Abstract: A welding method includes pressing multiple objects together by a jig and irradiating the objects with laser to form multiple welded spots. The welded spots may include multiple first welded spots formed in a first direction and multiple second welded spots formed in the first direction and misaligned with the first welded spots in a second direction which is perpendicular to the first direction. A gap between the center of each of the first welded spots and the center of each of the second welded spots in the second direction. Another gap between the first welded spots in the first direction. And a gap between the second welded spots in the first direction may be greater than or equal to the radius of the second welded spot and less than or equal to a value of about 1 mm plus a diameter of the second welded spot.

Abstract: An electric range is provided that may include a case, a cover plate coupled to an upper side of the case, and on which an object to be heated is placed, an air blowing fan discharging air, and an air guide that communicates with the air blowing fan, and forms a flow path of air. The air guide comprises a first air guide that communicates with the air blowing fan and guides the air discharged from the air blow fan substantially horizontally, and an expansion protrusion that protrudes from the first air guide in a lengthwise direction of the air guide or in a direction perpendicular to the lengthwise direction of the air guide such that a cross section of the air guide expands.

Abstract: A method and machine for cutting and removing a workpiece part from a plate-shaped material includes cutting the workpiece part with a beam or jet directed onto the material and separating the workpiece part and material. The workpiece part is removed as a scrap skeleton removal part. The cut-free workpiece part is lifted out of a workpiece supporting plane by a lifting device and removed by a gripping device, or the cut-free workpiece part is removed downwards from the plane through a gap between workpiece supporting surfaces by an ejection device, or gravity removes the cut-free workpiece part downwards through the gap. Before cutting the workpiece part free, a sacrificial part adjoining the workpiece part and partially having a common cutting line with the workpiece part is cut free from the material before cutting the workpiece part free in the material or scrap skeleton.

Abstract: A power tool includes a handle assembly, a power supply, and a temperature control module; where the handle assembly includes a left grip and a right grip, where a first end of the left grip is coupled to a body of the power tool, a second end of the left grip is coupled to a first end of the right grip, and a second end of the right grip is coupled to the body of the power tool; the temperature control module is coupled to the handle assembly and the power supply separately; and the power supply is configured to power the temperature control module so that the temperature control module is configured to heat the handle assembly.

Abstract: A substrate processing apparatus includes: a substrate holder configured to hold a substrate while being locally superimposed on a back surface of the substrate; a light irradiator configured to irradiate the back surface with light so as to remove an organic substance on the back surface of the substrate; a light shielding member provided at a back side of the substrate while being spaced apart from the back surface so as to prevent the light from being supplied to a front surface of the substrate; and a holding position changing mechanism configured to change a holding position by the substrate holder on the back surface of the substrate so as to irradiate the entire back surface of the substrate with the light.

Abstract: A method of forming fully aligned vias in a semiconductor device, the method including forming a first level interconnect line embedded in a first interlevel dielectric (ILD), selectively depositing a dielectric on the first interlevel dielectric, laterally etching the selectively deposited dielectric, depositing a dielectric cap layer and a second level interlevel dielectric on top of the first interlevel dielectric, and forming a via opening.

Abstract: Described herein are examples of systems that include a welding machine and a welding screen assembly communicatively linked to the welding machine. The welding screen assembly may include an adjustable opacity dimming screen and a coupling component configured to detachably couple the adjustable opacity dimming screen to a handpiece of the welding machine, wherein the coupling component may enable adjustable positioning of the dimming screen in relation to the handpiece. The welding screen assembly may further include a light source positioned on a side of the assembly proximal to a weld site and a control system configured to adjust the opacity of the adjustable opacity dimming screen to block excessive light during welding.

Abstract: A plasma processing method includes: setting a temperature of a substrate support surface to a first temperature; supplying electric power from an electric power adjuster to a heater; before plasma is generated, when the temperature of the substrate support surface measured by a temperature sensor stabilizes at the first temperature, measuring first electric power supplied to the heater; after the plasma is generated, when the temperature of the substrate support surface measured by the temperature sensor stabilizes at the first temperature, measuring second electric power supplied to the heater; calculating an input heat quantity input from the plasma based on the first electric power and the second electric power; and correcting the first temperature to a second temperature based on the input heat quantity and a thermal resistance between the substrate support and the temperature sensor or between a substrate and the temperature sensor.

Abstract: An arc welding method includes welding a steel sheet while alternately switching feeding of a welding wire between forward feeding and backward feeding. The welding wire contains, in mass % with respect to a total mass to the welding wire, C: more than 0 and 0.30 or less, Si: 0.01 to 0.30, Mn: 0.5 to 2.5, S: 0.001 to 0.020, Ti: 0.05 to 0.30, and optional elements with the remainder being Fe and unavoidable impurities, and a value obtained by 2×[Ti]/[Si]?50×[S] is more than 1.0. The welding is performed by using a shielding gas containing CO2 gas in an amount of 80 vol. % or more with respect to a total volume of the shielding gas at a frequency of 40 Hz or more and 200 Hz or less, where one cycle for determining the frequency is one forward feeding and one backward feeding.

