Patents Examined by T. M. Tufariello
  • Patent number: 5437777
    Abstract: A plating apparatus for forming a wiring pattern on a surface of a semiconductor wafer by causing a plating liquid into contact with the surface of the semiconductor wafer, comprises a storage tank storing and heating a plating liquid, a plating tank provided adjacent to the storage tank and having an opening formed in a wall at the side opposite to the side adjacent to the storage tank. The plating tank is supplied with the plating liquid from the storage tank, and the opening is configured to bring the surface of the semiconductor wafer into contact with the treatment liquid within the treatment tank. A holding mechanism is provided for holding the semiconductor wafer vertically and pushing the surface of the semiconductor wafer to the opening. With this arrangement, it is possible to prevent the unevenness of the plating which would otherwise have been caused by the bubbles generated in the process of the plating.
    Type: Grant
    Filed: December 28, 1992
    Date of Patent: August 1, 1995
    Assignee: NEC Corporation
    Inventor: Shuji Kishi
  • Patent number: 5316650
    Abstract: In a process of electroforming a metal to produce a dental prosthesis, the improvement comprising employing as the metal a metallic glass alloy such as cobalt and phosphorus containing 8-30% by weight of phosphorus. The electrolytic bath comprises:15-300 g/L CoSo.sub.4.7H.sub.2 O40-80 g/L CoCl.sub.2.6H.sub.2 O25-35 g/L H.sub.3 BC.sub.330-100 g/L H.sub.3 PO.sub.31-2 ml/L wetting agentpH about 0.8-2.0.
    Type: Grant
    Filed: February 19, 1993
    Date of Patent: May 31, 1994
    Inventors: Menahem Ratzker, David S. Lashmore, John A. Tesk
  • Patent number: 5304297
    Abstract: A system is provided for regenerating reducing agents used in ancillary chemical or electrochemical processes such as restoring solderability of electronic components. The system includes a cathode, an anode, and an electrolyte system that is separated by a semipermeable ionic barrier into a catholyte and an anolyte. The catholyte includes the reduced member of a redox couple, which can be regenerated electrochemically. The redox couple of the electrolyte system is charged like a battery and discharged during the ancillary process. Regeneration of the reduced member of the redox couple is accomplished at the cathode. The cathode comprises an electrode having a high hydrogen overvoltage so that sufficiently negative potentials can be attained while minimizing hydrogen evolution. Chemical balance is maintained by the semipermeable ionic barrier, which permits proton migration from the anolyte to the catholyte but acts as a barrier against diffusion and migration of cations from the catholyte to the anolyte.
    Type: Grant
    Filed: February 26, 1993
    Date of Patent: April 19, 1994
    Assignee: Rockwell International Corporation
    Inventors: D. Morgan Tench, Dennis P. Anderson, Leslie F. Warren, Jr.
  • Patent number: 5290422
    Abstract: A process for applying silver-graphite dispersion electrodeposits from an electrolyte with a conducting salt that is free of free cyanide. The process facilitates working at relatively high current densities to achieve high speed plating.
    Type: Grant
    Filed: September 28, 1992
    Date of Patent: March 1, 1994
    Assignee: Siemens Aktiengesellschaft
    Inventor: Ursula Michelsen-Mohammadein
  • Patent number: 5290425
    Abstract: An organic solvent electrolyte is provided for electrolytically forming a plating film on the surface of a R.sub.2 T.sub.14 B intermetallic compound permanent magnet. The organic solvent electrolyte comprises a metallic salt including at least one metalic element with a supporting electrolyte, the balance being an organic solvent for forming a plating film on the surface of a R.sub.2 T.sub.14 B intermetallic compound permanent magnet, wherein R denotes a rare earth element including Y and T denotes a transition metal including R, Fe and B as main components. The supporting electrolyte includes at least one selected from a group consisting of:(1) a boric acid compound including at least one of R'.sub.3 BO.sub.3 methyl, ethyl, propyl, butyl group, MBO.sub.2 (in which M denotes H or Na, K, Li metal), M'BO.sub.3 (M' denotes B or Na, K, Li metal), M'"BO.sub.x O.sub.(3x+2)/2 (X is an even number of more than 2).(2) a C10.sub.4 salt of an alkali metal or tetraalkylammonium including at least one of M'C10.sub.
