Abstract: A wiring board includes a first interconnect layer, a first insulating layer covering the first interconnect layer, a second interconnect layer including an interconnect pattern formed on an upper surface of the first insulating layer, and a via interconnect penetrating the first insulating layer and electrically connecting the interconnect pattern and the first interconnect layer, and a second insulating layer laminated on the first insulating layer. The second insulating layer includes a first insulating film laminated on the upper surface of the first insulating layer, and a second insulating film laminated on an upper surface of the first insulating film. The interconnect pattern has a recess in an upper surface thereof located at a position on the via interconnect. The first insulating film covers upper and side surfaces of the interconnect pattern, and fills the recess. The upper surface of the first insulating film is flatter than the interconnect pattern.

Abstract: A printed circuit board, in which two or more copper clad laminates (CCLs) are laminated vertically from an uppermost circuit layer to a lowermost circuit layer, includes a non-destructive testing area, mislamination identifying portions in the non-destructive testing area, the mislamination identifying portions being in the CCLs, respectively, through-via holes vertically exposing the mislamination identifying portions, respectively, in the non-destructive testing area, the through-via holes being spaced apart from each other by a first interval, and a probe via extending vertically and being in contact with an end portion of each of the mislamination identifying portions on a same side. A length of the mislamination identifying portion in an N-th (N is an integer of 1 to K) layer CCL in a horizontal direction is longer than a length of the mislamination identifying positioned in an (N?1)-th layer CCL in the horizontal direction.

Abstract: A multilayer resin substrate includes insulating resin base material layers, and conductor patterns on at least one of the insulating resin base material layers. The conductor patterns include a ground conductor on a main surface of the insulating resin base material layers and extend into a frame shape or a planar shape, and the ground conductor includes openings. An aperture ratio of the openings in an outer peripheral portion of the ground conductor is less than an aperture ratio of the openings in an inner peripheral portion of the ground conductor.

Abstract: A device comprises a first circuit member, a second circuit member and a third circuit member. The first circuit member comprises a first body for performing the function of the first circuit member and a first flexible board formed with a first integrated-electrode portion including first electrodes. The second circuit member comprises a second body for performing the function of the second circuit member and a second flexible board formed with a second integrated-electrode portion including second electrodes. The third circuit member comprises a third body for performing the function of the third circuit member and a third flexible board formed with a third integrated-electrode portion including third electrodes. The first integrated-electrode portion, the second integrated-electrode portion and the third integrated-electrode portion lie over each other in an upper-lower direction. The first body, second body and the third body are apart from each other when seen along the upper-lower direction.

Abstract: A wiring component with physical quantity sensor is provided with a plurality of electric wires, a physical quantity sensor for detecting a physical quantity of the plurality of electric wires, an electric wire holding member including an intervening portion interposed between the plurality of electric wires, and a holder holding the physical quantity sensor. The electric wire holding member includes a protrusion protruding from the intervening portion in a direction perpendicular to an arrangement direction of the plurality of electric wires, and aligning the holder in longitudinal directions of the plurality of electric wires by the protrusion. The holder includes an electric wire engaging portion being engaged with at least one of the plurality of electric wires.

Abstract: A flexible printed circuit board according to an embodiment includes a substrate, a circuit pattern disposed on the substrate, and a protective layer on the circuit pattern, wherein the substrate includes a chip mounting region, the circuit pattern includes a first circuit pattern and a second circuit pattern connected to a chip of the chip mounting region, the second circuit pattern includes a plurality of second wiring portions and a third pad portion and a fourth pad portion connected to the second wiring portion, the second wiring portion includes a first wiring region connected to the fourth pad portion and a second wiring region bent in the first wiring region, a first space of the first wiring region is greater than a second space of the second wiring region, and a length of the first wiring region is 100 ?m or more.

Abstract: A printed circuit board includes a first board including a plurality of first insulating layers and a plurality of first wiring layers disposed between the plurality of first insulating layers, respectively; and a second board disposed on one surface of the first board and including a plurality of second insulating layers and a plurality of second wiring layers disposed on or between the plurality of second insulating layers, respectively. At least one of the plurality of first insulating layers has a thickness less than a thickness of at least one of the plurality of second insulating layers. The first board further includes a through-via penetrating each of the plurality of first insulating layers and connected to one of the plurality of second wiring layers.

Abstract: An electrical system that includes a power source, a load, and an electrical connection operable to conduct electricity between the power source and the load, the electrical connection including an outer casing comprising a non-conducting material, and a material disposed within the outer casing, wherein the material is electrically conductive, the material including a boron-containing material and metal oxide nanoparticles, wherein the electrical connection includes a wire or cable.

