Abstract: A thick film multilayer substrate using a green ceramic sheet is constructed such that at least three conductor layers and at least two dielectric layers are alternately arranged in turn on the green ceramic sheet substrate, a power supply line being formed in the second conductor layer and thus interposed between the first and third conductor layers in which grounded conductors are formed.

Abstract: This invention relates to a printed wiring board having two electrically conductive circuit layers on an insulating laminate. The insulating laminate includes a first insulating layer having a thickness of 0.01 to 0.5 mm, and metal foils are provided on both sides of the first insulating layer. Metal foil circuit layers of predetermined patterns are formed by printing and etching the metal foils. Thereafter, through holes are formed in the first insulating layer across the facing metal foil circuit layers, and then electrically conductive members are applied over the through holes and the metal foil circuit layers at their ends. After that, a second insulating layer is attached onto one of the sides of the first insulating layer on which the connected metal foil circuit layers are provided.

Abstract: A printed circuit board includes an insulating board; at least one pair of conductive patterns arranged on the insulating board and spaced from each other by a predetermined length; and a paint layer formed in the space between the conductive patterns within a predetermined range.

Abstract: A circuit board formed with a spark gap for protecting a circuit element such as a transistor connected to a picture tube of a television receiver when spark discharge occurring within the picture tube produces a current under a high voltage tending to destroy the transistor. The spark gap comprises a pair of metal balls disposed respectively on the confronting tip portions of a pair of discharge electrodes disposed opposite to each other on an insulator substrate so that spark discharge can always occur across these metal balls without occurring across the electrodes.

Abstract: A heat shrunken polymeric material is wrapped around a plurality of adhesive coated, insulated wire strands juxtaposed in a transposed configuration to compact the metal strands into intersurface contacting relation, and thus promote improved bonding together of the metal strands for enhanced short circuit withstand.

Abstract: In a multi-layer ceramic package, a plurality of ceramic lamina each has a conductive pattern, and there is an internal cavity of the package within which is bonded a chip or a plurality of chips intereconnected to form a chip array. The chip or chip array is connected through short wire bonds at varying lamina levels to metalized conductive patterns thereon, each lamina level having a particular conductive pattern. The conductive patterns on the respective lamina layers are interconnected either by tunneled through openings filled with metalized material, or by edge formed metalizations so that the conductive patterns ultimately connect to a number of pads at the undersurface of the ceramic package mounted onto a metalized board. There is achieved a high component density; but because connecting wire leads are "staggered" or connected at alternating points with wholly different package levels, it is possible to maintain a 10 mil spacing and 10 mil size of the wire bond lands.

Abstract: In a cable consisting of three bundles each having three strands each bundle is rotated by 60.degree. in each of two consecutive longitudinal sections, no rotation occurring in the third section. The sections without rotation are displaced by one section for each bundle. Therefore, a close coupling of the strand of a bundle to all strands of the other bundles and a phantom surge impedance which only slightly differs from the surge impedance of the bundle are achieved. In addition, the bundles are twisted. The cable is suited for the simultaneous push-pull transmission of a maximal ten independent, binary signals in both directions.

Abstract: A void-free electrical conductor for power cables including a stranded electrical conductor formed of a central member and a plurality of abutting peripheral conducting members, the stranded conductor having a primary layer of electrical insulation heat shrunk about the exterior thereof and having an insulation material completely filling the internal space of the conductor within the primary external electrical insulation layer, the filler insulation adapted to fill all interstices between individual conducting strands outward from the abutment points between peripheral conducting members and the area inside of the abutment points being insulated by the insulation around the central conducting member to thereby form a completely void-free filling of the space within the primary electrical insulation in order to prevent the axial flow of any liquid or gaseous substance therethrough, said primary electrical insulation layer being void-free to increase the dielectric strength of the final electrical conductor c

Abstract: A printed circuit board mounting system uses three pairs of channels 7, 11, 14 to support a board 3 in a rest position, a test position or a repair position, for the maintenance of the board 3 without its removal from the equipment of which it is a part.

Abstract: Insulation for an electric power cable, and a power cable including such insulation, the insulation having an improved dielectric strength and being irradiation cross-linked polymeric material having mixed therewith carbon black having a particle size in the range from about 200 to about 500 millimicrons, the carbon black content being about 10% to about 40% of the weight of the mixture of carbon black and the polymeric material. Also, the cable insulation may be layers of different density polyethylene, at least one of the layers being the described mixture of polyethylene and carbon black.

