Patents Examined by T. M. Tufariello
  • Patent number: 5203973
    Abstract: Carbon commutator parts used as races for brushes in electric motors are typically soldered to copper carriers. The solder does not bond well unless a metallic coating is first placed on the carbon part. To improve adhesion between the metallic coating and the carbon part, the surface must first be roughened. An improved method of roughening the surface involves immersing the carbon part in an aqueous solution of sodium hydroxide or potassium hydroxide, connecting the carbon part as an anode, and applying an electric current for two or three minutes. This produces oxidation on the surface of the pressed body, thereby roughening its surface, so that the solderable metallic coating will subsequently adhere much better.
    Type: Grant
    Filed: April 27, 1992
    Date of Patent: April 20, 1993
    Assignee: Robert Bosch GmbH
    Inventors: Heribert Reith, Hans Lander
  • Patent number: 5202012
    Abstract: A method for manufacturing a zinciferous electroplated steel sheet excellent in press-formability, which comprises the steps of: electroplating a steel sheet in a zinciferous acidic electroplating solution, which contains nitric acid ions or nitrous acid ions in an amount within a range of from 0.1 to 50 g per liter of the electroplating solution, and oxide particles of a metal or a semimetal, uniformly dispersible into the electroplating solution, in an amount within a range of from 0.1 to under 0.5 g per liter of the electroplating solution, to form, on at least one surface of the steel sheet, a zinciferous electroplating layer in which zinc hydroxide particles having the oxide particles as nuclei thereof are uniformly dispersed.
    Type: Grant
    Filed: February 13, 1992
    Date of Patent: April 13, 1993
    Assignee: NKK Corporation
    Inventors: Masaki Abe, Yukimitsu Shiohara, Masaru Sagiyama
  • Patent number: 5202002
    Abstract: A process of pickling surfaces of a steel-based metallic material containing iron, carbon and chromium at a high speed wherein the surfaces of the metallic material are pickled at a high speed by dipping and then pickling the surfaces of the metallic material in an aqueous solution of hydrochloric acid or an aqueous solution of hydrochloric acid-nitric acid mixture while at least one kind of ion selected from a group comprising a platinum ion, a palladium ion and a rhodium ion is contained in a hydrochloric acid having a temperature of 50.degree. to 110.degree. C. and a concentration of 100 to 450 g/l with NO.sub.3.sup.- ion contained therein by a quantity of 300 g/l or less, as desired, or pickling treatment in the aforementioned aqueous solution by feeding a direct current between two electrodes at an electric current density of 5 to 200 A/Dm.sup.
    Type: Grant
    Filed: May 13, 1992
    Date of Patent: April 13, 1993
    Assignee: Nippon Steel Corporation
    Inventors: Masamitsu Tsuchinaga, Seizaburo Abe
  • Patent number: 5202003
    Abstract: A method for the electrolytic removal of titanium nitride from a coater surface. The titanium nitride coater surface functions as an anode and another electrode functions as the cathode. The voltage applied across the electrodes removes the titanium nitride from the surface of the coater.
    Type: Grant
    Filed: February 3, 1992
    Date of Patent: April 13, 1993
    Inventor: Roy G. Gordon
  • Patent number: 5198095
    Abstract: A method for continuously manganese-electroplating or manganese-alloy-electroplating a steel sheet, which comprises the steps of: using a manganese electroplating solution or a manganese alloy electroplating solution, using an insoluble anode, and causing a DC electric current to flow between the insoluble anode and a steel sheet during travelling through the electroplating solution while replenishing the manganese electroplating solution or the manganese alloy electroplating solution with manganese ions or manganese alloy ions, thereby forming a manganese plating layer or a manganese alloy plating layer on at least one surface of the steel sheet. As the insoluble anode, a hydrogen gas diffusing insoluble anode is used.
    Type: Grant
    Filed: August 13, 1991
    Date of Patent: March 30, 1993
    Assignee: NKK Corporation
    Inventors: Takayuki Urakawa, Yoshiharu Sugimoto
  • Patent number: 5198081
    Abstract: A novel and efficient electrochemical method is disclosed for the recovery of lithium value from an aqueous solution containing lithium ions in a relatively low concentration together with ions of various kinds of other metallic impurity elements. The method comprises electrochemical selective adsorption of lithium ions from the aqueous solution on to a specific working electrode by applying a DC voltage of a relatively low DC voltage of 0.1-0.4 volt versus a saturated calomel electrode to the working electrode as the cathode opposed to a counterelectrode as the anode and then desorption of the lithium ions therefrom by applying a DC voltage of 0.7-1.2 volts versus a saturated calomel electrode to the lithium-bearing working electrode as the anode opposed to a counterelectrode as the cathode in an aqueous desorption medium containing an electrolyte such as a lithium salt.
