Abstract: The present invention provides a novel method of extrusion-fusion welding of lead parts through an aperture in a battery case which uniformly controls the area of contact between members to be welded at the completion of the extrusion process in order to produce consistent, high-quality welds exhibiting higher strength and superior durability.

Abstract: The present invention provides a novel method for producing a homogenous weld exhibiting a superior grain structure, higher strength, and superior durability, using an extrusion-fusion type battery intercell welder having a novel electrode construction which provides improved current carrying characteristics.

Abstract: A composite wire containing a flux for use in gas-shielded arc welding of stainless steels which contains, in the flux, the following inorganic components with respect to the total weight of the wire: 0.1 to 10% by weight of an anhydrous silicate, and 0.01 to 0.75% of a metallic oxide having a melting point of no more than 888.degree. C.

Abstract: A circuit module (10) having a row of connector pins (21) and being approximately 4mm. thick or less, and including an electrical circuit (22) connected to the connector pins (21). In prior art designs, it has not been possible to utilize a large substrate having good heat dissipation properties and, at the same time, include an attached electrical device, without exceeding the allowed maximum dimensions of the module. The present invention solves the problem by recessing an edge (17) of the substrate (11), depositing spaced-apart conductor films (26a and 26b) in the recess (16) that electrically connect with the eletrical circuit (22), and soldering (31a and 31b) the electrical device (30) to the conductor films (26a and 26b). Principal uses for the invention include digital computers and similar complex electronic devices.

Abstract: A cored wire electrode for use with a shielding gas, particularly in out-of-position welding, said electrode having a core material containing rutile, an arc stabilizer, deoxidizers including from about 5 to 15 weight percent of a manganese and silicon-containing compound, from about 1 to about 7 weight percent of magnesium and/or magnesium-aluminum alloys, from about 3 to about 10 weight percent manganese oxide, from about 5 to 20 weight percent nickel, from about 2 to 15 weight percent silica, and from about 0.5 to 5.0 weight percent Al.sub.2 O.sub.3 -SiO.sub.2 -K.sub.2 O.

Abstract: This invention refers to a medium voltage electric cable (up to about 45 kV) comprising one or more cores, each of said cores being constituted by a conductor covered with an inner semiconductive screen, an insulation layer of extruded polymeric material (preferably, cross-linked polyethylene or ethylenepropylene rubber) and an outer semiconductive screen.The outer semiconductive screen, which is extruded on the insulation and vulcanized at the same time as the insulation in a continuous vulcanizing line, is constituted by a mixture based on a blend of nitrile rubber and ethylene-propylene rubber and containing carbon black, cross-linking agents and various additives.The blend of nitrile rubber and ethylene-propylene rubber comprises 50-70 parts by weight of nitrile rubber and 50-30 parts by weight of ethylene-propylene rubber.The so constituted outer semiconductive screen has good adhesion to the insulation and can be easily removed from said insulation.

Abstract: An electrically insulating coating for transformer wire consists of an asbestos paper coated with a plurality of strips of resin material. The resin material provides strength and toughness to the asbestos as well as abrasion resistance to the coated wire to protect the asbestos material during the coil winding process.

Abstract: An integrated semiconductor package containing circuitry capable of supporting separately packaged semiconductors to achieve greater circuit board density and to allow separate semiconductor packages which cooperate with the supporting semiconductor package and die to be interchanged. The supporting die is interconnected electrically to lead pins and socket contacts using conductive circuitry compatible with the other semiconductor die.In a first embodiment corresponding metallization patterns are used to electrically interconnect an integrated circuit package to a conventional printed wiring board or ceramic wiring board containing socket contacts to receive lead pins from another integrated circuit package. A second embodiment is a unitized package containing integral socket contacts within the unitized integrated package to receive lead pins from another integrated circuit package.

Abstract: A gas shielded, flux-cored welding electrode for vertical or overhead welding as well as for horizontal or flat welding is disclosed having a generally tubular metal sheath and a core defined within the sheath, wherein the core includes a slag forming system based, primarily, on about 2-7.5% of the fluorides of calcium and/or strontium.

