Abstract: A semiconductor device assembly (10) includes a multi-layer printed circuit board (PCB—40), a thermoelectric cooler (TEC—30), a chip (22), and packaged integrated circuitry (IC—26). The multi-layer PCB includes a lateral heat conducting path (60) formed in a recessed area (44) of the PCB. The TEC and the chip are disposed on the PCB, side-by-side to one another over the lateral heat conducting path. The TEC is configured to evacuate heat from the chip via the lateral heat conducting path, and to dissipate the evacuated heat via a first end of a heat sink (33) in thermal contact with the TEC. The packaged IC is disposed on an un-recessed area of the PCB, wherein the packaged IC is configured to dissipate heat via a second end of the heat sink that is in thermal contact with the packaged IC.

Abstract: An electrical insulation composition includes a base resin containing 65 parts by mass or more and 98 parts by mass or less of a polyethylene and 2 parts by mass or more and 35 parts by mass or less of a styrene-containing resin, the polyethylene and the styrene-containing resin totaling 100 parts by mass, and 0.05 parts by mass or more and 1.0 parts by mass or less of a fatty acid amide.

Abstract: This disclosure relates to a method for connecting a strand element to a connection element using a re-shaping method, such as a connecting a cable lug. A system is also disclosed which comprises a pair of receiving elements having a front side with a recess and a hollow section. The hollow section is designed to accommodate a press insert having a front side with a recess. The receiving element and the press inserts are arranged in a vice. The system also comprises a clamp having a front side with a recess, which is suitable for receiving the connection element. When a pair of receiving elements is arranged, together with the press insert, around a central region of the connection element, then a re-shaping connection, such as a crimp connection, is produced between the strand element and the connection element.

Abstract: The present disclosure has an object of providing a power supply block suitable to be shared among different types or classes of vehicles. A power supply block includes a block main body including a first insertion port for inserting a power supply terminal and a first fuse terminal insertion port for inserting a connection terminal, a conductive first conduction member that is held inside the block main body and configured to be electrically connected to the power supply terminal, and a conductive second conduction member that is held inside the block main body, is electrically connected to the first conduction member inside the block main body, and is configured to be electrically connected to the connection terminal.

Abstract: A printed circuit board (PCB) includes a substrate including a first insulating layer and first wiring patterns disposed on the first insulating layer, an optical sensing chip including a vertical cavity surface emitting laser (VCSEL) and a photodiode, disposed on the first insulating layer to be in contact with at least one of the first wiring patterns, a transimpedance amplifier (TIA) chip disposed to be spaced apart from the optical sensing chip on the first insulating layer and disposed to be in contact with at least one first wiring pattern, different from the first wiring pattern connected to the optical sensing chip, among the first wiring patterns, and a dielectric layer stacked on the substrate and having a hole exposing the VCSEL and the photodiode of the optical sensing chip. The optical sensing chip and the transimpedance amplifier chip are connected through a wiring pattern disposed on the dielectric layer.

Abstract: Provided are an electronic apparatus and a substrate capable of reducing the size and the cost thereof regardless of whether or not a shielding function is needed. An electronic apparatus includes a substrate including a first substrate portion and a second substrate portion arranged in a position opposite the first substrate portion, and a capacitor component arranged between the first substrate portion and the second substrate portion and attached to at least one of the first substrate portion and the second substrate portion. The capacitor component includes a dielectric, a first electrode located on one side of the dielectric, and a second electrode located through the dielectric on a side opposite to the first electrode. The first substrate portion and the second substrate portion are electrically connected to each other through the first electrode.

Abstract: A wire harness wall-passing structure and an installation method thereof. The wire harness wall-passing structure comprises: a sleeve pipe, a pouring sealant, and at least one sealing plug, wherein the sleeve pipe is alternately filled with the pouring sealant and the sealing plug along the axis direction of the sleeve pipe; and at least one first through hole formed in the sealing plug, and a wire harness which can penetrate through the pouring sealant and the first through hole in the sealing plug. According to the wire harness wall-passing structure, the sleeve pipe is filled with the pouring sealant and the sealing plug, so multi-stage sealing and multi-time sealing of the wire harness are achieved, the sealing performance of the wall-passing structure is greatly improved, and the wire harness wall-passing structure is more suitable for to-be-fixed devices such as a high pressure vessel.

Abstract: A magnetic PCB generated by simultaneously spin-spraying a ferrite ion solution and an oxidant solution on a substrate plate while the substrate plate is rotated at a speed 40 rpm to about 300 rpm and heated at 40° C. to 300° C.

Abstract: A mud ring supports an electrical device with respect to a junction box. The mud ring includes a base member configured to be coupled to the junction box; a cover coupled to the base member for movement between a first position and a second position, the cover including an opening; and an insert positioned in the opening and supported for movement relative to the cover, the insert configured to be coupled to the electrical device.

Abstract: A metal circuit structure based on a flexible printed circuit (FPC) contains: a substrate, a first metal layer attached on the substrate, a second metal layer formed on the first metal layer, and an intermediate layer defined between the first metal layer and the second metal layer. A first surface of the intermediate layer is connected with the first metal layer, and a second surface of the intermediate layer is connected with the second metal layer. The intermediate layer is made of a first material, the second metal layer is made of a second material, and the first material of the intermediate layer does not act with the second material of the second metal layer.

