Abstract: A popsicle demolding machine for popsicles is provided that has one or two vertical channels, wherein the popsicle demolding machine receives a mold formed by a set of cavities. The popsicle demolding machine has a lower reservoir for heating water, and a demolding tank internally provided with a guide coupled to the demolding tank. The demolding tank receives hot water from the lower reservoir through a pump so that the hot water applies a thermal shock to walls of the set of cavities. The hot water flows back to the lower reservoir through upper ends of vertical capillaries, allowing the set of cavities to be peripherically heated, including walls of inner tubes of the set of cavities for modeling the vertical channels, so that the popsicles can be extracted without damaging walls of the vertical channels, making it possible to manufacture said popsicles.

Abstract: A heater includes a ceramic base and a heat generating resistor. The ceramic base includes a plurality of crystal particles made of silicon nitride and a first grain boundary phase located between the plurality of crystal particles and containing oxides of a rare earth element and silicon. The heat generating resistor is located inside the ceramic base. The ceramic base includes a first region including an interface with the heat generating resistor and a second region farther away from the heat generating resistor than the first region. The distribution amount of the first grain boundary phase is greater in the first region than in the second region.

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first plurality of conductive interconnect lines in and spaced apart by a first ILD layer, wherein individual ones of the first plurality of conductive interconnect lines comprise a first conductive barrier material along sidewalls and a bottom of a first conductive fill material. A second plurality of conductive interconnect lines is in and spaced apart by a second ILD layer above the first ILD layer, wherein individual ones of the second plurality of conductive interconnect lines comprise a second conductive barrier material along sidewalls and a bottom of a second conductive fill material, wherein the second conductive fill material is different in composition from the first conductive fill material.

Abstract: An electrode manufacturing device is disclosed. The electrode manufacturing device includes a transfer unit configured to transfer an electrode, a laser output unit configured to emit a laser beam to the electrode, a guide unit including a first surface and a second surface for guiding the electrode so that the electrode is transferred along a preset path while the laser beam is emitted, and a cleaning unit disposed adjacent to the guide unit, and configured to remove dust deposited on the guide unit, wherein the guide unit rotates between a first state and a second state, in the first state, the first surface is disposed to guide the electrode and the second surface is disposed to be cleaned by the cleaning unit, and in the second state, the first surface is disposed to be cleaned by the cleaning unit and the second surface is disposed to guide the electrode.

Abstract: A laser cutting light spot control system. The system includes an upper computer (1) and a laser cutting light spot control apparatus (2), wherein the upper computer is in communication connection with a main processor (3), and the upper computer is used for acquiring a light spot track parameter inputted by an operator, and transmitting the inputted light spot track parameter to the main processor; and the main processor fits the inputted light spot track parameters by means of a graphics processing module (4), so as to form light spot track graphics data, i.e., a cutting coordinate set. A storage module (5) is used for storing the light spot track parameter inputted by the operator, and the cutting coordinate set. The present application further relates to a laser cutting light spot control method.

Abstract: The invention relates to an electrode for a plasma cutting torch, comprising an electrode holder and an emission insert, which are frictionally, interlockingly and/or integrally joined to each other, characterized in that the emission insert is made of an alloy at least of tungsten and at least one of the following elements or compounds: zirconium and/or hafnium and/or zirconium oxide and/or hafnium oxide; to an assembly having said electrode; to a plasma cutting torch having said electrode; and to a method for plasma cutting.

Abstract: An electronic device manufacturing system includes a transfer chamber, a tool station situated within the transfer chamber, a process chamber coupled to the transfer chamber, and a transfer chamber robot. The transfer chamber robot is configured to transfer substrates to and from the process chamber. The transfer chamber robot is further configured to be coupled to a sensor tool comprising one or more sensors configured to take measurements inside the process chamber. The sensor tool is retrievable from the tool station by an end effector of the transfer chamber robot.