Abstract: The disclosure relates to a connector pin, in particular a metal pin, for feedthroughs, in particular glass-metal feedthroughs, with at least one first, elongated portion, as well as at least one adjoining end portion, and the end portion has a rounding with at least radius R. The disclosure is further characterized in that the cone and/or radius R is preferably a cone and/or radius according to a specification and is obtained by means of a material-removing method and/or a non-material-removing method.

Abstract: According to one aspect of the disclosure, there is provided a mount bracket for installation of communication device in a structure, the mount bracket including: a bracket body coupled to the structure; a bracket base, to which the communication device is fixed, coupled to the bracket body and rotates to cover the bracket body; and a connection member provided at one end of the bracket body to rotatably connect the bracket base to the bracket body, wherein the bracket base includes an anti-detachment structure for preventing separation from the bracket body during rotation.

Abstract: A stretchable substrate includes a first elastomer, a plurality of unit devices on the stretchable substrate, a connecting wire configured to electrically connect adjacent unit devices, and a plurality of auxiliary structures each including a second elastomer and each at least partially overlapping with at least one unit device or the connecting wire, wherein the first elastomer and the second elastomer are separate, respective polymers that commonly include at least one structural unit.

Abstract: [Object] Provided is a printed circuit board ensuring a degree of freedom in circuit design and unlikely to cause a circuit connection failure. [Solving Means] A middle interlayer circuit 11, an upper surface side interlayer circuit 12, and a lower surface side interlayer circuit 13 are formed from a connection surface-less integral conductor. In addition, a connection surface 33 between the upper surface side interlayer circuit 12 and an upper surface side surface layer circuit 14 and a connection surface 34 between the lower surface side interlayer circuit 13 and a lower surface side surface layer circuit 15 lack a connection surface in a plate thickness direction, and thus a satisfactory connection state is achieved. Accordingly, a first circuit 10 is unlikely to cause a connection failure.

Abstract: A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.

Abstract: An electrical system that includes a power source, a load, and an electrical connection operable to conduct electricity between the power source and the load, the electrical connection including an outer casing comprising a non-conducting material, and a material disposed within the outer casing, wherein the material is electrically conductive, the material including a boron-containing material and metal oxide nanoparticles, wherein the electrical connection includes a wire or cable.

Abstract: A circuit board according to an embodiment includes a first insulating portion including at least one insulating layer; a second insulating portion disposed on the first insulating portion and including at least one insulating layer; and a third insulating portion disposed under the first insulating portion and including at least one insulating layer; wherein the insulating layer constituting the first insulating portion includes a prepreg containing glass fibers, and wherein each of the insulating layers constituting the second and third insulating portions is made of resin coated copper (RCC).

Abstract: A mouth guard senses impact forces and determines if the forces exceed an impact threshold. If so, the mouth guard notifies the user of the risk for injury by haptic feedback, vibratory feedback, and/or audible feedback. The mouth guard system may also remotely communicate the status of risk and the potential injury. The mouth guard uses a local memory device to store impact thresholds based on personal biometric information obtained from the user and compares the sensed forces relative to those threshold values. The mouth guard and its electrical components on the printed circuit board are custom manufactured for the user such that the mouth guard provides a comfortable and reliable fit, while ensuring exceptional performance.

Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

Abstract: An embodiment of an electronic system comprises a main board, and a modular capacitor subassembly mechanically and electrically coupled to the main board, wherein the modular capacitor subassembly provides backup power for the main board, and wherein the main board is adapted for use in at least two housing form factors. Other embodiments are disclosed and claimed.

Abstract: A circuit board structure includes a dielectric substrate, at least one embedded block, at least one electronic component, at least one first build-up circuit layer, at least one second build-up circuit layer, at least one conductive through hole, and a fine redistribution layer (RDL). The embedded block is fixed in a through cavity of the dielectric substrate. The electronic component is disposed in an opening of the embedded block. The first build-up circuit layer is disposed on a top surface of the dielectric substrate and electrically connected with the electronic component. The second build-up circuit layer is disposed on a bottom surface of the dielectric substrate and covers the embedded block. The conductive through hole is disposed in a via of the embedded block and electrically connects the first and the second build-up circuit layers. The fine RDL is disposed on and electrically connected to the first build-up circuit layer.

Abstract: A semiconductor package provides a low profile connection to a bottom side of the semi-conductor package. The semi-conductor package includes a computer processor die and a substrate. The computer processor die is mounted on to a top surface of the substrate. The substrate is mounted on to a printed circuit board. A voltage regulator is coupled to the printed circuit board. A top surface of the voltage regulator is coupled to a bottom surface of the substrate. The package also includes a connector device. The connector device includes a cable configured to conduct power from an upstream source, and a low-profile connector module attached to an end of the cable. The connector module is configured to interface to a bottom surface of the voltage regulator.