Abstract: The present invention provides a new and improved titanium metal drum cathode for use in the production of metal foils and a novel method of making the same. The method includes the steps of welding together the ends of a strip of titanium that has been roll formed into a cylinder. During the welding operation some of the weld beads that form the weld are hot peened immediately upon solidification. Upon complete formation of the weld, the formed and welded trip of titanium is subjected to a heat treating cycle that includes a double anneal. Preferably, the strip of titanium metal and the weld metal that is used to form the weld both comprise an addition agent such as yttria.

Abstract: The present invention relates to a method of producing a filter material and to a filter material produced by the described method. The method comprises the steps of providing a substrate and forming an electrically conductive structure on the substrate. Electrical insulating, fiber-like flock rods are then anchored to the substrate. A metal layer is then formed over the substrate and around the flock rods by electrodepositing. The substrate is separated from the electrodeposited metal layer and the flock rods are removed from the electrodeposited metal layer to produce a metal filter with microapertures traversing the thickness of the filter.

Abstract: A method of making a metallic pattern on a substrate having a surface comprising bare metal in predetermined areas and metal coated with a resist in remaining areas which comprises(i) protecting the bare metal by electrodepositing thereon a heat-curable polymeric film having(a) a group which is reactive with an isocyanate group and(b) a blocked isocyanate group, and incorporating in the electrodeposited film a compound containing at least two groups selected from hydroxy, amino and carboxyl,(ii) heating the electrodeposited film to render it resistant to a solvent with which the resist is removable(iii) removing the resist from said remaining areas using a solvent which does not remove the electrodeposited polymeric film, thereby exposing metal in said remaining areas, and(iv) etching the metal exposed in step (iii) using an etchant which does not remove the electrodeposited polymeric film, thereby leaving a metallic pattern protected by the electrodeposited polymeric film.

Abstract: The present invention relates to a vertical type stream plating apparatus for plating the surface of a metal strip with tin, chromium, copper or the like. Fundamentally, the apparatus comprises an electrolyte feeding nozzle for feeding an electrolyte into a space between electrodes, a side seal provided on both sides in the widthwise direction of the electrode and a pressure equalizing chamber provided on the backside of the electrode. The apparatus further comprises a electrode having a plurality of through holes communicating with the pressure equalizing chamber provided in an electrode box, waste electrolyte equipment provided with a waste electrolyte box for gathering and discharging the electrolyte and a seal equipment provided at the lowermost portion of the apparatus for preventing the outflow of the electrolyte.

Abstract: A continuous multi-layer plating line for steel sheet which includes a hot-galvanizing apparatus to form a galvanized coating and optionally to alloy the coating and an electroplating apparatus to form an electroplated coating on the galvanized coating. Between the hot-galvanizing apparatus and the electroplating apparatus, a post-galvanizing surface treatment apparatus effective for removing surface oxide contaminants and activating the surface of the galvanized coating is disposed and the galvanized steel sheet is treated thereby prior to electroplating. The post-galvanizing surface treatment may be carried out by applying an alkali solution or an acid which can dissolve aluminum oxide to the galvanized coating, by alkali electrolysis, by cathodic electrolysis, by cooling the galvanized steel sheet with an alkali solution, or by skin-pass rolling using an alkali solution or an acid which can dissolve aluminum oxide as a skin-pass roling liquid.

Abstract: A method for continuously manufacturing parts requiring precision micro-fabrication. According to the method, a surface of a mandrel having a reusable pattern thereon is moved through an electroforming bath. While the mandrel surface moves through the bath, a metal layer is deposited on the mandrel surface to define a pattern. After the metal layer has been deposited to the selected thickness, the metal layer is separated from the mandrel surface.

Abstract: A process to manufacture stepped mold inserts and stepped microstructural bodies molded with the mold inserts. Stepped mold inserts are manufactured using structured irradiation masks with regionally different absorption for x-radiation; to this end, extensive calculations are necessary. Furthermore, several masks can be used in succession and for each irradiation step the penetration depth of the x-radiation can be changed. These masks must be positioned with high precision. With the present process stepped mold inserts are manufactured by a simple procedure. Several layers of varying thickness are applied on a metal plate alternating with non-conductive and conductive material. The layered stack is prestructured by precision mechanical machining at depths that vary from region to region, filled with a resist material and irradiated preferably through a single structured mask.

Abstract: A method of surface treatment of a copper foil for printed circuit boards comprising the steps of forming a treating layer of copper-zinc or copper-zinc-nickel by electrolysing at least a side of a copper foil in a manner of cathodic electrolysis in a bath of copper-zinc including copper ion, zinc ion, tartaric acid and alkali or further including nickel ion, and giving a chromate treatment to the copper foil. A copper foil for printed circuit boards obtained by using a copper-zinc-nickel bath.

Abstract: The application of electrochemical reduction treatment liquids and electroless reduction treatment liquids to elements such as circuit boards for cleaning metallic surfaces in preparation for soldering is accomplished using a wave of the treatment liquid over a liquid tank. A wave treatment has advantages over spraying, which causes too much atomizing, and dipping, which is slow and requires complicated conveyors that are multi-directional. The method comprises forming a wave of reduction treatment liquid in an atmosphere having a limited included oxygen content and passing components through the wave so the reduction treatment liquid contacts the surfaces to be solder coated.

