Patents Examined by Sikyin Ip
  • Patent number: 9587293
    Abstract: A lead-free solder alloy includes a tin-copper alloy that also includes a minor amount of cobalt, which has been found to provide a shiny and reflective appearance to the solder alloy. Methods of soldering using such an alloy, as well as a solder joint including such an alloy also are disclosed.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: March 7, 2017
    Inventor: Stanley R. Rothschild
  • Patent number: 9566367
    Abstract: The present invention is directed to a magnesium alloy containing 5.0% by wt.-25.5% by wt. dysprosium, 0.01% by wt.-5.0% by wt. neodymium and/or europium, 0.1% by wt. 3.0% by wt. zinc, 0.1% by wt.-2.0% by wt. Zirconium, and balance to 100.0% by wt. magnesium, being degradable under physiological conditions and which is particularly suitable for the production of absorbable stents and to stents made thereof.
    Type: Grant
    Filed: August 15, 2012
    Date of Patent: February 14, 2017
    Assignees: Helmholtz-Zentrum Geesthacht Zentrum fur Material-und Kustenforschung GmbH, MEKO LASERSTRAHL-MATERIALBEARBEITUNGEN E.K
    Inventors: Michael Stekker, Norbert Hort, Frank Feyerabend
  • Patent number: 9533379
    Abstract: A solid phos-copper base brazing alloy component for forming a brazed joint with a raised shoulder, little to no black oxide, and improved corrosion resistance. The brazing components of the present invention are made of an alloy having a liquidus temperature above 840° F. and contain of about 4-7% phosphorus, about 2-8% tin, about 2% antimony, up to about 3% nickel, 0.1 to about 3% silicon, up to about 3% manganese, with the balance being copper.
    Type: Grant
    Filed: July 28, 2003
    Date of Patent: January 3, 2017
    Assignee: LINCOLN GLOBAL, INC.
    Inventor: Joseph W. Harris
  • Patent number: 9512506
    Abstract: A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0?([Co]?0.007)/([P]?0.008)?6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.
    Type: Grant
    Filed: February 23, 2009
    Date of Patent: December 6, 2016
    Assignees: MITSUBISHI SHINDOH CO., LTD., MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kazumasa Hori
  • Patent number: 9493859
    Abstract: Manufacturing method of a copper alloy sheet including melting and casting a raw material of a copper alloy having a composition containing 1.0 mass % to 3.5 mass % Ni, 0.5 mass % to 2.0 mass % Co, and 0.3 mass % to 1.5 mass % Si with a balance being composed of Cu and an unavoidable impurity. The method includes the steps of first cold rolling, intermediate annealing, second cold rolling, a solution heat treatment and aging. The solution heat treatment includes: heating at 800° C. to 1020° C.; first quenching to 500° C. to 800° C.; maintaining the 500° C. to 800° C. temperature for 10 seconds to 600 seconds; and second quenching to 300° C. or lower.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: November 15, 2016
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Weilin Gao, Akira Sugawara, Ryosuke Miyahara, Hisashi Suda
  • Patent number: 9437486
    Abstract: A sputtering target contains high purity Nb of which Ta content is 3000 ppm or less and oxygen content is 200 ppm or less. Dispersion of the Ta content in all the sputtering target is within ±30% as a whole target. Dispersion of the oxygen content is within ±80% as a whole target. According to such sputtering target, an interconnection film of low resistivity can be realized. In addition, each grain of Nb in the sputtering target has a grain diameter in the range of 0.1 to 10 times an average grain diameter and ratios of grain sizes of adjacent grains are in the range of 0.1 to 10. According to such sputtering target, giant dust can be largely suppressed from occurring. The sputtering target is suitable for forming a Nb film as liner material of an Al interconnection.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: September 6, 2016
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Koichi Watanabe, Yasuo Kohsaka, Takashi Watanabe, Takashi Ishigami, Yukinobu Suzuki, Naomi Fujioka
  • Patent number: 9412482
    Abstract: A Cu—Ni—Co—Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0×109 number/mm2 or more. A number density of fine second phase particles is not more than 5.0×107 number/mm2. A number density of coarse second phase particles is 1.0×105 number/mm2 or more and not more than 1.0×106 number/mm2. The material has crystal orientation satisfying the following equation (1): I{200}/I0{200}?3.0??(1) wherein I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane on the sheet material sheet surface; and I0{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane in a pure copper standard powder sample.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: August 9, 2016
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Toshiya Kamada, Takashi Kimura, Weilin Gao, Fumiaki Sasaki, Akira Sugawara
  • Patent number: 9382603
    Abstract: A metal tape material contains a metal having face centered cubic lattice structure, in which metal tape material an area fraction A1 of a preferentially <100>oriented region are within an orientation difference of 15° C. relative to a thickness direction of the metal tape material and further within an orientation difference of 15° C. relative to a first in-plane direction of the metal tape material is 60% or greater and not greater than 100%, and, where an area fraction of a preferentially <212>oriented region are within an orientation difference of 15° relative to the thickness direction and further within an orientation difference of 15° relative to the first in-plane direction is defined as A2, the total of the area fraction of the preferentially <212>oriented region and the area fraction of the preferentially <100>oriented region, A1+A2, is greater than 70% and not greater than 100%.