    Type: Grant
    Filed: April 24, 1992
    Date of Patent: March 1, 1994
    Assignee: Tokin Corporation
    Inventors: Hiroshi Momotani, Tsutomu Otsuka
  • Patent number: 5284571
    Abstract: The method of the invention deposits positively charged metal species, preferably platinum-amine, at sites where the negatively charged sulfonic acid groups of the SPE are in contact with carbon. Then an electrochemical reaction causes formation of elemental metal (platinum) particle from the metal species at these sites. Platinum localization is achieved by electro-depositing platinum from a dilute electrolyte consisting essentially of tetramine platinum (II) chloride Pt(NH.sub.3).sub.4 Cl.sub.2 electrolytes. Copper deposition is achieved by electrodepositing copper from a dilute electrolyte consisting essentially of copper sulfate.
    Type: Grant
    Filed: September 4, 1992
    Date of Patent: February 8, 1994
    Assignee: General Motors Corporation
    Inventor: Mark W. Verbrugge
  • Patent number: 5282955
    Abstract: The disclosure relates, inter alia, to a composition and, a method of making the composition. The composition comprises an electrically conductive polymer having a porous structure and a compound formed in situ and coating at least a portion of the surfaces of said polymer. The method of making the composition comprises forming an electrically conductive polymer having a porous structure, contacting the surfaces of the polymer with a solution comprising chemical species capable of being electrochemically formed into a coating material on the surfaces of said structure and electrochemically forming the coating material on the surfaces of the structure.
    Type: Grant
    Filed: June 19, 1991
    Date of Patent: February 1, 1994
    Assignee: Molecular Displays, Inc.
    Inventors: Nicholas Leventis, Young C. Chung
  • Patent number: 5281325
    Abstract: A method and apparatus for the uniform electroplating of printed circuit boards is described. At least one non conductive apertured mask covers selected areas of the electroactive surface of the anode or cathode electrode, whereby to establish substantially uniform electroplating ion transfer over the target areas of the target cathode.
    Type: Grant
    Filed: July 2, 1992
    Date of Patent: January 25, 1994
    Inventor: N. Edward Berg
  • Patent number: 5279725
    Abstract: An apparatus and method for electroplating a graphite-epoxy workpiece in-situ. An electroplating assembly includes a rigid base that is retained a fixed distance about the surface region by insulated standoff legs. A flexible vacuum bag is coupled to the graphite-epoxy workpiece with a fluid-tight seal. The vacuum bag surrounds the surface region and encloses the rigid base to form a plating chamber. A supply chamber, containing a plating fluid, is coupled to the plating chamber by a fluid-tight tubing. A storage chamber is coupled to the plating chamber by a fluid-tight tubing. A vacuum source is coupled by tubing to the supply chamber and to the storage chamber. Valves in each tubing permit the selective coupling of the vacuum source and plating chamber to either the supply chamber or the storage chamber. Electroplating is carried out while plating fluid is drawn by the vacuum, from the supply chamber into the plating chamber and into the storage chamber.
    Type: Grant
    Filed: March 18, 1992
    Date of Patent: January 18, 1994
    Assignee: The Boeing Company
    Inventor: Everett A. Westerman, Jr.
  • Patent number: 5277782
    Abstract: An infrared cold shield comprises a side wall, a top wall and at least one baffle extending across the interior of the cold shield. The top wall and baffles comprise aligned apertures. The cold shield is preferably made by securing one or more metal foil disks and aluminum mandrel segments in an alternating stacked arrangement wherein the outer edges of the metal foil disks are exposed. The assembly is then electroplated to deposit a layer of metal over the side surfaces of the mandrel segments and to capture and bond with the exposed edges of the metal foil sections. The mandrel segments are then dissolved.
