Patents Examined by Steven T Sawyer
  • Patent number: 10438748
    Abstract: A multilayer electronic component includes a capacitor body, first and second external electrodes, first and second land portions, and first and second insulating portions. The first and second external electrodes are disposed and spaced apart from each other on a mounting surface of the capacitor body. The first and second land portions include a conductive material and are disposed on the first and second external electrodes, respectively. The first and second insulating portions are disposed between the first and second land portions on the mounting surface of the capacitor body to be spaced apart from each other and each have one end connected to a respective one of the first and second land portions. A board having a multilayer electronic component includes a circuit board having first and second electrode pads disposed on one surface thereof, and the multilayer electronic component mounted thereon.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: October 8, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gu Won Ji, Heung Kil Park, Se Hun Park
  • Patent number: 10431353
    Abstract: A Metal-Clad (MC) cable assembly includes a core having a plurality of power conductors cabled with a subassembly, each of the plurality of power conductors and the subassembly including an electrical conductor, a layer of insulation, and a jacket layer. The MC cable assembly further includes an assembly jacket layer disposed over the subassembly, and a metal sheath disposed over the core. In one approach, the subassembly is a cabled set of conductors (e.g., twisted pair) operating as class 2 or class 3 circuit conductors in accordance with Article 725 of the National Electrical CodeĀ®. In another approach, the MC cable assembly includes a protective layer disposed around the jacket layer of one or more of the plurality of power conductors and the subassembly. In yet another approach, a bonding/grounding conductor is cabled with the plurality of power conductors and the subassembly.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: October 1, 2019
    Assignee: AFC Cable Systems, Inc.
    Inventors: George Anthony Straniero, Paul R. Picard, Richard A. Ricci, Peter Lafreniere
  • Patent number: 10429898
    Abstract: An electronic device includes a housing having an opening, a connection terminal located in an opening in the housing, and a terminal cover including a first resin member having a first surface facing the connection terminal and a second surface located opposite to the first surface and a second resin member located on the second surface. At least a portion of the second resin member covers a depression located on an outer peripheral portion of the first surface of the first resin member.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: October 1, 2019
    Assignee: KYOCERA CORPORATION
    Inventors: Yuki Yoshioka, Kengo Suzuki, Shuichi Kutsuzawa, Hiroyuki Fukuhara
  • Patent number: 10426046
    Abstract: A rollable display device includes a roller, a rollable display that is rollable onto the roller in a first direction, and a plurality of thin plates positioned at a rear surface of the rollable display, the thin plates being rollable onto the roller in the first direction along with the rollable display.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: September 24, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Khachatryan Hayk, Ki Hyun Kim, Sun Ho Kim, Jeong Ho Kim, Tae Woong Kim, Jung Hun Lee
  • Patent number: 10426027
    Abstract: A ceramic multilayer substrate that includes a ceramic insulator layer, which includes a first layer, a second layer, and a third layer and in which the first layer is interposed between the second layer and the third layer, an inner pattern conductor, an outer pattern conductor, and outer electrodes. The ceramic insulator layer is interposed between the inner pattern conductor and the outer pattern conductor. The sintering shrinkage start temperatures of the second layer alone and the third layer alone in a green sheet state are higher than or equal to the sintering shrinkage stop temperature of the first layer alone in a green sheet state. The thickness of the ceramic insulator layer is 5.0 ?m to 55.7 ?m. The ratio of the total of the thickness of the second layer and the thickness of the third layer to the thickness of the first layer is 0.25 to 1.11.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: September 24, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masaaki Hanao, Tsuyoshi Katsube, Kazuo Kishida
  • Patent number: 10426033
    Abstract: A printed board has an elongated shape and is to be electrically coupled to a display panel via a flexible board. The printed board includes a first board section; and a second board section shorter in length than the first board section in a substantially perpendicular direction to a longitudinal direction of the printed board. The first board section and the second board section are disposed in a row in the longitudinal direction, each of the first board section and the second board section has a first end in the substantially perpendicular direction to the longitudinal direction, the first end of the first board section projects further than the first end of the second board section in the substantially perpendicular direction, and a connection portion to be connected to the flexible board is disposed at the first end of each of the first board section and the second board section.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: September 24, 2019
    Assignee: JOLED INC.