Abstract: A hairstyling device is provided. The hairstyling device includes a heatable hair contact member having a hair-contactable surface, the hair contact member being operable to apply heat to hair via the hair-contactable surface. The hairstyling device includes a controller configured to monitor power draw associated with heating of the hair contact member during heating of hair of a user via the hair-contactable surface. Based on the monitored power draw, one or more hair damage parameters indicative of damage of the heated hair are calculated. The controller is configured to control the hairstyling device based on the one or more calculated hair damage parameters.

Abstract: A batch processing chamber and a process kit for use therein are provided. The process kit includes an outer liner having an upper outer liner and a lower outer liner, an inner liner, and a top plate and a bottom plate attached to an inner surface of the inner liner. The top plate and the bottom plate form an enclosure together with the inner liner, and a cassette is disposed within the enclosure. The cassette including shelves configured to retain a plurality of substrates thereon. The inner liner has inlet openings disposed on an injection side of the inner liner and configured to be in fluid communication with a gas injection assembly of a processing chamber, and outlet openings disposed on an exhaust side of the inner liner and configured to be in fluid communication with a gas exhaust assembly of the processing chamber. The inner surfaces of the enclosure comprise material configured to cause black-body radiation within the enclosure.

Abstract: An aerosol provision device is provided. The device comprises a receptacle configured to receive aerosol generating material, wherein the aerosol generating material is heatable by a susceptor. The device further comprises an inductor coil extending around the receptacle, wherein the inductor coil is configured to generate a varying magnetic field for heating the susceptor. The device further comprises a magnetic shield member extending at least partially around the inductor coil.

Abstract: An electronic device which can suppress peeling off and damaging of the bonding material is provided. The electronic device includes an electronic component, a mounting portion, and a bonding material. The electronic component has an element front surface and an element back surface separated in the z-direction. The mounting portion has a mounting surface opposed to the element back surface on which the electronic component is mounted. The bonding material bonds the electronic component to the mounting portion. The bonding material includes a base portion and a fillet portion. The base portion is held between the electronic component and the mounting portion in the z-direction. The fillet portion is connected to the base portion and is formed outside the electronic component when seen in the z-direction. The electronic component includes two element lateral surface and ridges. The ridges are intersections of the two element lateral surface and extend in the z-direction.

Abstract: An apparatus is provided that includes an integrated circuit die that includes an uppermost metal layer of an integrated circuit fabrication process, a plurality of first bonding pads disposed on the uppermost metal layer at a first bonding pad pitch, a first additional metal layer disposed above the uppermost metal layer, and a plurality of second bonding pads disposed on the first additional metal layer at a second bonding pad pitch greater than the first bonding pad pitch. The apparatus further includes a plurality of conductors each electrically coupling a unique one of the first bonding pads to a corresponding one of the second bonding pads.

Abstract: Various embodiments include a thermal storage system for storing energy in a graphite thermal storage structure and a thermal shutter assembly configured to control the transmission of heat from the graphite thermal storage structure to a thermal energy receiver, such as a heat exchanger or material processing crucible. A thermal storage block, which may be made of graphite, may be isolated by insulation except for the thermal shutter assembly. Energy may be stored in the graphite thermal storage block by applying energy to the block to raise its temperature to maximum operation temperature. Stored energy may then be harvested in a controlled manner by a control system actuating the thermal shutter to expose the thermal energy receiver to thermal radiation.

Abstract: Semiconductor module including a semiconductor and including a shaped metal body that is electrically contacted by the semiconductor, for forming a contact surface for an electrical conductor, wherein the shaped metal body is bent or folded. A method is also described for establishing electrical contacting of an electrical conductor on a semiconductor, said method including the steps of: fastening a bent or folded shaped metal body of a constant thickness to the semiconductor by means of a first fastening method and then fastening the electrical conductor to the shaped metal body by means of a second fastening method.

Abstract: An example welding torch includes: a handle piece that is electrically and mechanically connected to the torch head on a first end of the handle piece; a power supply connector configured to be coupled to a welding power supply on a first end of the power supply connector, wherein at least one of the handle piece or the power supply connector are a single piece; a welding cable that is electrically and mechanically connected to both a second end of the handle and a second end of the power supply connector; a first cover over the torch head, the handle piece, and a first portion of the welding cable connected to the handle piece; and a second cover over the power supply connector and a second portion of the welding cable connected to the power supply connector.

Abstract: A device for cooking food products by heat treatment comprises a housing and also a hinged lid connected to said housing by means of universal pivotable fastening devices. Electric heating elements are mounted inside the housing and on the inner side of the hinged lid, and control panels for controlling the electric heating elements are disposed on a lateral side of the housing and on the hinged lid. The device can contain two hinged lids which can be lifted away from the housing simultaneously or individually and are capable of pivoting through 90°, 180° or 270°.

Abstract: A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.

Abstract: Disclosed is a method of treating a substrate, the method including: supplying a liquid to the substrate, emitting a laser to the substrate supplied with the liquid to heat the substrate, and emitting imaging light for capturing the substrate to obtain an image of the substrate including a region to which the laser is emitted, in which the laser and the imaging light are emitted to the substrate through a head lens, and a divergence angle of the laser emitted from the head lens and a divergence angle of the imaging light are matched with each other.