Patents Examined by Robert J. Pascal
  • Patent number: 10992019
    Abstract: A small scale power divider which is less susceptible to large tolerances in the manufacture includes a substrate and a power dividing circuit thereon. The power dividing circuit includes an input port, a first output port, a second output port, an impedance converter, a first microstrip line, and a second microstrip line. An end of the first microstrip line is connected to the impedance converter, another end of the first microstrip line is connected to the first output port. An end of the second microstrip line is connected to the impedance converter, another end of the second microstrip line is connected the second output port.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: April 27, 2021
    Assignee: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.
    Inventor: Yu-Chih Chueh
  • Patent number: 10985725
    Abstract: According to some embodiments, an on-chip diplexer circuit is disclosed. The on-chip diplexer circuit includes a LC resonator module, the LC resonator module further comprises a first port, a first LC resonator unit and a second LC resonator unit; a first filter unit, the first filter unit is electrically connected to the first LC resonator unit in the LC resonator module, and the first filter unit is electrically connected to a second port; and a second filter unit, the second filter unit is electrically connected to the second LC resonator unit in the LC resonator module, and the second filter unit is electrically connected to a third port.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: April 20, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Ming-Hsien Tsai
  • Patent number: 10976108
    Abstract: Heat exchanger assemblies for electronic devices are disclosed. A heat exchanger assembly may include a heat transfer body that has a face that forms open passageways. A cover structure may be attached to the heat transfer body in a manner to enclose the open passageways, thereby forming a heat exchanger assembly that includes enclosed fluid conduits. In this regard, the enclosed fluid conduits may form complex and intricate patterns within the heat exchanger assembly that are tailored to the heat requirements of a particular application. Heat exchanger assemblies as described herein may be thermally coupled to a center waveguide section of a spatial power-combining device. The enclosed fluid conduits may be tailored based on locations of amplifiers within the center waveguide section to provide improved thermal operation of the spatial power-combining device.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: April 13, 2021
    Assignee: Qorvo US, Inc.
    Inventors: Gregory Valenti, Dylan Murdock, Eric Jackson
  • Patent number: 10978772
    Abstract: In a four-port transmission-line network, a first transmission line is connected to a first port, second and third transmission lines are connected to a first component port, fourth and fifth transmission lines are connected to a second component port, and a sixth transmission line is connected to a fourth port. The transmission lines are connected as baluns to the ports with the unbalanced signal on the port side and the balanced signals interconnecting with others of the transmission lines. In another example, two or more baluns are connected serially. Each balun includes two transmission lines having signal-return conductors connected together at the ends. One end of a signal conductor on the first balun forms a sum port. One end of the signal-return conductors of the second balun forms a difference port, and a capacitor connects the other end of the signal-return conductors to circuit ground.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: April 13, 2021
    Assignee: Werlatone, Inc.
    Inventors: Allen F. Podell, Ky-Hien Do, Mariama Dadhi Barrie
  • Patent number: 10978774
    Abstract: A resonator (40) for a filter comprises (i) a cavity (49) having first and second opposing conductive end walls (41, 42) and a conductive side wall (43); (ii) a conductive post (44) extending into the cavity from the first conductive end wall, the end of the conductive post remote from the first conductive end wall being provided or integral with a hollow conductive element (45) which is flared and increases in cross-section in a direction towards the second conductive end wall; and (iii) a load element (47) extending into the cavity from the second conductive end wall, the load element being flared and decreasing in cross-section in a direction away from the second conductive end wall. The end of the load element remote from the second conductive end wall extends into the end of the hollow conductive element remote from the conductive post and forms an annular gap with the hollow conductive element. The resonator has improved power-handling compared to resonators of the prior art.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: April 13, 2021
    Assignee: Nokia Technologies OY
    Inventors: Kimmo Kalervo Karhu, Efstratios Doumanis
  • Patent number: 10979017
    Abstract: A layered body includes a ceramic substrate formed of a polycrystalline ceramic and having a supporting main surface and a piezoelectric substrate formed of a piezoelectric material and having a bonding main surface that bonds to the supporting main surface through Van der Waals force. The ceramic substrate includes a supporting main surface amorphous layer formed so as to include the supporting main surface. The piezoelectric substrate includes a bonding main surface amorphous layer formed so as to include the bonding main surface. The supporting main surface amorphous layer has a smaller thickness than the bonding main surface amorphous layer.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: April 13, 2021
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Keiichirou Geshi, Ryota Yamaguchi, Masato Hasegawa
  • Patent number: 10980102
    Abstract: A radio frequency coupler includes a waveguide having an outer conductor and an inner conductor in a coaxial tube shape. The waveguide extends linearly from a power supply side, is bent in an L shape at a bend section, and extends linearly toward an acceleration cavity. A refrigerant passage part passes through the outer conductor and the inner conductor at the bend section from the outside of the waveguide toward the acceleration cavity and is connected to the interior of the inner conductor. The refrigerant passage part has a passage tube through which refrigerant passes between the inner part of the tip on the acceleration cavity side of the inner conductor, and the outer part of the waveguide, and the portion of the passage tube that is exposed to a radio frequency transmission space formed between the outer conductor and the inner conductor being formed of an insulator.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: April 13, 2021
    Assignee: MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, LTD.