    Inventor: Hirofumi Miyashita
  • Patent number: 10420215
    Abstract: Various embodiments provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion may be superimposed over the substrate layer portion. The substrate layer portion may have an opening formed therein and part of the electrically-conductive layer portion may be positioned over the opening to form a partially detachable tab. The tab may be for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a plurality of electronic devices.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: September 17, 2019
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Siang Sin Foo, Choong Meng How
  • Patent number: 10420212
    Abstract: A wiring board includes a substrate, an electrode on a surface of the substrate, a wall surface in a ring shape surrounding an outer circumference of the electrode, an upper end of the wall surface is located at a position higher than a surface of the electrode, and a protrusion at the upper end of the wall surface, the protrusion protruding with respect to the wall surface inward of a ring shape defined by the wall surface.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: September 17, 2019
    Assignee: FUJITSU LIMITED
    Inventor: Keiichi Yamamoto
  • Patent number: 10418257
    Abstract: The present disclosure relates to a substrate with a plating configuration and a process for making the same. The disclosed substrate includes a substrate base with a substrate body, and a plating configuration with a plating seed layer and a plating barrier layer. Herein, the substrate body is formed of metal-diamond composites. The plating seed layer is formed of copper, silver, or gold, and the plating barrier layer includes nickel material. The plating seed layer directly covers at least sidewalls of the substrate body, and the plating barrier layer is directly formed over the plating seed layer and encloses the substrate base.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: September 17, 2019
    Assignee: Qorvo US, Inc.
    Inventor: Dylan Murdock
  • Patent number: 10420235
    Abstract: An electronic device is provided. The electronic device includes a first metal plate of a metal bezel that forms the external appearance of the electronic device, a second metal plate that overlaps the first metal plate while being spaced apart from the first metal plate, a dielectric member interposed between the first metal plate and the second metal plate, and a substrate electrically connected to a contact terminal of the second metal plate to feed power. Other embodiments are possible.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: September 17, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Won Park, Seungyup Lee, Sangil Lee, Won-Jea Jang
  • Patent number: 10412829
    Abstract: To prevent degradation of electrical characteristics caused by a resin filled between electrodes in an ultraviolet light-emitting operation, the present invention provides a base 10 that comprises an insulating base material 11 and two or more metal films 12 and 13 that are formed on one side of the insulating base material 11 and electrically separated from each other. The two or more metal films are formed to include an upper surface and a side wall surface that are covered by gold or a platinum group metal, to be capable of mounting thereon one or more nitride semiconductor light-emitting elements and the like, and to have, as a whole, a predetermined planar view shape including two or more electrode pads.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: September 10, 2019
    Assignees: SOKO KAGAKU CO., LTD., AGC INC.
    Inventors: Akira Hirano, Ko Aosaki
  • Patent number: 10412849
    Abstract: Methods, devices, and systems for hardware migration are described herein. One device includes a top housing, a plurality of input/output (I/O) adapter boards housed by the top housing, a base housing adjacent to the top housing, and a printed circuit board (PCB) base adjacent to the plurality of I/O adapter boards and housed by the base housing, wherein the plurality of I/O adapter boards are electrically connected to the PCB base, and the PCB base includes a plurality of traces configured to provide an electrical path for inputs from a wiring baseboard of an existing controller to the plurality of I/O adapter boards.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: September 10, 2019
    Assignee: Honeywell International Inc.
    Inventors: Cary Leen, Andrew David Halford, Roy Alan Kolasa, Derek Tai, Jayaprakash Meruva
  • Patent number: 10401666
    Abstract: A waterproof electronic device includes a waterproof case in which electronic components are embedded and a display which is able to display and which is placed in an opening of the waterproof case in an air tight manner. The waterproof electronic device includes a space for waterproof testing therein and the waterproof electronic device includes a window for waterproof testing at positions (i) corresponding to the space for waterproof testing and (ii) avoiding the display.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: September 3, 2019
    Assignee: CASIO COMPUTER CO., LTD.
    Inventors: Hiroshi Katsuda, Akira Suzuki, Akihisa Ohmura, Hiroki Nishiyama
  • Patent number: 10401905
    Abstract: A dock for a portable electronic device includes a base; an arm extending from the base; a receiving arrangement coupled to the arm and including contacts disposed on a surface of the receiving arrangement for mating with contacts disposed on the portable electronic device or a cover disposed over a portion of the portable electronic device; and a cable extending from the receiving arrangement configured and arranged to couple the dock to a device for charging or providing data to or from the portable electronic device.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: September 3, 2019
    Assignee: NATIONAL PRODUCTS, INC.