    Type: Grant
    Filed: March 17, 2011
    Date of Patent: July 5, 2016
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Keiichi Kimura, Masamoto Tanaka, Wataru Ohashi
  • Patent number: 9340853
    Abstract: The invention relates to an alloy permitting to replace the current CuBe alloy, soon to be prohibited by the various environmental directives because of the presence of Be and for which there is currently no substitution alloy with similar desired thermal and mechanical properties for measuring physical parameters, notably in aeronautics. This alloy is a Cu—Al—Ni—Fe alloy and the balance is copper. It contains from 3.8 to 4.4 wt % aluminum, from 4.2 to 5 wt % nickel, from 1.7 to 5 wt % iron, additives including silicon, manganese, chromium and titanium, silicon being present at less than 0.8 wt %, manganese being present at less than 0.15 wt %, chromium being present at less than 0.3 wt %, titanium being present at less than 0.1 wt %, the other chemical elements having contents by weight of less than 1%, each being present at less than 0.05 wt % and the balance is copper.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: May 17, 2016
    Assignee: AUXITROL SA
    Inventor: Bruno Lhuillier
  • Patent number: 9340850
    Abstract: High purity tin and tin alloy are provided in which the respective contents of U and Th are 5 ppb or less, the respective contents of Pb and Bi are 1 ppm or less, and the purity is 5N or higher, provided that this excludes the gas components of O, C, N, H, S and P. A cast ingot of the tin or alloy has an ? ray count of 0.001 cph/cm2 or less. Since recent semiconductor devices are densified and of large capacity, there is risk of a soft error occurring due to ? ray from materials in the vicinity of the semiconductor chip. Thus, there are demands for purifying soldering material used in the vicinity of semiconductor devices, and materials with fewer ? rays. The disclosed tin, alloy, and method reduce ? dose of tin so as to be adaptable as the foregoing material.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: May 17, 2016
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Yuichiro Shindo, Kouichi Takemoto
  • Patent number: 9328405
    Abstract: A machine component or part for alternating mechanical stresses up to a temperature of at most 160° C. The component or part comprises a thermally quenched and tempered steel alloy which contains carbon, silicon, manganese, chromium, molybdenum and vanadium in certain concentrations, the remainder being iron (Fe) and accompanying elements and contaminants due to smelting. This abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: May 3, 2016
    Assignee: BOEHLER EDELSTAHL GMBH & CO KG
    Inventors: Ingo Siller, Herbert Schweiger, Devrim Caliskanoglu, Silvia Zinner
  • Patent number: 9284628
    Abstract: A copper alloy sheet has a chemical composition containing 0.1 to 5 wt % of nickel, 0.1 to 5 wt % of tin, 0.01 to 0.5 wt % of phosphorus and the balance being copper and unavoidable impurities, and has a crystal orientation satisfying 2.9?(f{220}+f{311)+f{420})/(0.27·f{220}+0.49·f{311}+0.49·f{420}) 4.0, assuming that the degree of orientation of a {hkl} crystal plane measured by the powder X-ray diffraction method on the rolled surface of the copper alloy sheet is f{hkl}.
    Type: Grant
    Filed: May 21, 2009
    Date of Patent: March 15, 2016
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Tomotsugu Aoyama, Akira Sugawara
  • Patent number: 9260768
    Abstract: Lead-free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably contain 0.0-4.0 wt. % of Ag, 0.01-1.5 wt. % of Cu, at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, Ce in an amount of 0.001-0.8 wt. %, Y in an amount of 0.001-1.0 wt. %, Ti in an amount of 0.001-0.8 wt. %, and Bi in an amount of 0.01-1.0 wt. %, and the remainder of Sn.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: February 16, 2016
    Assignee: Indium Corporation
    Inventors: Weiping Liu, Ning-Cheng Lee
  • Patent number: 9255314
    Abstract: The invention provides a hot-forging micro-alloyed steel which achieves excellent fracture-splitability and machinability, without impairing productivity or mechanical properties and without the addition of Pb or the like. It also provides a component made of hot-forged micro-alloyed steel. The hot-forging micro-alloyed steel contains, in mass %, C: from 0.35 to 0.60%, Si: 0.50 to 2.50%, Mn: 0.20 to 2.00%, P: 0.010 to 0.150%, S: 0.040 to 0.150%, V: 0.10 to 0.50%, Zr: over 0.0023 to 0.0050%, Ca: 0.0005 to 0.0050% and N: 0.0069 to 0.0200%, Al being limited to less than 0.010%, and a balance substantially of Fe and unavoidable impurities.
