Patents Examined by Steven Sawyer
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Patent number: 8526161Abstract: An electronic device may have buttons, a display, and a vibrator unit. Buttons may be included in electronic devices such as glass buttons, metal buttons, buttons that are assembled on printed circuit boards, and buttons that are partly formed from antenna structures. Button coatings may be used to improve the sliding performance of metal-on-metal buttons. A layer of polymer may be interposed between a button plate and a housing structure. A glass button member may have an underside on which a layer of patterned ink is formed. Elastomeric members may be used to reduce button rattle. Portions of a button may be provided with conductive features that form portions of an antenna.Type: GrantFiled: June 4, 2010Date of Patent: September 3, 2013Assignee: Apple Inc.Inventors: Trent Weber, Michael B. Wittenberg, Michelle A. Yu, Scott Myers, Kurt Stiehl
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Patent number: 8519265Abstract: According to one embodiment, a power module includes a metal base, a ceramic substrate, a semiconductor chip, a nut holder housing a nut, an electrode terminal and a casing. The ceramic substrate is connected to an upper surface of the metal base via a lower electrode. The semiconductor chip is located on a first major surface of the ceramic substrate. The electrode terminal includes a bent portion surrounding a nut holder. The electrode terminal includes a first connecting portion extending perpendicularly to the bent portion from one end of the bent portion, and being located on the first major surface via an upper electrode, and electrically connected to the semiconductor chip. A casing is bonded to the metal base to enclose the semiconductor chip and the electrode terminal. An upper end portion of the bent portion of the electrode terminal is exposed to outside of the casing through the opening.Type: GrantFiled: September 17, 2010Date of Patent: August 27, 2013Assignee: Kabushiki Kaisha ToshibaInventors: Junichi Nakao, Hiroshi Fukuyoshi
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Patent number: 8516692Abstract: A solder layer, a substrate for device joining utilizing the same and a method of manufacturing the substrate are provided whereby the device joined remains thermally unaffected, an initial bonding strength in solder joint is enhanced and the device can be soldered reliably. The solder layer formed on a base substrate (2) consists of a plurality of layers (5a) of a solder free from lead, which are different in its phase from one another. They are constituted by a layer of a phase that is completely melted, and a layer of a phase that is not completely melted at a temperature not less than a eutectic temperature of the solder. The solder layer (5) can be applied to a device joining substrate (1) comprising an electrode layer (4) formed on the base substrate (2) and the solder layer (5) formed on the electrode layer.Type: GrantFiled: March 28, 2007Date of Patent: August 27, 2013Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Yoshikazu Oshika, Munenori Hashimoto, Masayuki Nakano
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Patent number: 8514581Abstract: According to one embodiment, a flexible printed wiring board includes a component mounting portion to which a component is mounted and to which a reinforcing sheet is bonded. The component mounting portion includes an inner layer comprising a wiring pattern, and an outermost film layer disposed to cover the wiring pattern. The outermost film layer, to which the reinforcing sheet is bonded, is formed with a groove such that, when the reinforcing sheet is bonded, the groove extends in a region between the outermost film layer and the reinforcing sheet and communicates with an outside of the region.Type: GrantFiled: August 16, 2010Date of Patent: August 20, 2013Assignee: Kabushiki Kaisha ToshibaInventor: Kenji Hasegawa
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Patent number: 8513534Abstract: The present invention is directed to enhancing the bonding reliability of a bonding portion between an Al electrode of a semiconductor device and a bonding material having metal particles as a main bonding agent. In the semiconductor device, a semiconductor element and an Al electrode are connected to each other with a bonding layer made of Ag or Cu interposed therebetween, and the bonding layer and the Al electrode are bonded to each other with an amorphous layer interposed therebetween. It is possible to obtain excellent bonding strength to the Al electrode by performing a bonding process in atmospheric air by using a bonding material including a metal oxide particle with an average diameter of 1 nm to 50 ?m, an acetic acid- or formic acid-based compound, and a reducing agent made of an organic material.Type: GrantFiled: February 26, 2009Date of Patent: August 20, 2013Assignee: Hitachi, Ltd.Inventors: Toshiaki Morita, Yusuke Yasuda, Eiichi Ide
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Patent number: 8514549Abstract: A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.Type: GrantFiled: March 15, 2011Date of Patent: August 20, 2013Assignee: Oracle America, Inc.Inventors: David Hockanson, Istvan Novak, Leesa Noujeim
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Patent number: 8507800Abstract: A patterned substrate for a touch screen sensor assembly that includes a plurality of electrodes that are formed from a first transparent conductive layer that has a first surface resistivity. The substrate also has a plurality of traces that may be used to couple the electrodes controller associated with the touch screen sensor assembly. The traces are formed from a second conductive layer that has a second surface resistivity that is less than the surface resistivity of the first conductive layer. The first and second conductive layers may be formed from indium tin oxide (ITO) having different surface resistivities. A second, similarly configured substrate can be provided and may be spaced apart from the first substrate by a dielectric spacer.Type: GrantFiled: March 27, 2012Date of Patent: August 13, 2013Assignee: Multek Display (Hong Kong) LimitedInventors: Ding Hua Long, Hai Long Zhang, Ying Yu