Abstract: A method of removing contaminants (16) from a semiconductor wafer (10) includes placing the semiconductor wafer (10) into an ionic solution (19). A plurality of bubbles (24) are created along the surface of the semiconductor wafer (10). The bubbles (24) lift the contaminants (16) from the wafer (10) thereby floating the contaminants (16) off the wafer (10) and producing a clean wafer (10). Since the bubbles (24) form along the surface of the wafer's (10) recesses (14), contaminants (16) within the recess (14) are removed. The bubbles facilitate removing both organic and inorganic contaminants (16).

Abstract: An electroforming process is used to prepare a thin, deformable metal member by immersing an electrode having an outer surface with an undulating cross-section of hill-like and valley-like shapes in an electroforming bath. The hill-like shapes are narrower than the valley-like shapes, and, in a preferred embodiment, the bottoms of the valley-like shapes are electroformed to be thinner than the tops of the hill-like shapes. The metal member is useful as a spring in a fluid bearing such as an air bearing.

Abstract: The disclosure relates to insulated metal substrates and to a process for producing these substrates. These substrates have an aluminium base, an insulant constituted by an alumina film obtained by anodizing at least one of the faces of said base and at least one metal film which is to be transformed by chemical etching into a network of conductors. The alumina film is formed by a uniform compact zone adhering to the aluminium and having a thickness in excess of 500 nm and a porous layer with a rough outer surface. The process of making these substrates includes a step during which at least one of the faces of the aluminium base undergoes a treatment in a porous anodization layer forming bath and then in a barrier anodization layer forming bath. The invention is used in the production of substrates for single face, double face, with metallized holes, and multilayer conductive circuits. The substrates produced have a planar or non-planar configuration, and may also have resistive networks.

Abstract: An apparatus for applying a surface treatment to a metal foil comprising a drum rotatable about a generally horizontal axis for guiding a continuous metal foil about a predetermined path;anode means adapted to contain electrolyte solution, the anode means having a smooth, generally upward facing anode surface defining a cylindrical cavity, which cavity is dimensioned to surround a portion of the drum and to define an annular gap between the smooth surface and the drum, a predetermined portion of the predetermined path of the metal foil extending through the gap; inlet means for creating a continuous flow of electrolyte through the gap; and power means connected to the foil and the anode to create an electrical potential across the foil and smooth surface of the anode means.

Abstract: Monorail from which hangers are suspended move along a rail. Baskets containing works to be electrodeposition coated with paint are loaded in each hanger. Tanks are located below part of the rail. When the monorail has come to the position directly above each tank, the hanger is lowered into the tank. In the tank the works are treated with liquid while the hanger is rocked. Follwing the treatment, the hanger is raised out of the tank and is rocked again to drop into the same tank the liquid used in that tank and remaining on or in the works.

Abstract: An apparatus and corresponding method for electroplating wafers includes supporting a plurality of wafers on a backing board in the electroplating tank such that one surface of each wafer is masked from the electrolytic reaction. A programmable controller is used to regulate the waveform, frequency and duration of current passing between each individual wafer and a corresponding anode electrode during the electroplating process. Voltage is monitored between the wafers and the anode electrodes to ensure a proper electrical connection is maintained with each individual wafer during the electroplating process.

Abstract: A nitrohydrofluoric development bath for use in an electro-chemical etching rocess, known as the "blue etch process", for the non-destructive inspection of titanium or titanium alloy components such as turbo-machine blades and discs, the bath comprising, per liter, 320 g of nitric acid, from 13 to 22 g of hydrofluoric acid, from 4 to 7 g of dissolved titanium, and water as the balance.

Abstract: A method for electrochemically removing tin oxide from a coater surface. A tin oxide coater is placed in an electrolytic bath to function as the cathode of a pair of cell electrodes. The tin oxide is electrolytically removed by either reducing the tin oxide to tin metal and then dissolving the tin, or creating a bubble of hydrogen gas at the coater surface/tin oxide interface. Pressure of the hydrogen gas forces the tin oxide to break away from the coater at the coater surface/tin oxide interface.

Abstract: The present invention provides a process for producing a multicolor display without a photolithographic process which requires registration. The process comprises forming a transparent electroconductive layer on a transparent substrate, forming a desired colored layer patterned thereon, and subjecting the transparent electroconductive layer exposed between the gap of the patterned colored layers to a metal electroplating (or electrolytic reduction) to form a light-shielding layer.

Abstract: A method for manufacturing an iron-zinc alloy plated steel sheet having two plating layers and excellent in electropaintability and press-formability, which comprises the steps of: passing a steel sheet through a zinc dip-plating bath to form a zinc dip-plating layer on at least one surface of the steel sheet; then, heating the steel sheet, on which the zinc dip-plating layer has been formed, to alloy the zinc dip-plating layer and the surface portion of the steel sheet, so as to form, on the surface thereof, an alloying-treated iron-zinc alloy dip-plating layer as a lower layer having a plating weight of from 30 to 120 g/m.sup.

Abstract: A process for the production of white and black oxide ceramic surface films on silicon-containing light metal cast alloys by plasma-chemical anodic oxidation. An aluminum cast alloy is pickled with nitric acid and hydrofluoric acid and coated by plasma-chemical anodic oxidation in an aqueous electrolyte. Accordingly, a coating variant is provided particularly for construction parts of silicon-containing light metal cast alloys having complicated shapes which enables the production of uniformly thin oxide ceramic surface films in contrast to conventional coating variants.