    Inventor: Kyusaku Higa
  • Patent number: 10979018
    Abstract: A focusing interdigital transducer (IDT) and corresponding single- and dual-port piezoelectric devices are disclosed. The focusing interdigital transducer, which generates Lamé acoustic waves, permits operation at significantly higher frequencies than those possible with traditional IDTs. The focusing IDT employs multiple arced fingers formed both above and below the piezoelectric layer to improve coupling efficiency by coupling through both the e31 and e33 piezoelectric coefficients to the piezoelectric layer. By optimizing both anchor design and location, acoustic wave losses are minimized, thereby improving the device's quality factor Q. Through proper bus design and selection of the number of IDT fingers, a device's impedance can be tuned for a given application. The focusing IDTs may be used in single-port filter devices and dual-port transformer devices. The single- and dual-port devices may operate at a single frequency, at two frequencies, or over a band of frequencies.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: April 13, 2021
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Aleem Siddiqui, Matt Eichenfield, Benjamin Griffin, Christopher Nordquist
  • Patent number: 10978775
    Abstract: Examples of cavity resonators, filters, and communications devices are described. One example of cavity resonator includes a cover, a resonant column, and a cavity. The cover is mounted at an opening of a top portion of the cavity. The resonant column is disposed at a bottom portion of the cavity. A value of distributed capacitance is changed with a distance between the cover and the resonant column, a value of distributed inductance is changed with a distance between the cavity and the resonant column, and a material of at least one of the cover, the resonant column, and the cavity is a plastic metal material. Therefore, when the at least one of the cover, the resonant column, or the cavity deforms, the value of the distributed capacitance or the distributed inductance is changed, to adjust a resonant frequency.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: April 13, 2021
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Damiao Wu, Zheng Cui, Huanqing Zhang, Yuntao Zhu
  • Patent number: 10978771
    Abstract: The present invention discloses a lumped circuit balance converter applied to double-sided parallel lines, comprising a radio frequency transceiver, a balance converter, a filter and a matching network. The filter is connected with the matching network through the balance transmission line. The balance converter comprises a second circuit block, a first circuit block, a third circuit block, a first port, a second port and a third port. A positive polarity of a signal is positioned at the top of the second port and the bottom of the third port. Balance signals are respectively fed to the converter at the top of the second port and the bottom of the third port, and the signals are combined in the first port. The present invention has simple structure and better effect when used, can be easily changed to different required performance, and has good applicability and strong practicability.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: April 13, 2021
    Assignee: Innovation Sound Technology Co., Ltd.
    Inventors: Shun Ming Yuen, Wai Yin Mung, Ka Ming Wu
  • Patent number: 10971444
    Abstract: An electronic apparatus and an electronic system may include a first power delivery network (PDN) and a second PDN. The first PDN may include a first inductor as a segment of a power rail of the first PDN, while the second PDN may include a second inductor as a segment of a power rail of the second PDN. The first inductor and the second inductor may form a magnetically coupled inductor. The magnetically coupled inductor may provide migrated impedance ZT to the first PDN induced by the magnetically coupled inductor. The migrated impedance ZT to the first PDN may help the first PDN to reduce its voltage noise. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: April 6, 2021
    Assignee: Intel Corporation
    Inventors: Jimmy Huat Since Huang, Xingjian Cai, Paik Wen Ong, Herh Nan Chen, Yun Ji
  • Patent number: 10965273
    Abstract: A wideband piezoelectric filter with a ladder-type is provided, which is composed of a plurality of first resonators connected in series, a plurality of second resonators connected in parallel, an impedance matching device disposed near the input terminal or the output terminal of the filter, and at least one special parallel ground path led out from serial nodes. The special parallel ground path at least comprises one inductor having a larger inductance value, and a resonator having the same resonant frequency as a serial branch or a capacitor, wherein the larger inductor is connected to the resonator or capacitor in series in the parallel path. The ladder filter according to the invention can have a bandwidth which is more than twice that of the conventional ladder filter, and also has excellent out-of-band rejection characteristics.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: March 30, 2021
    Assignee: ROFS Microsystem (Tianjin) Co., Ltd
    Inventors: Wei Pang, Yunzhuo Zheng
  • Patent number: 10958243
    Abstract: A filter includes a plurality of series portions each including one or more series resonators, and a plurality of shunt portions each including one or more shunt resonators. At least one of the plurality of shunt portions includes two shunt resonators connected to each other in anti-series, and antiresonance frequencies of the two shunt resonators are arranged externally of a passband.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: March 23, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung-Tae Kim, Chang Hyun Kim, Jung Woo Sung, Yoon Sok Park
  • Patent number: 10944377
    Abstract: Broadband power splitter. In some embodiments, a power splitter can include an input port, a first output port and a second output port. The power splitter can further include a first signal path implemented between the input port and the first output port, and a second signal path implemented between the input port and the second output port. Each of the first and second signal paths can include a variable capacitance configured to provide a plurality of capacitance values that result in different frequency responses of the respective signal path.
