Abstract: A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection region of the printed circuit board includes at least two plated-through holes plated by a solderable material such as copper which also interconnects the holes, and a pin of weldable but solder-rejecting material such as stainless steel which lies in one of the holes and is in press fit contact with the walls of the hole. Component leads can be soldered into the pinless holes as by wave soldering techniques, without coating the pins with solder, and wires can be welded to the pins by stitch wire techniques. The pins permit wire welds to be made thereto without requiring large weld currents to pass through the thin plating layer of the board, and also facilitate repair of a damaged weld by replacement of the pin.

Abstract: A welding apparatus for pipes which provides for a guide means which is to be fixedly secured to the pipe adjacent the welding area, a first carriage and a second carriage is movably supported upon the guide means with each of the carriages supporting a pair of spaced apart welding heads. Attached to the guide means is a driving chain. Mounted on each of the carriages are motor means which, in turn, operate through the driving chain to move the carriages in a prescribed manner with respect to the guide means. The welding heads of each of the carriages move within the same plane but each are movable in a separate one hundred and eighty degree arc thereby forming a continuous circle. Associated with each welding head is a weld groove tracking system which automatically maintains each welding head correctly aligned within the welding groove. The entire apparatus of this invention, when combined with appropriate electronic computer equipment, automatically welds an adjoined pair of piping sections.

Abstract: A circuit board is fabricated from a metal layer laminated to an underlying dielectric substrate. A stamping die, or roller, formed with a deeply impressed pattern of circuit paths, is indented through the metal and into the substrate. The metal is formed into circuit path conductors, electrically isolated from one another by insetting sheared away portions of the metal into indented portions of the substrate.

Abstract: Electrical components (10 or 30) are fastened to a mounting surface (16) of a printed circuit board (11) by forming a plurality of thermoplastic pins (20, 35) projecting from the mounting surface of the board adjacent to positions where components are to be located. The component is placed on the board so that portions of the component are located adjacent to portions of the pins, following which portions of the pins are heated and formed about portions of the component to form plastic locking sections (22 or 37) that fasten the component to the board in a desired position. The mounting surface (16) of the board may be formed with a pocket (18 or 33) that receives and positions the component at the desired location, so that component leads (17 or 32) extend along the mounting surface to positions overlapping lead-contact areas (14, 34) of printed contact patterns deposited on the mounting surface, after which the leads are attached to the contact areas, as by reflow soldering.

Abstract: A product by process for reducing micro-voids in cross-linked cable insulation without reducing the voltage breakdown strength thereof in which process the insulation, after cross-linking, is heated at a temperature in the range from about 120.degree. C. to about 150.degree. C. and under a pressure less than 10 mm. Hg for a period from about 8 hours to 48 hours. Also, a cable having such insulation which has micro-voids less than about 10.sup.2 per mm.sup.3 and a perforation gradient greater than the perforation gradient of a cable which has not been so treated.

Abstract: This invention relates to a specific type of multi-conductor cable comprising a plurality of insulated wire conductor pairs, each of said insulated conductor pairs having alternating twist and straight portions and having alignment means for precisely aligning both the twisted portions and straight portions of said insulated conductor pairs in a predetermined, laterally spaced, relationship with respect to each other. The alignment means of the multi-conductor calbe of this invention comprises a laminated plastic sheet, initially formed from first and second plastic sheets or films, the laminated film having(a) a plurality of precisely spaced encapsulating ducts formed therein, each encapsulating duct containing either an individual, insulated, straight portion of a conductor or an insulated conductor twisted pair and(b) nip areas extending laterally between, and joining, each of said precisely spaced encapsulating ducts.

Abstract: Waterproof filling medium, used in telecommunication cables with cellular insulation of polyethylene or polypropylene, is based on a mineral oil (with or without a gelling agent such as microcrystalline wax) and includes two non-polar additives. The first is soluble and of low enough molecular weight to reduce significantly the osmotic pressure of the base, but does not diffuse into the insulation below 80.degree. C.; and the second is polymeric and of high enough molecular weight to increase the resistance to flow to obtain the required non-draining property. Filling of cells in the insulation is inhibited.

Abstract: An electrical apparatus, such as a capacitor, having an improved dielectric system. The capacitor includes alternate layers of metal foil and dielectric material which is impregnated with 1,1-bis(3,4-dimethylphenyl)ethane. The capacitor has improved corona characteristics and low dielectric losses. The liquid dielectric is biodegradable and environmentally acceptable.

