the third transmission line. The first output line has a second impedance that is greater than the first impedance.

Abstract: An acoustic resonator device includes a substrate and a piezoelectric plate. A first portion of the piezoelectric plate is on the substrate. A second portion of the piezoelectric forms a diaphragm suspended over a cavity in the substrate. An interdigital transducer (IDT) is on a surface of the piezoelectric plate, the IDT including first and second busbars on the first portion and interleaved IDT fingers on the diaphragm. A plurality of tethers support the diaphragm over the cavity, each tether providing an electrical connection between a corresponding one of the interleaved IDT fingers and one of the first and second busbars.

Abstract: A balanced-type circular disk resonator includes a circular conductive layer, a conductive member including a first conductive portion provided on a first surface of the circular conductive layer to enable a first dielectric board, a dielectric property of which is measured, to be placed between the first conductive portion and the circular conductive layer, and a second conductive portion provided on a second surface of the circular conductive layer to enable a second dielectric board, a dielectric property of which is measured, to be placed between the second conductive portion and the circular conductive layer, the second surface being opposite to the first surface with regard to the circular conductive layer, and a temperature adjustment unit coupled to the conductive member and configured to adjust temperatures of the first conductive portion and the second conductive portion.

Abstract: Apparatus and methods are provided for coupling RF signals. A lattice coupler design incorporating a pair of shunt inductors provides (i) a virtual ground for biasing and (ii) improved performance characteristics, in both splitter and combiner configurations. Magnetic coupling between the shunt inductors can be selected to maintain improved performance characteristics over a wide bandwidth, while retaining compactness and high efficiency. A design procedure, variations, and results are disclosed.

Abstract: A BAW resonator (BAWR) with improved power durability and improved heat resistance is provided. The resonator comprises a layer stack with a piezoelectric material (PM) between a bottom electrode (ELI) and a top electrode (EL2) and a shunt path parallel (PCPP) to the layer stack provided to enable an RF signal to bypass the layer stack, e.g. to ground (GND). The shunt path (PCPP) has a temperature dependent conductance with a negative temperature coefficient, NTC, of resistance. When the temperature of the device rises due to high power operation, currents that would otherwise permanently damage the device are shunted to ground or another dedicated terminal by the temperature dependent shunt path. Upon cooling down normal operation is resumed.

Abstract: A wide-bandwidth resonant circuit is provided. In an embodiment disclosed herein, the wide-bandwidth resonant circuit includes a positive resonant circuit coupled in parallel to a negative resonant circuit. The positive resonant circuit and the negative resonant circuit can be configured to collectively exhibit certain impedance characteristics across a wide bandwidth. As a result, it is possible to utilize the wide-bandwidth resonant circuit to support a variety of wide-bandwidth applications, such as in a wide-bandwidth signal filter circuit.

Abstract: A filter device includes a first port, a second port, a first high-pass filter, a first low-pass filter, and a stack. The first high-pass filter includes a first inductor. The first low-pass filter includes a first inductor. At least one second conductor layer constituting the first inductor of the first low-pass filter is located between at least one first conductor layer constituting the first inductor of the first high-pass filter and a ground conductor layer in a stacking direction.