    Type: Grant
    Filed: February 26, 1992
    Date of Patent: March 30, 1993
    Assignee: Japan as represented by Director General of Agency of Industrial Science and Technology
    Inventors: Hirofumi Kanoh, Kenta Ooi, Yoshitaka Miyai, Shunsaku Katoh
  • Patent number: 5196106
    Abstract: A process for forming an infrared absorbing cold shield which comprises anodizing an aluminum mandrel for the cold shield to provide a porous layer of aluminum oxide over the surface of the mandrel. The anodized mandrel is then immersed in an electroforming solution and metal is electrolytically deposited into and over the aluminum oxide layer. The aluminum mandrel is then selectively dissolved, leaving a metal body of the electroformed metal with a layer of infrared absorbing aluminum oxide mechanically anchored to the interior surface of the metal body.
    Type: Grant
    Filed: March 20, 1991
    Date of Patent: March 23, 1993
    Assignee: Optical Radiation Corporation
    Inventors: Don DuPree, Neil E. Mattson, Jack E. Cunningham
  • Patent number: 5196107
    Abstract: A dispersion plating method in which plating is conducted while plating liquid containing both abrasive grains of a size larger than 10 .mu.m and another grains is brought into contact with the surface of an object to be plated, the latter grains then being removed by washing with water with only abrasive grains being entrapped in a metal matrix. Plating liquid is circulated through a filter of a filtering size smaller than the average grain size of abrasive grains and the abrasive grains are made into a flocculating condition and adhered to the surface of object to be plated. Furthermore, abrasive grains are adhered to the surface of object to be plated in a plating thickness of less than one half of average grain size of abrasive grains.
    Type: Grant
    Filed: December 17, 1991
    Date of Patent: March 23, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yasuyuki Nakaoka, Minoru Fujita, Toshikazu Izumo, Tsuyoshi Watanabe
  • Patent number: 5194137
    Abstract: A method for forming a solder-bumped terminal on a planar dielectric substrate utilizes a terminal of a particular configuration and comprises depositing onto the terminal a thin plate of solder alloy and reflowing the solder alloy to form a bump. The terminal configuration includes an enlarged terminal pad connected to a relatively narrow linear runner section. Preferably, the runner section width is between about 50 and 150 microns, whereas the pad width is between about 1.2 and 2.0 times the runner section width. The terminal is initially fabricated to include a metal layer adjacent the substrate formed, for example, of copper and a thin, outer plate composed of the solder alloy. The solder plate is deposited in a uniform thickness to both the terminal pad and the adjacent runner section. The terminal is then heated to melt the solder plate, whereupon the molten solder is drawn from the runner onto the enlarged pad to form a bump.
    Type: Grant
    Filed: August 5, 1991
    Date of Patent: March 16, 1993
    Assignee: Motorola Inc.
    Inventors: Kevin D. Moore, John W. Stafford, William M. Beckenbaugh, Ken Cholewczynski
  • Patent number: 5194125
    Abstract: To stabilize the conditions of electroextraction of zinc in an acidic medium and in the presence of metal impurities, there is added to the electrolyte a surface-active compound comprising a perfluoroalkyl grouping linked to a polyoxyethylene, amine-oxide or betaine hydrophilic grouping.
    Type: Grant
    Filed: January 2, 1992
    Date of Patent: March 16, 1993
    Assignee: Elf Atochem S.A.
    Inventors: Chantal Cachet, Valerie Mariotte, Robert Wiart
  • Patent number: 5194127
    Abstract: A method for chemically etching an aluminum foil for an aluminum electrolytic capacitor, which comprises immersing the aluminum foil in an etching solution containing a polymer electrolyte having cation exchange groups dissociable in the etching solution.
    Type: Grant
    Filed: June 30, 1992
    Date of Patent: March 16, 1993
    Assignees: Asahi Glass Company Ltd., Elna Company Ltd.
    Inventors: Eiji Endoh, Haruo Jinbo
  • Patent number: 5194136
    Abstract: A method of fabricating a display panel, e.g., of the type used in active matrix liquid crystal display devices, includes the steps of forming a transparent, electrically conductive layer, e.g., an indium tin oxide (ITO) layer on an electrically insulating substrate, e.g., a glass substrate; forming an anodizable metal layer, e.g., an aluminjum (Al) layer, on the ITO layer; performing a first anodization step to thereby form an oxidized insulating layer, e.g., an Al.sub.2 O.sub.3 layer, on the Al layer; forming a patterned mask on the Al.sub.2 O.sub.3 layer to provide coverage only over selected regions of the Al.sub.2 O.sub.3 layer; and, performing a second anodization step to anodize all portions of the Al layer except portions thereof disposed beneath the selected regions, which portions remain intact to serve as the gate electrodes/wiring structure of the display panel.
    Type: Grant
    Filed: June 17, 1992
    Date of Patent: March 16, 1993
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sehun Jeung, Byungseong Bae
  • Patent number: 5194124
    Abstract: Disclosed is a process for beneficiating titaniferous material which contains iron oxide. The titaniferous material is mixed with a molten salt or mixture or molten salts in which iron oxide dissolves to produce iron ions and oxyanions. The iron ions are electrolytically reduced to iron at the cathode and deposited as high purity iron on the cathode. The oxyanions react with a carbonaceous anode to generate CO and/or CO.sub.2. A beneficiated TiO.sub.2 product is recovered from the molten salt or mixture of molten salts.