Abstract: A coated electrode having a flux formulation that is a function of the diameter of the electrode wire. The electrode wire is made from a nickel-chromium-cobalt-molybdenum-aluminum alloy. The flux coating contains differing amounts of manganese, iron and columbium depending on the diameter of the core wire.

Abstract: A method and composition for effecting splices of high voltage cable sections for use with a mold placed around the cable sections. The composition comprises a liquid polyolefin, a finely divided solid polyolefin and a chain extension agent capable of reacting to form addition polymer linkages with the liquid polyolefin.

Abstract: A wet welding electrode, for manual arc welding underwater, has a coating containing at least one oxidizing agent such as iron oxide, for neutralizing the embrittling effect of nascent hydrogen, and its core contains at least one constituent, e.g. aluminum oxide, aluminum and nitrogen, or copper, which results in the presence of hardening components in the weld deposit.

Abstract: The dielectric spacer between the conductive electrodes of an electrical capacitor is a biaxially oriented film made from a mixture of less than 80 percent by weight of isotactic polypropylene and more than 20 percent by weight of isotactic polybutene-1.

Abstract: The present invention provides a novel electrode construction and application for use in extrusion-fusion type battery intercell welders, which alters the current carrying characteristics of the electrodes and produces a homogeneous weld exhibiting a superior grain structure, higher strength, and superior durability.

Abstract: A conductive wire useful with a magnetic head assembly is formed from a zirconium/copper alloy core, which is plated with a corrosion resistant conductive metal, such as gold. The wire is preferably covered with insulation, such as polyurethane.

Abstract: The coaxial sub-marine telephone cable employs a central conductor which is formed by a compound twisted core of high tensile steel wires and of aluminum-based wires which are encased in a longitudinally welded copper tube that is applied tightly around the twisted core. The aluminum-based wire has high tensile strength, high breaking elongation and good electrical conductivity. The crushing of the aluminum based wires by the steel wires under the effect of radial pressures exerting on the core through sizing dyes while being manufactured is minimized and avoided by arranging the steel wires in contact with each other under radial compression so that they interact as an arch or vault.

Abstract: An installation for resistance-welding of structural parts, especially in the automotive industry, with a half-tong that is pivotal about an axis and longitudinally displaceable; the half-tong supporting thereon the welding electrode is pivotal about all three coordinate axes.

Abstract: There is provided an improved basic coated welding rod for downhand welding of fixed pipes. The coating contains by weight on a dry basis 22 to 28% of calcium carbonate, 1.5 to 3% of calcium fluoride, 7 to 14% of titanium dioxide, 35 to 55% of iron, and 5 to 25% of at least one element selected from the group consisting of chromium, manganese, silicon, nickel and molybdenum. The ratio of the coated welding rod diameter to the core wire diameter is between 1.45:1 and 1.70:1. Preferably the ratio of calcium carbonate to calcium fluoride in the coating is between 10:1 and 20:1. Advantageously, at least 35% of the iron in the coating is iron powder.

Abstract: A chip carrier system for supporting electronic semiconductor chips is provided with a matched coefficient of thermal expansion as well as a high value of capacitance. The carrier provides both mechanical and electrical connections to the chip. A small sized interposer for a silicon chip possesses high capacitance. An array of dot capacitors is formed between laminated layers of ceramic material. In some cases, conductive surfaces are provided on the upper and lower surfaces of a thin film of ceramic material in which dielectric bodies are interspersed in an array of openings therein. The resultant ceramic dielectric combination has a coefficient of thermal expansion which matches the coefficient of thermal expansion of the silicon chip and the substrate thereby relieving stress upon the solder ball joints between the interposer and both the chip and the substrate. This minimizes the mechanical stress upon the solder ball joints during thermal cycling of the structure.

Abstract: A double metallized paper electrode and polypropylene film dielectric capacitor is preferably impregnated with a blend of a single chemical compound fluid such as phenyl xylyl ethane or mono isopropyl biphenyl and an ester liquid for improved electrical characteristics.

Abstract: Communication cables with cores that have groups of conductor pairs, that carry messages in opposite directions, in the same cable present the problem of crosstalk between the different groups. With the increase in carrier frequency that is used for communication, the crosstalk problem increases, and cables that were acceptable for lower frequency are no longer adequate. This invention provides more efficient shielding; is suitable for higher frequencies; provides a stronger cable structure; and reduces corrosion of the shielding.