Abstract: A system is provided, including: an aerosol-generating device and/or a charging device associated with an aerosol-generating device; a near-field communication module including a nonvolatile memory; and a controller configured to receive an indication of an error occurrence and to update an error data log stored in the nonvolatile memory by storing an error data entry associated with the error occurrence to the error data log, the error data entry being configured to be read by an external device even when the aerosol-generating device and/or the charging device including the near-field communication module is not powered. A method for maintaining error data on an aerosol-generating device and/or a charging device associated with an aerosol-generating device is also provided. A method for recovery of error data from an aerosol-generating device and/or a charging device associated with an aerosol-generating device is also provided.

Abstract: A rail apparatus, a laser apparatus, and a laser machining device are provided in the present disclosure. The rail apparatus includes a rail frame assembly and a mounting assembly. The rail frame assembly includes a rail frame and a guide shaft fixed to the rail frame. The mounting assembly includes a mounting base and a pulley. The pulley defines a sliding groove. The sliding groove is slidably connected with the guide shaft. The laser apparatus includes a base, a laser, and a focusing member. The laser is disposed on the base and is configured to emit a laser light. The focusing member is movably disposed on the base and has a focusing end. The laser apparatus is operable in a retracting state and an extending state. The laser machining device includes the rail apparatus and the laser apparatus.

Abstract: A heater includes a base body, a conductive module, and an infrared electrothermal coating. The conductive module includes a first electrode and a second electrode spaced on the base body. The first electrode includes a first bar electrode axially extending from a first end to a second end, the second electrode includes a second bar electrode axially extending from the first end to the second end, and at least a part of the infrared electrothermal coating is located between the first bar electrode and the second bar electrode. An equivalent resistance of a part of the infrared electrothermal coating adjacent to the first end is less than an equivalent resistance of a middle part of the infrared electrothermal coating. An equivalent resistance of a part of the infrared electrothermal coating adjacent to the second end is less than the equivalent resistance of the middle part of the infrared electrothermal coating.

Abstract: The present disclosure relates to a silicon-controlled rectifier water-cooling heat dissipation device, including: a water-cooling cavity body; a silicon-controlled rectifier; and a heat dissipation plate. The heat dissipation plate includes: a first heat dissipation part configured to contact the water-cooling cavity body; and a second heat dissipation part connected to the first heat dissipation part and configured to contact the silicon-controlled rectifier. A preset included angle is formed between a plane where the first heat dissipation part is located and a plane where the second heat dissipation part is located. The heat of the silicon-controlled rectifier is transferred to the water-cooling cavity body through the heat dissipation plate. An occupied volume can be effectively reduced because the first heat dissipation part and the second heat dissipation part form the included angle. The cooling water takes away the heat by the flowability of the water to improve heat dissipation efficiency.

Abstract: A muffler cover for an appliance includes a first room, second room, and a first channel. The second room is positioned separate from the first room. The first channel is connected to the first room via a first inlet and connected to the second room via a first outlet. The first channel changes from a first direction to a second direction and changes from the second direction to a third direction. The first direction is substantially opposite to the second direction, and the second direction is substantially opposite to the third direction. A muffler and an appliance using the muffler are also provided.

Abstract: Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, a data processing system may include hardware components that provide the computer implemented services. Any of the hardware components may have a limited thermal operating range. To retain the temperatures of hardware components within their operating ranges, the data processing system may include heat sinks fitted to the hardware components that are both able to cool and warm the fitted hardware components.

Abstract: A heated baby bottle assembly includes a baby bottle for containing a fluid baby food. An insulating layer is wrapped around the baby bottle and the insulating layer is comprised of a thermally insulating material thereby inhibiting thermal communication between the baby bottle and ambient air. A pair of nipples is provided and a respective one of the nipples is removably attachable to the baby bottle thereby facilitating the fluid baby food to be consumed through the respective nipple. A heating element is integrated into the baby bottle to heat the baby bottle when the heating element is turned on thereby heating the fluid baby food in the baby bottle. A control unit is integrated into the baby bottle and the control unit actuates the heating element to a selectable temperature thereby facilitating the fluid baby food to be retained at the selected temperature.

