Patents Examined by Robert J. Pascal
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Patent number: 10812021Abstract: Antenna waveguide transitions for solid state power amplifiers (SSPAs) are disclosed. An SSPA includes a waveguide channel that is configured to propagate an input signal, such as an electromagnetic signal, from an input port to a solid state amplifier for amplification. The waveguide channel is further configured to propagate an amplified signal from the solid state amplifier to an output port. Waveguide transitions to and from the solid state amplifier are bandwidth matched to the waveguide channel. Additionally, the waveguide transitions may be thermally coupled to the waveguide channel. The waveguide transitions may include antenna structures that have a signal conductor and a ground conductor. In this manner, the SSPA may have improved broadband coupling as well as improved thermal dissipation for heat generated by the solid state amplifier.Type: GrantFiled: July 11, 2018Date of Patent: October 20, 2020Assignee: Qorvo US, Inc.Inventors: Ankush Mohan, Soack Yoon, Dan Denninghoff
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Patent number: 10812041Abstract: An elastic wave device includes an IDT electrode on a piezoelectric substrate to define a longitudinally coupled resonator elastic wave filter, a three-dimensional wiring portion on the piezoelectric substrate and connected to the longitudinally coupled resonator elastic wave filter, and a cover surrounding the longitudinally coupled resonator elastic wave filter on the piezoelectric substrate. The three-dimensional wiring portion includes a lower layer wiring line, an upper layer wiring line, and an insulating layer stacked between the lower layer wiring line and the upper layer wiring line. The cover includes a portion on the three-dimensional wiring portion.Type: GrantFiled: November 21, 2018Date of Patent: October 20, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Takuya Koyanagi
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Patent number: 10813212Abstract: The multiband filter includes a printed circuit board, a first filter, a second filter having an outer dimension different from that of the first filter and passband frequencies higher than those of the first filter, an input terminal, an output terminal, a first inductor, a first capacitor, which are connected except the first capacitor by signal line conductor patterns to form a first transmission line, which connect the second filter, the input terminal, the output terminal, and the first capacitor to form a second transmission line, a part thereof in the first transmission line being arranged in an area on the printed circuit board, formed by the difference between the outer dimensions of the first and the second filters, to achieve desirable passbands and enough attenuation in a suppression band outside the passbands.Type: GrantFiled: November 8, 2016Date of Patent: October 20, 2020Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Takeshi Yuasa, Takeshi Oshima, Hiroyuki Aoyama
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Patent number: 10811751Abstract: Embodiments of the invention include an electromagnetic waveguide and methods of forming the electromagnetic waveguide. In an embodiment the electromagnetic waveguide includes a first spacer and a second spacer. In an embodiment, the first and second spacer each have a reentrant profile. The electromagnetic waveguide may also include a conductive body formed between in the first and second spacer, and a void formed within the conductive body. In an additional embodiment, the electromagnetic waveguide may include a first spacer and a second spacer. Additionally, the electromagnetic waveguide may include a first portion of a conductive body formed along sidewalls of the first and second spacer and a second portion of the conductive body formed between an upper portion of the first portion of the conductive body. In an embodiment, the first portion of the conductive body and the second portion of the conductive body define a void through the electromagnetic waveguide.Type: GrantFiled: December 30, 2016Date of Patent: October 20, 2020Assignee: Intel CorporationInventors: Rahul Ramaswamy, Chia-Hong Jan, Walid Hafez, Neville Dias, Hsu-Yu Chang, Roman Olac-Vaw, Chen-Guan Lee
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Patent number: 10811752Abstract: A waveguide coupler includes a waveguide having a first and a second port, and a slot formed in a broadwall of the waveguide between the first and second ports, the slot centered on the first broadwall. A plurality of shifted waveguide sections are arranged between the first and second ports and extend along a length of the waveguide. A parallel-plate transmission line structure is coupled to the slot, wherein RF signals within one of the waveguide or the parallel-plate transmission line are communicated to the other of the waveguide and the parallel-plate transmission line through the slot.Type: GrantFiled: March 15, 2019Date of Patent: October 20, 2020Assignee: ThinKom Solutions, Inc.Inventors: Shahrokh Hashemi-Yeganeh, William Milroy
