Abstract: This holder includes a conductor metal part designed to be warmed for assembly of the electrical component on the metal part. It also includes a part made of synthetic material, jointed with the metal part, guaranteeing cohesion of the holder. This part made out of synthetic material contains a mass with a low melting point and a mass with a high melting point, inserted between the mass with a low melting point and the metal part. More specifically, the mass with the high melting point is made in a material with a melting point greater than the melting point of the mass with a low melting point.

Abstract: The present invention provides a printed circuit board including: a circuit pattern formed on a first insulating layer; a via pad disposed on the first insulating layer by being spaced apart from the circuit pattern, formed on a lower surface, where a via hole is formed, to have a cross section larger than that of the via hole, and having concavo-convex patterns; a second insulating layer formed on the via pad where the via hole is not formed and on the circuit pattern; and a copper foil layer formed on the second insulating layer and the via hole, and a method of manufacturing the same.

Abstract: A method, apparatus, and system are described for a pre-wired and pre-engineered integrated platform for power supply and distribution that is pre-assembled, scalable, and modular. The skeletal framework of the integrated platform acts as an equipment support structure as well as a cable routing support system. A set of cables having wiring is routed along the skeletal framework of the integrated platform and goes to two or more cabinet enclosures mounted onto the skeletal framework. The skeletal framework acts as a National Electric Code approved raceway system to support and route the set of cables to the electrical equipment in the mounted cabinet enclosures. The integrated platform supports the weight of the one or more cabinet enclosures mounted onto the skeletal framework.

Abstract: A wiring board including a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on one surface of the first substrate and including multiple interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the first substrate and opened to the outermost surface of the built-up layer, an interposer accommodated in the opening portion of the built-up layer and including a second substrate and a wiring layer formed on the second substrate, the wiring layer of the interposer including multiple conductive circuits for being connected to multiple semiconductor elements, and a filler filling the opening portion of the built-up layer such that the interposer is held in the opening portion of the built-up layer. The opening portion of the built-up layer has a tapered portion tapering toward the outermost surface of the built-up layer.

Abstract: A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.

Abstract: A printed circuit board (PCB) is provided. The PCB includes a first microwave board material, a second prepreg, and a third ordinary board material that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies.

Abstract: An encapsulation method of an environmental sensitive element is provided. An environmental sensitive element and a first rib are formed on a first substrate. The first rib surrounds the environmentally sensitive element. A getter layer is formed on the environmental sensitive element. A first encapsulation layer is formed to encapsulate the getter layer and the first rib. The first barrier layer is formed to encapsulate the first encapsulation layer located on the first rib. The first rib, a portion of the first encapsulation layer located on the first rib and the first barrier layer form a barrier structure. A second substrate is provided on the first substrate and a filling layer is formed between the first substrate and the second substrate. The second substrate is bonded to the first substrate by the filling layer. The filling layer encapsulates the environmental sensitive element, the first encapsulation layer and the barrier structure.

Abstract: A two-side cable-arrangement structure is disclosed. The two-side cable-arrangement structure includes a plate, a first cable-arrangement structure, and a second cable-arrangement structure. The first cable-arrangement structure and the second cable-arrangement structure are respectively disposed on two sides of the plate. A cable is fixed on the two sides of the plate by the first cable-arrangement structure and the second cable-arrangement structure simultaneously. Thereby, the cable is constrained at both the direction vertical toward the plate and the direction vertical away from the plate, and the fixed cable is not easy to move by pulling. It solves the difficulty of fixing a cable completely by a conventional single-side cable-arrangement structure in the prior art.

Abstract: An electronic device includes a housing, a connecting sheet, a display panel and a fixing module. The display panel is fixed on the connecting sheet. The fixing module includes a first latching member formed on the housing and a second latching member formed on the connecting sheet. The first latching member is detachably latched with the second latching member, such that the connecting sheet adhered to the display panel is detachably fixed on the housing.

Abstract: A switch/circuit board unit and a hand-held tool equipped with such a switch/circuit board unit are proposed. The switch/circuit board unit is adapted for installation in a handle of the tool and has a switch and a circuit board. The switch/circuit board unit also has a mechanical coupling element for producing a rigid mechanical coupling between the switch and circuit board. The rigid coupling that the coupling element produces between the switch and circuit board allows the arrangement of the switch and circuit board to be embodied as a unit, which can enable maneuvering before installation and permit a simplified installation, and in particular, it is possible to simplify a fastening of the switch and circuit board inside a housing of the tool, and in the accompanying installation of electrical connections, for example in the form of flexible cables, it is possible to avoid an incorrect placement or wedging of cables.

