Abstract: A semiconductor device package includes a first dielectric layer, a conductive pad and an electrical contact. The first dielectric layer has a first surface and a second surface opposite to the first surface. The conductive pad is disposed within the first dielectric layer. The conductive pad includes a first conductive layer and a barrier. The first conductive layer is adjacent to the second surface of the first dielectric layer. The first conductive layer has a first surface facing the first surface of the first dielectric layer and a second surface opposite to the first surface. The second surface of the first conductive layer is exposed from the first dielectric layer. The barrier layer is disposed on the first surface of the first conductive layer. The electrical contact is disposed on the second surface of the first conductive layer of the conductive pad.

Abstract: An electronic device (100) comprises a stretchable substrate (30) with a flap (30f) formed by a cut (40) in the substrate (30). The flap (30f) is disconnected by the cut (40) from a surrounding main section (30m) of the substrate (30) except on one side. The flap (30f) is exclusively connected to the main section (30m) via a connected section (30c) of the substrate (30) between two ends (40a, 40b) of the cut (40). An electronic component (10) is disposed on the flap (30f) with electrical contacts (11,12) connected to conductive tracks (21,22) disposed on the substrate (30). The conductive tracks (21,22) extend between the component (10) disposed on the flap (30f), and other parts (10r) of the electronic device (100) outside the flap (30f) via the connected section (30c). The flap (30f) with the component (10) is disposed in a pocket formed by surrounding lamination layers (31,32).

Abstract: An electronic device according to various embodiments of the present invention may comprise: a circuit substrate comprising a first layer including a first wire, a second wire formed at one side surface of the first wire along the first wire, and a third wire formed at the other side surface of the first wire along the first wire, a second layer including a ground plane formed along the first wire, the second wire, and the third wire and electrically connected to the second wire and the third wire, and an insulation layer disposed between the first layer and the second layer and having first permittivity; and a conductive member which is disposed above the first layer to have a dielectric-fillable interval space along the first wire and is electrically connected to the ground of the electronic device, the dielectric having second permittivity lower than the first permittivity.

Abstract: The present strain gauge includes a substrate having flexibility; a resistor formed from a material containing at least one of chromium and nickel, on the substrate; a pair of wiring patterns formed on the substrate and electrically connected to both ends of the resistor; and a pair of electrodes formed on the substrate and electrically connected to the pair of wiring patterns, respectively. The wiring patterns include a first layer extending from the resistor, and a second layer having a lower resistance than the first layer and layered on the first layer. On the substrate, an electronic component mounting area is demarcated, on which an electronic component electrically connected to the electrodes is mounted.

Abstract: A circuit board is manufactured by mounting a first circuit layer, mounting a conductive bump on the first circuit layer, covering the first circuit layer with a first dielectric layer which exposes the conductive bump, mounting a second dielectric layer on the first dielectric layer with a second dielectric layer opening that exposes the conductive bump, and finally, mounting a second circuit layer on the surface of the second dielectric layer and in the second dielectric layer opening. Since the surface roughness of the second dielectric layer and the second dielectric layer opening is low, it is unlikely to form nano voids between the second dielectric layer and the second circuit layer, and the second circuit layer may be attached to the second dielectric layer firmly, which is an advantage for fine line circuit disposal.

Abstract: An interconnection includes a circuit board assembly and a hybrid cable assembly. The circuit board assembly includes first and second outer layer assemblies and an intermediate layer assembly. The first and second outer layer assemblies each include an electrically conductive layer. A cable-receiving space is formed at a first side edge of the circuit board assembly. The hybrid cable assembly includes a dielectric waveguide system having a core and a cladding and being configured to transmit a radar wave in a frequency range from about 70 to about 300 GHz. A first conductor system configured to transmit power and/or data is disposed adjacent to the dielectric waveguide system and includes an electrically conductive inner conductor assembly inserted into the cable-receiving space and galvanically connected to a first inner-conductor connection region. The core of the dielectric waveguide system is inserted into the cable-receiving space and disposed at a waveguide connection region.

Abstract: A solder bridge (1) for a vehicle windscreen, the solder bridge (1) comprises a first foot portion (11A) for connection to a vehicle windscreen and a second foot portion (11B) for connection to a vehicle windscreen, the first foot portion (11A) and second foot portion (11B) being interconnected by a flexible electrically conductive body (12).

Abstract: An electronic component module includes a first module including a sealing portion disposed on a first surface of a first board and a shielding layer disposed on a surface of the sealing portion, a second module spaced apart from the first module, a connection board having greater flexibility than the first board and connecting the first module to the second module, and a first ground line electrically connected to a ground layer of the first board and disposed on a surface of the connection board, and at least a portion of the shielding layer is electrically connected to the ground layer of the first board.

Abstract: An electrical connecting element includes a stretchable insulation sheet, two or more first conductive threads on one surface of the insulation sheet, and two or more first resin threads on the one surface of the insulation sheet. The first conductive threads extend in a predetermined direction and are disposed in parallel with each other orthogonally to the predetermined direction. The first resin threads have thermal adhesiveness. The first resin threads do not overlap with any of the first conductive threads.