Abstract: Additive manufacturing systems and related methods are disclosed. In some embodiments, an additive manufacturing system includes a build surface, one or more laser energy sources configured to emit laser energy, an optical phased array operatively coupled to the one or more laser energy sources, and a Risley prism assembly comprising a plurality of wedge prisms. The optical phased array includes one or more phase shifters operatively coupled to the one or more laser energy sources and configured to control a phase of the laser energy. The optical phased array is configured to direct the laser energy towards the Risley prism assembly, and the Risley prism assembly is configured to direct the laser energy towards the build surface.

Abstract: An electric range is provided that may include a case, a cover plate coupled to an upper side of the case and on which an object to be heated is placed, at least one heater that heats the object, the at least one heater being disposed under the cover plate, an upper bracket that is disposed under the at least one heater and supports the at least one heater, a base bracket disposed under the upper bracket and on which a printed circuit board is mounted, a heat sink mounted on the printed circuit board, an air blowing fan that is mounted on the base bracket and discharges air toward the heat sink through an outlet thereof, and an air guide that communicates with the air blowing fan, surrounds the heat sink, and forms a flow path of air cooling the heat sink.

Abstract: An apparatus and method for efficiently increasing semiconductor chip functionality in a particular area. A semiconductor fabrication process (or process) grows a silicon substrate layer, and forms multiple p-type and n-type transistors along a front side surface of the silicon substrate layer. The process flips the silicon substrate layer and removes silicon substrate leaving a particular thickness of the silicon substrate layer. The process forms multiple p-type and n-type transistors along the back side surface of the silicon substrate layer, and forms metal layers that connect terminals of the transistors formed along the back side surface to particular signals. The process forms through silicon vias (TSVs) that traverse through the silicon substrate layer. The process again flips the silicon substrate layer, and forms metal layers that connect terminals of the transistors formed along the front side surface to particular signals.

Abstract: A welding method includes pressing multiple objects together by a jig and irradiating the objects with laser to form multiple welded spots. The welded spots may include multiple first welded spots formed in a first direction and multiple second welded spots formed in the first direction and misaligned with the first welded spots in a second direction which is perpendicular to the first direction. A gap between the center of each of the first welded spots and the center of each of the second welded spots in the second direction. Another gap between the first welded spots in the first direction. And a gap between the second welded spots in the first direction may be greater than or equal to the radius of the second welded spot and less than or equal to a value of about 1 mm plus a diameter of the second welded spot.

Abstract: An electric range is provided that may include a case, a cover plate coupled to an upper side of the case, and on which an object to be heated is placed, an air blowing fan discharging air, and an air guide that communicates with the air blowing fan, and forms a flow path of air. The air guide comprises a first air guide that communicates with the air blowing fan and guides the air discharged from the air blow fan substantially horizontally, and an expansion protrusion that protrudes from the first air guide in a lengthwise direction of the air guide or in a direction perpendicular to the lengthwise direction of the air guide such that a cross section of the air guide expands.

Abstract: A method and machine for cutting and removing a workpiece part from a plate-shaped material includes cutting the workpiece part with a beam or jet directed onto the material and separating the workpiece part and material. The workpiece part is removed as a scrap skeleton removal part. The cut-free workpiece part is lifted out of a workpiece supporting plane by a lifting device and removed by a gripping device, or the cut-free workpiece part is removed downwards from the plane through a gap between workpiece supporting surfaces by an ejection device, or gravity removes the cut-free workpiece part downwards through the gap. Before cutting the workpiece part free, a sacrificial part adjoining the workpiece part and partially having a common cutting line with the workpiece part is cut free from the material before cutting the workpiece part free in the material or scrap skeleton.