Abstract: A rail apparatus, a laser apparatus, and a laser machining device are provided in the present disclosure. The rail apparatus includes a rail frame assembly and a mounting assembly. The rail frame assembly includes a rail frame and a guide shaft fixed to the rail frame. The mounting assembly includes a mounting base and a pulley. The pulley defines a sliding groove. The sliding groove is slidably connected with the guide shaft. The laser apparatus includes a base, a laser, and a focusing member. The laser is disposed on the base and is configured to emit a laser light. The focusing member is movably disposed on the base and has a focusing end. The laser apparatus is operable in a retracting state and an extending state. The laser machining device includes the rail apparatus and the laser apparatus.

Abstract: A heater includes a base body, a conductive module, and an infrared electrothermal coating. The conductive module includes a first electrode and a second electrode spaced on the base body. The first electrode includes a first bar electrode axially extending from a first end to a second end, the second electrode includes a second bar electrode axially extending from the first end to the second end, and at least a part of the infrared electrothermal coating is located between the first bar electrode and the second bar electrode. An equivalent resistance of a part of the infrared electrothermal coating adjacent to the first end is less than an equivalent resistance of a middle part of the infrared electrothermal coating. An equivalent resistance of a part of the infrared electrothermal coating adjacent to the second end is less than the equivalent resistance of the middle part of the infrared electrothermal coating.

Abstract: The present disclosure relates to a silicon-controlled rectifier water-cooling heat dissipation device, including: a water-cooling cavity body; a silicon-controlled rectifier; and a heat dissipation plate. The heat dissipation plate includes: a first heat dissipation part configured to contact the water-cooling cavity body; and a second heat dissipation part connected to the first heat dissipation part and configured to contact the silicon-controlled rectifier. A preset included angle is formed between a plane where the first heat dissipation part is located and a plane where the second heat dissipation part is located. The heat of the silicon-controlled rectifier is transferred to the water-cooling cavity body through the heat dissipation plate. An occupied volume can be effectively reduced because the first heat dissipation part and the second heat dissipation part form the included angle. The cooling water takes away the heat by the flowability of the water to improve heat dissipation efficiency.

Abstract: A muffler cover for an appliance includes a first room, second room, and a first channel. The second room is positioned separate from the first room. The first channel is connected to the first room via a first inlet and connected to the second room via a first outlet. The first channel changes from a first direction to a second direction and changes from the second direction to a third direction. The first direction is substantially opposite to the second direction, and the second direction is substantially opposite to the third direction. A muffler and an appliance using the muffler are also provided.

Abstract: Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, a data processing system may include hardware components that provide the computer implemented services. Any of the hardware components may have a limited thermal operating range. To retain the temperatures of hardware components within their operating ranges, the data processing system may include heat sinks fitted to the hardware components that are both able to cool and warm the fitted hardware components.

Abstract: A heated baby bottle assembly includes a baby bottle for containing a fluid baby food. An insulating layer is wrapped around the baby bottle and the insulating layer is comprised of a thermally insulating material thereby inhibiting thermal communication between the baby bottle and ambient air. A pair of nipples is provided and a respective one of the nipples is removably attachable to the baby bottle thereby facilitating the fluid baby food to be consumed through the respective nipple. A heating element is integrated into the baby bottle to heat the baby bottle when the heating element is turned on thereby heating the fluid baby food in the baby bottle. A control unit is integrated into the baby bottle and the control unit actuates the heating element to a selectable temperature thereby facilitating the fluid baby food to be retained at the selected temperature.

Abstract: Additive manufacturing systems and related methods are disclosed. In some embodiments, an additive manufacturing system includes a build surface, one or more laser energy sources configured to emit laser energy, an optical phased array operatively coupled to the one or more laser energy sources, and a Risley prism assembly comprising a plurality of wedge prisms. The optical phased array includes one or more phase shifters operatively coupled to the one or more laser energy sources and configured to control a phase of the laser energy. The optical phased array is configured to direct the laser energy towards the Risley prism assembly, and the Risley prism assembly is configured to direct the laser energy towards the build surface.