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Patent number: 10812043Abstract: An acoustic wave filter device includes a first band pass filter including a first acoustic wave resonator connected between an antenna terminal and a first signal terminal and having a first pass band, and a second band pass filter connected with the antenna terminal and having a second pass band on a higher side of the first pass band. The first acoustic wave resonator includes a substrate on a surface of which a piezoelectric thin film is provided, an IDT electrode provided on the substrate, and reflectors. At least a pitch of some electrode fingers is different from a pitch of other electrode fingers in at least one of the IDT electrode and the reflectors of the first acoustic wave resonator on a side closest to the antenna terminal.Type: GrantFiled: April 4, 2019Date of Patent: October 20, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Yuichi Takamine
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Patent number: 10812051Abstract: Aspects of methods and systems for a matching circuit for a broadband bus in automotive applications are provided and may include a twisted pair wiring bus comprising a main line for coupling two end nodes and one or more stub lines, with each stub line coupling a stub node to the main line via a junction impedance on each wire in the stub line. Electrical signals may be communicated between devices coupled to the end nodes and the stub nodes. A subset of the stub nodes may be coupled to the main line in a star configuration. The junction impedance may comprise a resistor on each wire in the stub line where the resistor may have a resistance that is two to three times a nominal impedance of the main line. The junction impedance may comprise a resistor in parallel with an inductor on each wire in the stub line.Type: GrantFiled: August 21, 2018Date of Patent: October 20, 2020Assignee: MaxLinear, Inc.Inventor: Antonio Jimenez de Parga Bernal
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Patent number: 10812044Abstract: An acoustic wave device includes an IDT electrode provided on a piezoelectric substrate. The IDT electrode includes a crossing area including a central area, and first and second low-acoustic-velocity areas on both sides in a direction perpendicular or substantially perpendicular to an acoustic wave propagating direction. First and second high-acoustic-velocity areas are provided outside the first and second low-acoustic-velocity areas. Mass adding films are laminated in respective portions of first and second electrode fingers, the respective portions being positioned in the first and second low-acoustic-velocity areas. In at least one of the mass adding films, a width of a first end portion and a width of a second end portion are narrower than a width of a central portion, and a protruding portion protrudes from at least one of the first and second end portions.Type: GrantFiled: June 12, 2019Date of Patent: October 20, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Hiromu Okunaga
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Patent number: 10804874Abstract: Techniques that facilitate a superconducting combiner or separator of DC-currents and microwave signals are provided. In one example, a device includes a direct current circuit and a microwave circuit. The direct current circuit comprises a bandstop circuit and provides transmission of a direct current signal. The microwave circuit provides transmission of a microwave signal. The microwave circuit and the direct current circuit that comprises the bandstop circuit are joined by a common circuit that provides transmission of the direct current signal and the microwave signal.Type: GrantFiled: June 12, 2018Date of Patent: October 13, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: Baleegh Abdo
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Patent number: 10804588Abstract: Antenna structures for spatial power-combining devices are disclosed. A spatial power-combining device includes a plurality of amplifier assemblies, and each amplifier assembly includes an amplifier coupled between an input antenna and an output antenna. At least one of the input antenna or the output antenna comprises a nonlinear shape that is configured to propagate a signal along a nonlinear path to or from the amplifier with reduced signal loss. Accordingly, each amplifier may be configured on a corresponding amplifier assembly in a position such that each amplifier is spaced farther apart from other amplifiers in the spatial power-combining device. In this manner, heat generated by the amplifiers may be more evenly dissipated by the spatial power-combining device.Type: GrantFiled: December 10, 2018Date of Patent: October 13, 2020Assignee: Qorvo US, Inc.Inventors: Ankush Mohan, Dan Denninghoff, Soack Yoon