    Inventor: Jeffrey D. Carnevali
  • Patent number: 10405429
    Abstract: A transformer integrated type printed circuit board includes: a transformer including a core, a primary winding wire, and a secondary winding wire; and a printed circuit board including a surface layer and an internal layer in which wiring patterns are respectively formed, and having a plurality of insertion portions into which a plurality of leg portions of the core are respectively inserted. The primary winding wire is disposed in the surface layer of the printed circuit board so as to be wound between the leg portions, and the secondary winding wire is disposed in the internal layer of the printed circuit board so as to be wound between the leg portions. The primary winding wire is small in number of windings, is large in width, and is large in thickness, in comparison with the secondary winding wire.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: September 3, 2019
    Assignee: OMRON Corporation
    Inventors: Masanori Ando, Takashi Yamaguchi
  • Patent number: 10401902
    Abstract: An electronic device including a hollow housing and a display assembly. The hollow housing includes a wall, a circular opening disposed through the wall, and a first attachment mechanism positioned on the housing proximate to the circular opening. The display assembly includes a circular display screen and a display frame coupled to the circular display screen. The display frame is disposed within the circular opening and has a second attachment mechanism disposed proximate a periphery of the display frame to engage the first attachment mechanism and secure the display assembly to the hollow housing.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: September 3, 2019
    Assignee: Amazon Technologies, Inc.
    Inventors: Sourabh Pawar, Kok Yen Cheng, Garrett A. Schwanke, Hao Tan, Alexander Hu
  • Patent number: 10405427
    Abstract: A method for forming electrical connections between electrical conductors is provided. The method includes depositing an anisotropic conductive bonding material (AC bonding material) on a first plurality of electrical conductors, sandwiching the AC bonding material between the first plurality of electrical conductors and a second plurality of electrical conductors, providing first and second cushions formed of a thermally resistive and elastic material, and applying heat and pressure to the second cushion to form the AC bond between the first and second plurality of conductors.
    Type: Grant
    Filed: April 27, 2015
    Date of Patent: September 3, 2019
    Assignee: Flexenable Limited
    Inventor: Sharjil Siddique
  • Patent number: 10401922
    Abstract: Technology is provided for a memory drive storage tray. The memory drive storage tray includes a frame that defines one or more drive bays, each configured to contain a memory drive. Each drive bay includes an associated drive connector for interfacing the memory drive with the memory drive storage tray. Each drive bay also includes a first retainer tab positioned on the frame adjacent the drive connector and a second retainer tab, longer than the first retainer tab, positioned on the frame opposite the first retainer tab. A resilient member, such as a leaf spring, is centrally positioned in the drive bay opposite the drive connector to urge the memory drive toward the drive connector. The resilient member holds the memory drive in place against the drive connector and under the first and second retainer tabs.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: September 3, 2019
    Assignee: Facebook, Inc.
    Inventor: Jon Brian Ehlen
  • Patent number: 10405437
    Abstract: A display device includes a display substrate and a printed circuit board (PCB). The display substrate includes a display area to display an image, and includes a pad area outside the display area. The PCB is bonded to a surface of the display substrate in the pad area. The PCB includes a base film, first terminal wires positioned at the base film, second terminal wires positioned at the base film, first sub-pad terminals electrically connected to the first terminal wires through contact holes formed in the base film, and second sub-pad terminals directly and electrically connected to the second terminal wires without contact holes. The first sub-pad terminals and the second sub-pad terminals are alternately arranged. The first terminal wires and the second terminal wires are, in a view normal to the surface, spaced apart from one another.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: September 3, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Seung-Hwa Ha, Jeong Do Yang, Jung Yun Jo, Jeong Ho Hwang
  • Patent number: 10396056
    Abstract: A semiconductor device includes a printed circuit board in a peripheral portion of a housing portion of a case in which a laminated substrate is housed. A terminal block holding control terminals from which control signals are outputted to the printed circuit board is disposed over the printed circuit board. A gate electrode of a semiconductor chip and the printed circuit board are electrically connected by a wire.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: August 27, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Shin Soyano