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Patent number: 8503158Abstract: A key button mechanism and a portable electronic device using same are provided. The key button mechanism includes a base body, a protective piece and a key button. The protective piece is assembled to the base body and includes two actuating portions. The key button is partially attached to the base body and aligns with the protective piece. The key button includes a key body and two resisting blocks formed on the key body. The two resisting blocks are configured to align with and abut against the corresponding two actuating portions of the protective piece.Type: GrantFiled: October 7, 2010Date of Patent: August 6, 2013Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) LimitedInventor: Shi-Xu Liang
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Patent number: 8503183Abstract: An input/output module for a building automation system includes a mounting plate, a circuit board, and a cover. The mounting plate has at least two fastener receptacles (24-30) positioned to align with fastener receptacles of a standard electrical junction box (90). The mounting plate further includes at least two openings, each opening sized to receive one or more wires therethrough. The circuit board supports an interface circuit configured to communicate on a building network. The circuit board also includes device input terminals and device output terminals. The interface circuit is configured to provide an interface between the building network and devices connected to the input and output terminals. The circuit board is configured to be mounted to the mounting plate. The cover is sized to fit over the mounting plate and circuit board.Type: GrantFiled: February 18, 2011Date of Patent: August 6, 2013Assignee: Siemens Industry, Inc.Inventors: Steve R. Hamilton, Michael B. Strozewski, Jian Fang Wang, Yuan Zhang
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Patent number: 8497434Abstract: A printed circuit board and a manufacturing method of the same are disclosed. The method includes: preparing a carrier including a primer resin layer formed thereon; forming a circuit pattern on the primer resin layer; stacking the carrier onto an insulating layer such that the circuit pattern is buried in the insulating layer; removing the carrier; forming a via hole in the insulating layer on which the primer resin layer is stacked; and forming a conductive via in the via hole. The conductive via is formed by forming a plating layer in the via hole and on the primer resin layer and removing a portion of the plating layer formed over the primer resin layer.Type: GrantFiled: December 31, 2009Date of Patent: July 30, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Jae-Seok Lee
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Patent number: 8498124Abstract: A magnetic component provides both electrical interconnectivity and mechanical support between stacked circuit boards. The magnetic component includes a bobbin structure and a magnetically permeable core. The bobbin structure includes an upper bobbin pin rail and a lower bobbin pin rail. The upper bobbin pin rail includes one or more upper bobbin pins extending from the upper bobbin pin rail. Each upper bobbin pin may be adapted for soldering onto a first circuit board. At least one lower bobbin pin extends from the lower bobbin pin rail. Each lower bobbin pin may also be adapted for soldering onto a second circuit board, forming a circuit board assembly. Each soldered connection between a bobbin pin and a circuit board may provide an electrical connection between the circuit board and the magnetic component. Each soldered connection may also provide a mechanical attachment between a printed circuit board and the magnetic component.Type: GrantFiled: December 10, 2009Date of Patent: July 30, 2013Assignee: Universal Lighting Technologies, Inc.Inventors: Donald Folker, Mark Bauer, Travis Berry, Mike LeBlanc
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Patent number: 8498125Abstract: A downhole tool string component has a through-bore intermediate first and second tool joints adapted for connection to adjacent tool string components. An instrumentation package is disposed within an outer diameter of the component. The instrumentation package comprises a circuit board assembly. The circuit board assembly comprises alternating rigid and elastomeric layers. The rigid layers are in electrical communication with each other.Type: GrantFiled: June 9, 2008Date of Patent: July 30, 2013Assignee: Schlumberger Technology CorporationInventors: David R. Hall, Jim Shumway
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Patent number: 8481869Abstract: A take-up device for storing a flexible member, such as a cable, cord, flexible hose or tubing and the like, includes a housing for receiving a central portion of the flexible member in in a folded configuration with linear end portions thereof extending outwardly from the housing. The housing includes a member for holding an end portion of the flexible member.Type: GrantFiled: April 8, 2011Date of Patent: July 9, 2013Assignee: Arconas CorporationInventors: Richard Robert Coulson, Joel John Yatscoff, James Davidson Benzie