Abstract: The problem of the present invention is to provide a circuit board comprising a shape retention unit capable of thinning while maintaining mechanical strength. The present invention solves the above-mentioned problem by providing a circuit board comprising a metal supporting substrate, a first insulating layer formed on the above-mentioned metal supporting substrate, and a wiring layer formed on the above-mentioned first insulating layer, wherein an open area is formed in the above-mentioned metal supporting substrate, and the circuit board comprises a shape retention unit having a second insulating layer contacting with the above-mentioned metal supporting substrate and a reinforcing layer formed on the above-mentioned second insulating layer, and bridging the above-mentioned metal supporting substrate divided by the above-mentioned open area.

Abstract: A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.

Abstract: A mounting apparatus for a printed circuit board includes an enclosure and a tray. The enclosure includes a bottom wall and a side wall extending from the bottom wall. The side wall is substantially perpendicular to the bottom wall. The tray includes a bottom panel substantially parallel to the bottom wall and a side panel substantially perpendicular to the bottom panel. The bottom panel is configured to secure the printed circuit board, and the side panel contacts and is mounted to the side wall.

Abstract: Provided is a memory module, a system using the memory module, and a method of fabricating the memory module. The memory module may include a printed circuit board and a memory package on the printed circuit board. The printed circuit board may include an embedded optical waveguide and a first optical window extending from the optical waveguide to a first surface of the printed circuit board. The memory package may also include a memory die having an optical input/output section and a second optical window. The optical input/output section, the second optical window, and the first optical window may be arranged in a line and the first optical window and the second optical window may be configured to at least one of transmit an optical signal from the optical waveguide to the optical input/output section and transmit an optical signal from the optical input/output section to the optical waveguide.

Abstract: A method for manufacturing a printed circuit board assembled panel by a simple process with an excellent material yield and a high conforming product rate. Unit printed circuit boards previously manufactured are arranged in a frame in a prescribed relationship. Then, the printed circuit boards are fixed to one another, and the printed circuit board and the frame body are fixed to one another.

Abstract: An electronic apparatus includes: a circuit board that is disposed inside a case that is formed by coupling first and second case halves, the circuit board being interposed between first and second boss portions; first and second conductive members that are disposed between a gap formed between the first boss portion and the circuit board; a third conductive member that is disposed between the first boss portion and the first conductive member and between the first boss portion and the second conductive member to electrically connect the first conductive member to the second conductive member; and a measurement circuit that is electrically connected to a first wiring and a second wiring, which are respectively connected to the first conductive member and the second conductive member, and measures an electrical characteristic value of at least one of the first conductive member and the second conductive member.

Abstract: A wireless communication apparatus in one embodiment includes a bag body and a radio frequency device. The bag body has at least a first slot, which extends to an edge of the bag body. The radio frequency device including a wireless integrated circuit chip is for radio-frequency signal transmission or receiving, and is disposed across a portion of the first slot and coupled to two connection ends of the bag body so that the bag body between the two connection ends serves as an inductance circuit. The inductance circuit of the two connection ends of the bag body is based on metallic material. An impedance of the inductance circuit is for conjugate matching with that of the radio frequency device and is determined according to a plurality of geometric parameters including: a distance from the edge to the wireless integrated circuit chip, and size of the first slot.

Abstract: There is provided an interconnection structure. An interconnection structure according to an aspect of the invention may include: a plurality of side portions provided on one surface of a substrate part and a plurality of cavities located between the side portions and located further inward than the side portions; and electrode pattern portions provided on surfaces of the side portions and the cavities.

Abstract: A multi position mount for an electronic display providing an adjustable display interface including a mounting assembly providing adjustable movement in at least one direction as determined by a plurality of follower members disposed within slots for slideable movement, and includes a mounting bracket having flanges configured the receive the adjustable display interface in at least two distinct locations. A plurality of mounting positions are possible for quick and easy engagement and disengagement, where at least one position provides mounting of a flat panel device in very close proximity to a mounting surface, and at least one position provides for angled adjustment of a flat panel display.

Abstract: At least one electronic component having a plurality of terminals on one of surfaces is temporarily fixed to a surface of a first support with a first adhesive layer in such a manner that the terminal side of the electronic component faces the first support. A second support having a second adhesive layer is fixed to the electronic component in order to interpose the electronic component between the first support and the second support. The first support and the first adhesive layer are peeled. The electronic component on the second support is sealed with a sealing resin in such a manner that at least a part of the terminals of the electronic component is exposed. An insulating resin layer and a wiring layer to be electrically connected to the terminal of the electronic component are stacked on the electronic component and the sealing resin.