Abstract: An electric range is provided that may include a case, a cover plate coupled to an upper side of the case and on which an object to be heated is placed, at least one heater that heats the object, the at least one heater being disposed under the cover plate, an upper bracket that is disposed under the at least one heater and supports the at least one heater, a base bracket disposed under the upper bracket and on which a printed circuit board is mounted, a heat sink mounted on the printed circuit board, an air blowing fan that is mounted on the base bracket and discharges air toward the heat sink through an outlet thereof, and an air guide that communicates with the air blowing fan, surrounds the heat sink, and forms a flow path of air cooling the heat sink.

Abstract: An apparatus and method for efficiently increasing semiconductor chip functionality in a particular area. A semiconductor fabrication process (or process) grows a silicon substrate layer, and forms multiple p-type and n-type transistors along a front side surface of the silicon substrate layer. The process flips the silicon substrate layer and removes silicon substrate leaving a particular thickness of the silicon substrate layer. The process forms multiple p-type and n-type transistors along the back side surface of the silicon substrate layer, and forms metal layers that connect terminals of the transistors formed along the back side surface to particular signals. The process forms through silicon vias (TSVs) that traverse through the silicon substrate layer. The process again flips the silicon substrate layer, and forms metal layers that connect terminals of the transistors formed along the front side surface to particular signals.

Abstract: A welding method includes pressing multiple objects together by a jig and irradiating the objects with laser to form multiple welded spots. The welded spots may include multiple first welded spots formed in a first direction and multiple second welded spots formed in the first direction and misaligned with the first welded spots in a second direction which is perpendicular to the first direction. A gap between the center of each of the first welded spots and the center of each of the second welded spots in the second direction. Another gap between the first welded spots in the first direction. And a gap between the second welded spots in the first direction may be greater than or equal to the radius of the second welded spot and less than or equal to a value of about 1 mm plus a diameter of the second welded spot.

Abstract: An electric range is provided that may include a case, a cover plate coupled to an upper side of the case, and on which an object to be heated is placed, an air blowing fan discharging air, and an air guide that communicates with the air blowing fan, and forms a flow path of air. The air guide comprises a first air guide that communicates with the air blowing fan and guides the air discharged from the air blow fan substantially horizontally, and an expansion protrusion that protrudes from the first air guide in a lengthwise direction of the air guide or in a direction perpendicular to the lengthwise direction of the air guide such that a cross section of the air guide expands.

Abstract: A method and machine for cutting and removing a workpiece part from a plate-shaped material includes cutting the workpiece part with a beam or jet directed onto the material and separating the workpiece part and material. The workpiece part is removed as a scrap skeleton removal part. The cut-free workpiece part is lifted out of a workpiece supporting plane by a lifting device and removed by a gripping device, or the cut-free workpiece part is removed downwards from the plane through a gap between workpiece supporting surfaces by an ejection device, or gravity removes the cut-free workpiece part downwards through the gap. Before cutting the workpiece part free, a sacrificial part adjoining the workpiece part and partially having a common cutting line with the workpiece part is cut free from the material before cutting the workpiece part free in the material or scrap skeleton.

Abstract: A power tool includes a handle assembly, a power supply, and a temperature control module; where the handle assembly includes a left grip and a right grip, where a first end of the left grip is coupled to a body of the power tool, a second end of the left grip is coupled to a first end of the right grip, and a second end of the right grip is coupled to the body of the power tool; the temperature control module is coupled to the handle assembly and the power supply separately; and the power supply is configured to power the temperature control module so that the temperature control module is configured to heat the handle assembly.

