Abstract: A differential amplifier is provided, in which generation of unnecessary harmonic distortion in the differential output signal is suppressed. A common mode feedback circuit increases or decreases operating points of an inverting output terminal and a non-inverting output terminal such that an intermediate voltage of voltages respectively provided to an inverting input terminal and a non-inverting input terminal is consistent with to a reference voltage. Variations in voltage at the inverting input terminal and the non-inverting input terminal are suppressed, variations in electrical properties of elements connected to the input terminals are suppressed. Therefore, it is possible to suppress generation of harmonic distortion in the output signals from the inverting output terminal and the non-inverting output terminal.

Abstract: An example transconductance circuit includes a first portion that includes a first degeneration transistor, configured to receive a first input voltage, and a second portion that includes a second degeneration transistor, coupled to the first degeneration transistor and configured to receive a second input voltage. The first portion further includes a first input transistor, coupled to the first degeneration transistor and configured to provide a first output current, while the second portion further includes a second input transistor, coupled to the second degeneration transistor and configured to provide a second output current. Such a transconductance circuit may be used as an input stage capable of reliably operating within drain-source breakdown voltage of the transistors employed therein even in absence of any other protection devices, and may be significantly faster, consume lower power, and occupy smaller die area compared to conventional transconductance circuits.

Abstract: A micro-resonator includes a first electrode positioned on a piezoelectric plate at a first end of the piezoelectric plate, the first electrode including a first set of fingers and a second electrode positioned on the piezoelectric plate at a second end of the piezoelectric plate. The second electrode including a second set of fingers interdigitated with the first set of fingers with an overlapping distance without touching the first set of fingers, the overlapping distance being less than seven-tenths the length of one of the first set of fingers or the second set of fingers. At least one of the first end or the second end of the piezoelectric plate may define a curved shape.

Abstract: A filter device has a substrate with a first cavity and a second cavity on a single die; and a bonding layer formed on the substrate but not spanning the first cavity or the second cavity. A piezoelectric plate is bonded to the bonding layer and spans the first and the second cavity. However, excess portions of piezoelectric plate are removed that extend a certain length past the perimeter of the first cavity and of the second cavity. Excess portions may be piezoelectric material that extends in the length and width direction past the perimeter of a cavity by more than between 2 and 25 percent of the cavity perimeter. An interdigital transducer (IDT) is on a front surface of the piezoelectric plate and having interleaved fingers over the first cavity.

Abstract: A longitudinally coupled resonator elastic wave filter is disposed on a piezoelectric substrate. IDT electrodes include first and second busbars. An inorganic insulating layer is provided on at least one side in a direction perpendicular or substantially perpendicular to an elastic wave propagation direction to cover the first or second busbars, and a first wiring line is disposed on the inorganic insulating layer to extend in the elastic wave propagation direction. A second wiring line three-dimensionally crosses the first wiring line with the inorganic insulating layer interposed therebetween. The first wiring line is connected to busbars, which are connected to the same potential, by extending through the inorganic insulating layer.

Abstract: One embodiment provides a printed circuit board (PCB). The PCB can include one or more metal layers and at least a pair of differential transmission lines. The pair of differential transmission lines can include a first transmission line and a second transmission line. The first transmission line can include a plurality of timing-skew-compensation structures, and a respective timing-skew-compensation structure of the first transmission line or a corresponding segment of the second transmission line adjacent to the timing-skew-compensation structure has a non-uniform width.

Abstract: The present invention relates to a transmission line having improved bending durability, which includes a strip structure or a micro-strip structure that is divided into a base part and a bending part that is bent and unfolded based on the base part, wherein the base part and the bending part include a signal line configured to extend in a length direction so as to transmit a high frequency signal, a first dielectric of which an upper surface or a lower surface is provided with the signal line formed thereon, and a second dielectric formed above the first dielectric; and the second dielectric is coupled to the first dielectric in the base part and separated from the first dielectric in the bending part.

Abstract: A dynamic amplifier includes an amplifier configured to differentially amplify first and second input signals to generate first and second output signals, a bias circuit, and a variable impedance circuit. The bias circuit is connected between a first power node configured to supply a first source voltage and the amplifier, and configured to apply bias to the amplifier. The variable impedance circuit is connected between the amplifier and a second power node configured to supply a second source voltage that is lower than the first source voltage. The variable impedance circuit is configured to adjust amplification gain of the amplifier, by adjusting impedance based on a magnitude of one among the first and second input signals and the first and second output signals.

Abstract: A bias circuit includes first to fourth transistors and a phase compensation circuit. In the first transistor, a reference current or voltage is supplied to a first terminal, and the first terminal and a second terminal are connected. In the second transistor, a first terminal is connected to the first transistor, and a third terminal is grounded. In the third transistor, a power supply voltage is supplied to a first terminal, a second terminal is connected to the first transistor, and a bias current or voltage is supplied from a third terminal to an amplifier transistor. In the fourth transistor, a first terminal is connected to the third transistor, a second terminal is connected to the second transistor, and a third terminal is grounded. The phase compensation circuit is provided in a path extending from the fourth transistor to the third transistor through the second and first transistors.

