Abstract: A golf ball includes an inner core layer formed from a thermoset rubber composition. The inner core layer has a first outer surface Shore D hardness and an outer diameter of about 0.8 to 1.40 inches. A thermoplastic outer core layer is formed around the inner core layer, has a second outer surface Shore D hardness, and is formed from a copolymer of ethylene and an ?,?-unsaturated carboxylic acid, a magnesium salt of oleic acid, and sufficient cation source to fully-neutralize the acid groups of the copolymer. The golf ball includes an inner cover layer and an outer cover layer. The first outer surface Shore D hardness is greater than the second outer surface Shore D hardness and the outer core layer has a thickness of about 0.01 inches to 0.05 inches.

Abstract: Crosslinker/accelerator system for thermally crosslinking polyacrylates with functional groups that are adapted to react with epoxy groups in a crosslinking reaction, comprising at least one epoxy group-containing substance and at least one substance that accelerates the crosslinking reaction at a temperature below the melting temperature of the polyacrylate.

Abstract: A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3). The polyfunctional phenolic compound (a1) is represented by structural formula (1) below: (where Ar represents a benzene ring, a naphthalene ring, a benzene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, or a naphthalene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, X represents a methylene group, a divalent cyclic aliphatic hydrocarbon group, a phenylene dimethylene group, or a biphenylene-dimethylene group, and n represents the number of repeating units and the average thereof is in a range of 0.5 to 10).

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.

Abstract: A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.

Abstract: There is provided a thermosetting light-reflecting resin composition that has a high level of various characteristics required of optical semiconductor element mounting boards, such as optical properties and thermal discoloration resistance, provides high releasability during molding such as transfer molding, and allows molding processes to be performed continuously. There are also provided a highly-reliable optical semiconductor element mounting board and an optical semiconductor device each produced with the resin composition, and methods for efficient production thereof.

Abstract: An optical semiconductor sealing resin composition includes a rubber-particle-dispersed epoxy resin (A) containing an alicyclic epoxy resin and, dispersed therein, rubber particles, in which the rubber particles comprise a polymer including one or more (meth)acrylic esters as essential monomeric components and have a hydroxyl group and/or a carboxyl group in a surface layer thereof as a functional group capable of reacting with the alicyclic epoxy resin, the rubber particles have an average particle diameter of 10 nm to 500 nm and a maximum particle diameter of 50 nm to 1000 nm, and the difference in refractive index between the rubber particles and a cured article obtained from the optical semiconductor sealing resin composition is within ±0.02. The optical semiconductor sealing resin composition can give a cured article which exhibits excellent cracking resistance while maintaining satisfactory thermal stability and high transparency.

Abstract: This invention relates to an epoxy resin composition, in particular a curable phosphorus containing flame retardant epoxy resin composition comprising epoxy resin and an epoxy resin chain-extending amount of a diaryl alkylphosphonate and/or diaryl arylphosphonate and a cross-linking agent. The curable flame retardant compositions are useful in e.g., printed wiring boards or molding compounds for electronic applications, protective coatings, adhesives, as well as structural and decorative composite materials.

Abstract: A hydrolyzed divinylarene dioxide resin composition including the reaction product of (a) a divinylarene dioxide, and (b) water; a process for making the hydrolyzed divinylarene dioxide resin composition; and a curable hydrolyzed divinylarene dioxide resin composition made therefrom. The cured product made from the above hydrolyzed divinylarene dioxide resin composition offers improved properties such as a lower viscosity and a high heat resistance compared to known cured products prepared from known epoxy resins.

Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin and diaminodiphenylsulfone mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.

Abstract: A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210° C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150° C. to result in a thermoset resin having a glass transition temperature of at least 210° C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.

Abstract: An object of the invention is to provide a liquid resin composition with low viscosity while containing polymer particles. Further, another object of the invention is to provide a liquid resin composition containing a large quantity of polymer particles without increasing the viscosity of the liquid resin composition. A liquid resin composition of the invention is comprising a liquid resin component and polymer particles each having an elastic core layer, an intermediate layer formed with a monomer having two or more double bonds and coated on the core layer, and a shell layer coated on the intermediate layer; wherein the polymer particles are dispersed at a ratio of their volume average particle diameter (Mv) to their number average particle diameter (Mn) of 3 or lower.

Abstract: A curing resin composition that cures in two stages: photo cure and thermal cure, hardly contaminates a liquid or liquid crystals when in contact with, and provides high adhesive strength, particularly a curing composition that photocures sufficiently even when shadowed by TFT wires, a black matrix, etc. in photocuring; and a sealant, a sealant for ODF (one-drop-fill), and an LCD containing the curing resin composition.

Abstract: A curing catalyst (clathrate compound) for which the curing reaction is suppressed at low temperatures, allowing an improvement in the one-pot stability, but which can effectively cure a resin upon heat treatment. The clathrate compound includes at least an isophthalic acid compound represented by Formula (I), where R1 represents a C1 to C6 alkyl group, a C1 to C6 alkoxy group, a nitro group, or a hydroxyl group, and an imidazole compound represented by a Formula (II) where R2 represents a hydrogen atom, a C1 to C10 alkyl group, a phenyl group, a benzyl group, or a cyanoethyl group, and R3 to R5 each independently represents a hydrogen atom, a nitro group, or a halogen atom, or a C1 to C20 alkyl group, phenyl group, benzyl group, or C1 to C20 acyl group that may have a substituent.

Abstract: A curing agent composition including at least one benzylated polyamine compound. The benzylated polyamine compound is a reaction product of a benzaldehyde compound or benzyl halide compound and a polyamine according to the following formula: H2N—CH2-A-CH2-NH2 where A is a phenylene group or a cyclohexylene group. A method for making the curing agent composition and an amine-epoxy composition are also disclosed.

Abstract: Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate.

Abstract: A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.

Abstract: A light-curing resin composition includes an epoxy resin having two or more epoxy groups in one molecule; a photopolymerization initiator including an anion component and a cation component; and an aralkyl compound having an alcoholic hydroxyl group.

Abstract: A coating composition, an anticorrosion film formed by the composition, as well as an anticorrosive article, are disclosed. The coating composition comprises 1-35% by weight of one or more fluoropolymer; 1-70% by weight of one or more epoxy resin; 5-70% by weight of one or more polyamideimide; 0-40% by weight an auxiliary binder consisting of one or more of polyethersulfone, polyphenylene sulfide, polyamide, polyimide, polyether ether ketone, polyetherimide, polyurethane, alkyd resin, polyester, or acrylic polymers; and, based on 100 parts by weight of the above components, 100-400 parts by weight of solvent.