Abstract: A method for modifying a rate of temperature change of an epoxy resin composition in a resin container during a resin casting process is proposed. The resin composition has at least one epoxy monomer component and a curing agent. A passivation agent for the curing agent is added to the epoxy resin composition. A resin container arrangement for use in such a resin transfer moulding process, a composite product having an epoxy resin composition, and a use of an organic acid in an epoxy resin casting process as a passivation agent for modifying the rate of temperature change in a resin container containing an epoxy resin composition are proposed.

Abstract: Compositions and methods for forming surfactants, aqueous dispersions, and curing agents are provided. In one aspect, the invention relates to improved epoxy functional surfactants prepared by reaction of an epoxy composition and an amidoamine composition formed from a blend of acid-terminated polyoxyalkylene polyols. The improved epoxy functional surfactants may be reacted with an excess of epoxy composition and water to result in an aqueous dispersion. The amidoamine composition may be a reaction mixture of a diamine compound and an acid terminated polyoxyalkylene composition formed from two or more polyoxyalkylene polyol compounds. The epoxy functional surfactant may be reacted with amine compounds to form a compound suitable as a curing agent.

Abstract: Compositions and methods for forming surfactants, aqueous dispersions, and curing agents are provided. In one aspect, the invention relates to improved epoxy functional surfactants prepared by reaction of an epoxy composition and an amidoamine composition formed from a blend of acid-terminated polyoxyalkylene polyols. The improved epoxy functional surfactants may be reacted with an excess of epoxy composition and water to result in an aqueous dispersion. The amidoamine composition may be a reaction mixture of a diamine compound and an acid terminated polyoxyalkylene composition formed from two or more polyoxyalkylene polyol compounds. The epoxy functional surfactant may be reacted with amine compounds to form a compound suitable as a curing agent.

Abstract: A thermoplastic polymer toughening material in the form of polymeric fibers produced by mixing at least one epoxy curing agent and a thermoplastic polyaromatic polymer to form an admixture, and producing polymeric fibers from the admixture, wherein the thermoplastic polymer toughening material does not include an epoxy resin, and is soluble in an epoxy resin at a temperature lower than a dissolving temperature required by the thermoplastic polymer toughening material without epoxy curing agent.

Abstract: The invention relates to non aqueous curing agents for water dispersed epoxy resins. The curing agent composition offers a binder pot life of several hours, and in the presence of a metal, such as zinc, nearly no hydrogen generation is observed. The present curing composition can be mixed with a metal powder to provide a storage stable paste. The curing agent composition and/or paste is fully compatible with an epoxy water based resin. After low shear blending, the epoxy curing agent and metal system is storage stable for several hours working pot life that provides for cured coatings having good performance.

Abstract: The present invention has its object to provide a liquid-applied moisture-permeable waterproofing material that can protect a building from rainwater or humidity in the air, can drain moisture, which has been gathered on a substrate of a building, and can be applied easily. The present invention is a curable composition comprising: (A) a polyoxyalkylene polymer having a silicon-containing group crosslinkable by forming a siloxane bond; (B) a polyoxyalkylene plasticizer whose main chain contains 5 wt % or more of an oxypropylene-derived repeating unit and has one or more groups, at an end thereof, selected from the group consisting of an —OH group, a group represented by the formula: —OR9 (wherein R9 is a substituted or unsubstituted C1-20 hydrocarbon group), and a group represented by the formula: —NR102 (wherein R10 is each independently a hydrogen atom, or a substituted or unsubstituted C1-20 hydrocarbon group).

Abstract: The present invention concerns a low-odor, low-viscosity hardener for epoxy resins comprising the amine of formula (I), as well as a method for thinning of hardeners for epoxy resins by adding the amine of formula (I). These hardeners harden with epoxy resins quickly and without blushing to form films of high hardness and little brittleness, even without non-incorporable thinners such as benzyl alcohol. They are especially suitable for low-emission coatings.

Abstract: Disclosed are a p-doped conjugated polymer electrolyte and an organic electronic device using the same. The p-doped conjugated polymer electrolyte according to the present invention not only has an outstanding hole-transport capability but can also act as an electron-blocking layer and hence can be used in organic electronic devices, such as organic light-emitting devices or organic solar cells, in order to improve the light-emitting efficiency of the organic light-emitting device or the energy-conversion efficiency of the organic solar cell. Also, because the charge on the p-doped conjugated polymer electrolyte is almost completely neutral, the present invention can solve the problem of anode corrosion and make a positive contribution to increased life-cycle of the device.