Abstract: Soldering techniques, where a circuit component having a row of closely spaced leads (e.g., dual in-line packages) are to be soldered to a printed circuit board and the leads are oriented on the printed circuit board such that the row of leads is arranged parallel to the direction of motion of the printed circuit board through a wave solder pot, may effect a high incidence of soldering bridging. This bridging may form between the last few adjacent leads in the row which emerges from the solder pot. A printed circuit board is provided with an additional foil pad (or a pair of additional pads in the case of a dual in-line package) arranged in line with the row of leads. This additional foil pad tends to draw off any excess solder to reduce the solder bridging between adjacent leads during the soldering operation.

Abstract: In an electronic circuit arrangement mounted on a printed circuit board in which leadless circuit parts are attached to the printed circuit board with adhesive. A white paint is applied onto a region to which adhesive is applied, and an adhesive containing pigment contrastable to the white paint is applied onto the paint.

Abstract: The present invention provides a novel method of extrusion-fusion welding of lead parts through an aperture in a battery case which uniformly controls the area of contact between members to be welded at the completion of the extrusion process in order to produce consistent, high-quality welds exhibiting higher strength and superior durability.

Abstract: A construction for mounting plate-like electric parts within insertion holes formed in a printed circuit board is described which has additional holes for releasing any gases formed by soldering the parts to the printed circuit board. These additional holes are formed contiguous with said insertion holes at positions spaced away from any electrodes of the plate-like electric parts.

Abstract: Disclosed is a perforated circuit board with a linear arrangement of paired terminals through which jumper wires are inserted and which are positioned on each side of and adjacent to the perforations. The perforations permit flexible "breaking" of the circuit board into sections which may be oriented at any angle relative to one another while the machine-inserted jumper wires provide structural integrity and rigidity for the circuit board arrangement thus formed in addition to electrical coupling between adjacent board sections.

Abstract: In order to assist the mounting of a printed circuit board to a metallic frame and the soldering of a conductive pattern of the former to the latter, a wire rod of high solderability is bent to conform substantially with the outline of the frame and is disposed at the juncture between the frame and the marginal edge of the circuit board. The circuit board can thus be temporarily fixed to the frame by the resilience of the wire rod and then subjected to dip soldering.

Abstract: A welding wire comprising a hollow tubular portion of titanium metal and a core portion filling the tubular portion. The core portion is formed of compacted alloying powders selected from the group aluminum, molybdenum, niobium, tantalum and vanadium. The core portion may also include powdered titanium.

Abstract: A novel electrical interconnection system is described. The system includes a novel multiple-bussed matrix board and associated hardward and assembly tools for use therewith. The matrix board includes a plurality of plated-through holes arranged in a coordinate system of rows spaced 0.100 inches on center, measured from aperture-to-aperture. Selected apertures are electrically connected to selected bus bars on one or the other side of the board.

Abstract: Provided is an oil-impregnated power cable comprising an insulation layer formed by winding a composite film of polyolefin film and insulating paper onto an electric conductor and impregnated with an impregnating oil, said impregnating oil comprising distillates within a boiling range in terms of values at normal pressure between 265.degree. C. and 360.degree. C. obtained by contacting a hydrocarbon mixture with a boiling range between 75.degree. C. and 198.degree. C. resulting from a thermal cracking of petroleum hydrocarbons at a temperature of 700.degree. C. or higher and containing monocyclic aromatics and aromatic olefins, in liquid phase with an acid catalyst.

Abstract: A conductor bar for an electric machine is disclosed. At least one strip-like insert is provided on a surface of the conductor which forms an angle with an insulating sleeve enclosing the insert and conductor. Voids are produced at the edges of the insert which form impregnating canals for an impregnating medium to thereby improve the impregnability of the insulating sleeve.

Abstract: A module carrying microcircuit LSI chips includes stacks of parallel ceramic sheets carrying thin capacitor plates laminated in a ceramic structure in which the capacitor plates either serve (1) as the power distribution conductors known as power planes or (2) are connected to power conducting vias which pass through the capacitor plates. Those vias connect to the appropriate capacitor plates electrically, thereby locating the capacitance required as close as possible to the solder bonds between the chips and the carrier. Stacks of laminated ceramic capacitors serving as power planes can be inserted into slots in laminated ceramic sheets providing the first arrangement above. Signal vias are provided about the periphery of the power planes. A highly parallel distribution of current is provided by means of horizontal power conducting straps which reduce voltage fluctuations, electrical resistance, and current per via.