Abstract: A circuit board includes a core portion including a first cavity formed in one surface, and a second cavity formed in the other surface opposing the one surface and having a diameter different from a diameter of the first cavity; a first metal layer disposed on the one surface of the core portion; a second metal layer buried in the core portion; and a third metal layer disposed on the other surface of the core portion, wherein each of the first and second cavities of the core portion exposes at least a portion of the second metal layer.

Abstract: A die package structure and a method for fabricating the same are provided. The method includes: fixing a first die on a package base; aligning first hollow pads of a flexible printed circuit board with first pads of the first die, and fixing the flexible printed circuit board; soldering the first hollow pads to the first pads; fixing a second die on the flexible printed circuit board to overlap with the first die; folding the flexible printed circuit board, such that second hollow pads of the flexible printed circuit board are aligned with second pads of the second die, and signal test pads of the flexible printed circuit board are exposed; fixing the flexible printed circuit board on the second die; soldering the second hollow pads to the second pads; soldering metal wires to the signal test soldering pads; and soldering package pins to the metal wires.

Abstract: The storage device unit includes: a substrate having a main surface and having a plurality of wiring layers stacked together; and a storage device that has a plate shape having a first surface and is disposed on the substrate, the first surface facing the main surface. The plurality of wiring layers includes a heat-generating layer having a heat-generating circuit.

Abstract: A stacked-layer board includes a base material including a plurality of dielectric layers stacked on each other, a first main surface being a surface at one end in a stacking direction of the plurality of dielectric layers, and a second main surface being a surface at the other end in the stacking direction, and a first conductor provided on the first main surface, and a first groove is in a surface of the first conductor.

Abstract: A housing having an interior, including: a) a pressure-compensation-device (PCD), for compensating a pressure in the interior as to surroundings of the housing, the interior being connected with the PCD, and an overpressure-valve (OV) with a lip-sealing-element (LSE) with a main-part and a flexible-sealing-lip (FSL), protruding radially-outwardly from an outer-circumference of the main-part and interacts with a sealing-surface (SS); b) an annular-channel (AC), between the main-part and SS, the FSL being in sealed contact with the SS with elastic-pretensioning in a sealing-position and sealingly closes the AC to prevent a flow-conducting connection between the interior/surroundings, and is lifted away from the SS in an open-position and opens the AC to provide a flow-conducting connection between the interior/surroundings; c) the FSL position between the sealing/open positions is controlled as a function of a pressure-difference between the pressure in the interior/surroundings, d) the main-part of the LSE has

Abstract: A wiring board is disclosed. The wiring board includes a substrate including a first element, a diffusion layer in contact with the substrate and including a first metal element, and a first metal film in contact with the diffusion layer and including a second metal element. The diffusion layer has at least a region including the first element and the first metal element and a region including the first metal element and the second metal element. A concentration of the second metal element in the diffusion layer may decrease as it approaches the substrate in a depth direction. A concentration of the first element in the diffusion layer may decrease as it approaches the first metal film in the depth direction.

Abstract: A substrate of an electronic device includes a first set of contact pads and a first set of contact pillars having a height greater than the first set of contact pads. Components are coupled to the first set of contact pads and the first set of contact pillars in traversing directions. The components coupled to the contact pillars are positioned above the components coupled to the first set of contact pads such that at least a first portion of a first side of the component coupled to the contact traces faces a first side of the components coupled to the contact pillars. Stacking passive components in this manner can allow for increased component density without increasing package size.

Abstract: This invention provides a box for accommodating capacitor including bottom plate, two first side plates, two second side plates, fixed engagement structure and movable engagement structure. First side plates are disposed opposite to each other. Second side plates are disposed opposite to each other. Side plates are respectively connected to a plurality of side edges of bottom plate so that bottom plate and side plates together form accommodation space. Fixed engagement structure and the movable engagement structure are respectively connected to first side plates. Fixed engagement structure and movable engagement structure are located at a side of accommodation space that is located farthest from bottom plate. Movable engagement structure includes cantilever part and engagement part. Cantilever part is connected to one of first side plates. Engagement part protrudes from movable end part of cantilever part.

Abstract: The present disclosure provides a flexible display module and a method for manufacturing the flexible display module. The flexible display module includes a flexible display panel, a driving chip and a circuit board. The flexible display panel includes a display region and a bonding region, and the driving chip and the circuit board are arranged at the bonding region. The circuit board includes a first flexible printed circuit and a first printed circuit board provided with an electronic element, the first printed circuit board is coupled to one end of the first flexible printed circuit, and the first flexible printed circuit includes a bonded portion coupled to the bonding region of the flexible display panel. The first flexible printed circuit is bent so that a first space is defined by the first flexible printed circuit, the first printed circuit board and the flexible display panel.

Abstract: A first substrate includes a first surface and a second surface opposite to the first surface. A second substrate includes a third surface and a fourth surface opposite to the third surface. A third substrate includes a fifth surface and a sixth surface opposite to the fifth surface. The first substrate is made of an insulator, and includes a mounting portion for mounting an electronic element at the first surface, and the mounting portion is a rectangular shape. The third substrate is made of a carbon material, and the fifth surface is connected to at least the second surface at location overlapped with the mounting portion in plan view. The third substrate has a larger heat conduction in a direction perpendicular to the longitudinal direction of the mounting portion than heat conduction in the longitudinal direction of the mounting portion in plan view.