    Type: Grant
    Filed: November 26, 1991
    Date of Patent: March 16, 1993
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Kevin J. Leary
  • Patent number: 5192402
    Abstract: A method of dealkalizing a glass body that contains at least one alkali metal ion as either an impurity or an intentionally added constituent. The method involves intimately contacting the glass body with a hydrogen-ion-producing anode and an oxide receptor for the alkali metal ion as a cathode and exposing the glass body and electrode assembly to hydrogen while the assembly is at an elevated temperature.
    Type: Grant
    Filed: February 13, 1992
    Date of Patent: March 9, 1993
    Assignee: Corning Incorporated
    Inventors: Roger J. Araujo, Walter F. Love
  • Patent number: 5190637
    Type: Grant
    Filed: April 24, 1992
    Date of Patent: March 2, 1993
    Assignee: Wisconsin Alumni Research Foundation
    Inventor: Henry Guckel
  • Patent number: 5188723
    Abstract: A process for selectively electrodepositing a pattern of metal such as copper on a substrate comprises the deposition of two successive layers over the entire substrate, photolithographic patterning of the upper layer, and placement of the exposed part of the first deposited layer to a lower surface potential then the patterned second layer. The metal is then deposited under a periodical modulated voltage signal that is adjusted in reference to the reduction potential of the metal so that any metal deposited on the exposed part of the first layer during the positive duty cycle of the signal is removed during the negative duty cycle while little or none of the metal deposited on the second layer is removed due to the second layer higher surface potential. The remaining exposed part of the first layer is etched away after the electrodeposition process is terminated.
    Type: Grant
    Filed: April 13, 1992
    Date of Patent: February 23, 1993
    Assignee: Micron Technology, Inc.
    Inventors: Chris C. Yu, Gurtej S. Sandhu, Terry Gilton
  • Patent number: 5188718
    Abstract: The bulk material is transportable in an electrolyte in the conveying trough of a vibrator conveyor. The conveying trough forms a cathodic track for the bulk material. According to the invention, a granulate anode (40) is provided which consists of a granulate of the material provided for deposition, which is transportable with the vibration in an anodic track (44) associated with the cathodic track (22). This form of realization of the apparatus with a large-surface anode of movable granulate results in a simple design solution for supplying and for replacing the anodes and in a better material utilization of the anode. In addition, the necessary down times are reduced.
    Type: Grant
    Filed: November 6, 1991
    Date of Patent: February 23, 1993
    Assignee: Siemens Aktiengesellschaft
    Inventors: Siegfried Birkle, Johann Gehring, Waldemar Nippe
  • Patent number: 5188720
    Abstract: The installation comprises a set of radial type cells (25a, 25b). The electrical supply of the strip (16) to be coated constituting the cathode is ensured by way of two electrically conducting deflector rollers (20) each mounted rotatably about an axle parallel to the axle of the drum (8) of the electrolysis cell. The deflector rollers (20) are arranged at least in part below the upper level of the drum (8) close to its outer surface. Two support rollers (21a, 21b) associated with each of the deflector rollers ensure the holding of the strip against the deflector roller over a substantial part of its periphery and as far as a zone close to the part of the outer surface of the drum (8) which is submerged in the electrolytic liquid (2). The invention applies in particular to the electrogalvanizing of a steel sheet.
    Type: Grant
    Filed: October 26, 1990
    Date of Patent: February 23, 1993
    Assignee: Sollac
    Inventors: Gerard Colin, Jacques Keller
  • Patent number: RE34191
    Abstract: A process for electroplating metals in an electroplating cell in which the anode current efficiency of the cell is greater than the cathode current efficiency. Buildup of excess metal in the cell is counteracted by circulating the plating solution through an electrowinning cell and plating out the excess metal onto cathodes in the electrowinning cell. The amount of current flowing through the electrowinning cell is controlled so that the amount of the said current which results in the deposition of metal is at least substantially equal to the amount of current flowing through the electroplating cell which results in the evolution of hydrogen gas.
    Type: Grant
    Filed: September 6, 1991
    Date of Patent: March 9, 1993
    Assignee: Eco-Tec Limited
    Inventor: Craig J. Brown
  • Patent number: RE34227
    Abstract: An electrolytic process employing a water solution of metal lactates or lactic acid and metal hydroxides, rapidly and safely removes metal plating bleed, residual oxides or the like (stains), plastic flash, resin bleed and deflashing media, from electrodes of electronic devices. Anodic etching or a combination of cathodic and anodic etching is preferred. Noble metals are selectively removed without cyanide compounds. For example, excess silver from spot plating on copper leadframes is etched away 2-3 times faster than the underlying copper. After cleaning the device leads are bright, polished, stain-free and without scale, residual plating bleed, deflashing media, plastic flash or resin bleed. The process is effective, less hazardous, easy to use and economical.
    Type: Grant
    Filed: June 6, 1991
    Date of Patent: April 20, 1993
    Assignee: Motorola, Inc.
    Inventors: Reginald K. Asher, Duane W. Endicott, Beng L. Lim