Patents Examined by Samuel S Outten
  • Patent number: 11528003
    Abstract: A circuit is disclosed, in accordance with some embodiments. The circuit includes a transistor stage, a resistive element, a first tunable capacitive element and a second tunable capacitive element. The transistor stage includes a first input/output terminal and a second input/output terminal. The resistive element is connected to the transistor stage. The first tunable capacitive element is connected in parallel with the resistive element. The second tunable capacitive element is connected to the second input/output terminal of the transistor stage.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: December 13, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventor: Shu-Chun Yang
  • Patent number: 11528007
    Abstract: Disclosed is a Bulk Acoustic Wave (BAW) filter structure with a conductive bridge forming an electrical loop with an electrode for reduced electrical losses. In exemplary aspects disclosed herein, the BAW filter structure includes a transducer with electrodes, a piezoelectric layer between the electrodes, and at least one conductive bridge offset from at least a portion of one of the electrodes by an insulating volume. The conductive bridge forms a first electrical loop between a medial end and a distal end of the electrode. Such a configuration reduces electrical resistance, heat resistance, and/or ohmic losses for improved electrical loss of the BAW filter structure.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: December 13, 2022
    Assignee: Qorvo US, Inc.
    Inventors: Yazid Yusuf, Mohammad J. Modarres-Zadeh, Andreas Tag, Paul Stokes, Robert Aigner, Gernot Fattinger
  • Patent number: 11528041
    Abstract: A method of manufacturing an RF switch includes adding a first mutual inductance portion to a first self-inductance portion of a first transmission line; and adding a second mutual inductance portion to a second self-inductance portion of a second transmission line, wherein values of the first and second mutual inductance portions and values of the first and second self-inductance portions equalize an impedance difference between the first transmission line and the second transmission line.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: December 13, 2022
    Assignee: Infineon Technologies AG
    Inventors: Pierpaolo Verzola, Stephan Leuschner
  • Patent number: 11522503
    Abstract: A first transmission line and a second transmission line that are connected in series to each other are disposed at different positions in a thickness direction of a substrate. A third transmission line is disposed between the first transmission line and the second transmission line in the thickness direction of the substrate. The third transmission line includes a first end portion connected to one end portion of the first transmission line, and a second end portion that is AC-grounded. The first transmission line and the second transmission line are electromagnetically coupled to the third transmission line.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: December 6, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masatoshi Hase
  • Patent number: 11522510
    Abstract: A transconductance amplifier (TCA) implemented with high electron mobility transistors (HEMTs) in a push-pull amplifier output stage provides a voltage controlled constant high output current to loads ranging from 10 m? to 1? with a bandwidth of 25 MHz. A driving stage for the HEMTs is implemented with variable gain amplifiers that amplify the input voltage signal and provide bias for the HEMTs. An automatic gain control may be connected between the TCA output and the variable gain amplifiers to ensure a constant current output for a varying load.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: December 6, 2022
    Assignee: Queen's University at Kingston
    Inventors: Carlos Saavedra, Arthur Liraneto Torres Costa
  • Patent number: 11522554
    Abstract: A circuit includes an operational amplifier and a resistor network coupled to an output of the operational amplifier. The resistor network includes a first set of resistors coupled between the output of the operational amplifier and a first node of the resistor network, wherein the resistors of the first set are electrically connected in series with each other, a second set of resistors coupled between the first node and a second node of the resistor network, wherein the resistors of the second set are electrically connected in series with each other and include a first number of resistors, a third set of resistors coupled between the second node and a third node of the resistor network, wherein the third node is coupled to a first voltage, and wherein the resistors of the third set are electrically connected in parallel with each other and include a second number of resistors, and a resistor coupled between the first node and the second node and arranged in parallel with the second set of resistors.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: December 6, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Jun Zhang
  • Patent number: 11522516
    Abstract: An apparatus is disclosed for a surface-acoustic-wave filter using lithium niobate (LiNbO3). In an example aspect, the apparatus includes at least one surface-acoustic-wave filter including an electrode structure, a substrate layer, and a piezoelectric layer disposed between the electrode structure and the substrate layer. The piezoelectric layer includes lithium niobate material configured to enable propagation of an acoustic wave across its planar surface in a direction along a first filter axis. A second filter axis is along the planar surface and perpendicular to the first filter axis. A third filter axis is normal to the planar surface. An orientation of the first, second, and third filter axes is relative to a crystalline structure of the lithium niobate material as defined by Euler angles ?, ?, and ?. A value of ? has a range approximately from ?70° to ?55° or at least one symmetrical equivalent.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: December 6, 2022
    Assignee: RF360 EUROPE GMBH
    Inventors: Ulrike Monika Roesler, Ingo Bleyl
  • Patent number: 11522262
    Abstract: A combiner/divider includes a plurality of input/output waveguides distributed in a plane and diverging in at least a partially common direction away from a central point. Each input/output waveguide extends from an outer node disposed distal of the central point to an inner port proximate to and spaced from the central point. Each input/output waveguide has a respective dimension in the plane that increases between the inner port and the outer node. An output/input waveguide has an aggregate port proximate to the central point and facing the inner ports. A transition waveguide defines an open cavity that flares outwardly in the plane from the aggregate port toward the inner ports and communicatively couples the output/input waveguide with the input/output waveguides. Opposing distal surfaces of the transition waveguide and inner port edges are spaced apart by a distance that decreases with increasing distance from the aggregate port.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: December 6, 2022
    Assignee: Werlatone, Inc.
