Abstract: An electric kettle includes a power supply base, and a kettle main body to be removably mounted on the power supply base. The kettle main body has: a container having a bottomed cylindrical shape that contains a liquid; a nozzle provided in a lower part of a side surface of the container; and a valve mechanism that opens and closes a flow channel for the liquid from the container to the nozzle.

Abstract: A method of operating a cooking appliance includes receiving a temperature setpoint input for a preheating phase of a cooking operation; retrieving a default power level for at least one heating element in response to receiving the temperature setpoint input; directing the at least one heating element at the default power level over a thermal coupling classification period, the thermal coupling classification period being a portion of the preheating phase; determining a thermal coupling behavior of a cookware item provided on the at least one heating element after an expiration of the thermal coupling classification period; and adjusting one or more parameters of the preheating phase based on the thermal coupling behavior of the cookware item.

Abstract: An exhaust gas heater for an exhaust gas system of an internal combustion engine includes a carrier arrangement and a heating conductor arrangement carried on the carrier arrangement. The heating conductor arrangement has at least one heating conductor. At least one carrier-arrangement supporting unit is provided for carrying the heating conductor in an electrically insulated manner with respect to the carrier arrangement. The carrier-arrangement supporting unit includes at least one of the following: an insulating coating applied to the carrier arrangement; and, an insulating coating applied to the heating conductor supported on the carrier arrangement via the carrier-arrangement supporting unit.

Abstract: A method for stripping a rod-shaped conductor using laser radiation is provided. The rod-shaped conductor includes an electrically conductive core and a coating that is at least partially transparent to the laser radiation. The method includes traversing the conductor for a first time with at least one laser beam to at least partially reduce transparency of the coating, and traversing the conductor for a second time with the at least one laser beam to at least partially reduce adhesion of the coating.

Abstract: A laser welding mechanism includes a main body having a space and two securing devices which are respectively attached to two ends of the body. A linkage assembly includes a bearing and a linkage tube. A refraction mirror unit includes two mirrors connected to the linkage tube of the linkage assembly. A laser unit is pivotally connected to a swinging member which is connected to the linkage tube of the linkage assembly. A drive unit including a motor, a driving gear, and a driven gear. A rotation unit is connected to the swinging member of the laser unit. The laser unit rotates relative to the first workpiece and the second workpiece during welding, ensuring a stable rotation at the joining faces of the two workpieces.

Abstract: A laser-processing apparatus is disclosed. In one embodiment, the laser-processing apparatus includes a debris removal system with an integrated beam dump system, the beam dump system operative to selectively position an absorber within the beam path of a beam of laser energy. The beam dump system may allow the beam of laser energy to propagate through the scan lens of the laser-processing apparatus, but prevent the beam of laser energy from processing a workpiece. The beam dump system may include an actuator assembly operative to retract the absorber from the beam path, thereby allowing the beam to propagate to the workpiece and for debris from laser processing to be drawn into a vacuum nozzle, thereby preventing damage to the scan lens. The beam dump system may further include a heat transfer system operative to control the rate of heat transferred away from the absorber.

Abstract: There is provided a technique, which includes: a process chamber where a substrate is processed; a microwave oscillator configured to supply microwaves to the process chamber; and a controller configured to be capable of controlling the microwave oscillator to perform: a heating process where the substrate is heated with a first microwave, among the supplied microwaves, supplied at a first microwave power so that a process of supplying the first microwave during a supply time and a process of stopping the supply of the first microwave during a stop time shorter than the supply time are performed a predetermined number of times or for a first predetermined time; and a modifying process in which the substrate is supplied with a second microwave, among the supplied microwaves, at a second microwave power higher than the first microwave power for a second predetermined time while maintaining the second microwave power.

Abstract: An electric heating device comprises a housing having a partition wall, which separates a connection chamber from a heating chamber for dissipating heat and from which PTC heating devices protrude as heating ribs in the direction toward the heating chamber. Each PTC heating device comprises at least one PTC element and conductor tracks that are electrically connected in the connection chamber for energizing the PTC element with different polarities and that are connected to the PTC element in an electrically conductive manner. The heating chamber, in a top view onto the partition wall, has a substantially rectangular base area. The PTC heating devices are arranged obliquely relative to the base area for a more compact configuration of the electric heating device.

Abstract: A popsicle demolding machine for popsicles is provided that has one or two vertical channels, wherein the popsicle demolding machine receives a mold formed by a set of cavities. The popsicle demolding machine has a lower reservoir for heating water, and a demolding tank internally provided with a guide coupled to the demolding tank. The demolding tank receives hot water from the lower reservoir through a pump so that the hot water applies a thermal shock to walls of the set of cavities. The hot water flows back to the lower reservoir through upper ends of vertical capillaries, allowing the set of cavities to be peripherically heated, including walls of inner tubes of the set of cavities for modeling the vertical channels, so that the popsicles can be extracted without damaging walls of the vertical channels, making it possible to manufacture said popsicles.

Abstract: A heater includes a ceramic base and a heat generating resistor. The ceramic base includes a plurality of crystal particles made of silicon nitride and a first grain boundary phase located between the plurality of crystal particles and containing oxides of a rare earth element and silicon. The heat generating resistor is located inside the ceramic base. The ceramic base includes a first region including an interface with the heat generating resistor and a second region farther away from the heat generating resistor than the first region. The distribution amount of the first grain boundary phase is greater in the first region than in the second region.