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Patent number: 10799216Abstract: A wave guide assembly for a control and diagnostic system for a machine includes a housing defining an exterior surface and an internal cavity extending between distal ends. At least one wave guide within the internal cavity defines a wave propagation passage for at least one wave form signal. At least one conductor within the internal cavity is separate from the wave guide. A control and diagnostic system for a machine and a gas turbine engine are also disclosed.Type: GrantFiled: May 10, 2019Date of Patent: October 13, 2020Assignee: Raytheon Technologies CorporationInventors: Eric J. Heims, Ryan K. Snyder, Kurt J. Sobanski
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Patent number: 10797676Abstract: Acoustic resonators with enhanced boundary conditions are disclosed. In an example aspect, a resonator includes a volume of piezoelectric material including an upper surface and a lower surface. The resonator also includes a bottom electrode extending along a portion of the lower surface of the volume of piezoelectric material. The resonator further includes a multi-layered top electrode extending along a portion of the upper surface of the volume of piezoelectric material. The multi-layered top electrode includes an active region including an interface layer of a first thickness, where the active region overlaps a portion of the bottom electrode. The multi-layered top electrode also includes a frame region including the interface layer of a second thickness, where the second thickness is greater than the first thickness. The multi-layered top electrode further includes an outer region including the interface layer of a third thickness, where the third thickness is less than the second thickness.Type: GrantFiled: September 15, 2017Date of Patent: October 6, 2020Assignee: QUALCOMM IncorporatedInventors: Oscar Menendez-Nadal, Thomas Bain Pollard, Brian Hal Fisher, Janardan Nath
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Patent number: 10797369Abstract: A waveguide-to-parallel-plate twist transition includes at least one waveguide-to-parallel plate twist transition element comprising an input port comprising an input waveguide portion, the input waveguide portion configured to orient an E-field of an electromagnetic wave along a first plane, and an output port comprising a multi-mode parallel plate portion, the multi-mode parallel plate portion configured to orient an E-field of an electromagnetic wave along a second plane, wherein an angle of orientation of the second plane is different from an angle of orientation of the first plane.Type: GrantFiled: June 22, 2018Date of Patent: October 6, 2020Assignee: THINKOM SOLUTIONS, INC.Inventors: William Milroy, Shahrokh Hashemi-Yeganeh
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Patent number: 10797680Abstract: An elastic wave device includes a supporting substrate, an acoustic reflection layer disposed on the supporting substrate, a piezoelectric layer disposed on the acoustic reflection layer, and an interdigital transducer electrode disposed on the piezoelectric layer. The acoustic reflection layer includes three or more low acoustic impedance layers and two or more high acoustic impedance layers. A film thickness of the low acoustic impedance layer closest to the piezoelectric layer is larger than a film thickness of the low acoustic impedance layer closest to the low acoustic impedance layer that is closest to the piezoelectric layer.Type: GrantFiled: November 1, 2018Date of Patent: October 6, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Masakazu Mimura
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Patent number: 10797371Abstract: Conduit structures for redirecting extremely high frequency (EHF) signals are disclosed herein. The conduit structures discussed herein are designed to re-direct EHF or RF signal energy from a first signal path to a second signal path. The conduit structures according to embodiments discussed herein can re-direct the RF signal energy while simultaneously adhering to specified signaling characteristic of the RF signal and minimizing stray RF signal radiation within a device to support device-to-device contactless communications.Type: GrantFiled: April 4, 2019Date of Patent: October 6, 2020Assignee: KEYSSA SYSTEMS, INC.Inventors: Alan Besel, Eric Sweetman, Bojana Zivanovic