    Inventor: Stephen J. Foti
  • Patent number: 11522263
    Abstract: A balanced-type strip-shaped dielectric substrate integrated filter includes: a high-k dielectric substrate; and first low-k dielectric substrates, second low-k dielectric substrates and metal grounds are symmetrically stacked on upper and lower surfaces of the high-k dielectric substrate.
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: December 6, 2022
    Assignees: NANTONG UNIVERSITY, NANTONG RESEARCH INST. FOR ADVANCED COMM. & TECH.
    Inventors: Kai Xu, Mengdan Wang, Jin Shi, Rong Cai, Wei Zhang, Lingyan Zhang
  • Patent number: 11522500
    Abstract: An embodiment of a dual-path amplifier includes a power splitter connected to first and second power amplifiers respectively connected to first and second transmission lines connected to a power combiner having a phase-offset deficit at the second harmonic frequency 2f0, where the first and second transmission lines are designed to provide a complementary phase offset at 2f0 substantially equal to the phase-offset deficit such that the two amplified signals will be combined at the power converter with a total phase offset at 2f0 of about 180 degrees in order to reduce harmonic distortion in the amplified output signal, without substantially diminishing the output power at the fundamental frequency f0. In certain PCB-based implementations, the transmission lines include metal traces and lumped elements providing different impedance transformations that achieve the complementary phase offset, where the metal traces may have significantly different physical and electrical characteristics.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: December 6, 2022
    Assignee: NXP USA, Inc.
    Inventors: Arturo Roiz, Justin Nelson Annes, Terry L. Thomas
  • Patent number: 11522514
    Abstract: Piston mode Lamb wave resonators are disclosed. A piston mode Lamb wave resonator can include a piezoelectric layer, such as an aluminum nitride layer, and an interdigital transducer on the piezoelectric layer. The piston mode Lamb wave resonator has an active region and a border region, in which the border region has a velocity with a lower magnitude than a velocity of the active region. The border region can suppress a transverse mode.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: December 6, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jie Zou, Jiansong Liu, Gong Bin Tang, Chih-Ming Lin, Chun Sing Lam
  • Patent number: 11515855
    Abstract: A SAW resonator comprises two reflectors and a transducer arranged between the reflectors. A resonant space between the transducer and a respective reflector is set large enough to enable occurrence of main resonance and at least one further resonance of comparable admittance. Thus, a multiple resonant resonator is achieved that can be used as a parallel resonator in a filter circuit with a DMS track for example to improve attenuation in a stop band.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: November 29, 2022
    Assignee: QUALCOMM Incorporated
    Inventor: Andreas Bergmann
  • Patent number: 11515841
    Abstract: A dc coupled amplifier includes a pre-driver, and amplifier and a bias control circuit. The pre-driver is configured to receive one or more input signals and amplify the one or more input signals to create one or more pre-amplified signals. The amplifier has cascode configured transistors configured to receive and amplify the one or more pre-amplified signals to create one or more amplified signals, the amplifier further having an output driver termination element. The bias control circuit is connected between the pre-driver and the amplifier, the bias control circuit receiving at least one bias current from the output driver termination element of the amplifier, wherein the pre-driver, the amplifier and the bias control circuit are all formed on a same die.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: November 29, 2022
    Assignee: MACOM Technology Solutions Holdings, Inc.