    Type: Grant
    Filed: April 4, 2014
    Date of Patent: February 9, 2016
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Manabu Kubota, Shinya Teramoto
  • Patent number: 9255311
    Abstract: A copper alloy conductor has a copper alloy material which has a copper parent material with 0.001 to 0.1 wt % (=10 to 1000 wt·ppm) of oxygen and 0.15 to 0.70 wt % (exclusive of 0.15 wt %) of Sn. A crystalline grain to form a crystalline structure of the copper alloy material has an average diameter of 100 ?m or less, and 80% or more of an oxide of the Sn is dispersed in a matrix of the crystalline structure as a fine oxide grain with an average diameter of 1 ?m or less.
    Type: Grant
    Filed: January 10, 2006
    Date of Patent: February 9, 2016
    Assignee: Hitachi Metals, Ltd.
    Inventors: Hiromitsu Kuroda, Kazuma Kuroki, Seigi Aoyama, Hiroyoshi Hiruta
  • Patent number: 9255310
    Abstract: A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average misorientation between all the pixels in each crystal grain is less than 4° is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary, and a tensile strength is 641 to 708 N/mm2, and a bending elastic limit value is 472 to 503 N/mm2.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: February 9, 2016
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Takeshi Sakurai, Yoshihiro Kameyama, Yoshio Abe
  • Patent number: 9181606
    Abstract: A composition for a low lead ingot containing primarily copper and including tin, zinc, sulfur, phosphorus, nickel. The composition may contain carbon. The low lead ingot, when solidified, includes sulfur or sulfur containing compounds such as sulfides distributed through the ingot. The presence and a substantially uniform distribution of these sulfur compounds imparts improved machinability and better mechanical properties.
    Type: Grant
    Filed: May 4, 2012
    Date of Patent: November 10, 2015
    Assignee: Sloan Valve Company
    Inventors: Michael Murray, Mahi Sahoo
  • Patent number: 9175782
    Abstract: Problem A conventional alloy for a fusible plug contained harmful elements such as Cd or Pb, so there was a concern of pollution by these harmful elements. The present invention provides a fusible plug which does not contain the harmful components Cd or Pb, with which the alloy is not forced out of the fusible plug even when used for long periods as a safety device for refrigeration equipment, and which has a high mechanical strength such as creep strength. Means for Solving the Problem A fusible plug is used which employs a fusible alloy consisting essentially of 0.1-2.0 mass percent of Sn, 31-37 mass percent of Bi, and a remainder of In, the alloy melting at approximately at 70-75° C. A fusible plug is used which employs an alloy consisting essentially of 0.05-0.4 mass percent of Zn, 47-55 mass percent of Bi, and a remainder of In, the alloy melting at approximately 90-95° C.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: November 3, 2015
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Rikiya Kato, Tetsuro Kikuchi, Mutsumi Deguchi
  • Patent number: 9175368
    Abstract: A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder contains between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0,2 wt. % Mn; and a remainder of Sn.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: November 3, 2015
    Assignee: Indium Corporation
    Inventors: Weiping Liu, Ning-Cheng Lee
  • Patent number: 9157131
    Abstract: A high carbon content and high strength heat-treated steel rail including by weight 0.80-1.20% carbon, 0.20-1.20% silicon, 0.20-1.60% manganese, 0.15-1.20% chromium, 0.01-0.20% vanadium, 0.002-0.050% titanium, less than or equal to 0.030% phosphorus, less than or equal to 0.030% sulfur, less than or equal to 0.010% aluminum, less than or equal to 0.0100% nitrogen, and iron. The steel rail has excellent wear resistance and plasticity and can satisfy the requirement for overloading. A method for producing the steal rail by heating a slab to a heating temperature, multi-pass rolling, and accelerated cooling, wherein a maximum heating temperature (° C.) of said slab is equal to 1,400 minus 100[% C], [% C] representing the carbon content (wt. %) of said slab multiplied by 100.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: October 13, 2015
    Assignees: PANGANG GROUP CO., LTD., PANGANG GROUP RESEARCH INSTITUTE CO., LTD., PANGANG GROUP PANZHIHUA STEEL & VANADIUM CO., LTD.
    Inventors: Ming Zou, Dongsheng Mei, Quan Xu, Yong Deng, Hua Guo, Ming Liu, Li Tang, Yun Zhao, Gongming Tao