    Type: Grant
    Filed: October 13, 1992
    Date of Patent: January 11, 1994
    Assignee: Optical Radiation Corporation
    Inventors: Donald G. DuPree, David L. Gregory, Robert J. Housman
  • Patent number: 5277783
    Abstract: The present invention relates to a manufacturing method for an orifice plate to be used for an ink jet printer or the like. First, a master having a predetermined pattern firmly provided on a substrate is prepared. An electroformed film is then formed on the master by an electroforming method. Finally, the electroformed film is separated from the substrate. In this case, the mask pattern is firmly provided on the substrate, and a mechanical strength of the mask pattern itself is large. Furthermore, the mask pattern is insoluble to an alkali aqueous solution. Thus, the master can be reused, and it can be strongly washed. Accordingly, the master has a durability to repeated usage, thereby contributing to an improvement in the quality of the orifice plate to be manufactured and a reduction in the manufacturing cost.
    Type: Grant
    Filed: April 27, 1992
    Date of Patent: January 11, 1994
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Yumiko Ohashi, Hideo Maruyama
  • Patent number: 5277787
    Abstract: A method of manufacturing printed wiring board is disclosed. The method comprising steps of providing a double-sided copper clad laminate; embedding a conductive ink into a through hole provided in the copper clad laminate; subjecting the opposing surfaces of the double-sided copper clad laminate to copper electroplating to form a copper plated layer after curing the conductive ink under the given conditions; providing a circuit for displacing component mounting lands onto the copper plated layer directly over the cured conductive ink with the use of a dry film or ink for forming other circuit; and forming a printed wiring circuit with the material removing treatment.
    Type: Grant
    Filed: October 28, 1992
    Date of Patent: January 11, 1994
    Assignee: Nippon CMK Corp.
    Inventors: Yasuaki Otani, Fusao Birukawa, Tatero Takai
  • Patent number: 5277784
    Abstract: A manufacturing method for a vacuum fluorescent display is performed by the steps of dividing a substrate into a plurality of areas, and sequentially forming a signal line, an insulating layer, and a segment electrode on each area, arranging common wiring layers with a predetermined distance therebetween on the substrate to be electrically connected to all signal lines formed on the substrate, submerging the substrate into a container filled with a dispersed fluorescent material, and settling the fluorescent material on the segment electrode by applying power to the common wiring layers, and forming rear plates by cutting the substrate having the fluorescent material settled thereon into the plurality of individual areas. A separate settling jig is not required, and cost for the formation of the settling jig and manpower for its handling can be reduced, so that productivity is enhanced.
    Type: Grant
    Filed: September 25, 1992
    Date of Patent: January 11, 1994
    Assignee: Samsung Electron Devices Co., Ltd.
    Inventor: Sang-Mo Woo
  • Patent number: 5277785
    Abstract: Thick layers of hard dense chromium coatings are formed on metal substrates by an electrolytic brush plating operation in which a lead-tin electrode having a porous polypropylene felt topped by an polypropylene molded brush element is maintained during coating continuously over the area to be electrolytically coated. The correct current density and flow of electrolytic coating solution as well as relative movement between the anode and brush element and the work piece are closely controlled to enable the hard chromium coating to be produced.
    Type: Grant
    Filed: July 16, 1992
    Date of Patent: January 11, 1994
    Inventor: Erik S. Van Anglen
  • Patent number: 5275716
    Abstract: A method for manufacturing a tin-electroplated cold-rolled steel strip, which comprises the steps of: continuously annealing a degreased cold-rolled steel strip; then, subjecting, following the continuous annealing treatment, the continuously annealed cold-rolled steel strip to a continuous tin-electroplating treatment in a tin-electroplating bath to form, on at least one surface of the cold-rolled steel strip, a tin-electroplating layer having a plating weight within a range of from 0.1 to 2.8 g/m.sup.2 per surface of the cold-rolled steel strip; and then, temper-rolling, following the continuous tin-electroplating treatment, the cold-rolled steel strip having the tin-electroplating layer on at least one surface thereof, at a reduction ratio within a range of from 1 to 5%.
