Abstract: An acoustic wave device includes a supporting substrate, an acoustic reflection film the supporting substrate, a piezoelectric thin film on the acoustic reflection film, and an interdigital transducer electrode the piezoelectric thin film. The acoustic reflection film includes acoustic impedance layers including therein first, second, third, and fourth low acoustic impedance layers and first, second, and third high acoustic impedance layers. The acoustic reflection film includes a first acoustic impedance layer and a second acoustic impedance layer, the first and second acoustic impedance layers each being one of the acoustic impedance layers, and the second acoustic impedance layer has an arithmetic average roughness different from that of the first acoustic impedance layer.

Abstract: The present disclosure relates to a satellite signal feeding module and circuit board structure. The circuit board includes a dielectric substrate, a plurality of grounding sheets, a plurality of top feed sheets, a plurality of bottom feed sheets, and a conductive layer. The dielectric substrate includes a main segment having an opening, a rib segment extending across a full width of the opening, and a plurality of extending segments connected to the main segment. The grounding sheets cover the rib segment and a majority portion of the main segment. The top feeding sheets and the bottom sheets cover the extending segments. The conductive layer is disposed in first holes disposed in the main segment and the rib segment for electrically coupling the grounding sheets. The conductive layer is further disposed in second holes in the extending segments for electrically coupling the top and bottom feeding sheets.

Abstract: A CMOS gain element is disclosed herein. Also disclosed herein are splitters, comprising the CMOS gain element, and local oscillator distribution circuitry comprising the splitters and the CMOS gain elements. Semiconductor devices comprising the local oscillator distribution circuitry may have smaller footprints and reduced power consumption relative to prior art devices.

Abstract: Filter devices and methods of fabricating filter devices. A filter device includes a first chip and a second chip. The first chip has a first material stack and contains one or more series resonators of a ladder filter circuit. The second chip has a second material stack and contains one or more shunt resonators of the ladder filter circuit. The first material stack and the second material stack are different.

Abstract: An input/output apparatus of a multiplexer is provided, including: a main tap and at least two branch taps of the main tap, where each of the at least two branch taps is configured to couple to a different resonant cavity in the multiplexer, and the at least two branch taps include a first branch tap and a second branch tap; a coupling polarity of the first branch tap is opposite to that of the second branch tap; and a coupling calculation frequency of the second branch tap is closest to a coupling calculation frequency of the first branch tap. The input/output apparatus of the multiplexer enables two channels with closest frequencies to use different coupling polarities. Because the coupling polarities are different, signals naturally do not interfere with each other, and signal interference between channels is eliminated in principle. The embodiments of the present disclosure further provide a corresponding multiplexer.

Abstract: The present invention relates to the field of communications technology, and in particular, to technology related to impedance matching in communication technology, and in particular, to a dielectric phase shifting unit, dielectric phase shifter and base station antenna. It includes a feeding network and a dielectric plate for impedance matching and for moving along a predetermined path, an impedance matching portion of the dielectric plate being disposed on one end of the dielectric plate adjacent to an input port on the feeding network. The present invention not only reduces the number of impedance matching and network loss; it also reduces the equivalent electrical length of the entire network, effectively saving costs, reducing the complexity of disassembly and assembly of related components, and improves disassembly and assembly efficiency.

Abstract: An integrated circuit that includes a die with an active radio frequency (RF) unit embedded thereon; a first port for receiving an output signal from the active RF unit; a harmonic filter that comprises a first harmonic filter inductor; and a first RF inductive load that is electrically coupled to the first port and is magnetically coupled to the first harmonic filter inductor.

Abstract: A filter comprises a dielectric resonator element and a cylindrical waveguide cavity having a corrugated tube structure that surrounds the dielectric resonator element such that an outer encircling wall surface of the dielectric resonator element is in contact with an inner sidewall of the corrugated tube structure. The corrugated tube structure includes one or more spaced-apart corrugations configured to provide a spring-like action to controllably expand and contract the corrugated tube structure so that the dielectric resonator element can be controllably inserted and clamped within the cylindrical waveguide cavity. The geometry of the spaced-apart corrugations can be selected to define a rotationally asymmetric corrugated tube structure configured to split a plurality of fundamental modes of electromagnetic waves within the filter.

Abstract: Embodiments of the invention include a piezoelectric package integrated filtering device that includes a film stack. In one example, the film stack includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The film stack is suspended with respect to a cavity of an organic substrate having organic material and the film stack generates an acoustic wave to be propagated across the film stack in response to an application of an electrical signal between the first and second electrodes.

Abstract: Embodiments of the invention include a filtering device that includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The piezoelectric filtering device expands and contracts laterally in a plane of an organic substrate in response to application of an electrical signal between the first and second electrodes.

Abstract: A bulk acoustic wave filter device includes a substrate including an insulating layer, a resonance portion including a bottom electrode, disposed on the substrate, a piezoelectric layer, disposed above at least a portion of the bottom electrode, and a top electrode disposed above at least a portion of the piezoelectric layer, a wiring portion connected to the resonance portion such that the top electrode or the bottom electrode extends into the wiring portion, a connection electrode connecting the top electrode and the bottom electrode to an external device, and a heat transfer member connecting a portion of at least one of the bottom electrode and the top electrode that is disposed in the wiring portion to the substrate. The resonance portion is provided with a cavity disposed below the bottom electrode, and the heat transfer member is disposed outside of the cavity.