Abstract: AC life and corona characteristics of a polypropylene-aluminum foil or a metallized film wound capacitor are improved by coating at least the ends of the capacitor with a partially cured urethane containing unreacted isocyanate groups.

Abstract: A torque balanced cable for towing or suspending oceanographic instrumenton includes a data transmission core about which is wound a helically laid inner layer of load bearing strands formed of high tensile strength, low stretch aramid fiber and having a selected pitch angle, pitch diameter and strand thickness. An outer composite layer is contrahelically wound about the inner layer and an interposed, abrasion resisting barrier film layer, and includes alternating load bearing strands and non-load bearing filler strands, the other load bearing strands having the same degree of pitch angle and thickness as the inner strands and of a number that bears substantially the same ratio to the number of inner strands as the pitch diameter of the inner layer bears to the pitch diameter of the outer layer.

Abstract: A multi-core power cable (1) in which the conductors comprise a central conductor (2) and two or more tubular conductors (4, 6) coaxial with the central conductor (2), at least the tubular conductors forming the cores. The conductors (2, 4, 6) are isolated from one another by insulating layers (3, 5, 7). A sheath (8) and armoring (9, 10) may also be provided.

Abstract: An AC metallized film capacitor having a plurality of electrodes separated by a dielectric spacer contains as its impregnant system a dielectric fluid and 1-20% of an aliphatic or aromatic isocyanate having unreacted NCO groups to improve life characteristics.

Abstract: A multiple sheath cable for telemetry, heating and communications and methods of manufacturing such cable in long lengths with high tensile strength. The telemetry and communications cable may be of the wire type for conducting electrical signals or fiber optics for conducting laser or other optical signal, the conductors being typically insulated by mineral insulation material or organic insulation material. These insulated conductors are provided with concentric multiple layers of metal tubular sheaths having staggered weld joints for increasing tensile strength while protecting the conductors and the insulation from extreme environmental conditions such as heat, pressure and corrosion.

Abstract: A movable electroluminescent display which can be moved relative to its printed circuit board to effect selective viewing of the display apart from the printed circuit board.

Abstract: A cable assembly having a shielded conductor and a method of making same. The shielded conductor is formed by bonding a thin layer of conductive material to the outer surface of an insulated wire. The bonding may be achieved by coating the outside surface of the insulated wire with a metallic particle and solvent solution, and then heating the coated wire to flash off the solvent and achieve the desired bond. The outer conductive layer may be grounded by positioning grounding means adjacent thereto prior to encapsulation in an outer insulating jacket. The grounding means preferably takes the form of a center ground wire surrounded by a semi-conductive material whose outer diameter is substantially the same as that of the shielded conductor. The semi-conductor material contacts the outer conductive layer along its length, and physical and electrical contact is maintained by the outer jacket.

Abstract: In a tubular composite electrode for depositing stainless steel weld metal, satisfactory performance in vertical up welding is achieved through the inclusion in the electrode core of a slag mix comprising 15 to 60% weight percent zirconium dioxide.

Abstract: A circuit programming means for establishing a desired circuit pattern selected from a variety of circuit options comprises a circuit board having a plurality of side-by-side circuit board conductors thereon. A conductive connector clip is mounted on the circuit board in straddling relationship to the conductors and has contact springs extending therefrom which are in alignment with the conductors. A removable insulating program control means is positioned between a number of the springs and their associated circuit board conductors, the insulating means having openings so that at least two of the contact springs are in electrical contact with their associated conductors. The selected circuit pattern can be changed by merely moving the program control means and inserting a different program control means to commonly connect those conductors which will produce the desired circuit option.

Abstract: A multilayer circuit board (10) for putting semiconductor devices thereon consists of conductor layers (6, 60, 61, 62, 63) made of a metal selected from the group consisting of Au, Ag, Cu and an alloy thereof, insulating material (2, 7) made of glass-ceramic and an alumina sintered plate (1). The glass-ceramic is comprised of borosilicate glass and alumina and has a low dielectric constant and a thermal expansion coefficient approaching that of the semiconductor devices. The alumina sintered plate (1) is placed between the ground and supply voltage conductor layers (62, 63) and the signal conductor layers (60).