    Type: Grant
    Filed: March 11, 1993
    Date of Patent: January 4, 1994
    Assignee: NKK Corporation
    Inventors: Katsumi Kojima, Mikiyuki Ichiba, Hiroki Iwasa, Toyofumi Watanabe
  • Patent number: 5275717
    Abstract: Process for the manufacture of dental or maxillo-facial prostheses, particularly endo-osseous prostheses or pivots, in which a layer of pure aluminum is deposited on a conductive substrate, preferably a metal, which forms the core of the prosthesis. The aluminum layer is obtained by electrochemical deposition of pure aluminum with non-aqueous electrolyte base of the type which has an aluminumorganic complex bath. The layer is then oxidized by anodization such that an alumina layer which is sealed and electrically insulated, is obtained, separating the core and the biological tissues surrounding the prosthesis.
    Type: Grant
    Filed: January 30, 1992
    Date of Patent: January 4, 1994
    Inventors: Pascal Prunier, Jean Blanc, Laurent Isnard, Catherine Gerard, Maurice Cagniart, Regis Ruiz
  • Patent number: 5273642
    Abstract: An apparatus and corresponding method for electroplating wafers includes supporting a plurality of wafers on a backing board in the electroplating tank such that one surface of each wafer is masked from the electrolytic reaction. A programmable controller is used to regulate the waveform, frequency and duration of current passing between each individual wafer and a corresponding anode electrode during the electroplating process. Voltage is monitored between the wafers and the anode electrodes to ensure a proper electrical connection is maintained with each individual wafer during the electroplating process.
    Type: Grant
    Filed: December 9, 1992
    Date of Patent: December 28, 1993
    Assignee: ITT Corporation
    Inventors: James W. Crites, J. Meade Coulson
  • Patent number: 5273643
    Abstract: The present invention provides a method of producing a zinc-chromium alloy-plated steel sheet having excellent properties such as bare corrosion resistance, corrosion resistance after coating, plating adhesiveness and weldability.The method is characterized by plating the surface of the steel sheet using an acid plating bath containing zinc ion (Zn.sup.2+) and chromium ion (Cr.sup.3+) at a molar concentration ratio of about 0.1.ltoreq.Cr.sup.3+ /(Zn.sup.3+ +Cr.sup.3+).ltoreq.0.9 in a total amount of at least about 0.5 mol/1 within the dissolution range, and about 0.1 to 30 g/1 of at least one nonionic organic additive having at least a triple bond, at a bath temperature of about 25.degree. to 70.degree. C. and a pH of about 1.0 to 4.0 with a current density of about 50 to 200 A/dm.sup.2.
    Type: Grant
    Filed: April 13, 1993
    Date of Patent: December 28, 1993
    Assignee: Kawasaki Steel Corporation
    Inventors: Kazuhiro Hasegawa, Hiroki Nakamaru, Kazuo Mochizuki, Tomokatsu Katagiri, Nobuyuki Morito, Shigeo Kurokawa
  • Patent number: 5271822
    Abstract: A method for selectively electroplating a metallic coating, such as solder, onto a plurality of small and closely spaced electrical contacts. The method includes sealingly enclosing the contacts in an electroplating cell having an anode, a cathode and a chamber, forming an electrical connection between the cathode and the contacts and electroplating the contacts.
    Type: Grant
    Filed: March 22, 1993
    Date of Patent: December 21, 1993
    Assignee: Microelectronics and Computer Technology Corporation
    Inventors: Ernest R. Nolan, Charles W. C. Lin
  • Patent number: 5269889
    Abstract: In a method of grinding a workpiece employing a metallic grinding wheel sorting a non-conductive abrasive medium, a cathode is provided in spaced relationship with the abrasive surface so as to define a gap therewith. Electrolyte is caused to flow through the gap, and a low direct current is passed between the grinding wheel and the cathode through the electrolyte so that a small amount of metal is continually removed from the grinding wheel so that material trapped in the abrasive surface is dislodged and flushed away by the electrolyte flowing through the gap.
    Type: Grant
    Filed: March 18, 1992
    Date of Patent: December 14, 1993
    Assignee: National Research Council of Canada/Conseil national de recherches Canada
    Inventor: Gavin McGregor