Abstract: A BAW resonator/filter with a monolithic TFE package that defines an acoustic BC and suppresses resonances from the low-Q piezoelectric area of the resonator and resulting devices are provided. Embodiments include a BAW resonator over a dielectric layer, the BAW resonator including a first metal layer, a thin-film piezoelectric layer, and a second metal layer; a first cavity in the dielectric layer under the first metal layer and a second cavity over the first cavity on the second metal layer; and a pair of TFE anchors on the second metal layer, each TFE anchor adjacent to and on an opposite side of the second cavity and extending beyond the first metal layer.

Abstract: Wideband power combiners and splitters are provided herein. In certain embodiments, a power combiner/splitter is implemented with a first coil connecting a first port and a second port, and a second coil connecting a third port and a fourth port. The first coil and the second coil are inductively coupled to one another. For example, the first coil and the second coil can be formed using adjacent conductive layers of a semiconductor chip, an integrated passive device, or a laminate. The power combiner/splitter further includes a fifth port tapping a center of the first coil and a sixth port tapping a center of the second coil. The fifth port and the sixth port serve to connect capacitors and/or other impedance to the center of the coils to thereby provide wideband operation.

Abstract: An acoustic wave device includes: first and second terminals located on a first surface of a first substrate; a third terminal that is located on the first surface and is a ground terminal; series resonators located on a second surface of the first substrate and electrically connected in series with a path between the first and second terminals; a parallel resonator that is located on the second surface and has a first end electrically connected to the path and a second end electrically connected to the third terminal; and a fourth terminal located on the first surface, at least a part of the fourth terminal overlapping with, in a thickness direction of the first substrate, at least one of one or more first series resonators of the series resonators, the one or more first series resonators having both ends to which other series resonators are electrically connected.

Abstract: A power divider/combiner includes a first transmission line (TL) and two second TLs. The first TL has a first terminal that is for receiving or outputting a signal with a target wavelength, and a second terminal that is open circuited. Each of the second TLs is disposed adjacent to and spaced apart from the first TL so as to establish electromagnetic coupling therebetween. Each of the second TLs has a first terminal, and a second terminal that is distal from the first terminal of the first TL. The second terminals of the second TLs are for cooperatively outputting or receiving a pair of signals that have the target wavelength and that are in-phase. Each of the first and second TLs has a length that is a quarter of the target wavelength.

Abstract: An acoustic wave device includes: a first substrate having a first surface and a side surface; an acoustic wave resonator located on the first surface of the first substrate; and a first insulator film that covers the acoustic wave resonator and is in contact with at least a part, which is located closer to the first surface, of the side surface of the first substrate.

Abstract: A splitter for use in an in-home network includes an input and a plurality of outputs including at least a first output and a second output. A split point is between the input and the plurality of outputs. A first resistor and a first capacitor are connected in series between the input and the split point. A second resistor and a second capacitor are connected in series between the split point and the first output. A third resistor and a third capacitor are connected in series between the split point and the second output. The input, the first output, and the second output form a resistive Wye-type splitter. A first path exists between the input and the first output. A second path exists between the input and the second output. The first path and the second path have a substantially equal series resistance, series impedance, insertion loss, and isolation.

Abstract: An elastic wave device includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate. The IDT electrode includes a busbar electrode extending in an elastic wave propagation direction and electrode fingers connected to the busbar electrode and extending in a direction perpendicular or substantially perpendicular to the elastic wave propagation direction. The piezoelectric substrate includes a groove extending along the elastic wave propagation direction. The groove is provided on a side across the busbar electrode in the perpendicular or substantially perpendicular direction from a side at which the electrode fingers are located.

Abstract: The present disclosure relates to a multilayer electromagnetic waveguide that includes a plurality of layers forming guide channels for an electromagnetic wave, and at least one transition device including at least one dielectric layer between two guide channels, referred to as coupled guide channels, extending as an extension. Each transition device includes at least one adaptation channel extending in a longitudinal direction, and each adaptation channel is defined by two electrically conductive walls. At least one wall extends along the dielectric spacer layer from one end of the coupled guide channel, over a length suitable for optimizing the transmission of an electromagnetic wave between the two coupled guide channels.

Abstract: An ultra-wideband Ortho-Mode (OMT) Transducer with ridges is provided. The ultra-wideband OMT with ridges includes a mode separation cavity, a combining cavity and a matching cavity. The mode separation cavity is configured to separate waves transmitted by a common port into at least one TE01 mode and at least one TE10 mode. The combining cavity is connected to two side ports of the mode separation cavity, is configured to combine TE01 modes transmitted by the two side ports into one and output from a standard rectangular port. The matching cavity is connected to a through port of the mode separation cavity and is configured to smoothly transit at least one TE10 mode transmitted by the through port to the standard rectangular port for output. The ultra-wideband OMT with ridges further includes a first ridge, a second ridge, a third ridge, and a fourth ridge.