Abstract: A substrate processing apparatus includes: a substrate holder configured to hold a substrate while being locally superimposed on a back surface of the substrate; a light irradiator configured to irradiate the back surface with light so as to remove an organic substance on the back surface of the substrate; a light shielding member provided at a back side of the substrate while being spaced apart from the back surface so as to prevent the light from being supplied to a front surface of the substrate; and a holding position changing mechanism configured to change a holding position by the substrate holder on the back surface of the substrate so as to irradiate the entire back surface of the substrate with the light.

Abstract: A method of forming fully aligned vias in a semiconductor device, the method including forming a first level interconnect line embedded in a first interlevel dielectric (ILD), selectively depositing a dielectric on the first interlevel dielectric, laterally etching the selectively deposited dielectric, depositing a dielectric cap layer and a second level interlevel dielectric on top of the first interlevel dielectric, and forming a via opening.

Abstract: Described herein are examples of systems that include a welding machine and a welding screen assembly communicatively linked to the welding machine. The welding screen assembly may include an adjustable opacity dimming screen and a coupling component configured to detachably couple the adjustable opacity dimming screen to a handpiece of the welding machine, wherein the coupling component may enable adjustable positioning of the dimming screen in relation to the handpiece. The welding screen assembly may further include a light source positioned on a side of the assembly proximal to a weld site and a control system configured to adjust the opacity of the adjustable opacity dimming screen to block excessive light during welding.

Abstract: A plasma processing method includes: setting a temperature of a substrate support surface to a first temperature; supplying electric power from an electric power adjuster to a heater; before plasma is generated, when the temperature of the substrate support surface measured by a temperature sensor stabilizes at the first temperature, measuring first electric power supplied to the heater; after the plasma is generated, when the temperature of the substrate support surface measured by the temperature sensor stabilizes at the first temperature, measuring second electric power supplied to the heater; calculating an input heat quantity input from the plasma based on the first electric power and the second electric power; and correcting the first temperature to a second temperature based on the input heat quantity and a thermal resistance between the substrate support and the temperature sensor or between a substrate and the temperature sensor.

Abstract: An arc welding method includes welding a steel sheet while alternately switching feeding of a welding wire between forward feeding and backward feeding. The welding wire contains, in mass % with respect to a total mass to the welding wire, C: more than 0 and 0.30 or less, Si: 0.01 to 0.30, Mn: 0.5 to 2.5, S: 0.001 to 0.020, Ti: 0.05 to 0.30, and optional elements with the remainder being Fe and unavoidable impurities, and a value obtained by 2×[Ti]/[Si]?50×[S] is more than 1.0. The welding is performed by using a shielding gas containing CO2 gas in an amount of 80 vol. % or more with respect to a total volume of the shielding gas at a frequency of 40 Hz or more and 200 Hz or less, where one cycle for determining the frequency is one forward feeding and one backward feeding.

Abstract: A hairstyling device is provided. The hairstyling device includes a heatable hair contact member having a hair-contactable surface, the hair contact member being operable to apply heat to hair via the hair-contactable surface. The hairstyling device includes a controller configured to monitor power draw associated with heating of the hair contact member during heating of hair of a user via the hair-contactable surface. Based on the monitored power draw, one or more hair damage parameters indicative of damage of the heated hair are calculated. The controller is configured to control the hairstyling device based on the one or more calculated hair damage parameters.

Abstract: A batch processing chamber and a process kit for use therein are provided. The process kit includes an outer liner having an upper outer liner and a lower outer liner, an inner liner, and a top plate and a bottom plate attached to an inner surface of the inner liner. The top plate and the bottom plate form an enclosure together with the inner liner, and a cassette is disposed within the enclosure. The cassette including shelves configured to retain a plurality of substrates thereon. The inner liner has inlet openings disposed on an injection side of the inner liner and configured to be in fluid communication with a gas injection assembly of a processing chamber, and outlet openings disposed on an exhaust side of the inner liner and configured to be in fluid communication with a gas exhaust assembly of the processing chamber. The inner surfaces of the enclosure comprise material configured to cause black-body radiation within the enclosure.