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Patent number: 10790569Abstract: Aspects of the subject disclosure may include, receiving, by a waveguide system, a communication signal that conveys data; transmitting, via a coupler of the waveguide system, electromagnetic waves, where the electromagnetic waves propagate along a transmission medium without requiring an electrical return path, and where the electromagnetic waves convey the data; and mitigating, by the waveguide system, interference to the electromagnetic waves associated with residual electromagnetic waves propagating along the transmission medium. Other embodiments are disclosed.Type: GrantFiled: December 12, 2018Date of Patent: September 29, 2020Assignee: AT&T Intellectual Property I, L.P.Inventors: Robert Bennett, Irwin Gerszberg, Thomas M. Willis, III, Paul Shala Henry, Farhad Barzegar, Donald J. Barnickel, Giovanni Vannucci
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Patent number: 10790591Abstract: An integrated device comprises a horn antenna with an antenna waveguide feed, a waveguide transition element comprising a first end connected to the antenna waveguide feed and second end, and an orthomode transducer comprising a common waveguide connected to the second end of the waveguide transition element and at least two separate waveguides. The orthomode transducer is adapted to couple at least two orthogonal linear polarized fields into the common waveguide of the orthomode transducer with the aid of the at least two separate waveguides of the orthomode transducer and/or vice versa. The horn antenna is preferably adapted to support at least two waveguide modes corresponding to the at least two orthogonal linear polarized fields. The integrated device is preferably manufactured in at least two separate blocks such that each part of the at least two piece assembly is constructed as external protrusions and/or holes and/or partial holes.Type: GrantFiled: October 12, 2018Date of Patent: September 29, 2020Assignee: Rohde & Schwarz GmbH & Co. KGInventors: Corbett Rowell, Daniel Markert, Christian Riedel
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Patent number: 10784549Abstract: An ultra-wideband linear-to-circular polarizer is disclosed. In accordance with embodiments of the invention, the polarizer includes a plurality of cascaded waveplates having biaxial permittivity or cascaded anisotropic sheet impedances. Each waveplate/sheet has a principal axis rotated at different angles relative to an adjacent waveplate/sheet about a z-axis of a 3-dimensional x, y, z coordinate system. Each waveplate is composed of a unit cell of an artificial anisotropic dielectric. Each sheet impedance is composed of an anisotropic metallic pattern. The polarizer further includes impedance matching layers disposed adjacent the cascaded waveplates/sheets.Type: GrantFiled: November 13, 2018Date of Patent: September 22, 2020Assignee: The United States of America, as represented by the Secretary of the Air ForceInventors: Boris Tomasic, Carl R. Pfeiffer, Thomas P. Steffen
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Patent number: 10784838Abstract: Disclosed is an air gap type film bulk acoustic resonator (FBAR). The air gap type FBAR includes a substrate which includes an air gap portion in a top surface thereof, a lower electrode formed on the substrate, a piezoelectric layer formed on the lower electrode, and an upper electrode formed on the piezoelectric layer. Here, the lower electrode includes a first lower electrode formed spaced apart from the air gap portion in the substrate and a second lower electrode formed on the substrate to be separated from the first lower electrode by being stacked to surround only a part of a top of the air gap portion in order to form a non-deposition area of the air gap portion.Type: GrantFiled: May 3, 2018Date of Patent: September 22, 2020Assignee: WISOL CO., LTD.Inventor: Hoan Jun Choi
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Patent number: 10784552Abstract: According to one embodiment, a high-frequency power combiner has an external conductor and an internal conductor. The external conductor defines an internal space. The internal conductor has an output-side line and a plurality of input-side lines that branch off from the output-side line. The internal conductor is provided in the internal space of the external conductor. The high-frequency power combiner of the embodiment has a structure that can store a liquid in contact with the internal conductor in the internal space.Type: GrantFiled: September 18, 2018Date of Patent: September 22, 2020Assignees: Kabushiki Kaisha Toshiba, Toshiba Infrastructure Systems & Solutions CorporationInventor: Shunya Otsuki