    Inventors: Wayne Kennan, Baotoan Nguyen
  • Patent number: 11509287
    Abstract: An acoustic device includes a foundation structure and a transducer provided over the foundation structure. The foundation structure includes a piezoelectric layer between a top electrode and a bottom electrode. The piezoelectric layer has an active portion within an active region of the transducer, and a bi-polar border portion within a border region of the transducer. The piezoelectric material in the active portion has a first polarization. The bi-polar border portion has a first sub-portion and a second sub-portion, which resides either above or below the first sub-portion. The piezoelectric material in the first sub-portion has the first polarization, and the piezoelectric material in the second sub-portion has a second polarization, which is opposite the first polarization.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: November 22, 2022
    Assignee: Qorvo US, Inc.
    Inventors: Jyothi Swaroop Sadhu, Ralph Rothemund, Alireza Tajic
  • Patent number: 11509267
    Abstract: An amplifier includes: a signal polarity inversion circuit which modulates an input signal and outputs a modulation signal; an amplifier circuit which is constituted from an operational transconductance amplifier (OTA) to amplify the modulation signal and output a current; and a sample-hold circuit having a sampling capacitor which is charged and discharged by selective sampling of the output current of the amplifier circuit and a holding capacitor to which the voltage of the sampling capacitor is transferred.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: November 22, 2022
    Assignee: ABLIC INC.
    Inventor: Yuji Shiine
  • Patent number: 11509279
    Abstract: Acoustic resonator devices and filters. An acoustic resonator includes a substrate having a surface and a lithium niobate plate. A back surface of the lithium niobate plate is attached the substrate except for a portion of the lithium niobate plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on a front surface of the lithium niobate plate such that interleaved fingers of the IDT are disposed on the diaphragm. The IDT and the lithium niobate plate configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the diaphragm. Euler angles of the lithium niobate plate are [0°, ?, 0°], where ? is greater than or equal to 40° and less than or equal to 70°.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: November 22, 2022
    Assignee: Resonant Inc.
    Inventor: Bryant Garcia
  • Patent number: 11502647
    Abstract: Provided is an amplifier that includes a first transistor including a gate terminal to which an applied input signal is input, where a current depending on the applied input signal flows through the first transistor. A gate terminal of a second transistor is connected to a load section, and a current depending on a change in a voltage of the drain terminal of the first transistor flows through the second transistor. A source terminal of the first transistor and a drain terminal of the second transistor are connected in common to a first resistance, and the current from the first transistor and the current from the second transistor flow through the first resistance. A third transistor supplies a current approximately equal to the current of the second transistor. The current supplied by the third transistor is output from an output end.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: November 15, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Kazumasa Nishimura, Masahiro Ichihashi, Masayuki Katakura, Kenya Kondou, Tetsuya Tashiro, Boyang Hao, Kouzi Tsukamoto
  • Patent number: 11502067
    Abstract: A semiconductor package structure includes a plurality of transducer devices, a cap structure, at least one redistribution layer (RDL) and a protection material. The transducer devices are disposed side by side. Each of the transducer devices has at least one transducing region, and includes a die body and at least one transducing element. The die body has a first surface and a second surface opposite to the first surface. The transducing region is disposed adjacent to the first surface of the die body. The transducing element is disposed adjacent to the first surface of the die body and within the transducing region. The cap structure covers the transducing region of the transducer device to form an enclosed space. The redistribution layer (RDL) electrically connects the transducer devices. The protection material covers the transducer devices.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: November 15, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chien-Hua Chen, Cheng-Yuan Kung
  • Patent number: 11502654
    Abstract: In at least one embodiment, a differential amplifier including first and second current transfer systems, a current difference producing system, and a feedback network circuit is provided. The first current transfer system generates a first differential current signal. The second current transfer system generates a second differential current signal. The current difference producing system receives the first differential current signal and the second differential current signal and generates a voltage difference signal that is indicative of a difference between a first current signal and a second current signal. The feedback network circuit converts the voltage difference signal into at least two converted current signals and provides the at least two converted current signals to one of the first and second current transfer systems or the current difference producing system to minimize the difference between the first current signal and the second current signal.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: November 15, 2022
    Assignee: Harman International Industries, Incorporated
    Inventors: Dimitri Danyuk, Todd A. Eichenbaum
  • Patent number: 11502385
    Abstract: A multi-mode filter with a resonator having a plurality of resonator bodies which are rectangular prisms and the filter being configured with a through hole that electrically connects an input and an output to the center of a coupling structure between a respective pair of slabs. The multi-mode filter further comprising a plurality of coupling aperture segments which are coupling structures between each pair of resonator bodies or slabs such that two triangular apertures at opposite corners of at least two different slab-cube interfaces are utilized with the triangular apertures being diagonally opposed to one another across the respective interface.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: November 15, 2022
    Assignee: NOKIA TECHNOLOGIES OY
    Inventor: David Robert Hendry