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first plurality of conductive interconnect lines in and spaced apart by a first ILD layer, wherein individual ones of the first plurality of conductive interconnect lines comprise a first conductive barrier material along sidewalls and a bottom of a first conductive fill material. A second plurality of conductive interconnect lines is in and spaced apart by a second ILD layer above the first ILD layer, wherein individual ones of the second plurality of conductive interconnect lines comprise a second conductive barrier material along sidewalls and a bottom of a second conductive fill material, wherein the second conductive fill material is different in composition from the first conductive fill material.

Abstract: An electrode manufacturing device is disclosed. The electrode manufacturing device includes a transfer unit configured to transfer an electrode, a laser output unit configured to emit a laser beam to the electrode, a guide unit including a first surface and a second surface for guiding the electrode so that the electrode is transferred along a preset path while the laser beam is emitted, and a cleaning unit disposed adjacent to the guide unit, and configured to remove dust deposited on the guide unit, wherein the guide unit rotates between a first state and a second state, in the first state, the first surface is disposed to guide the electrode and the second surface is disposed to be cleaned by the cleaning unit, and in the second state, the first surface is disposed to be cleaned by the cleaning unit and the second surface is disposed to guide the electrode.

Abstract: A laser cutting light spot control system. The system includes an upper computer (1) and a laser cutting light spot control apparatus (2), wherein the upper computer is in communication connection with a main processor (3), and the upper computer is used for acquiring a light spot track parameter inputted by an operator, and transmitting the inputted light spot track parameter to the main processor; and the main processor fits the inputted light spot track parameters by means of a graphics processing module (4), so as to form light spot track graphics data, i.e., a cutting coordinate set. A storage module (5) is used for storing the light spot track parameter inputted by the operator, and the cutting coordinate set. The present application further relates to a laser cutting light spot control method.

Abstract: The invention relates to an electrode for a plasma cutting torch, comprising an electrode holder and an emission insert, which are frictionally, interlockingly and/or integrally joined to each other, characterized in that the emission insert is made of an alloy at least of tungsten and at least one of the following elements or compounds: zirconium and/or hafnium and/or zirconium oxide and/or hafnium oxide; to an assembly having said electrode; to a plasma cutting torch having said electrode; and to a method for plasma cutting.

Abstract: An electronic device manufacturing system includes a transfer chamber, a tool station situated within the transfer chamber, a process chamber coupled to the transfer chamber, and a transfer chamber robot. The transfer chamber robot is configured to transfer substrates to and from the process chamber. The transfer chamber robot is further configured to be coupled to a sensor tool comprising one or more sensors configured to take measurements inside the process chamber. The sensor tool is retrievable from the tool station by an end effector of the transfer chamber robot.

Abstract: A system is provided, including: an aerosol-generating device and/or a charging device associated with an aerosol-generating device; a near-field communication module including a nonvolatile memory; and a controller configured to receive an indication of an error occurrence and to update an error data log stored in the nonvolatile memory by storing an error data entry associated with the error occurrence to the error data log, the error data entry being configured to be read by an external device even when the aerosol-generating device and/or the charging device including the near-field communication module is not powered. A method for maintaining error data on an aerosol-generating device and/or a charging device associated with an aerosol-generating device is also provided. A method for recovery of error data from an aerosol-generating device and/or a charging device associated with an aerosol-generating device is also provided.

Abstract: A rail apparatus, a laser apparatus, and a laser machining device are provided in the present disclosure. The rail apparatus includes a rail frame assembly and a mounting assembly. The rail frame assembly includes a rail frame and a guide shaft fixed to the rail frame. The mounting assembly includes a mounting base and a pulley. The pulley defines a sliding groove. The sliding groove is slidably connected with the guide shaft. The laser apparatus includes a base, a laser, and a focusing member. The laser is disposed on the base and is configured to emit a laser light. The focusing member is movably disposed on the base and has a focusing end. The laser apparatus is operable in a retracting state and an extending state. The laser machining device includes the rail apparatus and the laser apparatus.

Abstract: A heater includes a base body, a conductive module, and an infrared electrothermal coating. The conductive module includes a first electrode and a second electrode spaced on the base body. The first electrode includes a first bar electrode axially extending from a first end to a second end, the second electrode includes a second bar electrode axially extending from the first end to the second end, and at least a part of the infrared electrothermal coating is located between the first bar electrode and the second bar electrode. An equivalent resistance of a part of the infrared electrothermal coating adjacent to the first end is less than an equivalent resistance of a middle part of the infrared electrothermal coating. An equivalent resistance of a part of the infrared electrothermal coating adjacent to the second end is less than the equivalent resistance of the middle part of the infrared electrothermal coating.

Abstract: The present disclosure relates to a silicon-controlled rectifier water-cooling heat dissipation device, including: a water-cooling cavity body; a silicon-controlled rectifier; and a heat dissipation plate. The heat dissipation plate includes: a first heat dissipation part configured to contact the water-cooling cavity body; and a second heat dissipation part connected to the first heat dissipation part and configured to contact the silicon-controlled rectifier. A preset included angle is formed between a plane where the first heat dissipation part is located and a plane where the second heat dissipation part is located. The heat of the silicon-controlled rectifier is transferred to the water-cooling cavity body through the heat dissipation plate. An occupied volume can be effectively reduced because the first heat dissipation part and the second heat dissipation part form the included angle. The cooling water takes away the heat by the flowability of the water to improve heat dissipation efficiency.

Abstract: A muffler cover for an appliance includes a first room, second room, and a first channel. The second room is positioned separate from the first room. The first channel is connected to the first room via a first inlet and connected to the second room via a first outlet. The first channel changes from a first direction to a second direction and changes from the second direction to a third direction. The first direction is substantially opposite to the second direction, and the second direction is substantially opposite to the third direction. A muffler and an appliance using the muffler are also provided.