Abstract: Cross-coupling of switched-capacitor output common-mode feedback capacitors in dynamic residue amplifiers is provided via a cross-coupled amplifier, comprising: a current source connected to a first node; a feedback capacitor connected to the first node and a second node; a feedback resistor connected between the second node and ground; an amplifier having an input connected to the second node; a gain transistor having: a drain connected to the first node; a source connected to ground; and a gate connected to an output of the amplifier; and a load capacitor connected to the first node and ground.

Abstract: A BAW resonator with an improved lateral energy confinement is provided. The resonator has a bottom electrode in a bottom electrode layer, a top electrode in a top electrode layer and a piezoelectric layer between the bottom electrode layer and the top electrode layer. The piezoelectric layer comprises piezoelectric materials of different piezoelectric polarities.

Abstract: Acoustic resonators and filter devices. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A conductor pattern formed is formed on the front surface of the piezoelectric plate, including an interdigital transducer (IDT) with interleaved fingers of the IDT on the diaphragm. The substrate and the piezoelectric plate are the same material.

Abstract: Examples described herein provide selective filtering by a network device for continuous 5 GHz and 6 GHz operation. Examples may include receiving, by the network device, a first signal in a 5 GHz band, and generating, by the network device, a second signal in a 6 GHz band. Examples may include selecting, by the network device, a first filter or a second filter to be applied the first signal in the 5 GHz band, wherein the first filter allows a lower frequency band to pass than the second filter in the 5 GHz band, selecting, by the network device, a third filter or a fourth filter to be applied to the second signal in the 6 GHz band, wherein the third filter allows a lower frequency band to pass than the fourth filter in the 6 GHz band, and simultaneously applying, by the network device, the selected first or second filter to the first signal and the selected third or fourth filter to the second signal.

Abstract: A substrate for a surface acoustic wave device is constituted of a piezoelectric material and includes a first surface on which a surface acoustic wave propagates, and a second surface located opposite to the first surface. The second surface has an arithmetic mean roughness (Ra) of 0.2 ?m to 0.4 ?m, and there is satisfied either of the relationship between the arithmetic mean roughness (Ra) and mean spacing (S) of local peaks of Ra/S?11, and the relationship between the arithmetic mean roughness (Ra) and mean spacing (Sm) of irregularities of Ra/Sm?6.7. Further, the second surface has a maximum height (Rmax) of 2.5 ?m to 4.5 ?m, and there is satisfied either of the relationship between the maximum height (Rmax) and mean spacing (S) of local peaks of Rmax/S?130, and the relationship between the maximum height (Rmax) and mean spacing (Sm) of irregularities of Rmax/Sm?80.

Abstract: There are disclosed matrix filters having an input port and sub-filters connected between the input port and respective output ports. Each of the sub-filters includes a ladder circuit with n transversely-excited film bulk acoustic resonator (XBAR) series elements and n?1 capacitor shunt elements, where n, the order of the sub-filter, is an integer greater than 2. Each sub-filter further has a first switch in parallel with a first capacitor shunt element and a second switch in parallel with a last capacitor shunt element.

Abstract: An orthomode transducer and to a satellite transmission chain includes the orthomode transducer, for transmitting a first signal and a second signal in orthogonal propagation modes. The transducer comprises: a primary waveguide with a square or rectangular cross section, two guided access means having firstly a free end via which the first signal and the second signal are respectively injected or recovered, and secondly two arms connected to the primary waveguide. Each guided access means comprises a junction configured so as to connect the free end to the two arms of the guided access means, the two arms of each guided access means being connected to the primary waveguide at two off-centred locations on one or more sides of the primary waveguide symmetrically about an axis of symmetry of the primary waveguide.

Abstract: An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having a first size disposed on the lower surface, and a plurality of second solder bond pads having second sizes smaller than the first size disposed on the lower surface and surrounding the first solder bond pad.

Abstract: Acoustic resonators are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. The IDT includes: a first busbar and a second busbar disposed on respective portions of the piezoelectric plate other than the diaphragm; a first set of elongate fingers extending from the first bus bar onto the diaphragm; and a second set of elongate fingers extending from the second bus bar onto the diaphragm, the second set of elongate fingers interleaved with the first set of elongate fingers.

Abstract: A circuit structure includes a substrate integrated waveguide, a substrate disposed on the substrate integrated waveguide, a waveguide signal feeding element and a ring-shaped conductive element. The substrate integrated waveguide includes another substrate having a waveguide transmitting region, two conductive layers disposed on this substrate and covering the waveguide transmitting region, and at least one waveguide conductive element passing through this substrate and electrically connected to the two conductive layers. The at least one waveguide conductive element surrounds the waveguide transmitting region. One of the conductive layers is located between the two substrates. The waveguide signal feeding element passes through one substrate and one conductive layer between the substrates, and the waveguide signal feeding element extends to the waveguide transmitting region. The waveguide signal feeding element is electrically insulated from one conductive layer.

Abstract: A microwave or radio frequency (RF) device includes an insulating substrate having a first surface and a second surface opposing the first surface. The device also includes a crossover conductor disposed on the first surface extending between a first edge of the first surface and a second edge of the first surface. The device also includes a depression in the second surface defined at least in part by (i) a third surface recessed in relation to the second surface, and (ii) at least one sidewall that extends between the second surface and the third surface. The device further includes a conductive coating formed over at least a portion of the second surface, the third surface, and the at least one sidewall, where the conductive coating is insulated from the crossover conductor by the insulating substrate.