Abstract: The present invention is directed to a method of making a copolymer, comprising the steps of at least partially epoxidizing a polyisoprene to produce an epoxidized polyisoprene; reacting the epoxidized polyisoprene with a dithiol to produce a thiol functionalized polyisoprene; and reacting the thiol functionalized polyisoprene with a thiolophile-functionalized polymer derived from a monomer having a hydrogen bond donor site and hydrogen bond acceptor site to form the copolymer.

Abstract: The disclosure provides a solvent system for dissolving an epoxy adhesive such as I2300L epoxy adhesive. The solvent system includes a dialkyl ether solvent and an alkyl alcohol solvent. The disclosure also provides methods for preparing a uniform thin film deposit of an epoxy adhesive for printhead interstitial bonding during their fabrication.

Abstract: Blend (B) comprising: at least one aromatic polycarbonate (P1), and at least one polyarylene (P2), more than 50 wt. % of the recurring units thereof are optionally substituted arylene groups [recurring units (R2)], each of said recurring units (R2) being linked by each of its two ends to two other optionally substituted arylene groups via a direct C—C linkage, and said recurring units (R2) being a mix (M) consisting of: between 0 and 75 mole %, based on the total number of moles of recurring units (R2), of rigid rod-forming arylene units (R2a), optionally substituted by at least one monovalent substituting group, with between 25 and 100 mole %, based on the total number of moles of recurring units (R2), of kink-forming arylene units (R2b), optionally substituted by at least one monovalent substituting group. Article or part of an article comprising the blend (B).

Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.

Abstract: A fluorinated aromatic epoxy compound having a fluorinated ether tail and a pendant epoxy functional group. These compounds are particularly useful as starting materials for producing various water and oil repellents and soil resists.

Abstract: Provided are curable resin compositions capable of giving cured articles that have high light reflectivity, are satisfactorily resistant to heat and light, are tough, and less suffer from light reflectivity reduction with time. A curable resin composition for light reflection includes an alicyclic epoxy compound (A), rubber particles (B), a white pigment (C), a curing agent (D), and a curing accelerator (E). Another curable resin composition for light reflection includes an alicyclic epoxy compound (A), rubber particles (B), a white pigment (C), and a curing catalyst (F).

Abstract: The present invention provides a modified natural rubber that offers higher efficiency of graft polymerization or attachment of a polar group-containing compounds, and that possesses excellent low loss factor, wear resistance and fracture resistance when used as a rubber composition, a rubber composition using the modified natural rubber and a tire using the rubber composition. In the present invention, a polar group-containing compound is graft polymerized or attached under mechanical shear force to a natural rubber raw material having a nitrogen content of 0.4 mass % or less.

Abstract: The present invention relates to a transparent resin composition which comprises (a) a (meth)acrylate based resin comprising one or more (meth)acrylate based derivatives; and (b) an aromatic based resin having a chain having the hydroxy group containing portion and an aromatic moiety.

Abstract: A solid epoxy resin powder coating composition which includes a divinylarene dioxide resin as one component; and wherein the solid epoxy resin powder coating composition can be formed by blending or reacting various other components with the divinylarene dioxide resin. For example, other components can include other epoxy resins; phenolic resins; or monomeric and/or polymeric isocyanates. The powder coating composition or formulation may advantageously provide, for example, a Fusion Bonded Epoxy coating on a substrate.

Abstract: A highly fluorinated photoresist employing a photodimerization chemistry and a method for manufacturing an organic light emitting diode display using the same. The photoresist includes a copolymer that is made from two different monomers. When the copolymer is used as a photoresist, the photoresist has the characteristic that it becomes insoluble when exposed to an ultraviolet light having a wavelength of 365 nm.

Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-curable epoxy-based adhesive compositions that are resistant to being washed off substrate surfaces prior to being cured. The incorporation of a solid diene-based rubber, in particular an acrylonitrile-butadiene copolymer rubber having a relatively high Mooney viscosity, significantly enhances the wash-off resistance of the adhesive, while still allowing the adhesive to be readily dispensed by pumping under high shear conditions.

Abstract: New polymer compositions based on poly(2,6-dimethyl-1,4-phenylene oxide) and other high-softening-temperature polymers are disclosed. These materials have a microphase domain structure that has an ionically-conductive phase and a phase with good mechanical strength and a high softening temperature. In one arrangement, the structural block has a softening temperature of about 210° C. These materials can be made with either homopolymers or with block copolymers.