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Patent number: 8477508Abstract: A blade for a chassis-based system includes a printed circuit board (PCB) mounted at a tilt angle within the blade. The tilt angle provides space above or below the PCB at the front end of the blade, such that media interface modules can be flexibly positioned within the blade. A tilt angle that positions the PCB higher near the front end of the blade may enable media interface modules mounted in a belly-to-belly configuration on the PCB to be fitted within the front end of the blade. A tilt angle that positions the PCB lower near the front end of the blade may enable media interface modules mounted on the upper surface of the PCB to be fitted within the first end of the blade. The tilt angle also positions a backplane connector mounted on the PCB to properly engage a backplane when the blade is inserted into a slot.Type: GrantFiled: November 17, 2009Date of Patent: July 2, 2013Assignee: Brocade Communications Systems, Inc.Inventors: David A. Skirmont, Daniel K. Kilkenny
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Patent number: 8477494Abstract: An electronic assembly includes an electronic device and a solar shield coupled to the electronic device. The solar shield has an attachment portion which attaches to the electronic device, and a shield portion coupled to the attachment portion. The shield portion prevents direct sunlight from substantially reaching a section of the electronic device. The shield portion defines (i) at least a portion of an air intake, (ii) at least a portion of an air exhaust, and (iii) at least a portion of an air passageway which extends from the air intake to the air exhaust. The air passageway overlies the section of the electronic device enabling ambient air adjacent the air intake to form natural convective airflow into the air intake and out the air exhaust through the air passageway to carry away heat from the section of the electronic device during electronic operation of the electronic device.Type: GrantFiled: August 26, 2010Date of Patent: July 2, 2013Assignee: Textron Systems CorporationInventor: Anthony S. Pruszenski
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Patent number: 8461463Abstract: A composite module is obtained which enables high-density mounting of components without increasing its size. A composite module includes a main substrate which is a multilayer circuit board, a sub-substrate mounted on a lower surface of the main substrate, a sealing layer arranged on the lower surface of the main substrate to cover the sub-substrate, the sealing layer defining a mount surface arranged to be mounted on a mount board, and terminal electrodes disposed on the mount surface. The terminal electrodes include at least one first terminal electrode drawn directly from the main substrate and at least one second terminal electrode drawn directly from the sub-substrate.Type: GrantFiled: April 6, 2011Date of Patent: June 11, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Jun Sasaki, Katsumi Taniguchi
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Patent number: 8456851Abstract: A flex circuit having conductive traces formed on only one side of a base film for attaching to both sides of a DITO touch sensor panel is disclosed. By having conductive traces formed on only one side of the base film, the number of process steps and fabrication cost can be reduced because only a single etching step is needed. Furthermore, because the flex circuit is thinner, the resultant space savings can be utilized for other features in a device without enlarging the overall device package.Type: GrantFiled: May 16, 2008Date of Patent: June 4, 2013Assignee: Apple Inc.Inventor: Martin Paul Grunthaner
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Patent number: 8451594Abstract: Provided is a universal stand for multivision for forming the multivision using a plurality of display devices. The universal stands includes: a plurality of base frames arranged horizontally and vertically in lines; and a support frame which is mounted on each of the base frames to move vertically or horizontally and supports the display device.Type: GrantFiled: April 14, 2009Date of Patent: May 28, 2013Assignee: Orion Co., Ltd.Inventors: Kunyoung Kim, Won Woo Jeon, Youngmi Kim
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Patent number: 8440917Abstract: A method, system and apparatus for coating plated through holes (PTHs) to reduce impedance discontinuity in electronic packages. PTH vias are imbedded in the core of a printed circuit board comprising a core layer, a plurality of buildup layers, a plurality of micro-vias, and a plurality of traces. Traces electrically interconnect each of the micro-vias to PTH vias, forming an electrically conductive path. PTHs are coated with a magnetic metal material, such as nickel, to increase the internal and external conductance of the PTHs, thereby providing decreased impedance discontinuity of the signals in electronic packages.Type: GrantFiled: November 19, 2007Date of Patent: May 14, 2013Assignee: International Business Machines CorporationInventors: Paul M. Harvey, Douglas O. Powell, Wolfgang Sauter, Yaping Zhou
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Patent number: 8437141Abstract: The invention relates to a device comprising a first electric contact (8, 98) and a substrate (1, 91). The first electric contact (8, 98) comprises a first area (10, 110) with a first wettability, and the substrate (1, 91) comprises a second area (3) with a second wettability and a third area (2) with a third wettability and being adjacent to the second area (2). The first electric contact (8, 98) is attached on the substrate (1, 91) so that the first area (10, 110) of the first electric contact (8, 98) is adjacent to the second area (3), and the second area (3) is located between the first area (10, 110) and the third area (2). The first and the second wettability are higher than the third wettability. The invention also relates to a transponder (T1, T2, T3) which comprises the substrate (1, 91), an electric device (50, 80) and an antenna (7, 93).Type: GrantFiled: November 23, 2006Date of Patent: May 7, 2013Assignee: NXP B.V.Inventors: Reinhard Rogy, Cristian Zenz