    Type: Grant
    Filed: December 29, 2018
    Date of Patent: March 9, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Anuranjan Hosagavi Puttaraju, Gunjan Pandey, Paul Raymond Andrys
  • Patent number: 10938080
    Abstract: A combiner is provided and belongs to the communications field. The combiner includes a conductive housing, a printed circuit board PCB, a conductive column, and a first conductor. The PCB, the conductive column, and the first conductor are located inside the conductive housing; one end of the conductive column is fastened to a bottom part of the conductive housing, the PCB is fastened to a top part of the conductive housing, and the first conductor is fastened to the PCB; and an axial direction of the first conductor is parallel to an axial direction of the conductive column, and a partial region of a side surface of the first conductor is opposite to the conductive column.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: March 2, 2021
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Jianwei Cao, Jianhua Wu
  • Patent number: 10938115
    Abstract: A beamforming system, comprising a plurality of subsets of tunable resonator elements arranged on a substrate. Each subset of tunable resonator elements comprises at least two resonator elements that have a common resonance property modifiable by a common physical stimulus. A first control input may provide a first physical stimulus to modify the resonance property of all the tunable resonator elements in a first subset of tunable resonator elements. A second control input may provide a second physical stimulus to modify the resonance property of all the tunable resonator elements in a second subset of tunable resonator elements. A controller adjusts the first and second physical stimulus provided via the control inputs between a plurality of physical stimulus values. Each different physical stimulus value corresponds to one of a plurality of a unique resonance patterns and associated unique radiation patterns.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: March 2, 2021
    Assignee: Elwha, LLC
    Inventor: Yaroslav A. Urzhumov
  • Patent number: 10931258
    Abstract: An electronic device includes a support layer is provided on a piezoelectric substrate and surrounds a functional element. A cover layer is located above the support layer, and faces the piezoelectric substrate. A protective layer seals the support layer and the cover layer. The support layer is provided on at least the outer periphery of the piezoelectric substrate, and defines a hollow portion within the outer periphery of the piezoelectric substrate. The protective layer includes a first portion above the hollow portion, a second portion above the support layer, and a curved surface that is convex in an opposite direction from the piezoelectric substrate.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: February 23, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.'
    Inventor: Koichiro Kawasaki
  • Patent number: 10931261
    Abstract: A filter includes a resonant circuit defining at least a portion of a signal path connected between a first terminal and a second terminal, an elastic wave resonator including one end that is grounded, a first inductor including one end connected to one end of the resonant circuit and another end connected to another end of the elastic wave resonator, and a second inductor including one end connected to another end of the resonant circuit and another end connected to the other end of the elastic wave resonator. The resonant circuit is an LC series resonant circuit in which a third inductor and first and second capacitors are connected in series with each other.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: February 23, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masanori Kato, Minoru Iwanaga, Hiroshi Matsubara
  • Patent number: 10931257
    Abstract: The present disclosure relates to a wafer-level packaged (WLP) bulk acoustic wave (BAW) device, which includes a BAW resonator, a WLP enclosure, and an interconnect. The BAW resonator includes a piezoelectric layer with an opening, a bottom electrode lead underneath the opening, and an interface structure extending over the opening and in contact with the bottom electrode lead through the opening. The WLP enclosure includes a cap, an outer wall that extends from the cap toward the piezoelectric layer to form a cavity, and a through-WLP via that extends through the cap and the outer wall and is vertically aligned with the opening of the piezoelectric layer. A portion of the interface structure is exposed to the through-WLP via. The interconnect is formed in the through-WLP via and electrically connected to the interface structure.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: February 23, 2021
    Assignee: Qorvo US, Inc.
    Inventors: Paul Stokes, Fabien Dumont, Buu Quoc Diep
  • Patent number: 10931262
    Abstract: A resonator element for use in a filter is provided. The resonator element includes a first resonator acoustically coupled to a second or third resonator or both. The first resonator has terminals for incorporation in a filter structure. A tuning circuit is coupled to the second or third resonator or both to enable tuning of the resonator element. The tuning circuit includes a variable capacitor and an inductor.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: February 23, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Hans-Joerg Timme, Ruediger Bauder