Abstract: A multilayer board includes a flexible substrate including insulating layers stacked and a pair of through-holes penetrating the insulating layers, and an interlayer connecting conductor in an opposing region in which the pair of through-holes opposes each other in a plan view of the insulating layers viewed from a stacking direction. A cross section of the flexible substrate taken in a lateral direction passing through the pair of through-holes and the interlayer connecting conductor and the stacking direction has a U or S shape. In the cross section, a curvature radius of an inner region located between the pair of through-holes is larger than a curvature radius of an outer region adjacent to the pair of through-holes on an outer side thereof.

Abstract: A printed circuit board assembly is disclosed. The printed circuit board assembly includes a printed circuit board, a sensor mounted on one side of the printed circuit board to detect a magnetic field, and a bus bar disposed in contact with another side of the printed circuit board, wherein a thickness between a region of the another side of the printed circuit board, with which the bus bar is in contact, and the one side of the printed circuit board is smaller than a thickness between a remaining region of the another side of the printed circuit board and the one side of the printed circuit board.

Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An electronic apparatus is provided. The electronic apparatus includes a printed circuit board (PCB), an antenna module mounted on a surface of the printed circuit board, and a radio frequency integrated circuit (RFIC) module mounted on another surface of the printed circuit. The printed circuit board includes a coaxial plated through-hole (PTH) electrically connected with the antenna module and the RFIC.

Abstract: The present strain gauge includes a substrate having flexibility; a resistor formed from a material containing at least one of chromium and nickel, on the substrate; a pair of wiring patterns formed on the substrate and electrically connected to both ends of the resistor; and a pair of electrodes formed on the substrate and electrically connected to the pair of wiring patterns, respectively. The wiring patterns include a first layer extending from the resistor, and a second layer having a lower resistance than the first layer and layered on the first layer. On the substrate, an electronic component mounting area is demarcated, on which an electronic component electrically connected to the electrodes is mounted.

Abstract: The invention provides a seal ring structure, which comprises a substrate, and a seal ring positioned on the substrate, wherein the seal ring comprises an inner seal ring comprising a plurality of inner seal units, wherein each of the inner seal units is arranged at intervals with each other, an outer seal ring comprising a plurality of outer seal units arranged at the periphery of the inner seal ring, wherein each of the outer seal units is arranged at intervals with each other, and a plurality of groups of fence-shaped seal units, wherein at least one group of fence-shaped seal units is positioned between one of the inner seal units and the other adjacent outer seal unit.

Abstract: Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

Abstract: An electronic device for providing feedback corresponding to an input for a housing may include a housing comprising a flexible material, a flexible printed circuit board (FPCB) positioned within the housing, at least one distance measurement sensor operatively coupled to the FPCB, and configured to transmit a signal to at least some area of the housing at given periods and further configured to receive a signal reflected by the some area, and at least one processor operatively coupled to the FPCB and the at least one distance measurement sensor. The at least one processor may be configured to control the electronic device to: receive data from the at least one distance measurement sensor, identify an external input for at least some area of the housing based on the received data, and provide feedback corresponding to the identified external input.

Abstract: This disclosure provides a multi-layered printed circuit board (PC) that has signal array region. The signal array region has a width and circumscribes a power core region and has signal vias connected to respective signal ball pads, and ground vias connected to respective ground ball pads within the signal array region that have an associated ball pad pitch. The PCB also has an inner current power layer. The signal and ground vias are arranged on the component layer in a pattern and extend into the inner current layer. The pattern forms current power paths across the width of the signal array region, such that the current power paths have a width that is at least about 50% as wide as the ball pad pitch.

Abstract: A mouth guard senses impact forces and determines if the forces exceed an impact threshold. If so, the mouth guard notifies the user of the risk for injury by haptic feedback, vibratory feedback, and/or audible feedback. The mouth guard system may also remotely communicate the status of risk and the potential injury. The mouth guard uses a local memory device to store impact thresholds based on personal biometric information obtained from the user and compares the sensed forces relative to those threshold values. The mouth guard and its electrical components on the printed circuit board are custom manufactured for the user such that the mouth guard provides a comfortable and reliable fit, while ensuring exceptional performance.

Abstract: The present disclosure relates to a printed circuit board and a module including the same. The printed circuit board includes an insulating body, a wiring pattern embedded in the insulating body, and a first conductor pattern disposed on the insulating body and overlapping at least a portion of the wiring pattern in a first direction. First conductive vias each penetrate a portion of the insulating body and are respectively disposed on opposite sides of the wiring pattern, in a second direction orthogonal to the first direction, to surround at least a portion of the wiring pattern. Each first conductive via has a first surface connected to the first conductor pattern, and a second surface, opposite to the first surface, connected to the insulating body.

Abstract: A display device includes a folding area, a first unfolding area located on a side of the folding area, and a second unfolding area located on a second side of the folding area. The display device further includes a display module which includes a display panel, and a first circuit board which is attached to the display panel and disposed under the display module, wherein the first circuit board includes a base film, a first driving integrated circuit (“IC”) disposed in the first unfolding area, and a second driving IC disposed in the second unfolding area where the first driving IC and the second driving IC do not overlap each other in a thickness direction during folding.